NVT-2006-146 23346twf.doc/e 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種軟性電路板，且特別是有關於一 種考量靜電放電防護之軟性電路板。 ' 【先前技術】 薄膜覆晶(Chip On Flex，以下簡稱c〇F)之接合結構乃 將驅動器積體電路以覆晶方式封裝於軟性電路板上，再與 顯示面板接合。因此，COF可達到縮小尺寸與整合多功^ 晶片組之目的。圖1說明傳統COF之佈局圖。一條軟性美 板100上有數個驅動器積體電路110，每個驅動器積體^ 路110内部接腳經由印刷在基板100上的導線連結至焊墊 101或102,以便與顯示面板或印刷電路板接合用。驅動器 積體電路110以COF技術配置在軟性基板1〇〇上。藉由印 刷在基板100上的導線，積體電路11〇可以電性連接至焊 墊101與102。基板100上還有一些導線是直接電性連接 於焊墊101與102之間而不需要經過積體電路11〇的。待 完成COF封裝後，便可以沿著切割線1〇3將軟性電路板 104裁切下來。裁切後之軟性電路板104便可以配置在顯 示面板與印刷電路板之間。 圖2是說明連接在顯示面板210與印刷電路板22〇之 間的軟性電路板104。請同時參照圖丨與圖2,軟性電路板 104之焊塾1〇1輕接至顯示面板21〇，而軟性雷路妬 之焊墊102則耦接至印刷電路板220。因此，印刷電路板 220可以經由焊墊1〇2將影像資料與控制信號傳送給驅動 1378744 NVT-2006-146 23346twf.doc/e 器積體電路110。驅動器積體電路110可以經由焊墊1〇1 將驅動仏號傳送給顯示面板210。當然，印刷電路板22〇 亦可以經由焊塾1〇2與焊墊1〇1直接將某些信號直接傳送 給顯示面板210而不需要經過積體電路11()。 圖1所示傳統軟性電路板104並未考慮到在生產線 上，環境產生之靜電對積體電路11〇的破壞影響。因此需 要有效的靜電放電防護手段來保護軟性電路板1〇4上的積 • 體電路。圖3為中華民國專利公告號1228819專利案所揭 露之解決方案。基板300之軟性電路板3〇4透過焊墊3〇2 與印刷在基板300上的導線與導電保護線3〇5相接。藉由 導電保護線305，軟性電路板3〇4可以將靜電導引至生產 線機台，以達到電磁靜電防治功用。待完成c〇F封裝後， 便可以沿著切割線303將軟性電路板304裁切下來。由於 已經將導電保護線305裁掉了，因此裁切後軟性電路板1〇4 之操作並不會受到導電保護線305所影響。 然而，傳統COF軟性電路板並未考慮到在組裝過程所 發生之靜電對積體電路的破壞影響。圖4是說明傳統軟性 電路板400在組裝過程所發生之靜電放電事件。液晶顯示 面板或印刷電路板常常會因為生產環境不佳而大量累積靜 電荷。在將傳統軟性電路板4〇〇電性連接在液晶顯示面板 與印刷電路板之間後’累積在液晶顯示面板之靜電會經由 導線401瞬間流向印刷電路板；或者，印刷電路板之靜電 會經由導線401瞬間流向液晶顯示面板β在靜電流通過導 線401的過程中’靜電會耦合至較靠近導線4〇1之積體電 6 1378744 NVT-2006-146 23346twf.doc/e 路斗川所連接之導線 放電而損毀（damage) 【發明内容】 防供—種考量靜電放電崎之倾電路板，以 :Γ於軟性電路板上之防護標的物不因靜電上損 本發明提出一種考量靜電放電防譯 以電性連接於第-基板與第二基板之;路板，用 括元件配置區、第—電⑽彳f電路板包 ==配=配η少-二= ;j:電:路 。靜魏電防料體喊於第—電性路徑盘^ ^且與第一、第二電性路徑絕緣。。一 性連接至焊電=導趙電 來電性連接㈣護標的物之電源接腳。〃㈣可以被用 括第實施例中’上述之軟性電路板可以更包 第-電性路"=護導體。第二靜電放電防護導體配置於 H生，與第二電性路經之間，且絕緣於第— 第二靜電放_ 可以被用來電性連接至該防護標第=源=焊塾 7 丄 J / Ο / Η·Η NVT-2006-146 23346twf.d〇c/e 電放二路徑與第二電性路徑之間配置^ 擗备笙一發w 匕了以發揮保護（Shielding)功能而 \ |之靜電耦合至第二電性路徑，進而避免 "勿例如積體電路）内部因靜電放電而損毁。 餘之上簡徵和優點能更_易懂’下文特 牛較，並配合所附圖式，作詳細說明如下。 【實施方式】NVT-2006-146 23346twf.doc/e IX. Description of the Invention: [Technical Field] The present invention relates to a flexible circuit board, and more particularly to a flexible circuit board that considers electrostatic discharge protection. [Prior Art] The bonding structure of Chip On Flex (c〇F) is to package the driver integrated circuit on a flexible circuit board in a flip chip manner, and then bond it to the display panel. Therefore, COF can achieve the purpose of downsizing and integrating multi-function chipsets. Figure 1 illustrates a layout of a conventional COF. A flexible stencil 100 has a plurality of driver integrated circuits 110, and each of the driver integrated circuit 110 pins is connected to the pads 101 or 102 via wires printed on the substrate 100 for bonding with the display panel or the printed circuit board. use. The driver integrated circuit 110 is disposed on the flexible substrate 1A by COF technology. The integrated circuit 11A can be electrically connected to the pads 101 and 102 by printing the wires on the substrate 100. There are also some wires on the substrate 100 that are directly electrically connected between the pads 101 and 102 without passing through the integrated circuit 11 . After the COF package is completed, the flexible circuit board 104 can be cut along the cutting line 1〇3. The cut flexible circuit board 104 can be disposed between the display panel and the printed circuit board. Figure 2 is