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TWI383657B - Method of manufacturing light source of contact image sensor module - Google Patents

Method of manufacturing light source of contact image sensor module Download PDF

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TWI383657B
TWI383657B TW98124786A TW98124786A TWI383657B TW I383657 B TWI383657 B TW I383657B TW 98124786 A TW98124786 A TW 98124786A TW 98124786 A TW98124786 A TW 98124786A TW I383657 B TWI383657 B TW I383657B
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light source
source
segment
image sensor
sensor module
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TW98124786A
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TW201105101A (en
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Shu Cheng Hsu
Wen An Lo
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Aten Int Co Ltd
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Description

製造接觸式影像感測器模組之光源之方法Method of manufacturing a light source of a contact image sensor module

本發明係關於一種接觸式影像感測器模組(Contact Image Sensor Module,CISM),尤其是一種製造接觸式影像感測器模組之光源之方法。The present invention relates to a contact image sensor module (CISM), and more particularly to a method of manufacturing a light source of a contact image sensor module.

目前掃瞄器大多以接觸式影像感測器模組作為其掃描時的感測元件。接觸式影像感測器模組主要由光源、柱狀透鏡以及感測器所組成。當掃描器開始掃描時,光源將所產生的光線照射到待掃瞄物或待掃瞄文件,由待掃瞄物或待掃瞄文件反射不同強度的光線後,如暗的區域反射少量光線,而亮的區域則反射大量光線等,柱狀透鏡再將所反射不同強度的光線聚焦到與掃描幅面等寬的感測器上,由感測器將不同強度的光線轉換為類比電氣信號,此類比電氣信號與光線強度成正比,最後將類比電氣信號轉換為數位電氣信號後再經由適當的影像處理,即可產生待掃瞄物或待掃瞄文件的資訊。At present, most of the scanners use a contact image sensor module as a sensing element for scanning. The contact image sensor module is mainly composed of a light source, a lenticular lens and a sensor. When the scanner starts scanning, the light source illuminates the generated light to the object to be scanned or the file to be scanned, and after the light of different intensity is reflected by the object to be scanned or the file to be scanned, such as a dark area, a small amount of light is reflected. The bright area reflects a large amount of light, etc., and the lenticular lens focuses the light of different intensity reflected onto the sensor of the same width as the scanning plane, and the sensor converts the light of different intensity into an analog electrical signal. The analog electrical signal is proportional to the light intensity. Finally, the analog electrical signal is converted into a digital electrical signal and then processed through appropriate imagery to generate information of the object to be scanned or the file to be scanned.

掃描影像的品質取決於接觸式影像感測器模組的優劣,如上所述,接觸式影像感測器模組係以光源照射至待掃瞄物或待掃瞄文件,藉由反射光線產生掃描影像,因此光源顯得相當重要。目前光源之製造方式,首先依照客戶所需要之光源尺寸,進行光均勻度(Photo Response Non-Uniformity,PRNU)模擬,當模擬結果達到預定規格後,將模擬的網點圖形(Pattern)出圖後進行模仁加工。加工完畢後,量測加工成品是否與模擬的網點圖形相當。確認加工成品與模擬的網點圖形相當後,將模仁安裝上模具再行上模射出,並調整射出機的參數,當射出機參數達到95%以上的網點圖形複製率後,將射出的成品即導光板(Light Guide),安裝至設計的光源基座(Housing)上,完成光源的製造。此時再將製造完成的光源組裝到接觸式影像感測器模組,執行實機驗證是否達到預定規格的光均勻度。如果實機驗證並未達到預定規格的光均勻度,則必須從最早的光均勻度模擬重新開始,重複上述步驟直到實機驗證達到預定規格的光均勻度為止。The quality of the scanned image depends on the advantages and disadvantages of the contact image sensor module. As described above, the contact image sensor module is illuminated by the light source to the object to be scanned or the file to be scanned, and is scanned by the reflected light. Image, so the light source is quite important. At present, the manufacturing method of the light source is first performed according to the size of the light source required by the customer, and the Photo Response Non-Uniformity (PRNU) simulation is performed. After the simulation result reaches the predetermined specification, the simulated dot pattern is drawn. Mold processing. After processing, measure whether the finished product is equivalent to the simulated dot pattern. After confirming that the finished product is equivalent to the simulated dot pattern, the mold is installed on the mold and then the upper mold is injected, and the parameters of the injection machine are adjusted. When the injection machine parameters reach 95% of the dot pattern replication rate, the finished product will be shot. The Light Guide is mounted on the designed light source housing to complete the manufacture of the light source. At this time, the manufactured light source is assembled to the contact image sensor module, and the actual machine is verified whether the light uniformity of the predetermined specification is achieved. If the actual machine verification does not reach the light uniformity of the predetermined specification, it is necessary to restart from the earliest light uniformity simulation, and repeat the above steps until the real machine verifies that the light uniformity of the predetermined specification is reached.

