TWI383522B - Light - emitting device package bracket structure and package module - Google Patents
Light - emitting device package bracket structure and package module Download PDFInfo
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Description
本發明係關於一種發光裝置封裝支架結構及其封裝模組,尤指一種具多組斜面組,而可增加發光效率之發光裝置封裝支架結構者。The present invention relates to a light-emitting device package support structure and a package module thereof, and more particularly to a light-emitting device package support structure having a plurality of sets of inclined surface groups and which can increase luminous efficiency.
現有的發光二極體組件,如第十圖所示者,大抵包含有一本體(40)及至少一個設置在本體(40)上的發光二極體(50)(light emitting diode,LED),而本體(40)上會形成有一反射面(42),用以對發光二極體(50)所發射的光產生反射的效果,以便能提高發光二極體(50)的發光亮度及效率。The existing LED assembly, as shown in FIG. 10, substantially includes a body (40) and at least one light emitting diode (LED) disposed on the body (40). A reflecting surface (42) is formed on the body (40) for reflecting the light emitted by the light emitting diode (50), so that the light emitting brightness and efficiency of the light emitting diode (50) can be improved.
然而,現有本體(40)的反射面(42)係呈一單一角度的傾斜面,如第十一圖所示者,其僅能提供光線一固定的反射角度,因此,光線在反射後,對光線的集中效果並不佳,因反射高度不同而使得光線有分散的情形,進而使得光的亮度反而會有變弱的現象。However, the reflecting surface (42) of the existing body (40) is a single angle inclined surface. As shown in FIG. 11, it can only provide a fixed reflection angle of light, and therefore, after the light is reflected, The concentration of light is not good, and the light is scattered due to the difference in reflection height, which in turn causes the brightness of the light to become weaker.
另,台灣新型第M318188號「發光二極體」專利案(以下簡稱為參考案),如第十二圖所示者,雖揭示有於一殼體(60)上形成有一反射側壁(62),於反射側壁(62)上形成有數個不同由底部至杯口分別漸增或漸減的傾斜角度,但參考案僅具有一組由三個斜面所構成的反射側壁(62),故參考案所能提供的出光能量提升效果仍屬有限,所以現有的發光二極體組件的發光效率仍無法達到需求,而有待進一步的改良。In addition, the Taiwanese new M318188 "Light Emitting Diode" patent (hereinafter referred to as the reference case), as shown in Fig. 12, discloses that a reflective sidewall (62) is formed on a casing (60). The reflection sidewall (62) is formed with a plurality of different inclination angles from the bottom to the mouth, respectively, but the reference has only one set of reflective sidewalls (62) composed of three slopes, so the reference case The luminous energy enhancement effect that can be provided is still limited, so the luminous efficiency of the existing light-emitting diode assembly still cannot meet the demand, and further improvement is needed.
因此,本發明人有鑑於現有發光裝置封裝支架結構及使用上的缺失,特經過不斷的試驗與研究,終於發展出一種可改進現有缺失之本發明。Therefore, the present inventors have finally developed a present invention which can improve the existing defects, in view of the lack of structure and use of the conventional light-emitting device package.
本發明之主要目的在於提供一種發光裝置封裝支架結構及其封裝模組,其可提供不同的反射角度,而對發光元件所發射的光產生一重新分佈的效果,以達到提高發光元件發光效率之目的者。The main object of the present invention is to provide a light-emitting device package support structure and a package module thereof, which can provide different reflection angles and generate a redistribution effect on the light emitted by the light-emitting elements, so as to improve the luminous efficiency of the light-emitting elements. Target person.