a diagram showing a flexible circuit board 104 connected between the display panel 210 and the printed circuit board 22A. Referring to FIG. 2 and FIG. 2, the soldering pad 1〇1 of the flexible circuit board 104 is lightly connected to the display panel 21〇, and the solder pad 102 of the soft lightning path is coupled to the printed circuit board 220. Therefore, the printed circuit board 220 can transmit the image data and control signals to the drive 1378744 NVT-2006-146 23346 twf.doc/e integrated circuit 110 via the pads 1〇2. The driver integrated circuit 110 can transmit the driving nickname to the display panel 210 via the pad 1〇1. Of course, the printed circuit board 22 can also directly transmit certain signals directly to the display panel 210 via the bonding pads 1〇2 and the pads 1〇1 without passing through the integrated circuit 11(). The conventional flexible circuit board 104 shown in Fig. 1 does not take into account the damage of the static electricity generated on the production line to the integrated circuit 11A on the production line. Therefore, effective electrostatic discharge protection is required to protect the integrated circuit on the flexible circuit board 1〇4. Figure 3 is a solution disclosed in the Patent Publication No. 1228819 of the Republic of China. The flexible circuit board 3〇4 of the substrate 300 is connected to the conductive protection wires 3〇5 through the pads 3〇2 and the wires printed on the substrate 300. With the conductive protection wire 305, the flexible circuit board 3〇4 can guide the static electricity to the production line machine to achieve the electromagnetic static prevention function. After the c〇F package is completed, the flexible circuit board 304 can be cut along the cutting line 303. Since the conductive protection line 305 has been cut, the operation of the flexible circuit board 1〇4 after cutting is not affected by the conductive protection line 305. However, conventional COF flexible boards do not take into account the effects of static electricity on the integrated circuit during assembly. Figure 4 is an illustration of an electrostatic discharge event that occurs with conventional flexible circuit board 400 during assembly. Liquid crystal panels or printed circuit boards often accumulate large amounts of static charge due to poor production environments. After the conventional flexible circuit board 4 is electrically connected between the liquid crystal display panel and the printed circuit board, the static electricity accumulated on the liquid crystal display panel instantaneously flows to the printed circuit board via the wire 401; or the static electricity of the printed circuit board is passed through The wire 401 instantaneously flows to the liquid crystal display panel β. During the process of electrostatic current flowing through the wire 401, the static electricity is coupled to the integrated electrical energy 6 1378744 NVT-2006-146 23346 twf.doc/e Ludouchuan The wire is discharged and damaged. [Invention] The anti-supply method considers the electrostatic discharge board of the electric discharge board, so that the protection object on the flexible circuit board is not damaged by static electricity. The present invention proposes an electrostatic discharge prevention