1375894 (1) 九、發明說明 ♦ 【發明所屬之技術領域】 . 本發明一般係有關於基底處理系統中的智慧型元件及 智慧型元件的使用及以智慧型元件爲基礎的管理技術，以 改善基底處理系統的安裝、運作、以及維護。 【先前技術】 # 基底處理系統（如電漿處理系統、濕蝕刻處理系統、 化學機械硏磨（CMP)系統、以及類似系統）長久以來已用於 基底（例如，半導體晶圓、平面顯示面板、光件基底、奈 米機基底、以及類似物）的處理。由於技術的進展，所以 取得及維護基底處理系統（如電漿處理系統）已變的更爲昂 貴。一部分的成本增加可歸因於基底處理系統本身的複雜 度增加。這是因爲當裝置縮小且生產壓力增加，以試圖跟 上不斷提升的電子產品之持續增加的消費者需求時，客戶 ® 期望基底處理系統能達成高需求的蝕刻及沈積製程，以及 能有高生產率。因此，現代基底處理系統之增加的特徵爲 闻精密設計、奇特材料、以及精確地工具零件。 當需安裝零件時（如例如是根據預定維護排程的替代 零件），基底處理系統的廠商時常堅持認爲需驗證替代零 件。驗證程序可確保零件符合嚴格的工程規格，例如是相 關於零件材料的成分及零件的尺寸。 • 當使用驗證過的零件時，基底處理系統的廠商可合理 ' 地確保基底處理系統具有預期的配置且符合預期的系統規 -5- (2) 1375894 格，以執行所需的應用（例如，蝕刻或沈積製程）。使用驗 、 證過的零件可同時有益於基底處理系統的擁有者（享有產 生預期製程結果之可靠系統）及廠商（享有不必修復由於次 等零件所產生的損壞之基底處理系統）。 就最高品質產品的情況而言，驗證過的零件之花費會 高於次等複製品。對於不擇手段的水貨市場廠商而言，因 爲實質上利益可藉由使零件很便宜且將其賣到高價零件市 # 場而增加，所以生產基底處理系統的次等複製品且使其完 成爲「可接受替代品」之誘惑很大。對於基底處理系統的 擁有者而言，因爲驗證過的零件（以高精確度製造）短期間 內之花費較高，所以購買且使用未驗證過的零件之誘惑很 大。在這些情況中，擁有者及廠商會同時遭受。 儘管短期間內節省一些錢，擁有者一定還會遭受系統 效能不可靠，並且由於設備無法作用而常常造成生產排程 中斷。廠商會遭受必須支援及修復較多數量的受損系統， • 並且可能遭受不可靠的基底處理系統之廠商的不正當品牌 之侵害。 會有其他問題與零件的安裝、運作、以及維護相關。 在今日的基底處理系統中，因爲太過簡單，所以安裝零件 不能錯誤，不能將將錯誤零件安裝於已知系統及/或應用 裝置，及/或不能遺漏對零件所需的維護。因爲基底處理 系統變的更爲複雜，所以問題會惡化。 鑑於上述’需要一種操控基底處理系統元件的不同方 法。 -6- (3) 1375894 【發明內容】 • 在一實施例中’本發明係相關於一種基底處理系統中 • 的元件管理之方法。此基底處理系統具有一組元件，此組 元件中的至少複數個元件係設計爲智慧型元件，該等元件 中的每個元件具有智慧型元件增強（ICE)。此方法包括查 詢該等元件，以自其各自的智慧型元件增強（ICE)中，請 求其各自的唯一識別資料。此方法更包括若該等元件中的 ® 任一個元件回應此査詢，則接收來自該等元件的唯一識別 資料。此方法另外包括當預期第一元件識別資料時，若該 等元件中的第一元件無法提供第一元件唯一識別資料，則 標示第一元件需要修正動作。 在另一實施例中，本發明係相關於一種基底處理系統 中的元件管理之方法。此基底處理系統具有一組元件，此 組元件中的至少複數個元件係設計爲智慧型元件，該等元 件中的每個元件具有智慧型元件增強（ICE)。此方法包括 β 經由轉換器，查詢該等元件中的第—元件，以自與智慧型 元件相關的智慧型元件增強（ICE)中，接收第一特徵資料 。此方法還包括經由轉換器，接收第一特徵資料β此方法 另外包括將特徵資料與智慧型元件的可接受規格資料進行 比較。若第一特徵資料無法符合智慧型元件的可接受規格 資料，則此方法包括電子式地標示第一元件需要修正動作 在又另一實施例中，本發明係相關於一種基底處理系 統中的元件管理之方法。此基底處理系統具有一組元件， (4) 1375894 此組元件中的至少複數個元件係設計爲智慧型元件，該等 * 元件中的每個元件具有智慧型元件增強（ICE)。此方法包 . 括經由轉換器，查詢該等元件中的第一元件，以得到第一 校正資料。第一校正資料係使用第—技術及第二技術其中 之一而得到。第一技術涉及自與第一元件相關的智慧型元 件增強（ICE)中得到該第一校正資料。第二技術涉及自與 智慧型元件增強（ICE)中得到唯一識別資料，並且使用唯 • 一識別資料，以自位於第一元件外部的資料儲存器中得到 第一校正資料。此方法另外包括將第一校正資料用於安裝 基底處理系統及保持基底處理系統其中之一。 本發明的這些及其他特性將於底下之本發明的詳細說 明及結合以下圖式而進行更詳細地說明。 【實施方式】 本發明現在將參考如附圖中所繪示的一些較佳實施例 而詳細地說明。在以下的說明中，會提及各種特定細節， 以使本發明完全了解。然而，將顯然可知的是，對於熟習 此項技術者而言，本發明可在無某些或全部的這些特定細 節之下實施。在其他的例子中，熟知的製程步驟及/或結 構不會詳細說明，以不混淆本發明。 在一實施例中，本發明係相關於用於基底處理環境及 技術中之智慧型元件，以使智慧型元件有效率地改善個別 元件、子系統、以及系統管理》爲了詳細說明，智慧型元 件會以最小化倂入至少可唯一識別元件的智慧型元件增強 -8- (5) 1375894 (ICE)。就在此使用的項目而言，智慧型元件可代表不可 • 分割的基本零件（如單一實體件的鑄塊鋁合金）或子系統（如 . RF電源供應器）。 智慧型元件可基於基底處理系統的一部分之任何元件 ’無論此種元件是否與反應氣體、液體或電漿直接接觸。 例如，電漿處理系統的元件可包括氣體注入器、氣體注入 系統、電漿室、電漿耦合的介電窗、襯套、聚焦環或其他 ί 邊緣環或均勻環、夾盤組件'夾盤本身、夾盤支撐元件、 端點偵測系統及/或其他診斷系統、RF電源供應器、或匹 配網路等。基底處理系統的所有元件不必然爲智慧型元件 。智慧型元件及傳統元件（亦即，無ICE的那些元件）的混 合可共存於已知系統上。 —般來說，每個智慧型元件可藉由其ICE而唯一地進 行識別。較佳而言，雖然本發明並未排斥人工可讀取的 ICE及利用此種人工可讀取的ICE之技術與外部資料的組 > 合，但是ICE會包含可爲機器可讀取的資料，以改善基底 處理系統的安裝、運作、以及維護。人工可讀取的ICE之 例子包括蝕刻、附加、塗抹 '或雕刻到智慧型元件之字母 與數字，或其他視覺可感知的符號。 若ICE爲機器可讀取，則與智慧型元件相關的資料可 以人工或自動地方式是讀取*例如，若ICE爲電腦條碼， 則人工讀取可包括使用手持式電腦條碼讀取器來讀取電腦 條碼。若電腦條碼的掃瞄可在無人工査核下完成，則相同 的電腦條碼當然可自動讀取》雖然使用電腦條碼當作例子 -9- (6) (6)1375894 ，但是任何可視、電子式、電磁式、光學 '化學、或可聽 見地感知機制可由ICE來使用。此種例子包括欲辨識的形 狀或圖案，欲化學偵測或經由電磁偵測配置之以同位素或 化學品的各種形式之添加或塗抹。自動讀取可使用如 RFID的技術，其允許智慧型元件在不需接觸或視線讀取 及/或寫入之下進行辨識。 事實上，RFID爲較佳的ICE可行技術其中之一。對 於未直接實際接觸或目視電磁頻譜而可傳送資料而言， RFID的運作係與電腦條碼類似，但是具有更強大的性能 。一例的RFID系統會需要以下元件：詢答撵（或標籤）、 讀取器/寫入器（訊問器）、天線、以及主電腦。 詢答機爲系統的一部分且包括較佳爲具有附加的矽晶 片之小電子電路。RFID標籤可供以電源且可分類爲主動 或被動》某些主動標籤具有可很遠的距離進行讀取之內部 電池。其通常爲可讀取/寫入，並且時常可在例如是收費 連接應用裝置中看到。被動標籤不具有電池，並且通常由 査詢器的分離外部電源供給電源。 典型的讀取器一般會包含天線，以將資訊傳送至標籤 ，以及從標籤接收資訊。天線的尺寸及形式可取決於特定 應用，以及所選擇的頻率。其通常會覆蓋解碼器及RF模 組，以及天線。讀取器可取決於應用而固定（亦即，安裝） ，或如手持式的可攜式。 再者’合適的ICE係用來抵抗受到智慧型元件所造成 的環境之腐蝕及/或破壞效應。因此，若此種曝露需要智 -10- (7) 1375894 慧型元件，則會將ICE建於電漿環境中，使得其實質上可 • 抵抗電漿蝕刻或沈積，以及抵抗因與電極產生相關的RF . 能量及/或高溫環境所產生的損壞。同樣地，化學蝕刻環 境中的ICE實質上將可抵抗蝕刻製程中所使用的化學品。 較佳而言，伴隨任何支撐或遮蔽結構的ICE係用來使對基 底處理製程的衝擊最小（例如，藉由使污染及/或製程參數 的衝擊最小）。 # 爲了使得ICE較能抵抗損壞，ICE或其一部分可安裝 於智慧型元件內，使得ICE或其易受損的部分實際上不會 曝露出來。對於資料轉移而言，此種安裝元件的ICE可依 賴非目視技術。另一種是，ICE及其部分可藉由適當的遮 蔽物（由如金屬、介電質、陶瓷、塑膠等的合適材料形成） 來遮蔽。遮蔽物及其部分爲光學上可穿透，且可使用需某 些等級的光學透明物之目視資料轉移技術。甚至當遮蔽物 爲光學上不可穿透時，若遮蔽物係設計爲具有適當的集膚 • 深度（skin depth)，或介電質邊界使遮蔽物可傳送足夠的電 磁訊號，使得可使RFID或其他不需接觸，則非目視技術 仍可用於資料傳輸。人工操作者也可移除資料轉移的遮蔽 物，但是較佳而言，ICE係在無人工查核下，用於自動資 料轉移。 到目前爲止，所討論的ICE爲資料不可變的裝置。 然而，本發明的實施例也包括可程式ICE，其允許資料寫 入ICE。就某種程度上來說，所有ICE需寫入一次（例如 ，在工廠），此時，會將唯一識別資料初始地指定給此元 -11 - (8) 1375894 件。若在外地不能改變這些ICE中的'資料，則這些ICE在 • 此係稱爲靜態ICE。 可程式ICE與靜態ICE的不同之處在於在外地可將資 料寫入可程式ICE。一般來說，可程式ICE包括用來儲存 另外資料的板上記億體。記憶體的量可爲小至僅用來儲存 唯一識別資料之一些位元組，或可爲用來記錄例如是製程 執行期間所收集的資料之夠大的量。記憶體可例如是以半 # 導體爲基礎，或可爲光學或以光電磁爲基礎。 如所提及的，可將資料寫入一次（例如，在工廠）且不 可改變。可選擇或另外地將資料以不可改變的方式寫入， 使得不能抹除舊資料。此種不可改變的寫入資料有助於查 核。可另外或選擇地將ICE中的資料反覆地寫入及重新寫 入。在某些情況中，可適當地將超過一種類型的記憶體或 晶片或電路包含於ICE中。另外，較佳而言，在某些情況 中，強大的安全配置（如加密及/或密碼）會存在於ICE中， ® 以保護竄改及/或未授權存取的資料。當使用在此稍後所 討論的技術而將資料善用於元件及/或系統管理時，此觀 點將會顯然可知。 ICE中的資料可藉由外部裝置（亦即，與ICE相關的 智慧型元件之外的裝置）寫入。例如，主電腦或基底處理 系統控制器可寫入至各種零件的ICE。ICE可選擇或另外 地包括探針，以得到寫入其本身的ICE之資料。例如，夾 盤可包括溫度探針，以將溫度資料寫入其ICE。就另一例 而言，匹配網路可包括電流探針，以記錄流入基底處理系 -12- (9) 1375894 統的電流量。在基底處理週期的期間，在一 * 料可記錄至智慧型元件的ICE，或在另一實 . 由ICE而傳送至另一裝置（例如，另一智慧 腦、或基底處理系統控制器）》 ICE中的資料儲存，以及將資料轉移至 轉移資料較佳係以高度安全性來達成。數位 以及其他安全性技術可用來達成資料安全性 • 在電漿處理期間，曝露於電漿環境且尙 的ICE可進行設計，使得其讀取/寫入的RF 處理所使用之RF訊號的頻率範圍之外。例 處理系統使用2MHz、13.56MHz、或27MHz 以進行蝕刻應用。藉由避免此種頻率範圍， 可靠及/或更有效率地達成。另一種是，ICE 輸的任何頻率，但是在將其資料傳送至接收 待，直到完成電漿處理，且在僅提供資料傳 • 際製程執行期間所使用的任何RF或其他電循 在一實施例中，ICE的唯一識別資料係 外部資料儲存器（其可以基底處理系統進行丨 由如區域網路、廣域網路或網際網路的網辟 是若ICE不能儲存大量資訊，則使用此種副 儲存器可大大地改善此種唯一識別資料的有 施例中，唯一識別資料可用來當作決定電華 或與智慧型元件相關的材料複合物資料之指 件的經歷（包括例如是其製造資料、其部署i 實施例中，資 施例中，可藉 型元件、主電 ICE與從ICE 簽名、DES、 〇 不需轉移資料 頻率係在基底 如，許多基底 的RF訊號， 資料轉移可更 可使用資料傳 裝置之前需等 輸電路留下實 I 〇 用來協助存取 記置，或可經 F存取）。特別 本的外部資料 效性。在一實 i、機械、及/ 標。智慧型元 資料、其使用 -13- 1375894 do) 資料、以及類似資料）、其校正資料、其規格等也可藉由 • 使用當作指標的唯一識別資料來搜尋此種外部資料儲存器 而得到。 資料庫可例如是藉由基底處理系統的廠商或藉由批發 商或另一組織來維護，並且經由資料網路來存取。—般來 說’外部資料儲存器較佳係以保護基底處理系統的個人擁 有者或操作者之機密資訊的方式而儲存。可用的資料安全 • 性技術可用來保護機密。 就以智慧型元件爲基礎的管理技術之一例而言，ICE 資料可用來即時或接近即時地確保元件是否爲確認過的元 件。本發明的觀點係藉由圖1A及1B來說明。藉由查詢（ 例如，在安裝時間時、在系統啓動時間時、或任何其他的 隨機時間）智慧型元件相關其唯一識別資料，基底處理系 統或主電腦能判斷此元件是否係設計用於特定建議的應用 (例如’特定蝕刻或沈積製程）。基底處理系統或主電腦具 ® 有包含與建議的應用及合適的元件相關之資料的資料庫， 或可經由電腦網路存取的此種資料庫。就某種意義而言， 基底處理系統或主電腦也能僅藉由查詢智慧型元件（例如 ，圖1A: 1 02- 1 04，圖1B: 1 52- 1 54)來判斷是否已驗證智 慧型元件係根據廠商的規格或依據適當授權而製造。