為達上述目的,本發明主要係提供一種發光裝置封裝支架結構,其包含有:一支架,具有一基部及遠離該基部的複數導電接腳;以及一本體,具有一內凹的凹部,該本體係圍繞該支架使該支架的基部由該凹部露出,且該等導電接腳由該由本體外部突伸出,該凹部的側壁係設有由多組斜面組所構成的反射面,其中每一組斜面組係由複數個斜面所組成。In order to achieve the above object, the present invention mainly provides a light-emitting device package support structure, comprising: a bracket having a base portion and a plurality of conductive pins away from the base portion; and a body having a concave recess portion The system surrounds the bracket such that the base of the bracket is exposed by the recess, and the conductive pins protrude from the outside of the body, and the side wall of the recess is provided with a reflecting surface composed of a plurality of sets of inclined faces, each of which The group of beveled groups consists of a plurality of bevels.
本發明另提供一種發光裝置之封裝模組,其包含有:一支架,具有一基部及遠離該基部的複數導電接腳;以及一本體,具有一內凹的凹部,該本體係圍繞該支架使該支架的基部由該凹部露出,且該等導電接腳由該由本體外部突伸出,該凹部的側壁係設有由多組斜面組所構成的反射面,其中每一組斜面組係由複數個斜面所組成;至少一個設置於該支架上並與支架電連接的發光元件;以及一填注於該本體凹部內並密封該至少一個發光元件的封裝膠體。The invention further provides a package module for a light-emitting device, comprising: a bracket having a base and a plurality of conductive pins away from the base; and a body having a concave recess, the system surrounding the bracket The base of the bracket is exposed by the recess, and the conductive pins protrude from the outside of the body, and the side wall of the recess is provided with a reflecting surface formed by a plurality of sets of inclined faces, wherein each set of inclined faces is composed of a plurality of inclined faces; at least one light-emitting element disposed on the bracket and electrically connected to the bracket; and an encapsulant filled in the body recess and sealing the at least one light-emitting element.
藉由上述之技術手段,本發明可藉由多組呈不同傾斜角度的複數個斜面,使光呈現不同角度的反射,並使光線隨反射高低位置的不同,而能達到集中的效果,同時亦可使光線能在不同路徑下得重新分佈而使部份光線得相互重疊,來提高發光元件的發光效率。According to the above technical means, the present invention can make the light reflect different angles by a plurality of sets of inclined faces with different inclination angles, and the light can achieve the concentrated effect with the difference of the high and low positions of the reflection, and at the same time, The light can be redistributed in different paths to partially overlap the light to improve the luminous efficiency of the light-emitting element.
本發明係提供一種發光裝置封裝支架結構及其封裝模組,請配合參看第一、二圖,由圖中可看到,本發明之支架結構主要係包含有一支架(20)及一本體(10),該支架(20)具有一基部(22)及遠離該基部(20)的複數導電接腳(24),該本體(10)具有一內凹的凹部(11),該本體(10)係圍繞該支架(20)使該支架(20)的基部(22)的上表面由該凹部(11)的開口露出,而於支架(20)的基部(22)上為本體(10)的凹部(11)所圍繞區域形成有一光源安置面(222),且該等導電接腳(24)由該由本體(10)外部突伸出,又本體(10)的凹部(11)的側壁包含有一設於光源安置面(222)周圍的反射面(12),又該反射面(12)係由多組斜面組所構成,每一組斜面組係由複數個斜面(13,14)所組成,用以反射發光元件(30)所發出之光線,在本實施例中,每一組斜面組係由二個不同角度的斜面所組成。The invention provides a light-emitting device package support structure and a package module thereof. Please refer to the first and second figures. As can be seen from the figure, the support structure of the present invention mainly comprises a support (20) and a body (10). The bracket (20) has a base portion (22) and a plurality of conductive pins (24) remote from the base portion (20), the body (10) having a concave recess (11), the body (10) The upper surface of the base (22) of the bracket (20) is exposed by the opening of the recess (11) around the bracket (20), and is the recess of the body (10) on the base (22) of the bracket (20) ( 11) a light source setting surface (222) is formed around the surrounding area, and the conductive pins (24) protrude from the outside of the body (10), and the side wall of the recess (11) of the body (10) includes a setting a reflecting surface (12) around the light source seating surface (222), and the reflecting surface (12) is composed of a plurality of sets of inclined surfaces, each set of inclined surfaces being composed of a plurality of inclined surfaces (13, 14). In order to reflect the light emitted by the light-emitting element (30), in this embodiment, each set of bevel sets is composed of two inclined faces of different angles.
