TWI382186B - Apparatus for automatically powering up circuit board - Google Patents
Apparatus for automatically powering up circuit board Download PDFInfo
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- TWI382186B TWI382186B TW98111077A TW98111077A TWI382186B TW I382186 B TWI382186 B TW I382186B TW 98111077 A TW98111077 A TW 98111077A TW 98111077 A TW98111077 A TW 98111077A TW I382186 B TWI382186 B TW I382186B
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- 230000005540 biological transmission Effects 0.000 claims description 37
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 13
- 238000012360 testing method Methods 0.000 description 10
- 238000013500 data storage Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
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Description
本發明有關於一種自動熱機裝置,且特別是有關於一種電路板自動熱機裝置。The present invention relates to an automatic heat engine device, and more particularly to a circuit board automatic heat engine device.
隨著電子科技的發展,電腦已成為資訊處理的必要配備。主機板是電腦不可或缺的重要組成部分,故電腦主機板的穩定性十分重要。為了確保電腦主機板的穩定性,在主機板製造完成時,必須通過各種測試標準,以確認其品質。為了保證這些測試的準確性,往往需要預先模擬出主機板使用時的用戶環境,再對其進行測試。With the development of electronic technology, computers have become a necessary equipment for information processing. The motherboard is an indispensable part of the computer, so the stability of the computer motherboard is very important. In order to ensure the stability of the computer motherboard, when the motherboard is manufactured, it must pass various test standards to confirm its quality. In order to ensure the accuracy of these tests, it is often necessary to pre-simulate the user environment when the motherboard is used, and then test it.
然而,過去大多依賴人工方式實現此種用戶環境的模擬。即在進行主機板測試之前,作業員需要用手插附電源線,以對主機板進行上電動作,並採用計時器對電路板整個熱機過程進行計時。當達到預設之時間時,再由作業員用手拔下電源線,並取下電路板放置於產線,從而進行後續各種測試操作。However, in the past, most of the manual relied on manual simulation of such user environments. That is, before the motherboard test, the operator needs to manually plug in the power cord to power on the motherboard, and use a timer to time the entire heat engine process of the board. When the preset time is reached, the operator removes the power cord by hand and removes the circuit board and places it on the production line, thereby performing various subsequent test operations.
上述的作法,由於作業員需要重復進行插拔電源線以及計時的動作,浪費人力與時間,進而無法有效提高生產效率。In the above-mentioned method, since the operator needs to repeatedly perform the operation of plugging and unplugging the power cord and timing, labor and time are wasted, and the production efficiency cannot be effectively improved.
本發明的目的在於提供一種電路板自動熱機裝置,以改善現有技術的缺失。It is an object of the present invention to provide a circuit board automatic heat engine apparatus to improve the deficiencies of the prior art.
本發明提出一種電路板自動熱機裝置,包括第一傳輸部、容置單元以及控制單元。第一傳輸部具有第一輸入端與第一輸出端,且第一傳輸部包括第一電源提供單元。容置單元用以容置電路板,包括第二電源提供單元,用以耦接電路板與第一電源提供單元。控制單元耦接第一傳輸部,並控制第一傳輸部,使得容置單元由第一輸入端移動至第一輸出端。並且,控制單元控制第一電源提供單元於一預設時間提供電源給第二電源提供單元,使得電路板於預設時間進行熱機操作。The invention provides a circuit board automatic heat engine device, which comprises a first transmission part, a accommodating unit and a control unit. The first transmission portion has a first input end and a first output end, and the first transmission portion includes a first power supply unit. The accommodating unit is configured to receive the circuit board, and includes a second power supply unit for coupling the circuit board and the first power supply unit. The control unit is coupled to the first transmission portion and controls the first transmission portion such that the accommodating unit is moved from the first input end to the first output end. And, the control unit controls the first power supply unit to supply power to the second power supply unit at a preset time, so that the circuit board performs the heat engine operation at the preset time.
本發明有益效果為,利用電路板自動熱機裝置可實現電路板熱機過程自動化。根據電路板的不同類型,可預先對電路板自動熱機裝置中的控制單元進行設置,以控制電路板熱機過程在一預定時間內進行。實現批量電路板同時進行熱機過程的操作,解放了人力,並提高了生產效率。The invention has the beneficial effects that the circuit board heat engine process can be automated by using the circuit board automatic heat engine device. Depending on the type of board, the control unit in the board's automatic thermal unit can be pre-set to control the board's heat engine process for a predetermined period of time. The realization of the batch circuit board and the operation of the heat engine process at the same time frees the manpower and improves the production efficiency.