translation. Electrically connected to the first substrate and the second substrate; the circuit board, including the component arrangement area, the first electric (10) 彳f circuit board package == match = with η less - two =; j: electricity: road. The static Wei electric material body is shouted on the first electrical path disk ^ ^ and is insulated from the first and second electrical paths. . Uniform connection to the welding power = guide Zhao electric call connection (4) power supply pin of the protection object. 〃 (4) can be used in the first embodiment. The above flexible circuit board can further include a first-electric path " The second electrostatic discharge protection conductor is disposed between the H and the second electrical path, and is insulated from the second electrostatic discharge _ can be electrically connected to the protection target = source = welding 塾 7 丄 J / Ο / Η·Η NVT-2006-146 23346twf.d〇c/e Between the two paths of the power amplifier and the second electrical path ^ 擗 笙 笙 发 以 以 以 以 以 以 以 发挥 发挥 发挥 发挥 发挥 发挥 发挥The electrostatic coupling to the second electrical path avoids damage to the interior due to electrostatic discharge. On the other hand, the simplification and advantages can be more _ easy to understand. The following is a detailed description of the following. [Embodiment]
^以下將以COF之接合結構來做為軟性電路板之實施 範例’使用本發明者當可依據其需求而制其他種類之軟 性電路板’其亦屬於本發明之範疇。如前所述，C〇；p乃將 積體電路以覆晶方式封裝於軟性基板上。例如液晶顯示面 板與印刷電路板之間的連接線，便可以使用c〇F來連接。 由於驅動器積體電路是配置在軟性電路板上，因此C0F 可達到縮小印刷電路板尺寸與整合多功能晶片組目的。 COF電路板可以是為銅與聚醯亞胺組合之兩層 結構’其具有耐熱性佳，透明度高，具可撓性佳之優點。 圖5是依照本發明說明一種考量靜電放電防護之軟性 電路板的實施範例。軟性電路板500可以被用來電性連接 於第一基板與第二基板之間。例如，軟性電路板500可以 被用來電性連接於液晶顯示面板與印刷電路板（printed circuit board，PCB)之間，亦可以被用來電性連接於印刷 電路板與印刷電路板之間。以下諸實施例將以顯示面板來 實施「第一基板」，而以印刷電路板來實現「第二基板」。 8 1378744 NVT-2006-146 23346twf.doc/e 圖5中僅以少量黑實線表示印刷在軟性電路板$⑻上 的導線。軟性電路板500包括元件配置區51〇、第一電性 路徑520、第二電性路徑53〇以及靜電放電防護導體。 在軟性電路板5GG之基板上配置有連接於顯示面板與印刷 電路板之間的多條第-電性路徑，以提供顯示面板與印刷 ^路板之間的信號傳導路徑。例如，印刷電路板可以透過 焊墊501、第一電性路徑52〇以及焊墊5〇2電性連接至顯 • 示面板。在軟性電路板500之基板上另配置有連接於顯示 面板與元件配置區510之間，以及連接於元件配置區51〇 ，印刷電路板之間的多條第二電性路徑’以提供元件配置 區510與印刷電路板（或顯示面板）之間的信號傳導路徑。 例如，元件配置區510可以透過焊墊5〇3、第二電性路徑 530以及焊墊504電性連接至顯示面板。 元件配置區510可以被用來配置至少一防護標的物。 此防護標的物可能是積體電路（例如驅動器）或是其他元 _ 牛在此將以驅動器積體電路（integmed circuit，ic ) 61 〇 來代表防護標的物。圖6是依照本發明說明圖5之軟性電 路板配置至少一防護標的物的實施範例。請同時參照圖5 與圖6，驅動器積體電路61〇是以覆晶方式配置在元件配 置區510上，並與元件配置區51〇内的焊墊相連接。因此 驅動器積體電路610可以透過配置在軟性電路板5〇〇之基 板上的多條第二電性路徑來連接到印刷電路板以及顯示面 板。例如，驅動器積體電路61〇可以透過焊墊5〇3、第二 電f·生路徑530以及焊墊504電性連接至顯示面板。 9 ^^2006-146 23346twf.d〇c/e 二恭^^防護導體540配置於第—電性路徑520與第 導二53G之間且三者相互絕緣。此靜電放電防護 以是鋼妓其他導電物質。靜電放電防 可嗔保護㈤eMing)功能而避免第一電 護俨二“之靜電耦合至第二電性路徑530 ’進而避免防 私的物（例如積體電路⑽）内部因靜電放電而損毀。 於本實施例令，靜電放電防護導體54〇可以被電性連 體510内的焊塾（此焊塾用以電性連接至積 β_电 之電源接腳）。例如，靜電放電防護導體540 ^以透過焊塾505電性連接至驅動器積體電路61〇之電源 :。因此，當靜電放電自第一電性路徑52〇耦合至靜電 放电防遵導體54G時，靜電流會經過驅動ϋ積體電路610 内部=電源軌線VDD而被導引至印刷電路板，或者經過 ，動讀體1路61〇㈣之電雜線VDD、靜電放電防護 二路、電源轨線GND而被導引至印刷電路板。當然，亦 可=在軟性電路板500上配置接地電性路徑（未繪示）， 使靜電流經過靜電放電防護導體540、焊墊5 05、接地電性 路徑（未繪示）而被導引至印刷電路板，而避免靜電流竄 入驅動器積體電路61〇。因此，靜電放電防護導體54〇可 以減少靜電放電耦合至第二電性路徑530的機率。且本實 施例不需要改變「印刷電路板與軟性電路板500之間的接 觸端子」或「顯示面板與軟性電路板500之間的接觸端 子」’僅須改變軟性電路板500之佈局。 1378744 NVT-2006-146 23346twf.doc/e 積銅St圖6)所t之靜電放電防護導體540是以大面 530之間，生路經520與第二電性路經 當可依據其需二ί他=本發明者 C4n 乃式只現靜電放電防護導體 117是依照本發明朗辦量靜電放電防 是二實施範例。此實施例之軟性電路板700 =_實施靜電放電防護導體，並且把靜電放 iH1174!配置於第一電性路徑720與第二電性路徑 沪性s。與剛實施例相較，本實施例可以獲得較佳之可 使用本發明者可以依據其需求而增加靜電放 體之數量。