下進行對位’則無法使2片基板同時位於高倍率相機之焦點 深度内。因此，無法高精度地對位該等基板，而有對位精 度下降的情況。 因此，過去在對位2片基板時，係將該等基板設為與貼 合狀態大致相同的間隔，且在該狀態下用高倍率相機照2片 基板，並根據該照相結果，朝X、γ及0方向驅動其中一基 板，以進行對位。該習知技術顯示於專利文獻1中。 【專利文獻1】日本專利公開公報第2〇01_51284^號 【考务明内】 發明之揭示 發明欲解決之課題 但，若將2片基板設為與貼合狀態大致相同的間隔，則 液晶在2片基板之間會被擠壓而擴散開來，而成為液晶幾乎 充滿基板之間全部的狀態。χ，此時也有其中—基板接觸 到塗布於基板的密賴的情況發生。因此，即使欲根據相 機的照相結果使其中—絲朝水平方向移動，也會因為來 自=述密封劑或液晶的阻力（黏著阻力）而增加移動基板時 所而的力a ’因此’會有無法抵抗該阻力而高精度且平順 地朝水平方向移動其中一基板的情況發生。 而且，右上述黏性阻力比基板的固持力大，則會有基 板在固持基台上偏移移動的収。因此，必減加基板的 口持力且防止‘性阻力造成偏移移動，如此會有用以增加 基板之固持力的成本增加的情況發生。 本發明係提供可以較輕的力量移動其中一基板並高精 xj/yi29 塗布有密封劑5之第1基板3係供給至滴下裝置7。該滴 下裝置7具有可載置第1基板3之機台及配置於該機台上方 之滴下噴嘴（皆未圖示）’且該滴下喷嘴係相對於前述第1基 板3相對地朝X、γ&Ζ方向驅動。藉此’將作為液狀物質（流 » - 體）之液滴狀液晶6以預定配置圖案，例如行列狀滴下供給 至由該第1基板3内面之密封劑5圍住的領域内。If the alignment is performed below, the two substrates cannot be simultaneously placed in the depth of focus of the high magnification camera. Therefore, it is impossible to align the substrates with high precision, and there is a case where the alignment accuracy is lowered. Therefore, in the past, when two substrates were aligned, the substrates were placed at substantially the same interval as the bonding state, and in this state, two substrates were irradiated with a high-magnification camera, and according to the photographing result, toward X, One of the substrates is driven in the γ and 0 directions to perform alignment. This prior art is shown in Patent Document 1. [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A No. Hei No. Hei No. Hei No. Hei No. Hei. No. 01-51284 No. [In the Invention] The object of the invention is to solve the problem. However, when the two substrates are placed at substantially the same interval as the bonding state, the liquid crystal is The two substrates are squeezed and diffused, and the liquid crystal is almost filled with all of the state between the substrates. χ At this time, there is also a case where the substrate is in contact with the substrate applied to the substrate. Therefore, even if it is desired to move the wire in the horizontal direction according to the photographic result of the camera, the force a 'will' may be increased when the substrate is moved due to the resistance (adhesive resistance) from the sealant or the liquid crystal. The fact that one of the substrates is moved in a horizontal direction with high precision and smoothness against the resistance occurs. Further, if the viscous resistance on the right side is larger than the holding force of the substrate, there is a possibility that the substrate is displaced and moved on the holding base. Therefore, it is necessary to reduce the holding force of the substrate and prevent the 'sexual resistance from causing the offset movement, so that the cost for increasing the holding power of the substrate increases. The present invention provides a first substrate 3 in which one of the substrates can be moved with a light force and the high-precision xj/yi29 is coated with the sealant 5, and is supplied to the dropping device 7. The dropping device 7 has a table on which the first substrate 3 can be placed and a dropping nozzle (not shown) disposed above the table, and the dropping nozzle is relatively opposed to the first substrate 3 toward X, γ &; Ζ direction drive. In this manner, the liquid droplets 6 as a liquid material (flow) are supplied in a predetermined arrangement pattern, for example, in a matrix, to a region surrounded by the sealant 5 on the inner surface of the first substrate 3.