若發 現未適當地進行驗證元件（依據接收到的唯一識別資料）， 則會電子式地標示（例如，資料庫中的標示）此元件需要修 正動作（例如，圖1A: 110，圖1B: 160)。. 就以智慧型元件爲基礎的管理技術之另一例而言， -14 - (11) (11)1375894 ICE，所查詢的唯一識別資料與外部資料儲存器之間的相 關性可在不允許安裝及使用之應該已丟棄的過時元件或例 如是受損元件之情況中’用來防止或採取修正動作。當然 ，若元件爲僞照元件或未驗證元件，則其識別資料，或其 不足部分（例如，圖1A: 106，圖1B: 156)將顯示此種僞 照企圖或試圖使用未驗證元件。即使複製唯一識別資料， 中央資料庫還是能偵測出兩個不同基底處理系統中及/或 兩個地理上不同位置中正偵測的相同唯一識別資料，並且 能產生適當的警報。 若接收到的唯一識別資料與預期的相同，則可允許繼 續進行進一步的系統安裝及/或電源開啓及/或基底處理（例 如，圖 1A: 108，圖 1B: 158)。 就另一例而言，ICE可包括元件特徵資料（包括描述一 個或更多個最新的元件使用圖案、校正資料、與使用智慧 型元件的應用相關之資料、及/或類似物之歷史資料）。然 後，元件特徵資料可進行查詢（例如，圖2 : 202-204)，並 且與某些可接受的規格資料進行比較（例如，圖2 : 206)。 若比較顯示此智慧型元件不再是使用的規格內（例如，太 舊、太過受損、已經歷過太多處理週期、過時等），則會 電子式地標示（例如，資料庫中的標示）此智慧型元件進行 修正動作（例如，圖2: 210)。要注意的是，智慧型元件的 可接受規格資料及比較的邏輯可儲存於智慧型元件本身， 這樣可使智慧型元件進行基本的自我診斷。可接受規格資 料可選擇性或另外地儲存於外部資料庫中。若接收到的元 -15- (12) (12)1375894 件特徵資料符合要求，則可允許繼續進行進一步的系統安 裝及/或電源開啓及/或基底處理（例如，圖2 : 208)。 如所提及的，也可儲存元件的校正資料（亦即，初始 校正資料及/或過時所記錄的經歷校正資料）。此種校正資 料可儲存於ICE的板上，或此種校正資料可儲存於外部資 料庠中。所儲存的初始校正資料（可在工廠測試期間得到） 可進行查詢（例如，圖3: 302)，並且用來協助安裝後的元 件校正（例如，圖3 : 3 (Μ)。所儲存的經歷校正資料可例如 用來判斷是否在不久的未來，元件可能無法使用。在一實 施例中，若經歷校正資料近來顯示很顯著地改變，則此種 圖案表示在不久的未來，此零件可能無法使用。就另一例 而言，元件之目前校正値與初始校正値之間的比較可提供 相關元件的狀態之資訊。就又另一例而言，一元件的校正 資料中之改變的圖案表示系統的另一零件或部分出現問題 。藉由利用所儲存的校正資料，預先動作的元件及/或系 統維護可在無法使用實際發生前達成。 一般來說，當來自智慧型元件之所査詢的資料顯示不 應該使用此元件時，至少兩種動作可供選擇。首先，可使 系統除能，使得不合適的元件不許運作。第二，可選擇性 地允許系統運作（在一實施例中，在產生警告之後），但是 因爲擁有者在警告後，會持續使用系統，所以會記錄資料 ，以產生擁有者承擔損壞的風險之證明。此種證明有助於 使合法系統廠商避免例如是必須承擔因使用不合適元件而 造成系統受損的擔保修復工作。 -16- (13) 1375894 在安裝、配置、或開啓電源的期間，也可使用唯一識 * 別資料，以判斷基底處理系統中的一元件或所有元件是否 . 適合用於建議的應用。要注意的是，當安裝在一起的一組 其他驗證過的元件相互衝突時，個別元件會分開進行驗證 及/或視爲適合用於已知的應用，及/或當一起用於另一應 用時·，個別元件會產生效能降低的情況。藉由自動查詢來 自個別智慧型元件的唯一識別資料（例如，圖4 : 402-404) • 及使用結合基底處理系統所主控的專家資料庫與經由網路 的此種查詢資料，可保證在處理單一基底之前（例如，圖4 :4 08)，此種預先動作的方法確信基底處理系統可適當或 最佳地用於執行建議的應用（例如，圖4 : 406)。 若發現一個或更多個元件不適合用於特定應用，則會 提供推薦給系統擁有者或操作者，建議改變元件及/或製 程方法，或基底處理系統會使基底處理系統（若其具有配 置能力）進行配置，使得可更爲最佳地達成此應用。例子 ® 包括例如使匹配網路具有不同的阻抗値。以此方式，實質 上可降低由於不正確地配置基底處理系統所浪費的基底數 〇 自動查詢來自智慧型元件的智慧型元件資料之能力也 可例如用於預先維護基底處理系統β若替基底系統廠商工 作的工程師認爲特定一批的智慧型元件有缺陷，則能使用 電腦網路查詢部署系統（其可經由製造地擴展或與跨洲的 不同擁有者相關），以確保其是否包含此種元件。若智慧 型元件回應，則工程師能在系統損壞發生之前，預先請求 -17- (14) 1375894 改變元件。 • ICE還可包括與使用情況相關的歷史資料、伴隨著安 . 裝於系統中的其他元件、及/或與應用相關的資料。可儲 存於智慧型元件本身，或儲存於外部資料儲存器中之歷史 資料可使用當作搜尋金鑰之ICE的唯一識別資料進行存取 。資料可藉由主電腦及/或基底處理系統來收集，並且可 下載至智慧型元件的ICE。資料也可藉由具有智慧型元件 9 及/或具有ICE的探針來收集。資料收集可隨時（在預定或 可組態的區間）進行，或資料收集能力可以是使用者可組 態的’並且只有在請求的時候才會開始。收集的歷史資料 可在收集到資料的時候上載，或智慧型元件可等到適當時 間（例如，在電漿週期完成或在請求之後），才會上載資料 〇 歷史資料可用來判斷智慧型元件是否爲或仍然適合用 於特定系統（結合已知系統中的其他元件，及/或其他特定 ® 應用）。歷史資料不只包括元件識別資料，而且包括其校 正資料、其使用記錄（例如，外地的小時數）、及/或應用資 料（例如，相對於其他應用，之前的某些應用會產生較高 程度的損耗）。歷史資料特別可用於允許擁有者及/或操作 者能對元件替代及/或清除預先動作的此種資料之維護， 及/或任何其他的維護工作。在一實施例中，若歷史資料 建議在不久的未來需替代元件，則替代元件可自動地藉由 適當驅動軟體的商業邏輯進行排序。歷史資料自動地進行 收集及可用來自動觸發維護動作之事實不只可使預先維護 -18- (15) (15)1375894 較爲可行，而且實質上可降低負擔很重的維護記錄，以及 降低追蹤錯誤的機會。 在一實施例中，歷史資料可用來推斷智慧型元件是否 適合用於建議的生產運作。假設智慧型元件接近使用壽命 的末期》其歷史資料可允許工程師判斷是否仍有足夠的使 用壽命來從事建議的生產運作，或是否在生產運作開始之 前，應該取代此元件。要注意的是，因爲智慧型元件本身 具有與使用情況、使用圖案、過去應用等相關的歷史資料 ，所以可以較高程度的精確性進行仍可使用壽命的自我檢 查。以此方式，可使元件的可使用壽命最大。另一種是， 歷史資料允許系統校正及/或修改用來補償的其他元件及/ 或其他製程參數，而產生達成已知元件情況的合適製程結 果之更合適的環境。 來自系統中的一個或更多個元件之歷史資料也允許工 程師更精確地確認過去的時間點之運作情況。此種過去的 鑑定重建可大大地幫助準確地確定記錄資料的智慧型元件 ，或系統中的任何其他元件無法使用的原因。若擁有者使 用未驗證過的元件（例如，不合適或未確認的元件）且這樣 使用改變促進無法使用的運作情況，則自智慧型元件所查 詢的歷史資料允許使用者準確地確定無法使用的原因，及 /或將辯解的鑑定證據提供給無辜的系統廠商，以允許廠 商避免必須割由於未授權使用的不合適元件而造成損壞的 系統，進行無報酬的擔保工作。 底下將說明智慧型元件及本發明的元件管理技術實質 -19- (16) 1375894 上可改善基底處理系統的安裝、運作、以及維護之範例方 . 法。當初始安裝時，系統會查詢其智慧型元件，並且比較 相關於智慧型元件及元件校正參數的識別所得到的資料， •以判斷元件是否授權及/或適合個別或一起用於本系統中（ 例如，元件是否相互衝突）^ 一旦確認系統正確地安裝（可藉由比較來自智慧型元 件的查詢資料與來自參考資料庫的資料），來自智慧型元 • 件的查詢資料會自動地得到及儲存（在個別的智慧型元件 及/或使用中心化資料庫），以保持歷史記錄，使得自系統 的智慧型元件所査詢的接下來資料集可與維護及/或診斷 用途的歷史資料集進行比較。 在開啓電源時’系統會自我識別及/或查詢用於唯一 識別資料，以及所需的校正及/或歷史及/或收集環境的資 料之零件，以進行自我診斷，還可設定與希望的校正及補 償設定相關之任何必須的參數變量。此資料允許系統判斷 • 零件是否仍在規格內，以進行例如是建議的蝕刻及/或沈 積。 若應用資料（例如，方法）可用，則來自系統的智慧型 元件之ICE資料可用來確保系統（如共同全體或如—起運 作的大量零件）是否最佳地用來進行建議的應用。要注意 的是’自我診斷測試及適合應用的此測試可同時進行。系 統也可進行各種可移動或動作的零件（如大流量控制器， RF供應系統等）之自我測試。 要注意的是’若發現元件不適合用於系統中及/或進 -20- (17) (17)1375894 仃建議的應用’則系統會除能，以防止其執行及損壞本身 。若損壞的風險輕微，則會以清楚地給予警告且記錄資料 (較佳是以可抗竄改的形式）的方式，允許擁有者執行具有 視爲不合適的零件之系統，以當基底處理系統最後由於使 用不合適元件而損壞時，防止不擇手段的使用者稍後得到 合法系統廠商的免費保證服務及/或任何其他的給予物。 若在安裝或運作的期間，智慧型元件其中之一遭遇異 常情況，則收集的環境資料會使警報產生聲音。資料會記 錄下來且選擇性地傳送至系統廠商，作爲品質控制之用。 如所提及的’此資料會以安全的方式保持下來，使得資料 可抗竄改或未授權存取。 如可從上述而了解到的，本發明實質上可改善與基底 處理系統的安裝、運作、以及維護相關之元件及系統管理 。藉由使基底處理系統的零件具有唯一識別資料及較佳具 有可由合適轉換器自動讀取之唯一識別資料，査詢的資料 然後可藉由本發明的元件管理技術來使用，以改善安裝精 確性，並且改善使系統中的零件最佳執行建議的應用之可 能性。 結合以揭露的智慧型元件爲基礎的管理技術之唯一識 別資料實質上可消除未偵測基底處理系統中之使用僞照及 /或次等替代品的機會。零件中所儲存的歷史資料有助於 降低欺詐的保證要求，並且有助於工程師重新產生過去任 何時間點之運作情況，以更精確地調整基底處理系統及/ 或準確地確定無法使用的原因。具有外部資料儲存器之零 -21 - (18) (18)1375894 件上所儲存的資料之間的相關係可擴大作爲工具的ICE之 實用性，以改善基底處理系統的安裝、運作、以及維護。 因此，雖然本發明已就許多較佳實施例的觀點進行說 明，但是有落於本發明的範圍內之變化、變更、以及等效 物。例如，雖然特定例子係討論於一般的電漿處理系統及 特別的電漿蝕刻系統之內文中，但是本發明也可用於其他 的基底處理系統，如化學氣相沈積（CVD)系統、電漿加強 式化學氣相沈積（PECVD)系統、物理氣相沈積（PVD)系統 、快速熱處理（RTP)系統、微影系統等。應該也要注意的 是實施本發明的方法及裝置有許多變化的方式。因此奪謂 以下後附的申請專利範圍係解讀爲包含落於本發明的真實 精神及範圍內之所有此種的變化、變更、以及等效物。 【圖式簡單說明】 本發明係藉由附圖的圖式中之非受限的例子作說明， 且其中相似的參考標號係與類似元件相關，且其中： 圖ΓΑ係繪示根據本發明的一實施例之利用來自智慧 型元件的資料來操控元件之方法； 圖1 B係繪示根據本發明的另一實施例之利用來自智 慧型元件的資料來操控元件之方法； 圖2係繪示根據本發明的另一實施例之利用來自智慧 型元件的資料來操控元件之方法； 圖3係繪示根據本發明的另一實施例之利用來自智慧 型元件的資料來操控元件之方法；以及 -22- (19)1375894 圖4係繪示根據本發明的另一實施例之利用來自智慧 型元件的資料來操控元件之方法。1375894 (1) IX. Description of the invention ♦ [Technical field to which the invention pertains] The present invention generally relates to the use of smart components and smart components in a substrate processing system and management techniques based on smart components to improve Installation, operation, and maintenance of the substrate processing system. [Prior Art] # Substrate processing systems (such as plasma processing systems, wet etching processing systems, chemical mechanical honing (CMP) systems, and the like) have long been used for substrates (eg, semiconductor wafers, flat display panels, Treatment of light substrate, nanomachine substrate, and the like. As technology advances, it has become more expensive to acquire and maintain substrate processing systems, such as plasma processing systems. A portion of the cost increase can be attributed to the increased complexity of the substrate processing system itself. This