TWI373814B - Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same - Google Patents

Description

1373814 IX. Description of the Invention: [Technical Field] The present invention relates to a semiconductor device inspection in which a cleaner is integrally installed to remove dust or impurities of the surface of the f-conductor device, thereby reducing pollution The number of semiconductors that are determined to be defective, and thereby improve the yield of the semiconductor device, and the semiconductor device detection method. [Previous technology] + ^^^^^^(^) (semiconductor integrated circuit) has the form of a wafer on a semiconductor wafer, which is processed by a through-system process to become a semiconductor package suitable for protecting the wafer from external vibration. ^ After the packaging process, the semiconductor package is supplied to the customer, and will be connected to the party for an electrical function test. (A) The semiconductor package that has passed the electrical function test will be moved to the mark. Marking equipment, in order to facilitate the semiconductor information (semiconductor chip type 'manufacturer, transaction name, etc.') - even small defects and internal defects can seriously affect such semiconductor packaging Performance. Therefore, in the above-mentioned electrical function test, the external imaging test of the semiconductor package is carried out by the imaging camera (10). As for the above-mentioned defects in the semiconductor package, especially the defects of the Ball Grid Arrays (BGAs) and leads, the process of assembling the semiconductor device to the printed circuit board ((4) (4) (10) Heart Board 'PCB) may be involved. Happened in. Therefore, the detection of leads or ball arrays and 7 marks becomes quite important. A conventional apparatus for detecting the appearance of a semiconductor package is disclosed in the Korean Patent Publication No. 2005-48584, the "Semiconductor device inspecting apparatus" proposed by the applicant of the present invention. The disclosed conventional semiconductor device detecting device, as shown in the ninth figure, comprises: a main body 100', a loader 210 for loading a tray carrying a semiconductor device to be detected, An inspection device 300 for detecting a semiconductor device; a buffer 220 for temporarily storing a buffer tray carrying the semiconductor device to be inspected; loading and carrying a semiconductor selected to be defective according to the detection result The first to third scrap carriers 230, 240, and 250 of the tray of the apparatus, the defective semiconductor devices carried by the trays of the individual waste carriers are selected according to the type of defect; an unloader (un -loader) 260 for loading a tray carrying a semiconductor device selected as normal according to the detection result; a plurality of tray conveyors 48 are respectively connected to the loader 210, the buffer 220, and the first to third waste products Carriers 230, 240, and 250, and an unloader 260 for moving the tray in the forward and rearward directions of the main body 1; a conveyor 5 mounted on the upper end of the main body 1 〇 can be moved horizontally and horizontally to transfer between the loader 21〇, the buffer 220, the first to third waste carriers 230, 240, and 250, and the unloader 260; and A picking device 6GG that is reciprocally moved between the loader 210, the buffer 220, the first to third scrap carriers 23〇, 24〇, and the 250' and the unloader tray conveyor belt The defective semiconductor device carried on the tray is picked up for transport to the unloader and filled up to be transferred to the unloader 26 according to the normal semiconductor device conductor arrangement of the 1373814=bearing tray. The empty space of the tray + Here, the detecting device 300 includes the first and the first execution of an image detection. First - image camera - surface of the body device 'second image camera 3 ^