又,進行晶片封裝後,於該支架(20)上設置有至少一發光元件(30),其中各發光元件(30)可為一發光二極體,發光元件(30)與支架(20)的基部(22)間設置導線(23)以相互電連接,又於本體(10)的凹部(11)內亦填注有密封發光元件(30)及導線(23)於其中的封裝膠體,而構成一發光裝置的封裝模組。After the chip is packaged, at least one light emitting element (30) is disposed on the bracket (20), wherein each of the light emitting elements (30) can be a light emitting diode, and the light emitting element (30) and the bracket (20) The wires (23) are disposed between the bases (22) to be electrically connected to each other, and the recesses (11) of the body (10) are also filled with a sealing colloid for sealing the light-emitting elements (30) and the wires (23) therein. A package module of a light emitting device.
請再配合參看第三圖,由圖中可看到,本體(10)的反射面(12)可由依光源安置面(222)的形狀而構成一至數個反射區(122),例如,若光源安置面(222)的形狀呈圓形,則反射面(12)係由一呈圓弧圍繞的反射區(122)所構成,若光源安置面(222)係如第一圖所示的四邊形,反射面(12)則係由四個反射區(122)所圍繞構成,而每個反射區(122)係由多組斜面組反覆堆積所構成,其中每一組斜面組可如圖所示包含兩個上下連接的斜面(13,14),而兩斜面(13,14)的傾斜角彼此不相同並由底部向上而漸增,即位於上方的斜面(14)傾斜角度大於位於下方斜面(13)的傾斜角度,其中各斜面(13,14)傾斜角度係斜面(13,14)與一垂直面間的夾角(α、β),而垂直面係一垂直於光源安置面(222)的平面。Referring to the third figure, it can be seen that the reflecting surface (12) of the body (10) can form one to several reflecting areas (122) according to the shape of the light source setting surface (222), for example, if the light source The shape of the placement surface (222) is circular, and the reflection surface (12) is formed by a reflection area (122) surrounded by a circular arc. If the light source placement surface (222) is a quadrangle as shown in the first figure, The reflecting surface (12) is composed of four reflecting regions (122), and each reflecting region (122) is composed of a plurality of sets of inclined groups, wherein each set of inclined groups can be included as shown Two inclined faces (13, 14) connected to each other, and the inclined angles of the two inclined faces (13, 14) are different from each other and are gradually increased from the bottom upward, that is, the inclined face (14) located above is inclined more than the lower inclined face (13) The angle of inclination of each of the slopes (13, 14) is the angle (α, β) between the slopes (13, 14) and a vertical plane, and the vertical plane is a plane perpendicular to the light source seating surface (222) .
又反射面(12A)每組斜面組的兩斜面(13A,14A)的傾斜角度亦可如第四圖所示,係由底部向上而漸減,即位於上方的斜面(14A)傾斜角度(β’)小於位於下方斜面(13A)的傾斜角度(α’)。The angle of inclination of the two inclined faces (13A, 14A) of each set of inclined faces of the reflecting surface (12A) can also be as shown in the fourth figure, which is gradually decreased from the bottom upward, that is, the inclined angle (βA) of the upper inclined surface (βA). ) is smaller than the inclination angle (α') of the lower slope (13A).