is because when the device shrinks and production pressure increases in an attempt to keep up with the ever-increasing consumer demand for ever-increasing electronic products, Customer® expects the substrate processing system to achieve high-demand etching and deposition processes, as well as high productivity. . Therefore, the added features of modern substrate processing systems are precision design, exotic materials, and precision tool parts. When parts need to be installed (such as, for example, replacement parts based on scheduled maintenance schedules), manufacturers of substrate handling systems often insist that verification of replacement parts is required. The verification process ensures that the part meets strict engineering specifications, such as the composition of the part material and the dimensions of the part. • When using validated parts, the manufacturer of the substrate processing system can reasonably ensure that the substrate processing system has the intended configuration and conforms to the expected system specification-5-(2) 1375894 to perform the desired application (eg, Etching or deposition process). The use of validated and certified parts can benefit both the owner of the substrate processing system (a reliable system that produces the desired process results) and the manufacturer (with a substrate handling system that does not have to repair damage from secondary parts). In the case of the highest quality product, the cost of the verified part will be higher than the secondary copy. For unscrupulous parallel market manufacturers, because the substantial benefits can be increased by making the parts cheap and selling them to the high-priced parts market, a secondary replica of the substrate processing system is produced and completed. The temptation to accept alternatives is great. For the owner of the substrate processing system, the cost of purchasing and using unverified parts is high because the cost of the verified parts (made with high precision) is high for a short period of time. In these cases, the owner and the manufacturer will suffer at the same time. Even though some money is saved in a short period of time, the owner must suffer from unreliable system performance and often cause production interruptions due to equipment failure. Vendors will suffer from the need to support and repair a large number of damaged systems, and may be subject to unfair branding by vendors of unreliable substrate handling systems. There are other issues related to the installation, operation, and maintenance of the part. In today's substrate handling systems, because it is too simple, the mounting parts cannot be incorrect, the wrong parts cannot be installed in known systems and/or applications, and/or the required maintenance of the parts cannot be missed. As the substrate processing system becomes more complex, the problem gets worse. In view of the above, there is a need for a different method of manipulating the components of the substrate processing system. -6-(3) 1375894 SUMMARY OF THE INVENTION In one embodiment, the present invention relates to a method of component management in a substrate processing system. The substrate processing system has a set of components, at least a plurality of which are designed as smart components, each of which has an Intelligent Component Enhancement (ICE). This method involves querying the components for their respective unique identification data from their respective Intelligent Component Enhancements (ICE). The method further includes receiving a unique identification from the elements if any of the elements in the elements respond to the query. The method additionally includes, when the first component identification material is expected, indicating that the first component requires a corrective action if the first component of the components is unable to provide the first component unique identification material. In another embodiment, the invention is directed to a method of component management in a substrate processing system. The substrate processing system has a set of components, at least a plurality of which are designed as smart components, each of which has an Intelligent Component Enhancement (ICE). The method includes, via a converter, querying a first component of the components to receive the first feature data from an intelligent component enhancement (ICE) associated with the smart component. The method also includes receiving the first feature data β via the converter. The method further includes comparing the feature data to acceptable specification data for the smart component. If the first feature data fails to meet the acceptable specification data of the smart component, the method includes electronically indicating that the first component requires a corrective action. In yet another embodiment, the present invention relates to a component in a substrate processing system. Management method. The substrate processing system has a set of components, (4) 1375894 at least a plurality of components of the set of components are designed as smart components, each of the components having an intelligent component enhancement (ICE). The method includes querying, by a converter, a first component of the components to obtain a first calibration data. The first calibration data is obtained using one of the first technique and the second technique. The first technique involves obtaining the first correction data from an Intelligent Element Enhancement (ICE) associated with the first component. The second technique involves obtaining uniquely identifying material from the Intelligent Component Enhancement (ICE) and using only the identification data to obtain the first calibration data from a data store external to the first component. The method additionally includes using the first calibration data for one of mounting the substrate processing system and maintaining the substrate processing