於此，供給至前述第1基板3之液晶的高度h係如第4Α 圖所示設定成較密封劑5的高度Η更高。即，只要決定供給 至第1基板3之液晶6的總量，則可用液滴的數量來決定每一 滴液晶6的量’然後藉由該量來決定液晶6每一滴的高度。 因此’藉由依照供給至第1基板3之液晶6的總量來調整液滴 的數量，可設定成h>H〇附帶一提，通常液晶6的高度h為 0·2〜〇.5mm，且密封劑5的高度Η為30~40/zm。 滴有液晶的第1基板3會供給至貼合裝置11。前述第2基 15 板4會與前述第1基板3同時供給至該貼合裝置11。然後，上 述第1基板3與第2基板4係如後所述進行對位並貼合。經貼 合之2片基板3、4會送到未圖示之紫外線照射裝置等，且在 此藉由照射紫外光使密封劑5硬化，藉此接合2片基板3、4。 藉此，可組成在一對基板3、4之間填充有上述液晶6之液晶 2〇 顯示面板。 上述貼合裝置11係如第2圖所示具有腔室12。該腔室12 内係藉由減壓泵10減壓至預定壓力，例如IPa。在腔室12的 其中一側形成有可藉由閘13開關之出入口 14，且前述第1基 板3與第2基板4從該出入口 14進出。 9 1379129 於上述腔室12内設有第1固持機台15。該第1固持機台 15藉由第1驅動源16朝X、Y及0方向驅動。在第1固持機台 15的固持面15a(上面）塗上密封劑5，同時，滴有液晶6之上 述第1基板3以使滴有液晶6之内面朝上之狀態供給至該固 5 持面15a。供給至固持面15a之第1基板3的外面（下面）係藉由 例如靜電力以預定固持力固持於上述固持面15a。 在上述第1固持機台15上方配設有藉由第2驅動源17朝 與第1固持機台15接近與分離之Z方向驅動之第2固持機台 18。上述第2基板4的外面則藉由靜電力固持於該第2固持機 10 台18下面的固持面18a。 在各固持機台15、18分別設有多數電極15b、18b。若 供電至該等電極15b、18b，則可在各固持機台15、18之固 持面15a、18a產生用以固持基板3、4的靜電力。 固持於第1固持機台15與第2固持機台18之固持面 15 15a、18a之第1基板3與第2基板4的四個角落部係利用分別 配設於上述腔室12下方的4組照相機構21(僅顯示2組）照 相。各照相機構21具有第1照相相機22與照相倍率較該第1 照相相機22高之第2照相相機23。 各照相機構21之第1、第2照相相機22、23係藉由具有 20 X、Y及Z機台之對位裝置24朝X、Y及Z方向驅動，且各對 位裝置24係設置於配置於上述腔室12下方之載置板25上。 上述腔室12之底壁之至少與各對位裝置24相向的部位 係形成於透明窗26。配置於上述腔室12内之第1固持機台15 之與上述透明窗26相對應的部位係形成於可藉由上述第 10 1379129 卜第2照相相機22、23照固持於第1固持機台15之固持面… 之第1基板3的四個角落部及隔著第丨基板3固持於上述第2 固持機台18之固持面18a之第2基板4的四個角落部。 在上述第1基板3與第2基板4之較上述密封劑5外側的 5四個角落部上分別設有未圖示之粗略對位標誌與精密對位 標誌。藉由使各基板3、4之粗略對位標誌一致，可粗略地 對位第1基板3與第2基板4，藉由使各基板之精密對位標誌 一致’可精密地對位一對基板3、4。 另，為了照第卜第2基板3、4，在第1固持機台15形成 1〇空洞部27，但亦可不形成空洞部27，而以透光性材料形成 第1固持機台15整體。 如第3圖所示，4組第丨照相相機22與第2照相相機^(第 3圖中僅顯示1組）的照相信號係輸入圖像處理部31且變換 處理為座標信號。經圖像處理部31變換處理之座標信號係 15輸入設於控制裝置32之演算處理部33。在該演算處理部\3 中根據由4組第1照相相機22或第2照相相機23所照的第j、 第2基板3、4之四個角落部之各一對粗略對位標諸或精密對 位標誌的照相信號所得之座標信號算出該等基板3、4之X、 Y及0方向之相對性的位置偏移。 2〇 若藉由上述演算處理部33算出一對基板3、4的位置偏 移，則將該位置偏移記憶在記憶部34,另一方面亦輸出至 驅動部35。藉此，驅動部35將驅動信號輪出至用以驅動第丄 固持機台15之第1驅動源16 ’且朝X方向、γ方向及θ方向 驅動第1固持機台15，以對位第丨基板3與第2基板4。 11 1379129 晶6及密封劑5疊合於第1基板3上。 即，在第2基板4固持於第2固持機台18之狀態下，如第 4D圖所示，第2基板4成為與密封劑5分離之狀態，但，一旦 解除由第2固持機台18所產生之第2基板4的固持狀態，則第 5 2基板4特別是周邊部會因為本身的重量而向下彎曲，且接 觸至密封劑5。 一旦解除第2基板4的固持狀態，則打開流量調整閥37 以將氣體從氣體供給源38供給至腔室12内，藉此使該腔室 12内的壓力上升《藉此，氣體會進入固持狀態業已解除之 10第2基板4與第2固持機台18之固持面18a之間，而藉由業已 疊合之第1、第2基板3、4内外的壓力差加壓第丨、第2基板3、 4 〇 另，所謂第1、第2基板3、4内外的壓力差為由第J、第 2基板3、4與密封劑5所圍住的空間内的壓力與腔室12内的 15 壓力之壓力差。 因此，如第4E圖所示，液晶6會被擠壓而充滿於2片基 板3、4之間，同時該等基板3、4可藉由密封劑5接著。此時’ 第2基板4僅下降液晶6被擠壓的部分。 另，在第4D圖所示之狀態中，若在使第2固持機台18 2〇上升後將氣體導入腔室12内，則在第2固持機台18之固持面 18a與第2基板4上面之間會形成間隙，故可利用導入腔室 之氣體有效而確實地進行第1、第2基板3 ' 4之加壓。 在將氣體供給至上述腔室12内且加壓2片基板3、4時， 控制流量调整閥37之開關程度，使腔室12内的壓力沿著第5 16 1379129 形成之液晶顯示面板的品質。 另，在上述第1實施形態中，基板3、4之精密對位係如 第4D圖所示在第2基板4隔著液晶6與第〗基板3接觸之狀態 下進行’但亦可在第4A圖所示之狀態下進行粗略對位後， 5在使第2基板4下降而接觸至液晶6之前，進行幻次的精密 對位，且在第4D圖之狀態下進行第2次的精密對位。 如此-來，若進行2次精密對位，則相較於】次可提高 對位精度。而且，由於2片基板3、4為非接觸狀態，故可輕 易地進行第1次的對位。 10 2片基板3、4隔著液晶6接觸之狀態下之第2次的精密對 位則由於在第1次的對位時已以相當程度的精度對位該等 基板3、4，而可縮小朝水平方向移動第2基板4的距離。即， 由於可縮小2片基板3、4隔著液晶6接觸之狀態下朝水平方 向移動的距離或者可幾乎不移動，故可輕易且確實地進行 15 對位。 另’亦可僅進行第1次的精密對位而省略第2次的精密 對位。 第ό圖與第7圖係顯示本發明第2實施形態。該實施形態 係如第ό圖所示，設於用以固持第2基板4之第2固持機台18 20之電極分成位於該第2固持機台18之周邊部之第1群G1之電 極18b-l與位於中央部之第2群G2之電極18b-2。第1群G1由8 個電極18b-l所構成’第2群G2由4個電極18b-2所構成。 在利用上述構造之第2固持機台18貼合兩片基板時，以 第7A圖〜第7E圖所示之步驟來進行。首先，在業經減壓之 18 5 5 18且以預定距離分離相 腔至12内’如第以圖所示，粗略對位固持於各固持機台心 向之第1基板3與第2基板 4 接者’如第7B圖所示，使第2固持機㈣下降至第2基 …又於第1基板3之液晶6接觸之前的位置，且在該狀態 下精密對位第丨基板3與第2基板4。 旦精密對位已結束，則停止通電至設於第2IU持機台 18之電極中之第1群G1之電極肌-1。藉此，第2基板4會解 。由靜电力所產生之周邊部的固持狀態。藉此，如第％圖 所不’由於第2基板4的周邊部會向下·彎曲，故第2基板4的 10 周邊。P S接觸到塗布於第！基板3的周邊部的密封劑5。