又每組的兩相鄰斜面(13,14/13A,14A)的傾斜角範圍差係介於1至5倍之間,其中傾斜角度範圍差即指相鄰兩個傾斜角度相除之倍數值,另各反射區(122)的斜面(13,14/13A,14A)傾斜角度可呈不同設計,如第五至七圖所示者,為本發明另一實施例,其中,光源安置面(222)係呈長方形,其周圍圍繞的反射面(12B)之長邊反射區(122B)每組之斜面(131B,141B)係分別呈2°及7°傾斜角,此時兩斜面(131B,141B)傾斜角度範圍差係7/2=3.5倍,而短邊反射區(123B)每組之斜面(13B,14B)係分別呈7°及28°傾斜角,此時兩斜面(13B,14B)傾斜角度範圍差係28/7=4倍。In addition, the difference of the inclination angle range of the two adjacent slopes (13, 14/13A, 14A) of each group is between 1 and 5 times, wherein the difference of the inclination angle range refers to the multiple of the adjacent two inclination angles. The inclined angles (13, 14/13A, 14A) of the other reflective regions (122) may be differently designed. As shown in the fifth to seventh embodiments, another embodiment of the present invention, wherein the light source is disposed ( 222) is a rectangle, and the inclined surface (131B, 141B) of each group of the long side reflection area (122B) surrounding the reflecting surface (12B) is inclined at an angle of 2° and 7°, respectively, and the two inclined surfaces (131B, 141B) The inclination angle range difference is 7/2=3.5 times, and the short side reflection area (123B) each group of slopes (13B, 14B) are inclined angles of 7° and 28°, respectively, and the two slopes (13B, 14B) The difference in the tilt angle range is 28/7 = 4 times.
本發明的每一組斜面組亦可為三個以上的斜面所組成。例如斜面組為三個一組時,則傾斜角度範圍差之計算,係以相鄰的第一、二斜面及相鄰的第二、三斜面,各別兩兩相除。Each set of bevel sets of the present invention may also be composed of more than three bevels. For example, when the slanting group is three sets, the calculation of the difference of the inclination angle range is divided by the adjacent first and second inclined surfaces and the adjacent second and third inclined surfaces, respectively.
又,本發明的反射面上的多斜面組之設置,不限定為全周、連續型態,本體(10)的反射面(12)可依需求而構成一至數個反射區(122),只要能藉由多斜面組之設置,以增加光線分佈能量並有效提升出光效率者,皆在本發明之專利範圍內。反射面(12B)可呈如第五至七圖所示的全周多斜面的設置形態,即各反射區(122B,123B)間係相互連接;而反射面(12C)亦可如第九圖所示者,係呈反射區間隔設置的形態,即各相鄰反射區(122C,123C)間係形成有一不具斜面的間隔區(124)。另外,亦可為該反射面(12C)係由一對相對的長邊多斜面反射區(122C)所構成,或反射面(12C)係由一對相對的短邊多斜面反射區(123C)所構成之態樣。Moreover, the arrangement of the multi-bevel set on the reflecting surface of the present invention is not limited to the whole circumference and the continuous type, and the reflecting surface (12) of the main body (10) can constitute one to several reflecting areas (122) as needed, as long as It is within the scope of the present invention to be able to increase the light distribution energy and effectively increase the light output efficiency by setting the multi-bevel set. The reflecting surface (12B) may be in the form of a full-circle multi-slope as shown in the fifth to seventh figures, that is, the respective reflecting regions (122B, 123B) are connected to each other; and the reflecting surface (12C) may also be as shown in the ninth drawing. As shown, the reflection regions are arranged at intervals, that is, a spacer (124) is formed between each adjacent reflection region (122C, 123C) without a slope. In addition, the reflecting surface (12C) may be composed of a pair of opposite long-side multi-bevel reflecting regions (122C), or the reflecting surface (12C) may be composed of a pair of opposite short-side multi-bevel reflecting regions (123C). The form of the composition.
