TWI376516B - Probing system for integrated circuit device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit component detecting system, and more particularly to an integrated circuit component detecting system for transmitting a detecting signal by wireless communication. [Prior Art] In general, an integrated circuit component on a wafer must first be tested for its electrical characteristics to determine whether the integrated circuit component is good. A good integrated circuit will be selected for subsequent packaging processes, and defective products will be discarded to avoid additional packaging costs. The completed integrated circuit components must also undergo another electrical test to screen out defective packages to improve final product yield. The automatic test equipment (ATE) uses a probe of a test card to contact a signal pad of a device to be tested, so as to transmit a test signal of a test machine to a device to be tested, and measure The electrical quantity is sent back to the 1 measuring machine. However, as semiconductor manufacturing technology continues to innovate, the operating speed of integrated electrical components (such as transistors) continues to increase, and conventional techniques use probes (ie, mechanical inspection) to detect wafers, thus providing overall time precision. (Overall time accuracy ' OTA) can't keep up with the fast-growing wafer work speed. Therefore, the conventional automatic detecting device is obviously not applicable to the electrical test of the future rapid integrated circuit component. SUMMARY OF THE INVENTION The present invention provides an integrated circuit component detection system that can be used between a tester including a first transceiver module and an integrated circuit 130216.doc 1376516 that is tested by the tester. 'Test data such as test signals and tested electrical parameters are transmitted by wireless communication. The integrated circuit component comprises a 核3 core~ circuit, a self-test circuit electrically connected to the core circuit (Built_inself_testeircuit BisT), a controller for controlling the operation of the self-test circuit, and - for The first transceiver module exchanges the second transceiver module of the test data. /

In an embodiment, the detection system of the integrated circuit component comprises a test head having a - transceiver module and a test station having a detection unit, the detection unit 35 being connected to the test head for testing. The detection system further comprises a communication module, the communication module has a second transceiver module, which can exchange data with the first transceiver module in a wireless communication manner; an integrated circuit component has a - to be tested The core circuit has a test module that has a self-test circuit coupled to the core circuit and the communication module for self-testing of the core circuit. [Embodiment]