即， 藉由第2基板4的周邊部全部接觸到密封劑5，可密封第i、 第2基板3、4間的空間s。 接著’停止通電至第2固持機台18之第2群〇2之電極 18b-2。藉此，如第7D圖所示，第2基板*會與第2固持機台 15 18分離並與供給至第1基板3之液晶6接觸。 一旦解除第2基板4之固持狀態，則將氣體供給至腔室 12内’且使該腔室12内的壓力緩緩地上升至大氣壓。此時 之腔室12内的壓力係沿著第5圖的直線X或曲線γ所示之分 布圖緩緩地上升。 20 由於將氣體供給至腔室12内，藉此加壓第2基板4，故 可如第7E圖所示貼合2片基板3、4。在貼合時，由於2片基 板3、4的周邊部在氣體供給至腔室12内之前已藉由密封劑5 接觸，故在將氣體供給炱腔室12内以加壓時，可確實地防 止氣體進入2片基板3、4之間而殘留下來。 19 1379129 在上述例子令也可以較輕的力量高精度地對位2片基 …同時#使在第1固持機台15與第2固持機台18之 =有平坦度不均時，也不會受_平坦度不均所造成的影 5Here, the height h of the liquid crystal supplied to the first substrate 3 is set to be higher than the height Η of the sealant 5 as shown in Fig. 4 . That is, as long as the total amount of the liquid crystals 6 supplied to the first substrate 3 is determined, the amount of liquid crystals 6 per droplet can be determined by the number of droplets. Then, the height of each droplet of the liquid crystals 6 is determined by the amount. Therefore, by adjusting the number of liquid droplets according to the total amount of the liquid crystals 6 supplied to the first substrate 3, it can be set to h>H〇, and usually the height h of the liquid crystal 6 is 0·2 to 〇.5 mm. And the height Η of the sealant 5 is 30 to 40/zm. The first substrate 3 on which the liquid crystal is dropped is supplied to the bonding apparatus 11. The second substrate 15 is supplied to the bonding apparatus 11 simultaneously with the first substrate 3. Then, the first substrate 3 and the second substrate 4 are aligned and bonded as described later. The two substrates 3 and 4 to be bonded are sent to an ultraviolet irradiation device or the like (not shown), and the sealing agent 5 is cured by irradiation of ultraviolet light, thereby joining the two substrates 3 and 4. Thereby, a liquid crystal display panel in which the liquid crystal 6 is filled between the pair of substrates 3 and 4 can be formed. The bonding apparatus 11 has a chamber 12 as shown in Fig. 2 . The chamber 12 is depressurized by a pressure reducing pump 10 to a predetermined pressure, such as IPa. On one side of the chamber 12, an inlet and outlet 14 through which the shutter 13 is opened and closed is formed, and the first substrate 3 and the second substrate 4 are introduced in and out of the inlet and outlet 14. 9 1379129 A first holding machine 15 is provided in the chamber 12. The first holding machine 15 is driven in the X, Y, and 0 directions by the first driving source 16. The sealant 5 is applied to the holding surface 15a (upper surface) of the first holding machine table 15, and the first substrate 3 on which the liquid crystal 6 is dropped is supplied to the solid state in a state where the inner surface of the liquid crystal 6 is dropped upward. Hold face 15a. The outer surface (lower surface) of the first substrate 3 supplied to the holding surface 15a is held by the holding surface 15a with a predetermined holding force by, for example, an electrostatic force. A second holding machine 18 that is driven in the Z direction that is close to and separated from the first holding machine 15 by the second driving source 17 is disposed above the first holding machine 15 . The outer surface of the second substrate 4 is held by the holding surface 18a on the lower surface of the second holding machine 10 by electrostatic force. A plurality of electrodes 15b and 18b are provided in each of the holding machines 15 and 18, respectively. When the