The other surface of the semiconductor device. In order to enable the first and second machines 310, 320 to sequentially detect the two surfaces of the semiconductor device, the conventional detecting device further includes an inverting device (invert = device) 700 which is interposed between the first image camera 31. A tray between the second image camera 320 and the second image camera 320 is used to reverse the flipping of the semiconductor device. In the ninth diagram, reference numeral 420 denotes an empty tray, reference numeral 410 denotes an i〇ading stacker, and reference numeral Co denotes a feeder of a forked empty tray. Reference numerals * 祁, 440, 450, and 460 denote feed lines respectively provided to the first, second, and ninth article carriers 230, 240, and 250, and the unloader 260. Similarly, the reference to the Muir 5 Tiger 610 represents a picker for selecting semiconductor devices. According to the above configuration, when the loader 21 is supplied to the tray, and the tray is transported along the tray conveyor 48 of the loader 210, the surface of the individual semiconductor device carried on the tray will pass through the first image. The fabric camera 310 performs image inspection, and when the image inspection is completed, the semiconductor device reversing device 700 is reversed and inverted. θ Here, the inversion device 700 must have an empty tray for allowing the semiconductor device carried on the loader tray to be re-inverted when it is turned upside down, 9 1373814 The upper surface of the tray will be exposed. The load-carrying device 500 transmits the 480 cup image camera 32 〇 & a tray conveyor in the viewing area, the transport value _ will be round-trip on the tray conveyor 480: = tray. The semiconductor 乂 θ transmitted to the inspection area after being flipped is spliced to an image detection of the second image camera 32A. There is a problem in the conventional casting device detection device. In the process, the dust may adhere to the semiconductor package, and on the lead type semiconductor device, the Tezuka image is New Zealand. Will remain in the appearance of the semiconductor device. , a semiconductor device that retains dust or impurities, although it can be placed in a semiconductor, there is still a great result that can be combined with the results of the test. The image detection of the image of the image of the image is inferior. Therefore, there will be detection positive (10) in order to solve the above problems, traditionally on the artificial side, defective semiconductor devices, or one after the other: in addition to dust or impurities, etc., then perform an image inspection: and because of the extra The labor cost increases the drop in the product price, and the present invention is based on the above problems. The second object is to provide a semiconductor hemp device having a! Two automatic = eleaner) is provided at the forefront of the image_machine, with two == shift _ there is a semi-conducting "the appearance of the surface is like a powder / wood, thereby preventing normal semiconductor devices because of pollution = 10 1373814 Mistaken judgment is defective, thereby improving yield and detection accuracy, and providing a semiconductor device detection method using the same.

Another object of the present invention is to provide a semiconductor device detecting apparatus in which a brush cleaner is operated when a tray of a semiconductor device carrying a defect is returned for re-detection, and automatically before image sensing of the semiconductor device Removing contaminants such as dust or impurities remaining on the surface of the semiconductor device, thereby preventing a normal semiconductor device from being erroneously determined to be defective due to a small surface defect, and providing a semiconductor device using the same Detection method. a According to one aspect of the present invention, the above and other objects are achieved by providing a semiconductor device detecting device, wherein the semiconductor device is mounted on a tray (the external device on the ti/' is via an image detecting device (vision inspecting) Device) shooting 'to eight according to the image being captured

As a result, the semiconductor devices are selected to be classified into a defective semiconductor device and a normal semiconductor device, and the defective semiconductor devices are classified according to the defect type. Picking and transferring to a plurality of reject carriers, and the normal semiconductor devices are transferred to the -4 (Om-loader), wherein the semiconductor device detecting device includes a *gas cleaner for performing with the image detecting device An image inspection automatically removes contaminants remaining on the exterior of the semiconductor device. The image detecting device includes - a first image: and a second; a camera, and a scale air m is provided at the forefront of the image camera and the second image camera. Each of the air cleaners may include: a casing having one surface formed with an opening, and one of the upper surfaces of the casing is formed with a plurality of holes 11 1373814; the plurality of roots are respectively installed into the holes a vacuum suction tube; and an air discharge tube horizontally inserted into the lower end of the housing, the exhaust tube being formed on the lower surface thereof at a predetermined angle A vent hole formed obliquely. Preferably, the housing has a dome shape to ensure smooth passage of impurities and dust through the vacuum pipette. An ion supply device may be connected to the exhaust pipe to supply ions to prevent static charge, and the air cleaner may further include a flow regulator valve (f low-rate ad justing valve) and a pressure The valve ' is adjusted to automatically adjust the flow and pressure of the air supplied to the exhaust pipe according to the type of the semiconductor device. Each of the air cleaners may further include a sensor ' to sense whether the semiconductor devices have been normally carried on the tray. The semiconductor device detecting apparatus may further include: a brush cleaner for automatically removing contaminants remaining on the surface of the semiconductor devices before performing image detection by the image detecting device. The brush cleaner operates when a tray loaded to an associated waste carrier is returned for re-detection, and the brush cleaner can include: a brush module integrally formed with the plurality of brushes; a casing of a rear end of the brush module, an opening is formed on a lower surface of the casing, and a plurality of holes are formed on an upper surface of the outer cover; a plurality of vacuum suction pipes respectively installed into the holes; And an exhaust pipe horizontally inserted into the lower end of the casing for receiving air supplied to the exhaust pipe, the exhaust pipe being formed on the lower surface thereof at a plurality of angles formed at a predetermined angle Vent hole. Preferably, the brush cleaner may further comprise a 12 provided to the housing.