例如，，是依照本發明說㈣-種考 放電防護之軟性電路板的實施範例。此實_之軟性電路 板8〇〇是在第一電性路徑82〇與第二電性路徑㈣之間配 j有第—靜電放電防護導體840以及第二靜電放電防護導 體850。第一電性路徑820、第二電性路徑830、第—靜電 放電防護導體84〇以及第二靜電放電防護導體85〇之間相 f絕緣。靜電放電防護導體840與850之材質可以是銅^ 是其他導電物質。靜電放電防護導體840與85〇可以發^ 保護（shielding)功能而避免第一電性路徑82〇 ^ 口主第二電性路徑83〇，進而避免防護標的物（例如 電路請）因靜電放電而損毀。 " 於本實施例中，靜電放電防護導體840與850可以各 自破電性連接至元件配置區内的不同焊墊，並透過這些焊 11 LJ/Ο NVT-2006-146 23346twfdoc/e 墊電性連接至積體電路810之 防護導體請可以透過第—焊塾電接電放電 此’當靜電放電自第-電性路徑，腳GND。因 導體84G時’靜電流會經過驅動 =^ 放電防護 '/5 (ώ \TT\r\ ^積體電路8 10内部之带 =線卿而被導引至印刷電路板；當靜電放 ^路径820輕合至靜電放電防護導體8 :=體電路81〇内部之電源軌線二;； 板。因此’靜電放電防護導體840與85= 每二丨^靜電放餘合至第二電性路徑830的機率。且本 只砭例亦不需要改變「印刷雷 本 的接觸端子」<「顯亍面與軟性電路板_之間 端子」^僅須改變之間的接觸 數條ί = Ϊ防^實==電路板上配置-條至 基r間的信號傳- 傳遂（弟基板與几件配置區之間的信號 敌電H靜電放電防護導體可以減少靜電 知靜=電=====_無論是增 比 等篮數目或疋增大靜電放電防護導體面 ’白具有高度設計·’且不會造成任何製造成本增加。 ，然本發明已以較佳實施例揭露如上，然其並非用以 疋發明，任何所屬技術領域中具有通常知識者，在不 12 1378744 NVT-2006-146 23346twf.doc/e 脫離本發明之精神和範圍内，當可作些許之 =本發明之保護範圍當視後附之申請專利範:所=者 【圖式簡單說明】 圖1說明傳統COF之佈局圖。 圖2是說明連接在顯示面板與印刷電路板之間的 電路板。The following is an implementation of a flexible circuit board using a COF joint structure. As an example, the inventors of the present invention can make other types of flexible circuit boards according to their needs, which are also within the scope of the present invention. As described above, C〇;p encapsulates the integrated circuit on a flexible substrate in a flip chip manner. For example, the connection line between the liquid crystal display panel and the printed circuit board can be connected using c〇F. Since the driver integrated circuit is configured on a flexible circuit board, the COF can achieve a reduction in printed circuit board size and integration of a multi-function chip set. The COF circuit board may be a two-layer structure in which copper and polyimide are combined. It has excellent heat resistance, high transparency, and flexibility. Figure 5 is a diagram showing an embodiment of a flexible circuit board in consideration of electrostatic discharge protection in accordance with the present invention. The flexible circuit board 500 can be used to be electrically connected between the first substrate and the second substrate. For example, the flexible circuit board 500 can be electrically connected between the liquid crystal display panel and the printed circuit board (PCB), or can be electrically connected between the printed circuit board and the printed circuit board. In the following embodiments, the "first substrate" is implemented by a display panel, and the "second substrate" is realized by a printed circuit board. 8 1378744 NVT-2006-146 23346twf.doc/e In Figure 5, the wires printed on the flexible circuit board $(8) are indicated by only a small number of solid black lines. The flexible circuit board 500 includes a component arrangement region 51A, a first electrical path 520, a second electrical path 53A, and an electrostatic discharge protection conductor. A plurality of first electrical paths connected between the display panel and the printed circuit board are disposed on the substrate of the flexible circuit board 5GG to provide a signal conducting path between the display panel and the printed circuit board. For example, the printed circuit board can be electrically connected to the display panel through the pad 501, the first electrical path 52A, and the pad 5〇2. Further disposed on the substrate of the