electrodes 15b and 18b are supplied to the electrodes, the electrostatic forces for holding the substrates 3 and 4 can be generated on the holding surfaces 15a and 18a of the holding machines 15 and 18. The four corner portions of the first substrate 3 and the second substrate 4 that are held by the first holding table 15 and the holding surfaces 15 15a and 18a of the second holding table 18 are disposed under the chamber 12, respectively. The group camera 21 (only two groups are shown) is photographed. Each of the photographing mechanisms 21 has a first photographing camera 22 and a second photographing camera 23 having a higher photographing magnification than the first photographing camera 22. The first and second camera cameras 22 and 23 of each camera unit 21 are driven in the X, Y, and Z directions by the aligning device 24 having the 20 X, Y, and Z machines, and each of the aligning devices 24 is disposed at It is disposed on the mounting plate 25 below the chamber 12. At least a portion of the bottom wall of the chamber 12 facing each of the alignment devices 24 is formed in the transparent window 26. The portion of the first holding machine 15 disposed in the chamber 12 corresponding to the transparent window 26 is formed by being held by the first camera unit 22, 23 and held by the first holding machine The four corner portions of the first substrate 3 of the holding surface of the first substrate 3 and the four corner portions of the second substrate 4 that are held by the second substrate 3 on the holding surface 18a of the second holding machine 18 are interposed. A rough alignment mark and a precision alignment mark (not shown) are provided on the five corner portions of the first substrate 3 and the second substrate 4 which are outside the sealant 5, respectively. By aligning the rough alignment marks of the respective substrates 3 and 4, the first substrate 3 and the second substrate 4 can be roughly aligned, and the precise alignment marks of the substrates can be aligned to precisely align a pair of substrates. 3, 4. Further, in order to form the first hollow portion 27 in the first holding table 15 in accordance with the second substrate 3, 4, the first holding table 15 may be formed of a light transmissive material without forming the hollow portion 27. As shown in Fig. 3, the photographic signals of the four sets of the second camera 22 and the second camera (only one set is shown in Fig. 3) are input to the image processing unit 31 and converted into coordinate signals. The coordinate signal system 15 converted by the image processing unit 31 is input to the arithmetic processing unit 33 provided in the control device 32. In the arithmetic processing unit \3, each pair of the four corner portions of the jth, second substrate 3, and 4 illuminated by the four sets of the first camera 22 or the second camera 23 is roughly aligned with each other or The coordinate signal obtained by the photographic signal of the precision alignment mark calculates the positional shift of the relative orientation of the X, Y and 0 directions of the substrates 3 and 4. When the positional deviation of the pair of substrates 3 and 4 is calculated by the above-described arithmetic processing unit 33, the positional deviation is stored in the memory unit 34, and is also output to the drive unit 35. Thereby, the drive unit 35 rotates the drive signal to the first drive source 16' for driving the second holding table 15, and drives the first holding machine 15 in the X direction, the γ direction, and the θ direction to match the position. The substrate 3 and the second substrate 4 are formed. 