為讓本發明的上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合附圖,作詳細說明如下。The above and other objects, features, and advantages of the present invention will become more apparent and understood by the appended claims appended claims
圖1繪示為根據本發明一較佳實施例的電路板自動熱機裝置的結構示意圖。圖2繪示為根據本發明一較佳實施例的電路板自動熱機裝置之容置單元與第一傳輸部的局部結構示意圖。請一併參考圖1與圖2。1 is a schematic structural view of a circuit board automatic heat engine device according to a preferred embodiment of the present invention. 2 is a partial structural diagram of a receiving unit and a first transmitting portion of a circuit board automatic heat engine device according to a preferred embodiment of the present invention. Please refer to Figure 1 and Figure 2 together.
本實施例所提供的電路板自動熱機裝置1用於對電路板2進行熱機,其中電路板2具有第一連接部20。The circuit board automatic heat engine device 1 provided in this embodiment is used to heat the circuit board 2, wherein the circuit board 2 has a first connecting portion 20.
於本實施例中,電路板自動熱機裝置1包括第一傳輸部10、容置單元11、控制單元12、第一承載部14、第二承載部13、第二傳輸部15、第一感應單元16、第二感應單元17、電路板提供單元18以及電路板取出單元19。控制單元12耦接各個部分,以控制各部分的運作。In this embodiment, the circuit board automatic heat engine device 1 includes a first transmission portion 10, a receiving unit 11, a control unit 12, a first carrier portion 14, a second carrier portion 13, a second transmission portion 15, and a first sensing unit. 16. A second sensing unit 17, a circuit board providing unit 18, and a circuit board taking-out unit 19. The control unit 12 is coupled to the various sections to control the operation of the various sections.
於本實施例中,第一傳輸部10具有第一輸入端101與第一輸出端102,第一傳輸部10並包括第一電源提供單元103,用於提供電路板2進行熱機時所需的電源。第一電源提供單元103可包括供電接觸部1030。於本實施例中,第一電源提供單元103可連接至一外接電源(圖未示)以提供220V的電源,供電接觸部1030可為銅軌或銅板,用以傳輸此電源。然而,本發明並不對此作出限制。In this embodiment, the first transmission portion 10 has a first input end 101 and a first output end 102, and the first transmission portion 10 includes a first power supply unit 103 for providing a circuit board 2 for performing a heat engine. power supply. The first power supply unit 103 may include a power supply contact 1030. In this embodiment, the first power supply unit 103 can be connected to an external power source (not shown) to provide 220V power, and the power contact portion 1030 can be a copper rail or a copper plate for transmitting the power. However, the invention is not limited thereto.
於本實施例中,容置單元11用以容置電路板2。如圖1所示,其可具有多個容置格112。每一容置格112可分別承載一個電路板。這些容置格112呈上下等距排列。於本實施例中,容置單元11的材質為電木,並且相鄰兩個容置格112之間存在電木隔板,以使各個電路板間保持電性絕緣。然而,本發明對容置格112的數目與排列方式不作任何限定。In the embodiment, the accommodating unit 11 is used for accommodating the circuit board 2. As shown in FIG. 1, it can have a plurality of compartments 112. Each of the receptacles 112 can carry one circuit board, respectively. These receptacles 112 are arranged equidistantly. In this embodiment, the material of the accommodating unit 11 is bakelite, and an electric baffle is disposed between the adjacent two accommodating cells 112 to maintain electrical insulation between the respective circuit boards. However, the present invention does not limit the number and arrangement of the cells 112.
於本實施例中,容置單元11還包括第二連接部110與第二電源提供單元111。第二連接部110分別耦接第二電源提供單元111與電路板2之第一連接部20。於本實施例中,第二電源提供單元111包括受電接觸部1110與電纜1111。電纜1111分別耦接受電接觸部1110與第二連接部110。In this embodiment, the accommodating unit 11 further includes a second connecting portion 110 and a second power supply unit 111. The second connecting portion 110 is coupled to the second power supply unit 111 and the first connecting portion 20 of the circuit board 2 respectively. In the present embodiment, the second power supply unit 111 includes the power receiving contact 1110 and the cable 1111. The cable 1111 is coupled to receive the electrical contact portion 1110 and the second connecting portion 110, respectively.