system. These and other features of the present invention will be described in more detail in the detailed description of the invention hereinbelow. [Embodiment] The present invention will now be described in detail with reference to some preferred embodiments as illustrated in the accompanying drawings. In the following description, various specific details are set forth in the claims However, it will be apparent to those skilled in the art that the present invention may be practiced without some or all of these specific details. In other instances, well-known process steps and/or structures are not described in detail to avoid obscuring the invention. In one embodiment, the present invention relates to smart components for use in substrate processing environments and technologies to enable intelligent components to efficiently improve individual components, subsystems, and system management. For detailed description, smart components Enhanced 8--(5) 1375894 (ICE) with minimal intelligence that breaks into at least uniquely identifiable components. For the items used here, the smart component can represent a basic part that cannot be split (such as a single solid piece of ingot aluminum) or a subsystem (such as an RF power supply). The smart component can be based on any component of a portion of the substrate processing system, whether or not such component is in direct contact with a reactive gas, liquid or plasma. For example, components of a plasma processing system may include a gas injector, a gas injection system, a plasma chamber, a plasma coupled dielectric window, a bushing, a focus ring or other ί edge ring or uniform ring, chuck assembly ' chuck Itself, chuck support components, endpoint detection systems and/or other diagnostic systems, RF power supplies, or matching networks. All components of the substrate processing system are not necessarily smart components. The mixing of smart components and conventional components (i.e., those without ICE) can coexist on known systems. In general, each smart component can be uniquely identified by its ICE. Preferably, although the present invention does not exclude artificially readable ICE and the use of such manually readable technology and external data sets, the ICE will contain machine readable data. To improve the installation, operation, and maintenance of the substrate processing system. Examples of manually readable ICEs include etching, attaching, painting, or engraving letters and numbers of smart components, or other visually perceptible symbols. If the ICE is machine readable, the information related to the smart component can be read manually or automatically*. For example, if the ICE is a computer barcode, the manual reading can include reading using a handheld computer barcode reader. Take the computer barcode. If the scan of the bar code can be completed without manual verification, the same bar code can of course be read automatically. Although the bar code is used as an example-9-(6) (6)1375894, but any visual and electronic Electromagnetic, optical 'chemical, or audible sensing mechanisms can be used by ICE. Such examples include the shape or pattern to be identified, the addition or application of various forms of isotopes or chemicals to be chemically detected or configured via electromagnetic detection. Automatic reading can use techniques such as RFID that allow smart components to be identified without contact or line of sight reading and/or writing. In fact, RFID is one of the better ICE viable technologies. For data that can be transmitted without direct physical contact or visual electromagnetic spectrum, RFID operates similarly to computer bar codes, but with more powerful performance. An example of an RFID system would require the following components: a query (or tag), a reader/writer (interrogator), an antenna, and a host computer. The interrogator is part of the system and includes a small electronic circuit preferably having an additional germanium wafer. RFID tags are available for power and can be classified as active or passive. Some active tags have an internal battery that can be read over long distances. It is typically readable/writable and can often be seen, for example, in a charging connection application. Passive tags do not have a battery and are typically powered by a separate external power source from the querier. A typical reader typically includes an antenna to transmit information to and receive information from the tag. The size and form of the antenna can depend on the particular application and the frequency chosen. It usually covers the decoder and RF modules, as well as the antenna. The reader can be fixed (ie, installed) depending on the application, or portable as a handheld one. Furthermore, a suitable ICE system is used to resist the corrosive and/or damaging effects of the environment caused by smart components. Therefore, if such exposure requires the wisdom-10-(7) 1375894 lithographic component, the ICE will be built into the plasma environment, making it substantially resistant to plasma etching or deposition, as well as resistance to electrode formation. RF. Damage caused by energy and / or high temperature environment. Likewise, the ICE in a chemically etched environment will substantially resist the chemicals used in the etching process. Preferably, the ICE with any support or shielding structure is used to minimize impact on the substrate processing process (e.g., by minimizing the impact of contamination and/or process parameters). # In order to make the ICE more resistant to damage, the ICE or part of it can be installed in a smart component so that the ICE or its vulnerable parts are not actually exposed. For data transfer, the ICE for such mounted components can rely on non-visual technology. Alternatively, the ICE and its parts can be shielded by suitable coverings (formed from suitable materials such as metals, dielectrics, ceramics, plastics, etc.). The