Fig. 1 illustrates an integrated circuit component detecting system 1 according to a first embodiment of the present invention, which transmits test data between a test machine 20 and a device to be tested 3 by wireless communication. The test machine 20 includes a first transceiver module 22, a physical layer module 24 electrically connected to the first transceiver module 22, a detection unit 26 electrically connected to the physical layer module 24, and an electrical connection. The diagnostic unit 28 of the physical layer module 24. The device under test 30 can be a system on chip, including a core circuit 32, a self-test circuit 34 electrically connected to the core circuit 32, and a control circuit for controlling the self-test circuit. 3 4 controller 3 6 and a second transceiver module 38β capable of exchanging the measurement with the first transceiver module 2 2 - 1302l6.doc C 1 1376516 test data, the first transceiver module 22 and the second transceiver Modules 38 each include a transceiver and an antenna. The core circuit 32 can be a memory circuit, a logic circuit, or an analog circuit. The design technique of the self-test circuit 34 can refer to the application of the inventor of the Chinese Patent No. 52, and the __45 towel. Preferably, the device under test 3 further includes a clock generator electrically connected to the second transceiver module 38 - a power regulator 42 electrically connected to the transceiver module %, wherein The test machine 2 transmits an RF signal through the first transceiver module (4), and the second transceiver module 38 receives the RF signal to drive the power stabilizer 42 to generate power required for the operation of the device under test 3 . In addition, the device under test 30 may further include an identifier register to store an identification code (ID) of the device under test 30. Fig. 2 illustrates an integrated circuit component test system 80 of a second embodiment of the present invention, which is applied to a wafer 9 (four) electrical detection including a plurality of components to be tested 3G. In particular, the integrated circuit component test system 8 is applied to the electrical detection of the wafer level W level). During the electrical detection, the first test module 22 transmits an RF signal, and the second test 42: the first transceiver module % receives the RF signal to drive the power stable (4) to generate the The power required to operate the component 30 to be tested. The test machine 2 is configured to set the respective components to be tested 3〇=identification code via the first transceiver module 22, and each (4) component 3G is identified by the second component of the standard component 3 : transmitting a start command to the first transceiver module 38 of the device to be tested to activate the self-test electrical material to perform electrical detection of 32. The diagnostic unit 28 collects the components to be tested 3: I302i6.doc ^/65.16 The test data returned after the test can be used to diagnose the advantages and disadvantages of each component to be tested and analyze the cause of failure of the defective component. The wafer 9 can further include a power supply line 92 surrounding the device under test 30, and the power required for the operation of the device under test 3 is taken from the power supply line 92 instead of via the power regulator. 42 receives the power generated by the RF signal. In particular, the power supply line 92 is disposed on the cutting line of the wafer 90. Fig. 3 illustrates an integrated circuit component test system 7A of the third embodiment of the present invention, which is applied to a final test of a package die 72. The wafer 90 as shown in FIG. 2 is cut along the power supply line 92 into individual elements 30 to be tested. After screening by the integrated circuit component test system 8 of Fig. 2, the device under test 30 having good electrical characteristics will be packaged into the package die 72, without the component 30 to be tested being discarded. Then, the test machine transmits the start command to the first transceiver module 38 of the device under test via the first transceiver module 22 to activate the self test circuit 34 to perform the electrical function of the core circuit μ. Detection. Thereafter, the diagnostic unit 28 collects the test data returned by the component under test to complete the test, so as to diagnose the superiority of the test element (4) and analyze the cause of failure of the defective component. The integrated circuit component detecting system of the fourth embodiment of the present invention is further characterized in that the testing machine 20 of the integrated circuit component detecting system 6 further includes a wheeling device electrically connected to the commercial power supply. The 30 series is disposed on a circuit board 50. The circuit board is electrically connected to the mains, and the power to be tested is operated by the power supply unit. The circuit board 50, that is, indirectly from the transport device 62. The transport device 62 can transmit the circuit board 50 to a predetermined test position, and the test unit I30216.doc 13.76516 26 of the test machine 2 transmits a start command to the standby via the first transceiver module 22 The second transceiver module 38 of the measuring component 3 is configured to activate the self-test circuit 34 to perform electrical detection of the core circuit 32. After the diagnostic unit 28 collects the test data returned by each component under test to complete the test, It is possible to diagnose whether each of the components to be tested 3 is in compliance with the specifications of the electrical properties and analyze the cause of failure of the defective component. The integrated circuit component detecting system 10 shown in Fig. 1 can be adjusted by changing the configuration of its internal modules or components to increase the flexibility of various applications. Fig. 5 is a view showing an integrated circuit component detecting system of a fifth embodiment of the present invention. The integrated circuit component detecting system 1 includes a tester 11A and a DUT 120 to be tested. The test machine no includes a test head 111, a test stand 1 12 and a carrier 113. The test station 12 includes a diagnostic unit 132 and a detection unit 134. The diagnostic unit 132 is a free option, and the test unit 111 can be configured to include a physical layer module 及 5 and a coupling to the physics. The first transceiver module 114 of the layer module 115. The physical layer module 115 is coupled to the detecting unit 丨34, and the diagnostic unit 321 is coupled to the detecting unit 134. The carrier 113 carries the DUT 120 and includes a communication module 161 and a power regulator 117. The communication module 116 includes a second transceiver module 130, a communication controller 118, and a clock generator 119. The communication controller 11 8 is connected to the second transceiver module 丨3 〇, and the clock generation state 119 is electrically connected to the second transmission module 13 〇, the communication controller 118 and the dut 120 to provide a clock signal. The DUT 120 (e.g., system single chip (s〇c)) includes a core circuit 121 and a test module 122. - in the embodiment, the test module