於本實施例中,控制單元12控制容置單元11進入第一傳輸部10的第一輸入端101,此時容置單元11藉由第一傳輸部10由第一輸入端101傳送至第一輸出端102。當容置單元11位於第一輸入端101與第一輸出端102之間時,供電接觸部1030接觸受電接觸部1110。藉此,於預定的時間內,第一電源提供單元103可提供電源給第二電源提供單元111。並透過第二連接部110傳輸至電路板2。In this embodiment, the control unit 12 controls the accommodating unit 11 to enter the first input end 101 of the first transmission unit 10, and the accommodating unit 11 is transmitted from the first input terminal 101 to the first by the first transmission unit 10 Output 102. When the accommodating unit 11 is located between the first input end 101 and the first output end 102, the power supply contact portion 1030 contacts the power receiving contact portion 1110. Thereby, the first power supply unit 103 can supply power to the second power supply unit 111 for a predetermined time. And transmitted to the circuit board 2 through the second connecting portion 110.
於其他實施例中,容置單元11包括第二電源提供單元111,且具有多數個端子(圖未示)。電路板2亦具有多數個端子(圖未示),並且電路板2進入容置單元11時,該些端子相互電性接觸。當控制單元12控制容置單元11進入第一輸入端101時,第一電源提供單元103可提供電源給第二電源提供單元111。此時,第二電源提供單元111藉由該些端子將電源傳輸至電路板2。本發明並不對此作出限制。In other embodiments, the accommodating unit 11 includes a second power supply unit 111 and has a plurality of terminals (not shown). The circuit board 2 also has a plurality of terminals (not shown), and when the circuit board 2 enters the accommodating unit 11, the terminals are in electrical contact with each other. When the control unit 12 controls the accommodating unit 11 to enter the first input terminal 101, the first power supply unit 103 can supply power to the second power supply unit 111. At this time, the second power supply unit 111 transmits power to the circuit board 2 through the terminals. The invention is not limited thereto.
於本實施例中,第一承載部14設置於第一輸出端102之一側。如圖1所示,第一輸出端102之左側具有一第一支架組192,第一承載部14設置於第一支架組192。待電路板2完成熱機過程後,控制單元12控制容置單元11進入第一承載部14。In this embodiment, the first carrying portion 14 is disposed on one side of the first output end 102. As shown in FIG. 1 , the first output end 102 has a first bracket set 192 on the left side thereof, and the first load bearing portion 14 is disposed on the first bracket set 192 . After the circuit board 2 completes the heat engine process, the control unit 12 controls the accommodating unit 11 to enter the first carrier portion 14.
於本實施例中,第一支架組192具有一預設的電路板取出位置193,且電路板取出單元19設置於此電路板取出位置193。控制單元12控制第一承載部14移動容置單元11,使得容置單元11進入預設的電路板取出位置193。在控制單元12的控制下,電路板取出單元19可由容置單元11取出電路板2。In the present embodiment, the first bracket set 192 has a predetermined board take-out position 193, and the board take-out unit 19 is disposed at the board take-out position 193. The control unit 12 controls the first carrier portion 14 to move the accommodating unit 11 such that the accommodating unit 11 enters a predetermined board take-out position 193. Under the control of the control unit 12, the circuit board take-out unit 19 can take out the circuit board 2 by the accommodating unit 11.
於本實施例中,電路板取出單元19可包括輸出軌道191與動力裝置(圖未示)。當容置單元11藉由第一承載部14進入預設的電路板取出位置193後,動力裝置將容置格112中的電路板2推入輸出軌道191中。其中輸出軌道191可以根據需要連接不同的收納裝置或其它等效物。In the present embodiment, the circuit board take-out unit 19 may include an output rail 191 and a power unit (not shown). After the accommodating unit 11 enters the preset board take-out position 193 by the first carrying portion 14, the power unit pushes the circuit board 2 in the accommodating box 112 into the output rail 191. The output track 191 can be connected to different storage devices or other equivalents as needed.