如此,藉由反射面(12,12A,12B,12C)不同傾斜角度之斜面,請再配合參看第八圖,可對發光元件(30)所發出的光線產生不同角度的反射效果,可讓光線隨著不同的反射位置高度,而達到集中光源的效果,同時亦可使光線能在不同路徑下得重新分佈而使部份光線得相互重疊,以藉此能提高發光元件(30)的發光效率,經本發明人實際實驗的結果,藉由本發明反射面(12)的多重反射效果,光的最大照度值可有效提昇7.6%,而光強度最大值可提昇6.6%。相較於一般LED產業對於光照度、光強度提昇3~5%即為需求滿足點,本發明之結構設計對於發光效率之提昇係具有極高效益。In this way, by using the reflecting surface (12, 12A, 12B, 12C) to be inclined at different tilt angles, please refer to the eighth figure, and the light emitted by the light-emitting element (30) can be reflected at different angles to allow light to be transmitted. With the height of different reflection positions, the effect of concentrating the light source is achieved, and at the same time, the light can be redistributed in different paths so that some of the light beams overlap each other, thereby improving the luminous efficiency of the light-emitting element (30). As a result of actual experiments by the inventors, with the multiple reflection effect of the reflecting surface (12) of the present invention, the maximum illuminance value of light can be effectively increased by 7.6%, and the maximum light intensity can be increased by 6.6%. Compared with the general LED industry, the illuminance and light intensity increase by 3~5% is the demand satisfaction point, and the structural design of the invention has extremely high efficiency for improving the luminous efficiency.
又,本發明之由多組斜面組所組成的反射面(12,12A,12B,12C),除可運用於如圖所示的單一發光元件封裝模組外,亦可運用於發光二極體的燈管或背光模組等,可提高本發明的實用性。Moreover, the reflecting surface (12, 12A, 12B, 12C) composed of a plurality of sets of inclined groups of the present invention can be applied to the light emitting diode in addition to the single light emitting element package module as shown in the figure. The lamp tube or the backlight module and the like can improve the practicability of the present invention.
由上述內容可知,不同的修改及改變可在不脫離本發明實質的精神及新穎概念的範圍下加以達成,並且本發明揭露的特定實施例並非用以限制本發明,此一揭露內容係包含落入所附的申請專利範圍的範疇下的所有修改。It is apparent that the various modifications and changes can be made without departing from the spirit and novel concept of the invention, and the specific embodiments disclosed herein are not intended to limit the invention. All modifications in the scope of the appended patent application.
(10)...本體(10). . . Ontology
(11)...凹部(11). . . Concave
(12,12A,12B,12C)...反射面(12, 12A, 12B, 12C). . . Reflective surface
(122,122B,123B,122C,123C)...反射區(122, 122B, 123B, 122C, 123C). . . Reflection zone
(124)...間隔區(124). . . Spacer
(13,13A,13B,131B,14,14A,14B,141B)...斜面(13, 13A, 13B, 131B, 14, 14A, 14B, 141B). . . Bevel
(20)...支架(20). . . support
(22)...基部(twenty two). . . Base
(222)...光源安置面(222). . . Light source placement surface
(23)...導線(twenty three). . . wire
(24)...導電接腳(twenty four). . . Conductive pin
(30)...發光元件(30). . . Light-emitting element
(40)...本體(40). . . Ontology
(42)...反射面(42). . . Reflective surface
(50)...發光二極體(50). . . Light-emitting diode
(60)...殼體(60). . . case
(62)...反射側壁(62). . . Reflecting sidewall
第一圖係本發明第一實施例之立體外觀圖。The first figure is a perspective view of the first embodiment of the present invention.
第二圖係本發明第一實施例之局部剖面圖。The second drawing is a partial cross-sectional view of a first embodiment of the present invention.
第三圖係本發明第一實施例之局部放大剖面圖。The third drawing is a partially enlarged cross-sectional view of the first embodiment of the present invention.
第四圖係本發明第二實施例之局部放大剖面圖。Figure 4 is a partially enlarged cross-sectional view showing a second embodiment of the present invention.