然而上述習知製造接觸式影像感測器模組之光源的缺點在於,整個流程僅能設計一種尺寸,如果需要特殊尺寸的光源時,必須從光均勻度模擬、出圖、模仁加工、上模射出、安裝至光源基座、組裝到接觸式影像感測器模組、實機驗證等流程重複測試到達到規格為止。上述過程需耗費相當高的成本,包含購買相關光學模擬軟體(例如traspro light tool)以及標準光輝度量測儀費用、模具開模費用等,且開發製程繁瑣,要花許多時間驗證。However, the above-mentioned conventional light source for manufacturing the contact image sensor module has the disadvantage that only one size can be designed for the whole process. If a special size light source is required, it must be simulated from the light uniformity, the drawing, the mold processing, and the upper The process of injection molding, mounting to the light source base, assembly to the contact image sensor module, and real machine verification is repeated until the specification is reached. The above process requires a relatively high cost, including the purchase of related optical simulation software (such as traspro light tool) and the cost of standard luminosity measuring instrument, mold opening cost, etc., and the development process is cumbersome, and it takes a lot of time to verify.

因此需要對上述問題提出一種解決方法。Therefore, it is necessary to propose a solution to the above problems.

本發明之一目的在於提供一種製造接觸式影像感測器模組之光源之方法,能以低成本且簡單的流程製造出所需尺寸之接觸式影像感測器模組之光源。It is an object of the present invention to provide a method of fabricating a light source for a contact image sensor module that can produce a light source of a contact image sensor module of a desired size in a low cost and simple process.

依據本發明之製造接觸式影像感測器模組之光源之方法,包含下列步驟:The method for manufacturing a light source of a contact image sensor module according to the present invention comprises the following steps:

(1)提供一主光源,該主光源之表面具有網點且一側具有一點光源;(1) providing a main light source, the surface of the main light source having a dot and having a light source on one side;

(2)去除主光源之複數個預定長度之網點,使主光源上形成複數個無網點區域;(2) removing a plurality of dots of a predetermined length of the main light source to form a plurality of dotless regions on the main light source;

(3)裁切主光源,形成一第一裁切段光源以及至少一第二裁切段光源,其中第一裁切段光源以及第二裁切段光源之兩側各包含一無網點區域,且第一裁切段光源包含點光源;以及(3) cutting the main light source to form a first cutting segment light source and at least one second cutting segment light source, wherein the first cutting segment light source and the second cutting segment light source each comprise a dotless region, And the first crop segment source comprises a point source;

(4)將第二裁切段光源與另一點光源結合。(4) Combining the second cropped light source with another point source.

除上述步驟外,本發明製造接觸式影像感測器模組之光源之方法更包含下列步驟:In addition to the above steps, the method for manufacturing the light source of the contact image sensor module of the present invention further comprises the following steps:

(5)將第一裁切段光源以及第二裁切段光源分別組裝在一接觸式影像感測器模組;以及(5) assembling the first cutting segment light source and the second cutting segment light source into a contact image sensor module;

(6)量測每一接觸式影像感測器模組之光均勻度。(6) Measure the light uniformity of each contact image sensor module.