例如,電路板2在完成熱機過程後,通常需進入測試產線以進行後續各種功能性測試。此時,則可將輸出軌道191連接測試產線。如此,電路板2可沿著輸出軌道191直接進入測試產線。並且,電路板取出單元19的輸出軌道191還可包括旋轉機構(圖未示),以依據產線的不同高度,對輸出軌道191進行角度調整。For example, after completing the heat engine process, the board 2 typically needs to enter the test line for subsequent functional testing. At this point, the output track 191 can be connected to the test line. As such, the circuit board 2 can enter the test line directly along the output track 191. Moreover, the output track 191 of the board take-out unit 19 may further include a rotating mechanism (not shown) to adjust the angle of the output track 191 according to different heights of the line.
於本實施例中,第二傳輸部15具有第二輸入端151與第二輸出端152。於本實施例中,第二傳輸部15設置於第一傳輸部10上方,即第二輸出端152設置於第一輸入端101上方,第二輸入端151設置於第一輸出端102上方。於其他實施例中,第二傳輸部15也可以設置於第一傳輸部10下方,本發明並不限制第一傳輸部10與第二傳輸部15的相對位置關係。In the embodiment, the second transmission portion 15 has a second input end 151 and a second output end 152. In the embodiment, the second transmission portion 15 is disposed above the first transmission portion 10, that is, the second output end 152 is disposed above the first input end 101, and the second input end 151 is disposed above the first output end 102. In other embodiments, the second transmission portion 15 may also be disposed under the first transmission portion 10, and the present invention does not limit the relative positional relationship between the first transmission portion 10 and the second transmission portion 15.
於本實施例中,待容置單元11中的電路板2取出後,控制單元12可進一步控制第一承載部14移動容置單元11,使得容置單元11由預設的電路板取出位置移動至第二傳輸部15的第二輸入端151。In this embodiment, after the circuit board 2 in the accommodating unit 11 is taken out, the control unit 12 can further control the first accommodating portion 14 to move the accommodating unit 11 so that the accommodating unit 11 is moved by the preset board taking position. To the second input end 151 of the second transmission portion 15.
於本實施例中,第二感應單元17設置於第一支架組192。當第一承載部14將容置單元11移動至第二傳輸部15時,第二感應單元17使得控制單元12控制第二傳輸部15,以將容置單元11由第二輸入端151移動至第二輸出端152。關於第二感應單元17的作動過程,容後詳述。In the embodiment, the second sensing unit 17 is disposed on the first bracket group 192. When the first carrying portion 14 moves the accommodating unit 11 to the second transmitting portion 15, the second sensing unit 17 causes the control unit 12 to control the second transmitting portion 15 to move the accommodating unit 11 from the second input end 151 to Second output 152. The operation process of the second sensing unit 17 will be described in detail later.
於本實施例中,第二承載部13設置於第一輸入端101之一側。如圖1所示,第一輸入端101之右側具有一第二支架組194。與第一承載部14相類似的,第二承載部13設置於此第二支架組194。當容置單元11移動至第二輸出端152時,藉由控制單元12的控制,第二承載部13移動容置單元11。如此,容置單元11可由第二傳輸部15的第二輸出端152進入第一傳輸部10的第一輸入端101。In this embodiment, the second carrying portion 13 is disposed on one side of the first input end 101. As shown in FIG. 1, the first input end 101 has a second bracket set 194 on the right side. Similar to the first carrier portion 14, the second carrier portion 13 is disposed on the second bracket set 194. When the accommodating unit 11 moves to the second output end 152, the second carrier portion 13 moves the accommodating unit 11 by the control of the control unit 12. As such, the accommodating unit 11 can enter the first input end 101 of the first transmission portion 10 by the second output end 152 of the second transmission portion 15.
於本實施例中,第一感應單元16設置於第一輸入端101。當容置單元11到達第一輸入端101時,第一感應單元16使得控制單元12控制第一傳輸部10,以將容置單元11由第一傳輸部10的第一輸入端101移動至第一輸出端102。In the embodiment, the first sensing unit 16 is disposed at the first input end 101. When the accommodating unit 11 reaches the first input terminal 101, the first sensing unit 16 causes the control unit 12 to control the first transmission portion 10 to move the accommodating unit 11 from the first input terminal 101 of the first transmission portion 10 to the first An output 102.