11 1379129 The crystal 6 and the sealant 5 are laminated on the first substrate 3. In other words, in the state in which the second substrate 4 is held by the second holding machine 18, as shown in FIG. 4D, the second substrate 4 is separated from the sealant 5, but the second holding machine 18 is released. In the state in which the second substrate 4 is held, the fifth substrate 4, particularly the peripheral portion, is bent downward due to its own weight and comes into contact with the sealant 5. When the holding state of the second substrate 4 is released, the flow rate adjusting valve 37 is opened to supply the gas from the gas supply source 38 into the chamber 12, thereby increasing the pressure in the chamber 12. "The gas is then retained. Between the 10th substrate 4 and the holding surface 18a of the second holding machine 18, the state has been released, and the pressure difference between the inside and the outside of the first and second substrates 3 and 4 which have been overlapped is pressed to the second and second. In the substrates 3 and 4, the pressure difference between the inside and the outside of the first and second substrates 3 and 4 is the pressure in the space surrounded by the Jth and second substrates 3 and 4 and the sealant 5, and the pressure in the space in the chamber 12. 15 Pressure difference between pressures. Therefore, as shown in Fig. 4E, the liquid crystal 6 is squeezed to be filled between the two substrates 3, 4, and the substrates 3, 4 can be followed by the sealant 5. At this time, the second substrate 4 only lowers the portion where the liquid crystal 6 is pressed. In the state shown in FIG. 4D, when the second holding machine 18 2 is raised and the gas is introduced into the chamber 12, the holding surface 18a of the second holding table 18 and the second substrate 4 are placed. Since a gap is formed between the upper surfaces, the gas introduced into the chamber can be used to effectively and reliably pressurize the first and second substrates 3'4. When the gas is supplied into the chamber 12 and the two substrates 3 and 4 are pressurized, the degree of switching of the flow regulating valve 37 is controlled, and the pressure in the chamber 12 is along the quality of the liquid crystal display panel formed in the fifth 16 1379129. . Further, in the above-described first embodiment, the precise alignment of the substrates 3 and 4 is performed in a state where the second substrate 4 is in contact with the first substrate 3 via the liquid crystal 6 as shown in FIG. 4D. After the rough alignment is performed in the state shown in FIG. 4A, 5 before the second substrate 4 is lowered and brought into contact with the liquid crystal 6, the precise alignment of the magic is performed, and the second precision is performed in the state of FIG. 4D. Counterpoint. In this way, if the precision alignment is performed twice, the alignment accuracy can be improved compared to the second time. Further, since the two substrates 3 and 4 are in a non-contact state, the first alignment can be easily performed. The