flexible circuit board 500 is connected between the display panel and the component arrangement area 510, and connected to the component arrangement area 51, a plurality of second electrical paths between the printed circuit boards to provide component configuration. A signal conducting path between the region 510 and the printed circuit board (or display panel). For example, the component placement region 510 can be electrically connected to the display panel through the pad 5〇3, the second electrical path 530, and the pad 504. Component placement area 510 can be used to configure at least one protection object. The subject matter of this protection may be an integrated circuit (such as a driver) or other elements. Here, the integmed circuit (ic) 61 〇 will represent the protection target. Figure 6 is an illustration of an embodiment of the flexible circuit board of Figure 5 configured with at least one guard in accordance with the present invention. Referring to Fig. 5 and Fig. 6, the driver integrated circuit 61 is flip-chip mounted on the component arrangement region 510 and connected to the pads in the component placement region 51A. Therefore, the driver integrated circuit 610 can be connected to the printed circuit board and the display panel through a plurality of second electrical paths disposed on the substrate of the flexible circuit board 5. For example, the driver integrated circuit 61 can be electrically connected to the display panel through the pad 5〇3, the second electrical path 530, and the pad 504. 9 ^^2006-146 23346twf.d〇c/e The protective conductor 540 is disposed between the first electrical path 520 and the second conductive 53G and is insulated from each other. This electrostatic discharge protection is a conductive material other than steel crucibles. The electrostatic discharge protection (5) eMing function prevents the first electric guard 2 from being electrostatically coupled to the second electrical path 530', thereby preventing the internal anti-personal material (such as the integrated circuit (10)) from being damaged by electrostatic discharge. In this embodiment, the ESD protection conductor 54A can be electrically soldered to the inside of the electrical body 510 (this soldering is used to electrically connect to the power supply pin of the product β_). For example, the ESD protection conductor 540 ^ The power source is electrically connected to the driver integrated circuit 61 by the soldering pad 505. Therefore, when the electrostatic discharge is coupled from the first electrical path 52 to the electrostatic discharge preventing conductor 54G, the electrostatic current passes through the driving scum The circuit 610 is internally connected to the printed circuit board by the power rail VDD, or is guided to the printed circuit by the motor VDD, the ESD protection MOSFET, and the power rail GND of the movable body 1 (61). Circuit board. Of course, it is also possible to configure a grounding electrical path (not shown) on the flexible circuit board 500 to pass the static electricity through the electrostatic discharge protection conductor 540, the pad 505, and the ground electrical path (not shown). Guided to the printed circuit board, The electrostatic current is prevented from entering the driver integrated circuit 61. Therefore, the electrostatic discharge protection conductor 54 can reduce the probability of electrostatic discharge coupling to the second electrical path 530. This embodiment does not require changing the "printed circuit board and the flexible circuit board 500". The contact terminal between the two or the "contact terminal between the display panel and the flexible circuit board 500" only needs to change the layout of the flexible circuit board 500. 