具體來說,於本實施例中,第一感應單元16為壓力傳感器。當容置單元11到達第一輸入端101時,接觸第一感應單元16,此時,第一感應單元16輸出一高準位啟動信號,控制單元12接收此啟動信號,控制第一傳輸部10啟動。第二感應單元17之作動原理與第一感應單元16相同,在此不再贅述。Specifically, in the embodiment, the first sensing unit 16 is a pressure sensor. When the accommodating unit 11 reaches the first input terminal 101, the first sensing unit 16 is contacted. At this time, the first sensing unit 16 outputs a high level activation signal, and the control unit 12 receives the activation signal to control the first transmission unit 10. start up. The operation principle of the second sensing unit 17 is the same as that of the first sensing unit 16, and details are not described herein again.
於本實施例中,電路板提供單元18設置於第一輸入端101之一側。在作業員將待處理的電路板2放置於電路板提供單元18後,在控制單元12的控制下,電路板提供單元18提供電路板2至容置單元11。隨後,藉由第二承載部13,容置單元11可移動至第一傳輸部10的第一輸入端101,以進行後續的熱機操作。關於電路板提供單元18的具體結構與作動過程,容後詳述。In the embodiment, the circuit board providing unit 18 is disposed on one side of the first input end 101. After the operator places the circuit board 2 to be processed on the circuit board providing unit 18, the circuit board providing unit 18 supplies the circuit board 2 to the accommodating unit 11 under the control of the control unit 12. Subsequently, the accommodating unit 11 is movable to the first input end 101 of the first transfer portion 10 by the second carrier portion 13 for subsequent heat engine operation. The specific structure and operation process of the circuit board providing unit 18 will be described in detail later.
圖3繪示為根據本發明一較佳實施例的電路板自動熱機裝置之電路板提供單元的局部結構示意圖。請一併參考圖1。3 is a partial structural diagram of a circuit board providing unit of a circuit board automatic heat engine device according to a preferred embodiment of the present invention. Please refer to Figure 1 together.
於本實施例中,電路板提供單元18包括驅動裝置180與輸入軌道181,且驅動裝置180設置於輸入軌道181之一側。In the present embodiment, the circuit board providing unit 18 includes a driving device 180 and an input track 181, and the driving device 180 is disposed on one side of the input track 181.
於本實施例中,當作業員將電路板2放置於輸入軌道181之一側後,位於另一側之驅動裝置180可將電路板2推入容置單元11的容置格112內。此時,控制單元12可控制第二承載部13下降一預設高度,此預設高度與容置格112之間距相等。隨後,作業員將下一塊待處理的電路板放置於輸入軌道181之一側,並藉由驅動裝置180將其推入容置格112內。以此類推,電路板提供單元18可依次將多個電路板2提供至容置單元11中。In this embodiment, after the operator places the circuit board 2 on one side of the input rail 181, the driving device 180 on the other side can push the circuit board 2 into the receiving compartment 112 of the accommodating unit 11. At this time, the control unit 12 can control the second carrying portion 13 to descend by a predetermined height, and the preset height is equal to the distance between the receiving compartments 112. Subsequently, the operator places the next circuit board to be processed on one side of the input track 181 and pushes it into the housing 112 by the driving device 180. By analogy, the circuit board providing unit 18 can sequentially supply the plurality of circuit boards 2 into the accommodating unit 11.
於本實施例中,驅動裝置180可為氣缸等動力裝置。 於其他實施例中,驅動裝置180可以為其他等效之物,本發明並不對此進行限制。In this embodiment, the driving device 180 can be a power device such as a cylinder. In other embodiments, the driving device 180 may be other equivalents, and the invention is not limited thereto.
於本實施例中,電路板自動熱機裝置1還可包括資料獲取單元182與資料存儲單元(圖未示)。其中,資料獲取單元182耦接控制單元12,用以獲取電路板2之資訊。資料存儲單元耦接資料獲取單元182,用以接收並存儲電路板2之資訊。In this embodiment, the board automatic heat engine device 1 may further include a data acquisition unit 182 and a data storage unit (not shown). The data acquisition unit 182 is coupled to the control unit 12 for acquiring information of the circuit board 2. The data storage unit is coupled to the data acquisition unit 182 for receiving and storing information of the circuit board 2.