The lower end opening mask member (where 41 is disposed adjacent to reduce an inspiratory space to increase the always-on first surface-up tray from a loader to a first image detecting area Performing a first-shirt image detection on the first surfaces of the semiconductor devices, and selecting the semiconductor devices as defective semiconductor devices and normal semiconductor devices according to the results of the first image detection, wherein the semiconductor devices The detecting method further includes: performing an air cleaning operation on the semiconductor devices carried on the tray before the tray is transferred to the first image detecting area. The semiconductor device detecting method may further include: executing the first After an image detection, and before selecting the semiconductor device as a defective semiconductor device and a normal semiconductor device according to the result of the first image detection, the semiconductor surfaces carried on the tray are reversed and inverted, so that the semiconductors The second surface of the device faces upward; performing an air cleaning operation on the second surfaces of the semiconductor devices; Transferring the trays of the semiconductor devices that have passed the air cleaning operation to a second image sensing area; and the semiconductor devices that are carried on the trays that are transferred to the second image sensing area The second surface performs a second image detection. The semiconductor device detecting method may further include: returning a tray carrying the semiconductor device selected to be defective to the loader, and carrying the bearing on the bearing 13^/3814 The second surfaces of the semiconductor devices that are returned to the tray perform a brush cleaning operation; the trays carrying the semiconductor devices that are carried by the brush cleaning operation are turned off, so that the semiconductors are turned off. The first surface is facing upward; performing a brush cleaning operation on the first surfaces of the semiconductor devices; and loading the tray carrying the semiconductor devices that have been cleaned by the brush to the loader After that, the image detection outside is performed. [Embodiment] The following is a reference to the embodiment of the present invention, which can be easily understood by those skilled in the art. The present invention is understood and reproduced. The first drawing is a perspective view of the inspection according to the first embodiment of the present invention. The second drawing is a partial perspective view of the first drawing. The second drawing is a plan view of the second drawing. >Kato® to the second figure, the present invention provides an apparatus in which an image of a loader tray supplied by a loading state is carried by an in-frozen conductor m Analyze the fruit '^ = 2 set 1 to shoot, according to the lack of _ 贞 dragon pick and money reading = etc. Normal semiconductor devices will be transmitted to - two body device ^ test 3 preparations including air cleaning n 3, Performing image detection using 丨 to remove contaminants left on the surface of the semiconductor device. Automatically transferring dev^) in the figure to refer to the label "2" for selecting a device (such as devlce) to select a semiconductor device. Tray. Semiconductors are listed in the head, 丨_^#^ It can be said that b" represents all the components of the work device's test equipment, except for the air 14 1373814 cleaner 3, which is the same as the previous case. The same constituent elements and their operation will not be mentioned. The image detecting device 1 includes a first image camera 11 for viewing a surface of an individual semiconductor device carried on a loader tray, and a second image camera 12 for viewing another surface of the semiconductor device. The air cleaners 3 are located at the foremost ends of the first and second image cameras 11, 12, respectively. The semiconductor devices carried on the tray transported by the loader L have their lower surfaces facing upward, and when they pass through the air cleaner 3 provided at the foremost end of the first image camera 11, they will receive the first The image of the image camera 11 is cleaned before image detection. Next, the semiconductor device is turned upside down by the inverting device (not shown) such that the upper surface of the semiconductor device is upward. When the tray carrying the semiconductor device passes through the air cleaner 3 at the forefront of the second image camera 12, the semiconductor device is cleaned before receiving the image detection of the second image camera 12. As described above, by attracting and removing contaminants such as impurities or dust before image detection, the present invention can prevent a normal semiconductor device from being erroneously determined to be defective based on the result of image detection because of contamination. The fourth figure is a front perspective view of one of the air cleaners according to an exemplary embodiment of the present invention, and the fifth figure is a bottom view of the fourth figure. The air cleaner 3 includes a casing 3, a plurality of vacuum suction tubes 32, an exhaust pipe 33, and an air supply tube 34. The casing 31 is formed with an opening formed on a lower surface thereof, and a plurality of holes 311 are formed in an upper surface of the casing. Preferably, the casing 31 has a shape of a dome 15 1373814 so as to attract impurities and powder contained in the air without accumulating at the corners of the casing 31. i Suqian 32 smoothly 32 series broken separately installed in the housing here, if only one vacuum pipette 32 is used, the suction pipe 32 is gathered in a special area of the casing 31. The impurities and dust of the plurality of vacuum may accumulate. In the case of the housing 3 "the air that is drawn into the air will pass completely through the housing 31. To avoid this question ^ in the special area'