1378744 NVT-2006-146 23346twf.doc/e Copper St. Figure 6) The electrostatic discharge protection conductor 540 is between the large surface 530, the path 520 and the second electrical path can be used according to its needs. He = the inventor C4n is only the electrostatic discharge protection conductor 117 is a two-example embodiment of the electrostatic discharge prevention according to the present invention. The flexible circuit board 700 of this embodiment implements an electrostatic discharge protection conductor, and disposes the electrostatic discharge iH1174! on the first electrical path 720 and the second electrical path. Compared with the prior embodiment, the present embodiment can be preferably used. The inventors can increase the number of electrostatic discharges according to their needs. For example, it is an implementation example of a flexible circuit board according to the present invention (4) - a test for discharge protection. The flexible circuit board 8 is provided with a first electrostatic discharge protection conductor 840 and a second electrostatic discharge protection conductor 850 between the first electrical path 82A and the second electrical path (4). The first electrical path 820, the second electrical path 830, the first electrostatic discharge protection conductor 84A, and the second electrostatic discharge protection conductor 85A are insulated from each other. The material of the electrostatic discharge protection conductors 840 and 850 may be copper or other conductive material. The ESD protection conductors 840 and 85 can perform a shielding function to avoid the first electrical path 82 and the second electrical path 83〇, thereby preventing the protection target (such as a circuit) from being electrostatically discharged. Damaged. " In this embodiment, the ESD protection conductors 840 and 850 can be electrically connected to different pads in the component arrangement region, and through these solders 11 LJ / Ο NVT-2006-146 23346twfdoc / e padding The protective conductor connected to the integrated circuit 810 can be electrically discharged through the first soldering wire. This is the electrostatic discharge from the first electrical path to the foot GND. Because of the conductor 84G, the 'electrostatic current will be driven to the printed circuit board by the drive = ^ discharge protection '/5 (ώ \TT\r\ ^ integrated circuit 8 10 internal band = line qing; when the electrostatic discharge path 820 is lightly coupled to the ESD protection conductor 8: = the internal power supply rail 2 of the body circuit 81 ;;; the board. Therefore, the 'electrostatic discharge protection conductors 840 and 85= each 丨 ^ electrostatic discharge to the second electrical path 830 And the only example is that there is no need to change the "contact terminal of the printed