shield and portions thereof are optically permeable and can be visually transferred using optical transparency that requires some level of optical transparency. Even when the mask is optically impermeable, if the mask is designed to have an appropriate skin depth, or the dielectric boundary allows the mask to deliver sufficient electromagnetic signals, enabling the RFID or Non-visual technology can still be used for data transmission without other contact. The manual operator can also remove the mask for data transfer, but preferably, the ICE is used for automatic data transfer without manual checking. So far, the ICE in question is a device with immutable data. However, embodiments of the present invention also include a programmable ICE that allows material to be written to the ICE. To some extent, all ICEs need to be written once (for example, at the factory), at which point the unique identification data is initially assigned to this element -11 - (8) 1375894 pieces. If the 'information' in these ICEs cannot be changed in the field, these ICEs are called static ICE. The difference between a programmable ICE and a static ICE is that data can be written to a programmable ICE in the field. In general, the programmable ICE includes an onboard board for storing additional data. The amount of memory can be as small as a few bytes used to store uniquely identified data, or can be used to record, for example, a sufficiently large amount of data collected during execution of the process. The memory can be based, for example, on a half-conductor or can be optical or based on optical electromagnetics. As mentioned, the data can be written once (e.g., at the factory) and cannot be changed. The data can be optionally or additionally written in an unalterable manner so that the old material cannot be erased. Such unchangeable written data is helpful for checking. The data in the ICE can be additionally and selectively written and rewritten. In some cases, more than one type of memory or wafer or circuit may be suitably included in the ICE. Additionally, preferably, in some cases, a strong security configuration (such as encryption and/or password) will exist in the ICE to protect against tampering and/or unauthorized access. This will be apparent when the material is used for component and/or system management using the techniques discussed later herein. The data in the ICE can be written by an external device (i.e., a device other than the smart component associated with the ICE). For example, the main computer or substrate processing system controller can write to the ICE of various parts. The ICE may or may additionally include a probe to obtain information about the ICE written to itself. For example, the chuck can include a temperature probe to write temperature data to its ICE. In another example, the matching network can include a current probe to record the amount of current flowing into the substrate processing system -12-(9) 1375894. During the substrate processing cycle, one can be recorded to the ICE of the smart component, or the other can be transferred from the ICE to another device (eg, another brain, or substrate processing system controller). The storage of data in ICE and the transfer of data to transfer data are preferably achieved with a high degree of security. Digital and other security technologies can be used to achieve data security • During plasma processing, the ICE exposed to the plasma environment can be designed so that the frequency range of the RF signal used for RF processing of its read/write is Outside. Example The processing system uses 2MHz, 13.56MHz, or 27MHz for etching applications. By avoiding such a frequency range, it is achieved reliably and/or more efficiently. The other is that any frequency of the ICE transmission, but in the transmission of its data to the reception until the completion of the plasma processing, and in the provision of only any RF or other electrical circuit used during the execution of the data transmission process in an embodiment The only identification data of the ICE is the external data storage (which can be performed by the base processing system, such as the regional network, the wide area network or the Internet). If the ICE cannot store a large amount of information, the secondary storage is used. In the case where the unique identification data can be greatly improved, the unique identification data can be used as an indication of the parameters of the material composite material relating to the genus or the smart component (including, for example, its manufacturing materials, In the embodiment of the deployment i, the borrowing component, the main power ICE and the signature from the ICE, DES, and the data frequency are not required to be transferred on the substrate, such as many substrates, the RF signal, the data transfer can be more usable data. Before transmitting the device, it is necessary to wait for the transmission circuit to leave the real I 〇 to assist the access record, or to access the F.) Special external data validity. , and / / .. Smart metadata, its use -13 - 1375894 do) data, and similar information), its calibration data, its specifications, etc. can also be searched for by using • the unique identification data used as indicators Obtained from the data store. The database can be maintained, for example, by the manufacturer of the substrate processing system or by a wholesaler or another organization, and accessed via a data network. Generally speaking, the external data storage is preferably stored in a manner that protects the confidential information of the individual owner or operator of the substrate processing system. Available data security • Sex technology can be used to protect confidentiality. For an example of a smart component-based management technique, the ICE data can be used to ensure that the component is a validated component, either immediately