上述去除網點的方式例如利用膠帶黏附於預定長度上之網點。在另一實施例中,係將一網點模仁拋光的方式去除網點。The above manner of removing the dots is carried out, for example, by using a tape to adhere to dots of a predetermined length. In another embodiment, the dots are removed by polishing a dot die.

上述預定長度包含6公釐至10公釐之範圍,其中較佳之值為8公釐。The above predetermined length ranges from 6 mm to 10 mm, with a preferred value of 8 mm.

與習知技術相比,本發明製造接觸式影像感測器模組之光源之方法能將低價的標準尺寸光源裁切後,製造出所需尺寸之光源,而免除先前技術中模擬、開模、驗證等高成本又耗費時間的流程。Compared with the prior art, the method for manufacturing the light source of the contact image sensor module can cut a low-cost standard-size light source to produce a light source of a desired size, without the prior art simulation and opening. High-cost and time-consuming processes such as modulo and verification.

為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂,配合所附圖式,作詳細說明如下:The above and other objects, features, and advantages of the present invention will become more apparent and understood.

以下將參照所附圖式詳細說明本發明之技術內容。The technical contents of the present invention will be described in detail below with reference to the accompanying drawings.

請一併參閱第1圖以及第2A圖至第2D圖,第1圖係繪示依據本發明製造接觸式影像感測器模組之光源之方法流程圖,第2A至第2D圖係繪示依據本發明製造接觸式影像感測器模組之光源之示意圖。本發明之方法包含下列步驟:Please refer to FIG. 1 and FIG. 2A to FIG. 2D together. FIG. 1 is a flow chart showing a method for manufacturing a light source of a contact image sensor module according to the present invention, and FIGS. 2A to 2D are diagrams. A schematic diagram of a light source for fabricating a contact image sensor module in accordance with the present invention. The method of the present invention comprises the following steps:

步驟S10中,提供一主光源20,該主光源20之表面具有網點28且一側具有一點光源22,如第2A圖所示。點光源22例如但不限於發光二極體。主光源20的尺寸為價格最低廉的標準尺寸光源,例如A4尺寸,其長度為218公釐(Millimeter)。In step S10, a main light source 20 is provided, the surface of which has a dot 28 and a light source 22 on one side, as shown in Fig. 2A. The point source 22 is, for example but not limited to, a light emitting diode. The primary light source 20 is the lowest priced standard size light source, such as the A4 size, which has a length of 218 millimeters (Millimeter).

步驟S20中,去除主光源20之複數個預定長度L上之網點28,使主光源20上形成複數個無網點區域24。至於去除網點28的目的將於稍後有更詳細的解釋。去除後之結果如第2B圖所示。網點28去除的方式視網點28形成的方式可有不同的選擇。當網點28以網版印刷的方式形成時,能以膠帶黏附預定長度L上的網點28,達到形成無網點區域24的目的。當網點28以射出成型的方式形成時,將製造出網點28之網點模仁(未圖示)上對應預定長度L處予以拋光,則製造出的主光源20之預定長度L上即不具有網點,達到形成無網點區域24的目的。In step S20, the plurality of dots 28 on the predetermined length L of the main light source 20 are removed, so that a plurality of dotless regions 24 are formed on the main light source 20. The purpose of removing the dots 28 will be explained in more detail later. The result after removal is as shown in Fig. 2B. The manner in which the dots 28 are removed may vary depending on the manner in which the dots 28 are formed. When the dots 28 are formed by screen printing, the dots 28 on the predetermined length L can be adhered with a tape to achieve the purpose of forming the dotless regions 24. When the halftone dots 28 are formed by injection molding, the dot molds (not shown) on which the dots 28 are formed are polished at a predetermined length L, and the manufactured main light source 20 has no dots at a predetermined length L. The purpose of forming the dotless area 24 is achieved.

在第2B圖中,每一預定長度L之大小為相等,當然亦可視實際需求調整預定長度L之大小為不相等,即無網點區域24的大小不同。至於預定長度L之範圍包含在6公釐至10公釐之間,較佳實施例中,預定長度L為8公釐。In FIG. 2B, the size of each predetermined length L is equal. Of course, the size of the predetermined length L may be adjusted to be unequal according to actual needs, that is, the size of the no-dot area 24 is different. The range of the predetermined length L is comprised between 6 mm and 10 mm. In the preferred embodiment, the predetermined length L is 8 mm.