122 includes a cipher BIST 123, a logical BIST 124, an analog BIST 125, and a test controller 126. In another embodiment, the test module 122 I30216.doc 1376516 may only include a combination of the suffix BIST 123, the logic BIST 124 or the analog bist 125, or any two BIST circuits connected to the test controller 126. The DUT 120 can be located on the carrier 113 and obtain operating power from the carrier 113. Additionally, the DUT 120 can be transmitted by the conveyor to a predetermined location. In an embodiment, the core circuit 12 1 may include a memory circuit, a logic circuit, and an analog circuit. The core circuit 121 is coupled to the memory BIST 123 'logic BIST 124 and the analog BIST 125 ' and the operation of the BIST circuits is controlled by the test controller 126. In another embodiment, core circuit 12 1 may be a single-memory circuit, a logic circuit, or an analog circuit or a combination of any of the above. The core circuit 121 is coupled to the corresponding memory BIST 123, logic BIST 124 or analog BIST 125. The test data and the tested electrical parameters are transmitted between the test head 111 and the carrier U3 by means of the first transceiver module 114 and the second transceiver module 13 in a wireless communication manner. In other words, the first transceiver module 114 and the second transceiver module 13 exchange test data with each other. The physical layer module 11 5 and the communication controller 1丨8 respectively control the transmission and reception of the data signals. In one embodiment, the first transceiver module 114 and the second transceiver module 13 each include a transceiver and an antenna. The power regulator 117 is electrically coupled to the communication module 116 and the DUT 120. The first transceiver module 114 receives the RF signal, and the first transceiver module 13 receives the RF signal to drive the power regulator 117, thereby generating the operating power required by the DUT 120. Fig. 6 illustrates an integrated circuit component detecting system 140 of a sixth embodiment of the present invention. Compared to the system 1 shown in FIG. 5, the test module 122 is changed to be included in the carrier 113 of the test machine 110. Therefore, the DUT 12 〇 includes only the core -10. I30216.doc c 13.765, 16 core circuit 121 and is easy to manufacture. The power regulator 117 is electrically connected to the communication module 116, the test module 122, and the DUT 120. Fig. 7 illustrates an integrated circuit component detecting system 150 of a seventh embodiment of the present invention. Compared with FIG. 5, the communication module 116 is changed to include sdut 12,, in. Therefore, the DUT 120" includes the core circuit 121, the test module 122, and the communication module 116, and the tester 110, the carrier 113, and only the power regulator 11 7 power regulator 117 is electrically connected. The DUT 120,,. φ Figure 8 shows a schematic diagram of signal transmission for a detectable complex system in accordance with an embodiment of the present invention. The test machine system includes a test bench and a plurality of test heads, and each test head corresponds to a communication module. Test data such as test signals and test-related electrical parameters are transmitted wirelessly between the test head and the communication module. In particular, the communication is performed in a one-to-one manner. Each communication module is electrically connected to a test module, and the test module is connected to a core circuit. Since this embodiment includes a plurality of test heads, the test efficiency can be significantly improved. Lutu 9 shows a schematic diagram of signal transmission of a detection system capable of detecting a complex DUT according to another embodiment of the present invention. The test machine system includes a test bench and a test head, and the test head corresponds to a plurality of communication modules. Test data such as the test signal and the electrical parameters of the test are transmitted between the test head and a plurality of communication modules for wireless transmission. In particular, the communication is performed in a one-to-many manner. Each communication module is coupled to a test module, which is connected to the core circuit. The S-Technology Department uses mechanical components (probes) to transmit test data, so the overall accuracy of the system cannot keep up with the fast-growing wafer operating speed. Relatively '«302l6.doc -11 - 1376516 The integrated circuit component detection system of the present invention transmits test data between the test machine and the device to be tested by wireless communication, so that the overall time is precise and/or economical. The integrated circuit of the components is uniform and is not limited by the mechanical components, and can be applied to the electrical detection of the high-speed integrated circuit. In particular, the integrated circuit component detection system of the present invention can be used to diagnose the failure of the component to be tested in addition to the electrical measurement of the component to be tested. The technical contents and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be construed as not limited by the scope of the invention, and the invention is intended to be BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 illustrates an integrated circuit component detecting system of a first embodiment of the present invention; FIG. 2 illustrates an integrated circuit component testing system of a second embodiment of the present invention; FIG. 3 illustrates a third embodiment of the present invention. FIG. 4 illustrates an integrated circuit component detecting system of a fourth embodiment of the present invention; FIG. 5 illustrates an integrated circuit component detecting system of a fifth embodiment of the present invention; FIG. 6 illustrates a sixth embodiment of the present invention. The integrated circuit component detecting system of the seventh embodiment of the present invention; and FIG. 8 and FIG. 9 are schematic diagrams showing the signal transmission of the integrated circuit component detecting system of the embodiment of the present invention. [Main component symbol description] 10 integrated circuit component detection system 20 test machine I30216.doc -12- 1376516 22 first transceiver module 2 6 detection unit 3 0 component under test 3 4 self test circuit 3 8 second transceiver module Group 42 power regulator 50 circuit board 62 conveyor 7 integrated circuit component detection system 80 integrated circuit component detection system 1 00 integrated circuit component detection system 111 test head I 1 3 carrier II 5 physical layer module 1 1 7 power regulator 1 1 9 clock generator 12 1 core circuit 123 memory BIST 125 analog BIST 130 second transceiver module