second precision alignment in the state in which the two substrates 3 and 4 are in contact with each other via the liquid crystal 6 is such that the substrates 3 and 4 are aligned with a considerable degree of accuracy in the first alignment. The distance in which the second substrate 4 is moved in the horizontal direction is reduced. In other words, since the distance between the two substrates 3 and 4 in the horizontal direction in contact with the liquid crystal 6 can be reduced or the movement can be hardly performed, the 15 alignment can be easily and surely performed. Alternatively, the first precise alignment can be performed and the second precise alignment can be omitted. The second embodiment and the seventh embodiment show a second embodiment of the present invention. In this embodiment, as shown in the figure, the electrode provided in the second holding table 1820 for holding the second substrate 4 is divided into the electrode 18b of the first group G1 located at the peripheral portion of the second holding machine 18. -l and the electrode 18b-2 of the second group G2 located at the center. The first group G1 is composed of eight electrodes 18b-1. The second group G2 is composed of four electrodes 18b-2. When the two substrates are bonded to each other by the second holding machine 18 having the above-described structure, the steps shown in Figs. 7A to 7E are performed. First, the phase cavity is separated by a predetermined distance from 18 5 5 18 to 12 within a predetermined distance. As shown in the figure, the first substrate 3 and the second substrate 4 are held in a substantially opposite position to the center of each holding machine. As shown in FIG. 7B, the second holding device (four) is lowered to the second base ... and the position before the liquid crystal 6 of the first substrate 3 is contacted, and in this state, the precision alignment of the second substrate 3 and the first 2 substrate 4. When the precision alignment has been completed, the energization to the electrode muscle-1 of the first group G1 provided in the electrode of the second IU holding table 18 is stopped. Thereby, the second substrate 4 is resolved. The state of holding of the peripheral portion caused by the electrostatic force. Therefore, the peripheral portion of the second substrate 4 is bent downward as shown in the ninth figure, so that the periphery of the second substrate 4 is 10 . P S contact is applied to the first! The sealant 5 of the peripheral portion of the substrate 3. In other words, by the entire peripheral portion of the second substrate 4 contacting the sealant 5, the space s between the i-th and second substrates 3 and 4 can be sealed. Then, the energization to the electrode 18b-2 of the second group 〇2 of the second holding machine 18 is stopped. As a result, as shown in Fig. 7D, the second substrate * is separated from the second holding table 15 18 and is in contact with the liquid crystal 6 supplied to the first substrate 3. When the holding state of the second substrate 4 is released, the gas is supplied into the chamber 12, and the pressure in the chamber 12 is gradually raised to the atmospheric pressure. The pressure in the chamber 12 at this time gradually rises along the map indicated by the straight line X or the curve γ in Fig. 5 . Since the second substrate 4 is pressurized by supplying the gas into the chamber 12, the two substrates 3 and 4 can be bonded as shown in Fig. 7E. At the time of bonding, since the peripheral portions of the two substrates 3 and 4 are contacted by the sealant 5 before the gas is supplied into the chamber 12, when the gas is supplied into the chamber 12 for pressurization, it is surely The gas is prevented from entering between the two substrates 3 and 4 and remaining. 