步驟S30中,沿第2B圖虛線處裁切主光源20,裁切後之結果如第2C圖所示,形成第一裁切段光源30以及第二裁切段光源40,其中第一裁切段光源30以及第二裁切段光源40之兩側各包含一無網點區域24,且第一裁切段光源30包含點光源22。以上述長度218公釐之A4尺寸為例,可將其裁切為長度108公釐之A6尺寸及長度54公釐之A8尺寸,即可得到A6尺寸及A8尺寸兩種不同長度之光源。另一種裁切的搭配方式,可將長度218公釐之A4尺寸裁切為長度140公釐之A5尺寸及長度54公釐之A8尺寸,即可得到A5尺寸及A8尺寸兩種不同長度之光源。由於A4尺寸為業界使用之接觸式影像感測器模組的標準光源尺寸,除了裁切為上述A5、A6或A8尺寸光源外,亦可依客戶需求將大量生產的標準尺寸裁切成任意長度之光源。In step S30, the main light source 20 is cut along the broken line of FIG. 2B, and the result of the cutting is as shown in FIG. 2C, and the first cutting segment light source 30 and the second cutting segment light source 40 are formed, wherein the first cutting is performed. Each of the segment light source 30 and the second crop segment light source 40 includes a dotless region 24, and the first segment segment source 30 includes a point source 22. Taking the A4 size of the above-mentioned length of 218 mm as an example, it can be cut into an A6 size of 108 mm in length and an A8 size of 54 mm in length to obtain a light source of two different lengths of A6 size and A8 size. Another cutting method can cut the A4 size of 218 mm in length into A5 size of 140 mm in length and A8 size of 54 mm in length, which can obtain two different lengths of light of A5 size and A8 size. . Because the A4 size is the standard light source size of the contact image sensor module used in the industry, in addition to cutting the A5, A6 or A8 size light source, the standard size can be cut to any length according to customer requirements. Light source.

目前業界在大量生產第2A圖標準尺寸的主光源20時,並未使用去除網點的技術,即整個主光源20表面佈滿網點。因此若不先去第2B圖之預定長度L的網點28而直接將主光源20裁切後,在裁切側會產生嚴重的散射現象,即裁切側光線過亮。事實上,解決裁切側產生的散射現象可將裁切後的光源組裝在接觸式影像感測器模組內,然後再黏貼擴散片等光學衰減薄膜材料於裁切側的上方,以解決裁切側散射現象的問題。然而黏貼擴散片的方法必須經過測試,求出所需擴散片的大小及透光率,黏附於裁切側上方後須再經過光均勻度測試,以對擴散片的透光率進行微調。又,擴散片係以人工方式黏附而成,因此黏附在裁切側上方有誤差時,也會對抑制散射現象的效果打折。At present, when the mass production of the main light source 20 of the standard size of FIG. 2A is mass-produced, the technique of removing the dots is not used, that is, the surface of the entire main light source 20 is covered with dots. Therefore, if the main light source 20 is directly cut without going to the half point 28 of the predetermined length L of FIG. 2B, severe scattering occurs on the cutting side, that is, the cut side light is too bright. In fact, solving the scattering phenomenon generated on the cutting side can assemble the cut light source into the contact image sensor module, and then stick the optical attenuation film material such as the diffusion sheet on the cutting side to solve the cutting. The problem of cutting side scattering phenomenon. However, the method of adhering the diffusion sheet must be tested to determine the size and transmittance of the desired diffusion sheet. After adhering to the upper side of the cut side, the light uniformity test is performed to finely adjust the light transmittance of the diffusion sheet. Further, since the diffusion sheet is artificially adhered, when there is an error in the upper side of the cutting side, the effect of suppressing the scattering phenomenon is also discounted.