or near instantaneously. The views of the present invention are illustrated by Figures 1A and 1B. By querying (eg, at installation time, at system startup time, or at any other random time) that the smart component is associated with its unique identification, the base processing system or host computer can determine whether the component is designed for a particular recommendation. Applications (such as 'specific etching or deposition processes). The substrate processing system or main computer tool ® has a database containing information about the proposed application and the appropriate components, or such a library accessible via a computer network. In a sense, the base processing system or the host computer can also determine whether the smart type has been verified by querying the smart component (for example, Figure 1A: 1 02-104, Figure 1B: 1 52- 1 54). Components are manufactured according to the manufacturer's specifications or with appropriate authorization. If it is found that the verification component is not properly verified (according to the unique identification data received), it will be electronically marked (eg, in the database) that the component requires a corrective action (eg, Figure 1A: 110, Figure 1B: 160) ). For another example of a smart component-based management technique, -14 - (11) (11) 1375894 ICE, the correlation between the unique identification data queried and the external data store may not be allowed to be installed. And used in the case of obsolete components that have been discarded or in the case of, for example, damaged components, 'to prevent or take corrective action. Of course, if the component is a fake component or an unverified component, its identification data, or its underlying portion (e.g., Figure 1A: 106, Figure 1B: 156) will show such a sham attempt or attempt to use an unverified component. Even if the unique identification data is copied, the central repository can detect the same unique identification data being detected in two different substrate processing systems and/or in two geographically distinct locations, and can generate appropriate alerts. If the unique identification data received is the same as expected, further system installation and/or power-on and/or substrate processing may be allowed to continue (e.g., Figure 1A: 108, Figure 1B: 158). In another example, the ICE may include component profile data (including historical data describing one or more of the most recent component usage patterns, calibration data, information related to the application of the smart component, and/or the like). Component characteristics can then be queried (for example, Figure 2: 202-204) and compared to certain acceptable specifications (for example, Figure 2: 206). If the comparison shows that this smart component is no longer within the specifications used (for example, too old, too damaged, has experienced too many processing cycles, obsolescence, etc.), it is electronically labeled (for example, in the database) Mark) This smart component performs a corrective action (for example, Figure 2: 210). It should be noted that the acceptable specification data and comparison logic of the smart component can be stored in the smart component itself, so that the smart component can perform basic self-diagnosis. Acceptable specifications can be optionally or additionally stored in an external database. If the received -15-(12)(12)1375894 feature data meets the requirements, further system installation and/or power-on and/or substrate processing may be allowed (eg, Figure 2: 208). As mentioned, the calibration data for the component (i.e., the initial calibration data and/or the obsolete correction data recorded) may also be stored. This calibration information can be stored on the ICE board, or such calibration data can be stored in an external data file. The stored initial calibration data (available during factory testing) can be queried (eg, Figure 3: 302) and used to assist with post-installation component calibration (eg, Figure 3: 3 (Μ). Stored experience The calibration data can be used, for example, to determine if the component may not be usable in the near future. In an embodiment, if the correction data has recently changed significantly in the display, the pattern indicates that the part may not be available in the near future. In another example, the comparison between the current correction 元件 of the component and the initial correction 可 provides information on the state of the associated component. In yet another example, the changed pattern in the calibration data of a component represents another A problem occurs in a part or part. By using the stored calibration data, pre-action components and/or system maintenance can be achieved before the actual use can occur. In general, when the information from the smart component is displayed When this component should not be used, at least two actions are available. First, the system can be disabled, making the inappropriate components inoperable. Second, the system can be selectively allowed to operate (in an embodiment, after a warning is generated), but because the owner continues to use the system after the warning, the data is recorded to generate the risk of damage to the owner. Proof of this type of proof helps the legitimate system manufacturer to avoid, for example, the warranty repair work that must be performed to damage the system due to the use of inappropriate components. -16- (13) 1375894 During installation, configuration, or power-on, You can also use unique data to determine if a component or all components in the substrate processing system are suitable for the proposed application. Note that when a set of other verified components that are installed together conflict with each other Individual components may be verified separately and/or deemed suitable for use in known applications, and/or when used together in another application, individual