The manifold is distributed by a vacuum pipette, and is a special area of the plurality of roots 31. Instead of gathering in the casing, the exhaust pipe 33 is horizontally placed in the casing 31. A plurality of exhaust holes == two r air itching 332 is connected to the exhaust pipe 33' for

The hole 311 of the vacuum pipette 31 for attracting air is used. L is supplied to the exhaust pipe 33, and air is discharged through the exhaust hole 331 to m = removing contaminants attached to the semiconductor device, such as mass and dust. A work suction g 32 system is used to attract the removed contaminants by vacuum suction. The six's 仏 gas tube 34 is connected to an ion supply tube (i〇n SUppiy t_ube) 35 and the latter is connected to an ion supply device (not shown in the figure) to supply ions to prevent electrostatic adsorption of pollutants (electrostatic Adsorption) 〇 In general, the surface of a semiconductor device will remove static dust or impurities due to electrostatic adsorption of dust. 16 1373814 For this reason, in the present invention, it is preferable to remove the ions or the surface supplied from the semiconductor through the ion supply tube 35 for the purpose of removing dust or impurities adsorbed to the semiconductor device. It is easier to achieve. Although not shown in the drawings, the air cleaner 3 preferably adjusts the valve (1). The w-rate adjust lng valve) and the [pressure adjusting valve] are used to automatically adjust the flow rate and pressure of the air supplied to the exhaust pipe according to the semiconductor device. The whole valve and pressure are difficult to connect to - personal computer, money for automatic remote control of the whole valve and the friction adjustment valve. In 5. For example, an object to be inspected, that is, a conductor device, has (4) components, such as spherical leads or so 'if all the same applies to air pressure, it may be mounted on the semiconductor device. Components. Therefore, it is preferable to adjust the flow disk = gas pressure. The 'two air cleaners 3' further include a sensor 36 for sensing whether the semiconductor guides have been normally carried on the tray. And x according to the above-described first embodiment relating to the present invention, by using an air cleaner located at the most end of the camera to automatically remove contaminants such as powder impurities remaining on the surface of the semiconductor device, the present invention has A normal semiconductor device can be erroneously determined to be a defective conductor device because of contaminants' and thus achieve better yield and detection accuracy. Figure 6 is a perspective view of a semiconductor $ detecting apparatus according to a second embodiment of the present invention. The same constituent elements as those of the first figure will not be mentioned below. Referring to a sixth diagram, a semiconductor device detecting apparatus according to a second embodiment of the present invention further includes a brush cleaner 4 for automatically removing dust or impurities before performing image detection using the image detecting device} 1373814 Contaminants that remain on the surface of the semiconductor device (see Figure 1). Preferably, the brush cleaner 4 operates when the tray loaded to the reject carrier R is returned for re-detection. More specifically, once the semiconductor device determined to be defective based on the result of the image detection is carried on the tray of the reject carrier R, the reject tray is returned for re-detection. In this case, the upper surface of the semiconductor device is first cleaned by the brush cleaner 4 before the re-detection is