19 1379129 In the above example, it is also possible to accurately align the two bases with a lighter force. At the same time, when the first holding machine 15 and the second holding machine 18 have flatness unevenness, Affected by _ flatness unevenness 5
10 2而可進行均勻的加壓，因此，可以均㈣厚度貼合2片 基板3、4。 本發月並不限於上述各實施形態，雖然利用靜電力將 例如第！基板固持於下部固持機台，但亦可在下部固持心 上面貼上橡膠特性板’且藉由該彈性板的摩擦力使第以 板無法移動_持於下部_機台上。該彈性板的大小可 與下部H3賴台大致相等，或者村分料从區塊。 另’為了使第1基板3在彈性板表面（固持面)上與彈性板 容易分離，板宜❹非轉性的材質，或者在表面施 加可降低黏著力之加工。 在上述第2實施形態中針對由—對基板3、4形成i個液 15晶顯示面板之所謂一面的情況作說明，但也有由一對美板 3、4形成多數液晶顯示面板之多面的情況。在多面時，如 第8圖所示，密封劑5以多數矩形框狀塗布於第丨，基板3，同 時在該第1基板3周邊部以矩形框狀塗有替代密封劑5 &。 此時，在第7C圖之步驟中，由於第2基板4之周邊部與 20替代密封劑5a接觸’故即使在多面的情況下，執行第i、第 2實施形態也是有效的。 另’在本發明中’即使將密封劑塗布於第2基板或兩基 板也沒有關係’而且，液晶也可滴至第2基板或兩基板。 雖然朝上下方向驅動上部固持機台，但亦可朝上下方 21 1379129 向驅動下部固持機台，再者，亦可朝上下方向驅動兩固持 機台。 在上述實施形態中，雖然以利用密封劑貼合第1基板與 第2基板為例作說明，但密封劑亦可設有用以接著第1基板 5 與第2基板之接著劑，且利用該接著劑貼合兩片基板，且密 封劑亦可使用至少具有可密封液晶的功能者。 又，雖然以液晶顯示面板之組成裝置為例作說明，但 亦可適用於其他顯示器面板，例如有機電場發光顯示面板 之組成裝置。 10 【圖式簡單說明】 第1圖係有關於本發明之第1實施形態之液晶顯示器面 板之組成裝置之概略圖。 第2圖係顯示用以貼合一對基板之貼合裝置的概略構 造之縱截面圖。 15 第3圖係顯示貼合裝置之控制系統的方塊圖。 第4A圖〜第4E圖係顯示貼合兩片基板之步驟的說明 圖。 第5圖係將氣體導入腔室内使壓力上升時之說明圖。 第6圖係顯示本發明第2實施形態之第2固持機台的平 20 面圖。 第7A圖〜第7E圖係顯示利用第6圖所示之固持機台貼 合兩片基板時之步驟的說明圖。 第8圖係顯示塗布於多面之第1基板的密封劑之說明 圖。 22 1379129Since the pressure can be uniformly applied to 10 2 , the two substrates 3 and 4 can be bonded to each other (iv). This month is not limited to the above embodiments, and the use of electrostatic force will be, for example, the first! The substrate is held by the lower holding machine, but the rubber characteristic plate ' can be attached to the lower holding core and the first plate cannot be moved by the frictional force of the elastic plate_held on the lower_machine. The elastic plate may be approximately equal in size to the lower H3 table, or the village material may be divided into blocks. Further, in order to allow the first substrate 3 to be easily separated from the elastic plate on the surface (sustention surface) of the elastic plate, the plate is preferably made of a non-rotating material or a surface for reducing the adhesion. In the second embodiment, the case where the so-called one surface of the liquid crystal display panel is formed by the pair of substrates 3 and 4 will be described. However, there are cases where a plurality of liquid crystal display panels are formed by a pair of beautiful plates 3 and 4. . In the case of a plurality of faces, as shown in Fig. 8, the sealant 5 is applied to the second substrate in a plurality of rectangular frames, and the sealing member 5 is applied to the peripheral portion of the first substrate 3 in a rectangular frame shape instead of the sealant 5 & At this time, in the step of Fig. 7C, since the peripheral portion of the second substrate 4 is in contact with the sealing agent 5a instead of the sealing agent 5a, it is effective to perform the i-th and second embodiments even in the case of a plurality of faces. Further, in the present invention, it