為了避免上述使用擴散片產生的問題,本發明在裁切前先去除預定長度L上的網點28,當主光源20裁切為第一裁切段光源30及第二裁切段光源40後,第一裁切段光源30及第二裁切段光源40之兩側無網點區域24能防止散射現象的問題產生。簡言之,無網點區域24具有與黏附擴散片相同的效果,然不再需要經過測試、求出所需擴散片的大小及透光率、以及對擴散片的透光率進行微調的步驟,又能避免人工黏附造成的誤差及節省使用擴散片的成本。因此,形成無網點區域24的方式比黏附擴散片的方式更加簡便且能降低生產成本。In order to avoid the above problems caused by using the diffusion sheet, the present invention removes the halftone dots 28 on the predetermined length L before cutting, and after the main light source 20 is cut into the first cutting segment light source 30 and the second cutting segment light source 40, The no-mesh area 24 on both sides of the first cropping section light source 30 and the second cropping section source 40 prevents the problem of scattering. In short, the dotless region 24 has the same effect as the adhesive diffusion sheet, but the test, the size and transmittance of the desired diffusion sheet, and the fine adjustment of the transmittance of the diffusion sheet are no longer required. It also avoids the error caused by manual adhesion and saves the cost of using the diffusion sheet. Therefore, the manner in which the dot-free region 24 is formed is simpler than the method of adhering the diffusion sheet and can reduce the production cost.

步驟S40中,如第2D圖所示,將第二裁切段光源40與另一點光源26結合。由於第一裁切段光源30具有主光源20之點光源22,故不需額外與另一點光源26結合,至於第二裁切段光源40在裁切後並未具有主光源20之點光源22,因此必須額外與另一點光源26結合,以作為光線來源,至於結合在第二裁切段光源40之哪一側並未有限制。在一實施立中,另一點光源26為二極體封裝,可使用現有技術製造而成,為所屬領域中之通常知識,故此不再贅述。In step S40, as shown in Fig. 2D, the second cropping segment light source 40 is combined with another point source 26. Since the first cutting segment light source 30 has the point source 22 of the main light source 20, it is not necessary to additionally combine with another point source 26, and the second segment segment source 40 does not have the point source 22 of the main source 20 after cutting. Therefore, it must be additionally combined with another point source 26 as a source of light, and there is no limitation on which side of the second section of the source 40 is incorporated. In one implementation, the other point source 26 is a diode package, which can be fabricated using the prior art and is generally known in the art and will not be described again.

要說明的是,本發明並不限於裁切成兩段,可依據實際需求裁切成多段。以裁切成三段為例,可形成一段第一裁切段光源30以及兩段第二裁切段光源40,其中僅有兩段第二裁切段光源40需要額外與另一點光源26結合。It should be noted that the present invention is not limited to cutting into two segments, and can be cut into multiple segments according to actual needs. For example, by cutting into three segments, a first segmented segment light source 30 and two segments of the second segment segment source 40 can be formed, wherein only two segments of the second segment segment source 40 need to be additionally combined with another point source 26. .

在一實施例中,第二裁切斷光源40與另一點光源26結合更包含下列步驟:提供一黏膠(未圖示);將黏膠黏附於第二裁切段光源40之一側;以及將另一點光源26黏附於第二裁切段光源40之黏膠側。In an embodiment, the second cutting light source 40 is combined with another point light source 26 to further comprise the steps of: providing a glue (not shown); and adhering the adhesive to one side of the second cutting segment light source 40; And attaching another point source 26 to the adhesive side of the second cutting segment source 40.

再另一實施例中,第二裁切斷光源40與另一點光源26為利用相互卡扣的方式固定結合。然結合方式並不限於上述黏附或卡扣方式。In still another embodiment, the second cut light source 40 and the other point light source 26 are fixedly coupled by mutual snapping. However, the manner of bonding is not limited to the above-described adhesion or snapping method.

步驟S50中,將第一裁切段光源30以及第二裁切段光源40分別組裝在一接觸式影像感測器模組(未圖示)。In step S50, the first cutting segment light source 30 and the second segment segment light source 40 are respectively assembled into a contact image sensor module (not shown).

步驟S60中,量測每一接觸式影像感測器模組之光均勻度,測試是否達到所需規格。In step S60, the light uniformity of each contact image sensor module is measured, and the test is performed to meet the required specifications.