components may have reduced performance. By auto-query from individual intelligence Unique identification of the component (eg, Figure 4: 402-404) • and use of an expert database hosted by the combined substrate processing system and via the network Such query data can be guaranteed to be processed prior to processing a single substrate (eg, Figure 4: 4 08). This method of pre-action is believed to be appropriate or optimal for the substrate processing system to perform the proposed application (eg, Figure 4: 406). If one or more components are found to be unsuitable for a particular application, a recommendation is provided to the system owner or operator, suggesting that the component and/or process method be changed, or the substrate processing system will cause the substrate processing system (if Configuring with configuration capabilities makes this application even better. Examples® include, for example, making the matching network have different impedances. In this way, the waste due to incorrectly configuring the substrate processing system is substantially reduced. The number of bases 〇 the ability to automatically query the smart component data from smart components can also be used, for example, to pre-maintain the substrate processing system. If the engineer working for the substrate system manufacturer believes that a particular batch of smart components is defective, then Use a computer network to query the deployment system (which can be extended by manufacturing or related to different owners across continents) to ensure It contains such elements. If the smart component responds, the engineer can request -17-(14) 1375894 to change the component before system damage occurs. • The ICE may also include historical information related to usage, other components accompanying the installation, and/or application-related information. Historical data that can be stored in the smart component itself or stored in an external data store can be accessed using the unique identification data of the ICE as the search key. Data can be collected by the host computer and/or substrate processing system and downloaded to the ICE of the smart component. The data can also be collected by means of smart elements 9 and/or probes with ICE. Data collection can be done at any time (in a predetermined or configurable interval), or data collection capabilities can be user-configurable' and only begin when requested. The collected historical data can be uploaded at the time the data is collected, or the smart component can wait until the appropriate time (for example, after the plasma cycle is completed or after the request) to upload the data. Historical data can be used to determine whether the smart component is Or still suitable for a particular system (in combination with other components in known systems, and/or other specific ® applications). Historical data includes not only component identification data, but also its calibration data, its usage records (for example, hours in the field), and/or application data (for example, some previous applications have a higher degree of comparison than other applications). loss). Historical data may be used in particular to allow the owner and/or operator to perform maintenance of such information on component replacement and/or removal of pre-actions, and/or any other maintenance work. In one embodiment, if the historical data suggests that the component needs to be replaced in the near future, the replacement component can be automatically ordered by the business logic of the appropriate driver software. The fact that historical data is automatically collected and can be used to automatically trigger maintenance actions not only makes pre-maintenance -18-(15) (15)1375894 feasible, but also substantially reduces the burdensome maintenance records and reduces tracking errors. chance. In one embodiment, historical data can be used to infer whether the smart component is suitable for the proposed production operation. Assuming that the smart component is near the end of its useful life, its historical data allows the engineer to determine if there is still enough useful life to perform the proposed production operation, or whether it should be replaced before the start of production operations. It should be noted that since the smart component itself has historical data related to usage, use patterns, past applications, etc., it is possible to perform a self-check of the service life with a high degree of accuracy. In this way, the useful life of the component can be maximized. Alternatively, the historical data allows the system to calibrate and/or modify other components and/or other process parameters for compensation to produce a more suitable environment for achieving suitable process results for known component conditions. Historical data from one or more components in the system also allows the engineer to more accurately confirm the operation of past time points. Such past identification reconstruction can greatly help to accurately determine the reason why the smart component of the recorded data, or any other component in the system, cannot be used. If the owner uses unverified components (for example, inappropriate or unidentified components) and such use changes promote unusable operation, the historical data queried from the smart component allows the user to accurately determine the reason for the unusable use. And/or provide the evidence of the justification to the innocent system vendor to allow the manufacturer to avoid unscrupulous guarantees by avoiding systems that must be damaged by improper use of unauthorized components. The following is a description of the smart components and the component management techniques of the present invention. -19- (16) 1375894 Examples of improvements in the installation, operation, and maintenance of substrate processing systems. When initially installed, the system queries its smart