is not necessary to apply the sealant to the second substrate or the two substrates. Further, the liquid crystal may be dropped onto the second substrate or the two substrates. Although the upper holding table is driven in the up and down direction, the lower holding table can be driven toward the upper and lower sides 21 1379129, and the two holding tables can be driven in the up and down direction. In the above embodiment, the first substrate and the second substrate are bonded together by a sealant. However, the sealant may be provided with an adhesive for adhering the first substrate 5 and the second substrate, and the adhesive may be used. The agent is applied to the two substrates, and the sealant can also use a function having at least a liquid crystal sealable. Further, although the constituent device of the liquid crystal display panel has been described as an example, it can also be applied to other display panels, such as a constituent device of an organic electric field light-emitting display panel. [Brief Description of the Drawings] Fig. 1 is a schematic view showing a configuration of a liquid crystal display panel according to a first embodiment of the present invention. Fig. 2 is a longitudinal cross-sectional view showing a schematic configuration of a bonding apparatus for bonding a pair of substrates. 15 Figure 3 is a block diagram showing the control system of the laminating device. 4A to 4E are explanatory views showing the steps of bonding two substrates. Fig. 5 is an explanatory view showing a case where a gas is introduced into a chamber to raise the pressure. Fig. 6 is a plan view showing a second holding machine of the second embodiment of the present invention. Figs. 7A to 7E are explanatory views showing the steps when the two substrates are bonded by the holding machine shown in Fig. 6. Fig. 8 is an explanatory view showing a sealant applied to a first substrate having a plurality of faces. 22 1379129
【圖式之主要元件代表符號表】 1...組成裝置 18b-l…第1群G1之電極 2...塗布裝置 18b-2...第2群G2之電極 3...第1基板 21...照相機構 4...第2基板 22…第1照相相機 5...密封劑 23...第2照相相機 5a...替代密封劑 24...對位裝置 6...液晶 25...載置板 7...滴下裝置 26...透明窗 10...減壓泵 27...空洞部 11...貼合裝置 31...圖像處理部 12...腔室 32…控制裝置 13...閘 33...演算處理部 14...出入口 34...記憶部 15…第1固持機台 35...驅動部 15a...固持面 37...流量調整閥 15b、18b...電極 38...氣體供給源 16...第1驅動源 h...液晶的南度 17...第2驅動源 H...密封劑的高度 18…第2固持機台 18a...固持面 S··.第1 '第2基板間之空間 23[Main component representative symbol table of the drawing] 1...Composed device 18b-1; Electrode 2 of the first group G1... Coating device 18b-2... Electrode 3 of the second group G2... 1st Substrate 21...photographing mechanism 4...second substrate 22...first camera 5...sealant 23...second camera 5a...instead of sealant 24...alignment device 6. .. liquid crystal 25...mounting plate 7...drip device 26...transparent window 10...decompression pump 27...cavity portion 11...bonding device 31...image processing unit 12...chamber 32...control device 13...gate 33...calculation processing unit 14...inlet and exit 34...memory unit 15...first holding machine 35...drive unit 15a... Holding surface 37...flow regulating valve 15b, 18b...electrode 38...gas supply source 16...first driving source h...nandrical 17 of liquid crystal...second driving source H.. The height of the sealant 18...the second holding table 18a...the holding surface S··.the space between the first 'second substrate 23