第一裁切段光源30以及第二裁切段光源40之具有透光性,其作用係分別將點光源22以及另一點光源26轉換為線光源。The first cutting segment light source 30 and the second segment segment source 40 are translucent, and their function is to convert the point source 22 and the other point source 26 into line sources, respectively.

請參閱第3圖,係繪示接觸式影像感測器模組50之示意圖。接觸式影像感測器模組50包含收容於基座54內之複數個透鏡52、第2D圖之第一裁切段光源30及透鏡52下方之感測器(未圖示)。接觸式影像感測器模組50可應用於多功能事務機、掃描器、傳真機或影印機等光學設備。Please refer to FIG. 3 , which is a schematic diagram of the contact image sensor module 50 . The contact image sensor module 50 includes a plurality of lenses 52 housed in the susceptor 54, a first cropped segment light source 30 of FIG. 2D, and a sensor (not shown) below the lens 52. The contact image sensor module 50 can be applied to optical devices such as multifunction printers, scanners, fax machines, or photocopiers.

本發明與習知技術相比,具有下列優點:(a)可依據需求將標準尺寸的主光源裁切後,再組裝點光源後形成多段不同尺寸的光源,即能省去不斷驗證、開模的製程,大幅降低生產成本;(b)以網點去除的方式抑制光源兩側散射問題能簡化製程、省去使用擴散片的成本及人為黏附造成的誤差。Compared with the prior art, the invention has the following advantages: (a) the main light source of the standard size can be cut according to requirements, and then the light source is assembled to form a plurality of light sources of different sizes, which can eliminate the need for continuous verification and mold opening. The process greatly reduces the production cost; (b) suppressing the scattering problem on both sides of the light source by means of dot removal can simplify the process, eliminate the cost of using the diffusion sheet and the error caused by human adhesion.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何具有本發明所屬技術領域之通常知識者,在不脫離本發明之精神和範圍內,當可作各種更動與潤飾,並可思揣其他不同的實施例,因此本發明之保護範圍當視後附申請專利範圍所界定者為準。While the present invention has been described above by way of example, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. Other different embodiments are contemplated, and the scope of the present invention is defined by the scope of the appended claims.

20...主光源20. . . Main light source

22...點光源twenty two. . . point Light

24...無網點區域twenty four. . . No dot area

26...另一點光源26. . . Another point source

28...網點28. . . Network

30...第一裁切段光源30. . . First cutting segment light source

40...第二裁切段光源40. . . Second cutting segment light source

50...接觸式影像感測器模組50. . . Contact image sensor module

52...透鏡52. . . lens

54...基座54. . . Pedestal

L...預定長度L. . . Scheduled length

S10~S60...步驟S10~S60. . . step

第1圖係繪示依據本發明製造接觸式影像感測器模組之光源之方法流程圖;1 is a flow chart showing a method of manufacturing a light source of a contact image sensor module according to the present invention;

第2A圖至第2D圖係繪示依據本發明製造接觸式影像感測器模組之光源之示意圖;以及2A to 2D are schematic views showing a light source for manufacturing a contact image sensor module according to the present invention;

第3圖係繪示接觸式影像感測器模組之示意圖。Figure 3 is a schematic diagram showing a contact image sensor module.

S10~S60...步驟S10~S60. . . step

Claims (12)