第五圖係本發明第三實施例之立體外觀圖。The fifth drawing is a perspective view of a third embodiment of the present invention.
第六圖係本發明第三實施例之局部剖面圖。Figure 6 is a partial cross-sectional view showing a third embodiment of the present invention.
第七圖係本發明第三實施例之放大局部剖面圖。Figure 7 is an enlarged partial cross-sectional view showing a third embodiment of the present invention.
第八圖係本發明第一實施例之光路反射示意圖。The eighth figure is a schematic view of the optical path reflection of the first embodiment of the present invention.
第九圖係本發明第四實施例之立體外觀剖面圖。Figure 9 is a perspective view showing a perspective view of a fourth embodiment of the present invention.
第十圖係現有發光裝置封裝支架結構之局部立體剖面圖。The tenth figure is a partial perspective sectional view of a conventional light-emitting device package support structure.
第十一圖係現有發光裝置封裝支架結構之光路反射示意圖。The eleventh figure is a schematic diagram of the optical path reflection of the existing light-emitting device package support structure.
第十二圖係現有參考案發光裝置封裝支架結構之光路反射示意圖。The twelfth figure is a schematic diagram of the optical path reflection of the package structure of the light-emitting device package of the prior reference.
(10)...本體(10). . . Ontology
(11)...凹部(11). . . Concave
(12)...反射面(12). . . Reflective surface
(122)...反射區(122). . . Reflection zone
(13)...斜面(13). . . Bevel
(14)...斜面(14). . . Bevel
(22)...基部(twenty two). . . Base
(23)...導線(twenty three). . . wire
(24)...導電接腳(twenty four). . . Conductive pin
(30)...發光元件(30). . . Light-emitting element
Claims (38)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99101204A TWI383522B (en) | 2009-12-29 | 2010-01-18 | Light - emitting device package bracket structure and package module |
| KR1020110003412A KR101245715B1 (en) | 2010-01-18 | 2011-01-13 | Luminous device package frame |
| JP2011005865A JP2011146712A (en) | 2010-01-18 | 2011-01-14 | Frame of package for light-emitting device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98145472 | 2009-12-29 | ||
| TW99101204A TWI383522B (en) | 2009-12-29 | 2010-01-18 | Light - emitting device package bracket structure and package module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201123547A TW201123547A (en) | 2011-07-01 |
| TWI383522B true TWI383522B (en) | 2013-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99101204A TWI383522B (en) | 2009-12-29 | 2010-01-18 | Light - emitting device package bracket structure and package module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI383522B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6682205B2 (en) * | 2002-04-16 | 2004-01-27 | Yuan Lin | Flexible rod light and manufacturing method thereof |
| US20060091416A1 (en) * | 2004-10-29 | 2006-05-04 | Ledengin, Inc. (Cayman) | High power LED package with universal bonding pads and interconnect arrangement |
| US7119422B2 (en) * | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
| US20070165414A1 (en) * | 2003-12-11 | 2007-07-19 | Shih-Chang Shei | Light-emitting diode package structure |
-
2010
- 2010-01-18 TW TW99101204A patent/TWI383522B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6682205B2 (en) * | 2002-04-16 | 2004-01-27 | Yuan Lin | Flexible rod light and manufacturing method thereof |
| US20070165414A1 (en) * | 2003-12-11 | 2007-07-19 | Shih-Chang Shei | Light-emitting diode package structure |
| US20060091416A1 (en) * | 2004-10-29 | 2006-05-04 | Ledengin, Inc. (Cayman) | High power LED package with universal bonding pads and interconnect arrangement |
| US7473933B2 (en) * | 2004-10-29 | 2009-01-06 | Ledengin, Inc. (Cayman) | High power LED package with universal bonding pads and interconnect arrangement |
| US7119422B2 (en) * | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
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|---|---|
| TW201123547A (en) | 2011-07-01 |
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