performed. After that, the semiconductor device is turned upside down by using an inverting device (not shown). By the operation of the inverting means (not shown), the lower surface of the semiconductor device carried on the tray is upward. Once the semiconductor device is cleaned with the brush cleaner 4, the tray is loaded into the loader L and re-detected. Preferably, the brush cleaner 4 is an antistatic brush to prevent static charge when in contact with the semiconductor device. • Fig. 7 is a front perspective view of an embodiment of the brush cleaner shown in Fig. 6, and Fig. 8 is a perspective view of the brush shown in Fig. 6. The brush cleaner 4 includes a brush module 41, two: d number of vacuum suction pipes 43, and an exhaust pipe 44. The brush module 41 is formed integrally with the plurality of brushes 411. A pair of tension adjusters 45 are coupled to both ends of the brush module 41. Each tension adjuster 45 is placed within a guide member 46. Although the above embodiment utilizes the brush 411 to clean the surface of the semiconductor device by sliding the 1373814 of the brush 411, it will be appreciated that another embodiment of the present invention can be rotated using the operation of a motor using a rotating brush. Similarly, although not shown in the drawings, the tension adjuster 45 preferably incorporates a force member such as a spring therein to maintain an appropriate pre-between the brush module and the semiconductor device. load

When the semiconductor devices are carried in the tray, they may have different heights depending on the type of the semiconductor device. Therefore, in the case where the brush core group 41 and the surface of the semiconductor device cannot be pre-loaded, the brush 411 is placed excessively in contact with the semiconductor device, causing the semiconductor device to be scratched, or the money is a job. Conversely, if the brush 411 does not follow the material «close distance ^ whitening, the semiconductor device cannot be sufficiently cleaned. Therefore, it is preferable to select an appropriate tension adjuster 45 in accordance with the object to be detected, that is, the semiconductor package.

Preferably, the tension adjuster 45 is moved by the cylinder to move the cylinder to adjust the height of the brush module 41 in response to a control signal generated by the sore of the personal computer root-emitting conductor device. The outer cover 42 is mounted on the rear end of the brush module 41. One of the outer covers 42 has an opening formed thereon, and the upper surface of the outer cover 42 is formed with a plurality of holes 421. A plurality of vacuum suction pipes 43 for attracting air are respectively fitted into the holes 421 of the outer cover 42. The exhaust pipe 44 is horizontally placed in the lower end opening of the outer cover 42, and the exhaust pipe = a plurality of exhaust holes 441 are formed on the lower surface thereof so that a plurality of exhaust gases are formed obliquely at a predetermined angle. If the wire is sent to the exhaust pipe 44 through the air 蝉 442 at the end of the rolling mill 44, the air 1373814 can be discharged to the outside through the vent hole 441, and the air 埠 442 is connected to provide an ion supply device for the ion. (not shown) 'to avoid electrostatic contact with semiconductor devices. In general, the surface characteristics of the semiconductor device after cleaning via the brush may have a risk of deterioration due to electrostatic contact with the brush. In addition, brush cleaners and air cleaners cannot be easily removed because dust and impurities are electrostatically attached to the semiconductor device.