於本實施例中,資料獲取單元182可設置於輸入軌道181之一側。於本實施例中,資料獲取單元可設置於電路板提供單元18或電路板取出單元19。本發明對此不作任何限制,只要其可獲取電路板2的資訊即可。In this embodiment, the data acquisition unit 182 can be disposed on one side of the input track 181. In this embodiment, the data acquisition unit may be disposed on the circuit board providing unit 18 or the circuit board taking-out unit 19. The present invention is not limited in this regard as long as it can acquire information of the circuit board 2.
於本實施例中,電路板2包括儲存單元21以及電路板識別標籤22。其中儲存單元21儲存有一測試程式。待電路板2獲得電源後可以在預設時間內執行此測試程式,即進行熱機過程,以測試電路板2是否正常操作。In the present embodiment, the circuit board 2 includes a storage unit 21 and a circuit board identification tag 22. The storage unit 21 stores a test program. After the board 2 is powered, the test program can be executed within a preset time, that is, a heat engine process is performed to test whether the board 2 is operating normally.
於本實施例中,當控制單元12控制電路板提供單元18提供電路板2至容置單元11時,資料獲取單元182用以掃描電路板識別標籤22,以獲取電路板識別碼。此電路板識別碼對應電路板2的型號等參數。In the embodiment, when the control unit 12 controls the circuit board providing unit 18 to provide the circuit board 2 to the accommodating unit 11, the data acquiring unit 182 is configured to scan the circuit board identification tag 22 to obtain the circuit board identification code. This board identification code corresponds to parameters such as the model number of the board 2.
於本實施例中,資料獲取單元182可為一掃描器,用以掃描電路板識別標籤22。於其他實施例中,資料獲取單元182可為照相機或其他等效之裝置。In this embodiment, the data acquisition unit 182 can be a scanner for scanning the circuit board identification tag 22. In other embodiments, the data acquisition unit 182 can be a camera or other equivalent device.
於本實施例中,在資料獲取單元182獲取了電路板識別碼後,會將其儲存至資料存儲單元(圖未示),以記錄 進行熱機過程的電路板的資訊。於本實施例中,資料儲單元可為獨立的存儲卡或集成於控制單元12。本發明對此不作任何限制。In this embodiment, after the data acquisition unit 182 acquires the circuit board identification code, it stores it in the data storage unit (not shown) for recording. Information about the board that performs the thermal process. In this embodiment, the data storage unit can be a separate memory card or integrated into the control unit 12. The invention is not limited in any way.
綜上所述,本實施例所提供的電路板自動熱機裝置可實現電路板熱機過程自動化。根據電路板的不同類型,可預先對電路板自動熱機裝置中的控制單元進行設置,以控制電路板熱機過程在一預定時間內進行。實現批量電路板同時進行熱機過程的操作,解放了人力,並提高了生產效率。In summary, the circuit board automatic heat engine device provided by the embodiment can realize the automation of the circuit board heat engine process. Depending on the type of board, the control unit in the board's automatic thermal unit can be pre-set to control the board's heat engine process for a predetermined period of time. The realization of the batch circuit board and the operation of the heat engine process at the same time frees the manpower and improves the production efficiency.
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,因此本發明的保護範圍當視申請專利範圍所界定者為準。Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention is subject to the definition of the scope of the patent application.