13 4 detection unit 1 10' test machine 120' DUT

1 10"Testing Machine 120" DUT 24 Physical Layer Module 28 Diagnostic Unit 32 Core Circuit 36 Controller 40 Clock Generator 44 Marking Register 60 Integrated Circuit Component Detection System 64 Predetermined Test Location 72 Package Grain 90 Wafer 1 1 0 test machine 1 12 test station 1 14 first transceiver module 1 1 6 communication module 1 1 8 communication controller

120 DUT 122 test module

124 Logic BIST 126 Test Controller 132 Diagnostic Unit 14 0 Integrated Circuit Component Detection System 113' Carrier 150 Integrated Circuit Component Detection System 113"Carrier 1302l6.doc -13-

Claims (1)

Patent Application No. 09914-79 Replacement (August 101) X. Patent Application Range: 1. An integrated circuit component detection system comprising: a test head including a first transceiver module; and a test bench a detection unit coupled to the test head for testing; the communication module includes a second transceiver module, a clock generator, and a pass m controller, the second transceiver module and the first Data exchange between the transceiver modules by wireless communication; an integrated circuit component including a core circuit to be tested; and a test module including a self-test circuit coupled to the core circuit and the The communication module is configured to perform the self-test of the core circuit; wherein the clock generator is coupled to the second transceiver module and configured to provide a clock signal to the communication controller; wherein the communication controller, The second transceiver module and the clock generator are configured to be coupled to the second transceiver module. 2. The integrated circuit component detecting system of claim 1, wherein the integrated circuit component further comprises an indicator register for storing the identification code. 3. The integrated circuit component detection system of claim 1, wherein the clock generator is coupled to the test module. 4. The integrated circuit component detecting system of claim 1, further comprising a power regulator that is connected to the communication module, the test module, and the integrated circuit component, wherein the detecting unit uses the first transceiver module The group transmits an RF signal, and the second transceiver module receives the RF signal to drive the power regulator 1376516 • * ' ' Patent Application No. 097141279 • Chinese Manual Replacement (August) The integrated circuit components operate with the required power. 5. The integrated circuit component detecting system according to claim 1, further comprising - a turning device and the integrated circuit member being positioned by the conveying means. heart The integrated circuit component detecting system of claim 1, wherein the test head further comprises a physical layer module coupled to the first transceiver module. The integrated circuit component detecting system of claim 1, wherein the test bench is additionally connected to the diagnostic unit of the detecting unit. The integrated circuit component detecting system of claim 4, wherein the integrated circuit component comprises the power regulator. 9. The integrated circuit component detecting system of claim 4, wherein the integrated circuit component is located in a contractor including the power regulator, and the operating power is obtained from the carrier write. D 1〇_ According to the integrated circuit component detecting system of claim 9, the semiconductor component includes the communication module and the test module. 11. The integrated circuit component detecting system of claim 9, wherein the carrier spoon comprises the communication module. 12. The integrated circuit component detecting system of claim 11, wherein the bearer includes the test module. 13. The integrated circuit component detecting system of claim 11, wherein the integrated circuit component comprises the test module. 14. The integrated circuit component detecting system according to claim 1, wherein the core circuit comprises a memory circuit, and the test module comprises a memory self test - Patent Application No. 097141279 (1) August) Circuit. The integrated circuit component detecting system of claim 1, wherein the core circuit comprises a logic circuit 'the test module comprises a logic self-test circuit. • The integrated circuit component detection system of claim 1, wherein the core module includes an analog circuit. The test white-and-white group includes an analog self-test circuit. • An integrated circuit component detection system comprising: at least one test head; a plurality of communication modules, a complex | short, s _ __ eight communicated with the at least one test head by wireless communication; 'plural The test module, the individual warp connection is coupled to the plurality of communication modules; and the plurality of integrated circuit components 'the integrated circuit components comprise a core circuit' and the plurality of integrated circuit circuits The core circuit is individually coupled to the plurality of test modules; wherein the clock generator is coupled to a transceiver module configured to provide a clock signal to the communication control The communication controller is configured to be pure to the second transceiver die and the clock generator. According to the integrated circuit component detecting system of claim 17, a test head communicates with one or more communication modules.