To this end, in the present invention, it is preferred that the ion supply device (not shown) supplies material during the brush cleaning operation to avoid electrostatic contact between the brush and the semiconductor device to achieve better electronic reliability. The electrostatic surface of the semiconductor device is neutralized, so that dust and impurities adhering to the semiconductor device due to electrostatic adsorption can be easily removed. The brush cleaner 4 further includes a mask member 47 provided to the lower end opening of the outer cover 42. The mask member 47 is affixed with the lower end opening of the outer cover 42, and more particularly, to reduce excess space around the exhaust pipe 44. Right

The effect of the vacuum suction of the vacuum pipette 43 is increased. Therefore, it can be confirmed that the cover 47 more efficiently attracts and removes impurities or dust generated by the use of the brush 411. According to the second embodiment of the present invention described above, before the re-sub-device is executed - the image is detected, the supplied surface is used to move (4) the surface impurity on the surface of the semiconductor device. °, ° The present invention has a normal semiconductor device because it is a small surface defect: the effect of a semiconductor device that is erroneously determined to be defective. Next, a semiconductor device detecting method performed using the above-described semiconductor 20 device detecting device will be briefly described in accordance with the present invention. First, a tray carrying semiconductor devices such that the first surface of the semiconductor devices faces upward is loaded to the loader L. Then, the tray loaded by the loader L is sequentially transferred to an image detecting area. In this case, the first surface of the semiconductor device is subjected to a cleaning operation before the tray is transported to a first image sensing area. After performing image detection on the first surface of the semiconductor device carried on the tray by the first image camera 11, the tray is reversed by the reverse (not shown) to make the second table of the semiconductor device. Upward. The tray carrying the second surface-facing semiconductor device is then transferred to a second image sensing area. In this case, the cleaning operation is performed by the air cleaner 3 on the second surface of the semiconductor device before being transferred to the second image sensing region. After the second image camera 12 performs an image detection, the semiconductor device is selected as a normal semiconductor device to be transferred to the unloader U, and is transmitted to the waste product based on the result of the image detection. A defective semiconductor device. At the same time, the defective semiconductor device on the reject tray carried on the reject carrier R is returned to the loader' to receive an image detection. More specifically, when the waste tray carrying the second surface-facing semiconductor device is transferred to the loader, the second surface of the semiconductor device is cleaned by the brush cleaner 4. In this case, the scrap carrier R can be classified into different scrap regions (reject 1373814 regions) m, R2, R3, and B, depending on the type of defect of the semiconductor device determined to be defective. The above-described brush cleaning operation is performed by a specific waste tray (a disk is carried out in which a semiconductor device having a surface defect is carried.] 43 For example, when a semiconductor device having a surface defect is carried in the scrap region R2 The brush cleaner 4 is mounted on the tray conveyor extending from the waste area and the waste tray carried on the waste area R2 is returned for preparation for the brush cleaning operation.

Although the semiconductor device having the surface defect described in the embodiment of the present invention is sent to the reject region R2 via selection, the brush cleaner 4 is mounted on the tray conveyor extending from the scrap region R2: |曰: The present invention is not limited thereto, and the picking area of the semiconductor device having surface defects and the mounting position of Caiqing can be achieved in various ways of the embodiment of the present invention. ^ At the same time, the cleaning of the semiconductor device is completed. After the second surface, the tray I is hunted by the reverse skirt (not shown) and is turned upside down to flip the second surface of the first surface up.