1‧‧‧電路板自動熱機裝置1‧‧‧Circuit automatic heat unit
10‧‧‧第一傳輸部10‧‧‧First Transmission Department
101‧‧‧第一輸入端101‧‧‧ first input
102‧‧‧第一輸出端102‧‧‧ first output
103‧‧‧第一電源提供單元103‧‧‧First power supply unit
1030‧‧‧供電接觸部1030‧‧‧Power Contact
11‧‧‧容置單元11‧‧‧ accommodating unit
110‧‧‧第二連接部110‧‧‧Second connection
111‧‧‧第二電源提供單元111‧‧‧Second power supply unit
1110‧‧‧受電接觸部1110‧‧‧Electrical contact
1111‧‧‧電纜1111‧‧‧ cable
112‧‧‧容置格112‧‧‧容格
12‧‧‧控制單元12‧‧‧Control unit
13‧‧‧第二承載部13‧‧‧Second load bearing department
14‧‧‧第一承載部14‧‧‧First load bearing department
15‧‧‧第二傳輸部15‧‧‧Second transmission department
151‧‧‧第二輸入端151‧‧‧ second input
152‧‧‧第二輸出端152‧‧‧second output
16‧‧‧第一感應單元16‧‧‧First sensing unit
17‧‧‧第二感應單元17‧‧‧Second sensing unit
18‧‧‧電路板提供單元18‧‧‧Board supply unit
180‧‧‧驅動裝置180‧‧‧ drive
181‧‧‧輸入軌道181‧‧‧ input track
182‧‧‧資料獲取單元182‧‧‧Information acquisition unit
19‧‧‧電路板取出單元19‧‧‧Board take-out unit
191‧‧‧輸出軌道191‧‧‧ Output track
192‧‧‧第一支架組192‧‧‧First stent set
193‧‧‧電路板取出位置193‧‧‧Board removal location
194‧‧‧第二支架組194‧‧‧Second bracket set
2‧‧‧電路板2‧‧‧ boards
20‧‧‧第一連接部20‧‧‧First connection
21‧‧‧儲存單元21‧‧‧ storage unit
22‧‧‧電路板識別標籤22‧‧‧Board identification label
圖1繪示為根據本發明一較佳實施例的電路板自動熱機裝置的結構示意圖。1 is a schematic structural view of a circuit board automatic heat engine device according to a preferred embodiment of the present invention.
圖2繪示為根據本發明一較佳實施例的電路板自動熱機裝置之容置單元與第一傳輸部的局部結構示意圖。2 is a partial structural diagram of a receiving unit and a first transmitting portion of a circuit board automatic heat engine device according to a preferred embodiment of the present invention.
圖3繪示為根據本發明一較佳實施例的電路板自動熱機裝置之電路板提供單元的局部結構示意圖。3 is a partial structural diagram of a circuit board providing unit of a circuit board automatic heat engine device according to a preferred embodiment of the present invention.
1...電路板自動熱機裝置1. . . Circuit board automatic heat engine
10...第一傳輸部10. . . First transmission unit
101...第一輸入端101. . . First input
102...第一輸出端102. . . First output
11...容置單元11. . . Housing unit
112...容置格112. . .容格
12...控制單元12. . . control unit
13...第二承載部13. . . Second carrier
14...第一承載部14. . . First carrier
15...第二傳輸部15. . . Second transmission unit
151...第二輸入端151. . . Second input
152...第二輸出端152. . . Second output
16...第一感應單元16. . . First sensing unit
17...第二感應單元17. . . Second sensing unit
18...電路板提供單元18. . . Board supply unit
19...電路板取出單元19. . . Board take-out unit
191...輸出軌道191. . . Output track
192...第一支架組192. . . First bracket set
193...電路板取出位置193. . . Board removal location
194...第二支架組194. . . Second bracket set
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98111077A TWI382186B (en) | 2009-04-02 | 2009-04-02 | Apparatus for automatically powering up circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98111077A TWI382186B (en) | 2009-04-02 | 2009-04-02 | Apparatus for automatically powering up circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201037326A TW201037326A (en) | 2010-10-16 |
| TWI382186B true TWI382186B (en) | 2013-01-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98111077A TWI382186B (en) | 2009-04-02 | 2009-04-02 | Apparatus for automatically powering up circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI382186B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW471022B (en) * | 1999-04-01 | 2002-01-01 | Stk Technology Co Ltd | Test board unit |
| US20030076125A1 (en) * | 2000-09-22 | 2003-04-24 | Mccord Don | Method and system for wafer and device level testing of an integrated circuit |
| US20060236138A1 (en) * | 2005-04-13 | 2006-10-19 | Bieker John J | Methods and apparatus for managing signals during power-up and power-down |
-
2009
- 2009-04-02 TW TW98111077A patent/TWI382186B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW471022B (en) * | 1999-04-01 | 2002-01-01 | Stk Technology Co Ltd | Test board unit |
| US20030076125A1 (en) * | 2000-09-22 | 2003-04-24 | Mccord Don | Method and system for wafer and device level testing of an integrated circuit |
| US20060236138A1 (en) * | 2005-04-13 | 2006-10-19 | Bieker John J | Methods and apparatus for managing signals during power-up and power-down |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201037326A (en) | 2010-10-16 |
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