一種製造接觸式影像感測器模組之光源之方法,包含:(1)提供一主光源,該主光源之表面具有網點且一側具有一點光源;(2)去除該主光源之複數個預定長度之網點,使該主光源上形成複數個無網點區域;(3)裁切該主光源,形成一第一裁切段光源以及至少一第二裁切段光源,其中該第一裁切段光源以及該第二裁切段光源之兩側各包含一無網點區域,且該第一裁切段光源包含該點光源;以及(4)將該第二裁切段光源與另一點光源結合。A method of manufacturing a light source of a contact image sensor module, comprising: (1) providing a main light source having a dot on a surface thereof and having a light source on one side; (2) removing a plurality of predetermined ones of the main light source a dot of a length such that a plurality of dot-free regions are formed on the main light source; (3) cutting the main light source to form a first cropping segment light source and at least a second cropping segment light source, wherein the first cropping segment The light source and the second cutting segment light source each include a no-dot region, and the first cutting segment source includes the point source; and (4) combining the second segment segment source with another point source. 如申請專利範圍第1項所述之方法,更包含:(5)將該第一裁切段光源以及該第二裁切段光源分別組裝在一接觸式影像感測器模組;以及(6)量測每一接觸式影像感測器模組之光均勻度。The method of claim 1, further comprising: (5) assembling the first cutting segment light source and the second cutting segment light source into a contact image sensor module; and (6) Measuring the light uniformity of each contact image sensor module. 如申請專利範圍第1項所述之方法,其中係利用膠帶黏附於該等預定長度上去除網點。The method of claim 1, wherein the dots are removed by adhering to the predetermined length with a tape. 如申請專利範圍第1項所述之方法,其中係將一網點模仁拋光的方式去除網點。The method of claim 1, wherein the dot is removed by polishing a dot die. 如申請專利範圍第1項所述之方法,其中每一預定長度之大小相等。The method of claim 1, wherein each predetermined length is equal in size. 如申請專利範圍第1項所述之方法,其中每一預定長度之大小不相等。The method of claim 1, wherein each predetermined length is unequal in size. 如申請專利範圍第1項所述之方法,其中每一預定長度包含6公釐至10公釐之範圍。The method of claim 1, wherein each predetermined length comprises a range of from 6 mm to 10 mm. 如申請專利範圍第7項所述之方法,其中每一預定長度為8公釐。The method of claim 7, wherein each predetermined length is 8 mm. 如申請專利範圍第1項所述之方法,其中該點光源為發光二極體。The method of claim 1, wherein the point source is a light emitting diode. 如申請專利範圍第1項所述之方法,其中該另一點光源為發光二極體。The method of claim 1, wherein the other point source is a light emitting diode. 如申請專利範圍第1項所述之方法,其中在步驟(4)中更包含:提供一黏膠;將該黏膠黏附於該第二裁切段光源之一側;以及將該另一點光源黏附於該第二裁切段光源之黏膠側。The method of claim 1, wherein in the step (4), the method further comprises: providing a glue; attaching the adhesive to one side of the second cutting segment light source; and the other point light source Adhered to the adhesive side of the second cutting segment light source. 如申請專利範圍第1項所述之方法,其中在步驟(4)中更包含:將該第二裁切段光源與該另一點光源相互卡扣固定。The method of claim 1, wherein in the step (4), the second cutting segment light source and the other point source are mutually snap-fastened.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW290670B (en) * 1994-08-01 1996-11-11 Matsushita Electric Industrial Co Ltd
TW200411287A (en) * 2002-12-24 2004-07-01 Toppoly Optoelectronics Corp Flat lighting structure
US20050191914A1 (en) * 2004-03-01 2005-09-01 Asia Tech Image Inc. Method for repairing and assembling contact image sensor module and structure thereof
TW200810514A (en) * 2006-08-07 2008-02-16 Ritdisplay Corp Contact image sensor module
TW200910923A (en) * 2007-08-23 2009-03-01 Prodisc Technology Inc Light source module of scanning device
TW200925516A (en) * 2007-12-07 2009-06-16 Gigno Technology Co Ltd Light emitting unit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW290670B (en) * 1994-08-01 1996-11-11 Matsushita Electric Industrial Co Ltd
TW200411287A (en) * 2002-12-24 2004-07-01 Toppoly Optoelectronics Corp Flat lighting structure
US20050191914A1 (en) * 2004-03-01 2005-09-01 Asia Tech Image Inc. Method for repairing and assembling contact image sensor module and structure thereof
TW200810514A (en) * 2006-08-07 2008-02-16 Ritdisplay Corp Contact image sensor module
TW200910923A (en) * 2007-08-23 2009-03-01 Prodisc Technology Inc Light source module of scanning device
TW200925516A (en) * 2007-12-07 2009-06-16 Gigno Technology Co Ltd Light emitting unit

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