, the first surface of the conductor device will utilize the brush cleaner ^ ^ = the tray carrying the cleaned semiconductor wafer will be followed by an image inspection of all the returned trays. = The cost of the goods is checked and the money is checked. = The air is cleared before the test. ^ Any image detection error caused by _=clear; fixed = so before removing the image detection that has not been cleaned by the air cleaning operation can improve the detection accuracy. As can be appreciated from the foregoing embodiments, the present invention can provide the following several functions: First, according to the present invention, an air cleaner is provided at the forefront of each image camera for automatically removing the semiconductor remaining. The appearance of the skirt is like a dusty silk material, which has the effect of preventing the normal semiconductor device from being mistakenly judged as a defective semiconductor device due to the contaminant, thereby improving the yield and the detection accuracy. Secondly, according to the present invention, since a carrier having a brush cleaner is provided, the surface of the semiconductor I is removed as a powdery surface impurity before the additional conductor inspection is performed by the material conductor device. Etc. 2 'This has a normal semiconductor device that will be wrong due to a small table ^ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The ions supplied to the air cleaning 11 and the brush cleaner ΐ: = the sub-characteristics are deteriorated. Similarly, the supply of ions can be used as dust and impurities in the surface. The performer of the Shishi thousand conductor device is explained by the preferred embodiment, and is familiar with the technology: the workmanship is different from the spirit of the following patent application scope, and there may be various kinds of money. BRIEF DESCRIPTION OF THE DRAWINGS [0009] The above and other objects, features and other detailed descriptions of the present invention and the accompanying drawings are explained in more detail, wherein: FIG. 23 is a diagram according to the present invention. - a perspective view of the first embodiment device detecting device; ', the second drawing is a partial perspective view of the first figure; the second drawing is a plan view of the second figure; according to the exemplary embodiment of the present invention An air/month view of your state; the fifth picture is the bottom view of the fourth picture;

6 is a perspective view of a semiconductor device detecting apparatus according to a second embodiment of the present invention; and FIG. 7 is a front perspective view of an embodiment of a brush cleaner shown in FIG. 6; The figure is a rear perspective view of the brush cleaner shown in the sixth figure; and the ninth figure shows a conventional semiconductor device detecting apparatus. [Main component symbol description]

[Embodiment of the Invention] 1 Image detecting device 11 First image camera 12 Second image camera E Empty tray L Loader R Waste carrier R1 Waste area R2 Waste area 24 1373814 Waste area waste area Unloader picking device Air cleaning Shell hole vacuum tube exhaust pipe vent hole air 埠 air supply pipe ion supply tube sensor brush cleaner brush module brush cover hole vacuum pipe exhaust pipe vent hole air 槔 tension adjuster 25 1373814 46 Guide member 47 mask member

[Prior Art] 100 Body 100 210 Loader 210 220 Buffer 230 First Waste Carrier 240 Second Waste Carrier 250 Third Waste Carrier 260 Unloader 300 Detection Device 310 First Image Camera 320 Second Image Camera 410 Loading Stack 420 empty tray 430 feeder 440 feeder 450 feeder 460 feeder 470 feeder 480 tray conveyor 500 conveyor 600 picking device 26 1373814 610 picker 700 reversing device

Claims (1)