components and compares the information obtained from the identification of the smart components and component calibration parameters, • to determine if the components are authorized and/or suitable for use in the system individually or together ( For example, if the components conflict with each other) ^ Once the system is correctly installed (by comparing the query data from the smart component with the data from the reference library), the query data from the smart component is automatically obtained and stored. (in individual smart components and/or use centralized database) to maintain historical records so that the next data set queried by the system's smart components can be compared to historical data sets for maintenance and/or diagnostic purposes. . When the power is turned on, the system will self-identify and/or query the parts used to uniquely identify the data, as well as the required corrections and/or history and/or collection environment, for self-diagnosis, and also to set the desired corrections. And any necessary parameter variables related to the compensation settings. This information allows the system to determine if the part is still within specification to perform, for example, the recommended etching and/or deposition. If application data (eg, methods) is available, the ICE data from the smart components of the system can be used to ensure that the system (eg, a common or a large number of parts that operate) is optimally used for the proposed application. It should be noted that the 'self-diagnostic test and this test for the application can be performed simultaneously. The system can also perform self-testing of various moving or moving parts (such as large flow controllers, RF supply systems, etc.). It should be noted that 'if the component is found to be unsuitable for use in the system and/or enter -20- (17) (17) 1375894 仃 recommended application' then the system will be disabled to prevent its execution and damage itself. If the risk of damage is minor, the owner is allowed to perform a system with parts deemed to be inappropriate, in a manner that clearly gives a warning and records the data (preferably in a form that is resistant to tampering). When the damage is caused by the use of inappropriate components, the unscrupulous user is prevented from obtaining the free warranty service of the legal system manufacturer and/or any other donor later. If one of the smart components experiences an abnormality during installation or operation, the collected environmental data will cause the alarm to sound. The data is recorded and selectively transmitted to the system manufacturer for quality control purposes. As mentioned, this information will be kept in a secure manner so that the information is resistant to tampering or unauthorized access. As can be appreciated from the foregoing, the present invention substantially improves component and system management associated with the installation, operation, and maintenance of a substrate processing system. By having the parts of the substrate processing system have unique identifying information and preferably having unique identifying information that can be automatically read by a suitable converter, the queried material can then be used by the component management techniques of the present invention to improve mounting accuracy, and Improve the possibility of making the best possible implementation of the recommended parts in the system. The unique identification data combined with the management techniques based on the disclosed smart components virtually eliminates the opportunity to use artifacts and/or inferior substitutes in undetected substrate processing systems. Historical data stored in the part helps to reduce fraud assurance requirements and helps engineers reproduce the operation of any point in the past to more accurately adjust the substrate processing system and/or accurately determine the reasons for the inability to use. Zero--21 with external data storage - (18) (18) 1375894 The relationship between the data stored on the piece can expand the utility of the ICE as a tool to improve the installation, operation, and maintenance of the substrate handling system. . Therefore, the present invention has been described with respect to the preferred embodiments thereof, and variations, modifications, and equivalents within the scope of the invention. For example, although specific examples are discussed in the context of general plasma processing systems and special plasma etching systems, the invention is also applicable to other substrate processing systems, such as chemical vapor deposition (CVD) systems, plasma strengthening. Chemical vapor deposition (PECVD) systems, physical vapor deposition (PVD) systems, rapid thermal processing (RTP) systems, lithography systems, and the like. It should also be noted that there are many variations to the method and apparatus embodying the invention. Therefore, the scope of the claims below is to be construed as including all such variations, modifications, and equivalents. BRIEF DESCRIPTION OF THE DRAWINGS The present invention is illustrated by the non-limiting example of the drawings, in which like reference numerals are A method for manipulating components using data from smart components in an embodiment; FIG. 1B illustrates a method for manipulating components using data from smart components in accordance with another embodiment of the present invention; A method of manipulating an element using data from a smart component in accordance with another embodiment of the present invention; FIG. 3 is a diagram illustrating a method of manipulating a component using data from a smart component in accordance with another embodiment of the present invention; -22- (19) 1375894 FIG. 4 illustrates a method of manipulating an element using data from a smart component in accordance with another embodiment of the present invention.
-23--twenty three-