mine" < "the terminal between the display surface and the flexible circuit board _" ^ only need to change the number of contacts between the two ί = Ϊ 防Real == configuration on the board - the signal transmission between the strip and the base r - pass 遂 (signal between the substrate and several pieces of configuration area enemy H electrostatic discharge protection conductor can reduce static electricity static = electricity ===== _ Whether it is increasing the number of baskets or the number of baskets or increasing the electrostatic discharge protection conductor surface 'white has a high design' and does not cause any increase in manufacturing cost. However, the present invention has been disclosed above in the preferred embodiment, but it is not used Invented by ,, anyone of ordinary skill in the art, not 12 1378744 NVT-2006-146 2 3346 twf.doc/e Within the spirit and scope of the present invention, when the scope of protection of the present invention can be made, the scope of protection of the present invention is attached to the patent application: = [simplified description of the drawing] Figure 1 illustrates the layout of the conventional COF Figure 2 is a diagram showing a circuit board connected between a display panel and a printed circuit board.
圖3為中華民國專利公告號1228819專利案所揭 解決方案。 圖4是說明傳統軟性電路板在組裝過程所發生之 敌電事件。 静電 圖5是依照本發明說明一種考量靜電放電防護之軟 電路板的實施範例。 圖6是依照本發明說明圖5之軟性電路板配置至少— 防護標的物的實施範例。Figure 3 shows the solution of the Patent No. 1228819 patent of the Republic of China. Figure 4 is a diagram showing the enemy power events that occur during the assembly process of a conventional flexible circuit board. Electrostatic Figure 5 is an illustration of an embodiment of a flexible circuit board that considers electrostatic discharge protection in accordance with the present invention. Figure 6 is a block diagram showing an embodiment of the flexible circuit board configuration of Figure 5 in accordance with the present invention.
圖7是依照本發明說明另一種考量靜電放電防護之軟 性電路板的實施範例。 圖8是依照本發明說明另一種考量靜電放電防護之軟 性電路板的實施範例。 【主要元件符號說明】 100、 300 :軟性基板 Π0、410、610、810 :積體電路 101、 102、302、501 〜505 :焊墊 103、303 :切割線 13 1378744 NVT-2006-146 23346twf.doc/e 104、304、400 :傳統軟性電路板 210 :顯示面板 220 :印刷電路板 305 :導電保護線 401、402 :導線 500、700、800 :本案實施例之軟性電路板 510 :元件配置區 520、720、820 :第一電性路徑 530、730、830 :第二電性路徑 540、740、840、850 :靜電放電防護導體Fig. 7 is a diagram showing another embodiment of a flexible circuit board for considering electrostatic discharge protection in accordance with the present invention. Figure 8 is a diagram showing another embodiment of a flexible circuit board that considers electrostatic discharge protection in accordance with the present invention. [Description of main component symbols] 100, 300: flexible substrate Π0, 410, 610, 810: integrated circuits 101, 102, 302, 501 to 505: pads 103, 303: cutting line 13 1378744 NVT-2006-146 23346twf. Doc/e 104, 304, 400: conventional flexible circuit board 210: display panel 220: printed circuit board 305: conductive protection lines 401, 402: wires 500, 700, 800: flexible circuit board 510 of the embodiment of the present invention: component arrangement area 520, 720, 820: first electrical path 530, 730, 830: second electrical path 540, 740, 840, 850: electrostatic discharge protection conductor
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