丄0/J614 X. Patent application scope: 1 semiconductor device testing device, in which the half & mounted on a tray, the external table will be photographed by an image detecting device to be based on the photographed shirt image The result of the analysis is to distinguish the conductor device from being divided into a defective semiconductor device and a normal material conductor device. The semiconductor device with a miscellaneous material is selected and transmitted to a plurality of waste products according to the defect, *the normal The semiconductor device is transmitted to an unloader, and the Zhonglin conductor device detecting device includes an air cleaner for performing the image-pre-image detection before the image device is automatically removed from the appearance of the semiconductor device. Contaminants. 2. The semiconductor device detecting device according to item ii of claim 1, wherein the fine image detecting and splitting comprises a first image camera and a second image camera, and 5 air and other air cleaning systems are provided separately. The first image camera and the front end of the second image camera. 3. The apparatus for detecting a swivel device according to claim 2, wherein each of the air cleaners comprises: and one of the housings - the housing - the lower surface of one of the housings is formed with an opening, a surface Forming a plurality of holes; a plurality of vacuum suction pipes respectively installed into the holes; and a predetermined end of the casing and the Wei pipe, the exhaust pipe being at the surface of the 28 1^/3814 T A plurality of [predetermined angle tilting secret red vents are formed. 4. The semiconductor device detecting apparatus according to claim 3, wherein the body has a dome shape to ensure smooth suction of impurities and dust through the vacuum pipe. 5. The semiconductor device detecting device of claim 3, wherein the ion supply device is connected to the exhaust pipe to supply ions to prevent electrostatic charge. 6. The semiconductor device testing apparatus according to claim 5, wherein the side air cleaning H step comprises: a flow rate adjustment and a pressure adjustment valve to supply the Wei according to the semiconductor device The flow and pressure of the air of the tube. 7 Each of the semiconductors described in claim 2 of the patent scope includes: the sense of the air, and the use of the material device such as the shouting surface is normally carried on the tray. 8. The semiconductor device testing apparatus of any of clauses 1 to 7, further comprising: a brush cleaner for automatically removing the image before performing an image detection using the image detecting device Contaminants on the surface of the semiconductor device. 9. The semiconductor device testing apparatus of claim 8, wherein the brush cleaning operation is performed when the tray loaded to the associated waste carrier is returned for re-detection. 1 〇 如 如 如 专利 _ 第 第 赖 赖 赖 赖 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 a rear cover, the lower surface of the outer cover is formed with -open α, and the upper surface of the cover is formed with a plurality of holes; a plurality of vacuum suction pipes respectively installed into the holes; and - horizontally placed The exhaust pipe of the outer cover_lower opening is adapted to receive a supply to the exhaust pipe. The money pipe is formed on the lower surface thereof with a plurality of exhaust holes formed obliquely at a predetermined angle. The semiconductor cracking detecting device of the invention of claim 2, wherein the semiconductor crack detecting device is provided with a mask member of the lower end opening of the plough cover, and the mask member is configured with ribs. Lowering - the suction space to increase a vacuum suction. The semiconductor device detection device of claim i, wherein the ion supply is connected to the exhaust pipe of the brush cleaner to supply ions to prevent electrostatic charge. 13. The semiconductor device testing apparatus of claim ii, wherein the brush cleaning person further comprises a force adjuster to maintain an appropriate tension with the semiconductor body. 14. A method of detecting a semiconductor device, comprising: carrying a semiconductor device such that a first surface-up tray of the family conductor device is sent from the -to-image detection region; 30 1373814 to the semiconductor device The first surface performs a first image detection; and the semiconductor device is selected as a defective semiconductor device and a normal semiconductor device according to the result of the first image detection; wherein the semiconductor device detection method further comprises: An air cleaning operation is performed on the semiconductor devices carried on the tray before the tray is transported to the first scene > image detection area. 15. The semiconductor device detection method according to claim 14, wherein the half-box device inspection method further comprises: after performing the first image detection, and comparing the semiconductors according to the result of the first image detection Before the device is selected as a defective semiconductor device and a normal semiconductor device: the semiconductor surfaces carried on the tray are inverted upside down such that the second surface of the semiconductor devices faces upward; the second of the semiconductor devices Performing an air cleaning operation on the surface; transferring the tray of the semiconductor device that has passed the air cleaning operation to a second image detecting area; and carrying the same to the second image detecting area The second surfaces of the semiconductor device of the tray perform a second image detection. 16. The method of detecting a semiconductor device according to claim i5, wherein the semiconductor device detecting method further comprises: returning - carrying the semiconductor device selected to be defective to the loader, 1373814 and carrying Performing a brush cleaning operation on the second surfaces of the semiconductor devices that are returned to the tray; inverting the trays carrying the semiconductor devices that are subjected to the brush cleaning operation, such that the semiconductor devices a surface facing upward; performing a brush cleaning operation on the first surfaces of the semiconductor devices; and loading the tray carrying the semiconductor devices that have been cleaned by the brush into the loader After that, an additional image detection is performed. 32