[go: up one dir, main page]

TWI372861B - A substrate including check marks and a method of monitoring conductive glue on the substrate thereof - Google Patents

A substrate including check marks and a method of monitoring conductive glue on the substrate thereof

Info

Publication number
TWI372861B
TWI372861B TW097114907A TW97114907A TWI372861B TW I372861 B TWI372861 B TW I372861B TW 097114907 A TW097114907 A TW 097114907A TW 97114907 A TW97114907 A TW 97114907A TW I372861 B TWI372861 B TW I372861B
Authority
TW
Taiwan
Prior art keywords
substrate
conductive glue
including check
check marks
monitoring conductive
Prior art date
Application number
TW097114907A
Other languages
Chinese (zh)
Other versions
TW200944786A (en
Inventor
Sanchi Wang
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW097114907A priority Critical patent/TWI372861B/en
Priority to US12/188,489 priority patent/US7727852B2/en
Publication of TW200944786A publication Critical patent/TW200944786A/en
Priority to US12/760,120 priority patent/US8044525B2/en
Application granted granted Critical
Publication of TWI372861B publication Critical patent/TWI372861B/en

Links

Classifications

    • H10W46/00—
    • H10P72/0448—
    • H10P72/0606—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/975—Substrate or mask aligning feature
TW097114907A 2008-04-23 2008-04-23 A substrate including check marks and a method of monitoring conductive glue on the substrate thereof TWI372861B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW097114907A TWI372861B (en) 2008-04-23 2008-04-23 A substrate including check marks and a method of monitoring conductive glue on the substrate thereof
US12/188,489 US7727852B2 (en) 2008-04-23 2008-08-08 Substrate with check mark and method of inspecting position accuracy of conductive glue dispensed on the substrate
US12/760,120 US8044525B2 (en) 2008-04-23 2010-04-14 Substrate with check mark and method of inspecting position accuracy of conductive glue dispensed on the substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097114907A TWI372861B (en) 2008-04-23 2008-04-23 A substrate including check marks and a method of monitoring conductive glue on the substrate thereof

Publications (2)

Publication Number Publication Date
TW200944786A TW200944786A (en) 2009-11-01
TWI372861B true TWI372861B (en) 2012-09-21

Family

ID=41214201

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097114907A TWI372861B (en) 2008-04-23 2008-04-23 A substrate including check marks and a method of monitoring conductive glue on the substrate thereof

Country Status (2)

Country Link
US (2) US7727852B2 (en)
TW (1) TWI372861B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105161037B (en) * 2015-08-20 2017-12-22 京东方科技集团股份有限公司 Position calibration method, test circuit plate, sample panel and location calibration device
CN110400530A (en) * 2019-07-05 2019-11-01 深圳市华星光电技术有限公司 The detection method of conducting resinl in liquid crystal display
US11842478B2 (en) * 2020-10-01 2023-12-12 Ford Global Technologies, Llc Method and apparatus for automated adhesive wash-off quality control and root-cause analysis using artificial intelligence
CN113297271B (en) * 2021-05-19 2022-02-18 深圳明锐理想科技有限公司 A method and equipment for automatic PCB assembly

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100280889B1 (en) * 1998-06-30 2001-02-01 구본준, 론 위라하디락사 Pad part manufacturing method of liquid crystal display device and liquid crystal display device by the method
GB0210411D0 (en) * 2002-05-08 2002-06-12 Zarlink Semiconductor Ab Photonic device with monitor
JP4141340B2 (en) * 2003-07-16 2008-08-27 三洋電機株式会社 Manufacturing method of semiconductor device
CN100381918C (en) 2003-09-30 2008-04-16 友达光电股份有限公司 Method for confirming attachment position of anisotropic conductive adhesive
JP4024773B2 (en) * 2004-03-30 2007-12-19 シャープ株式会社 WIRING BOARD, SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR MODULE DEVICE
JP2005317615A (en) * 2004-04-27 2005-11-10 Toshiba Corp Manufacturing method of semiconductor device
US7928591B2 (en) * 2005-02-11 2011-04-19 Wintec Industries, Inc. Apparatus and method for predetermined component placement to a target platform
US20070052344A1 (en) * 2005-09-07 2007-03-08 Yu-Liang Wen Flat panel display device and method of correcting bonding misalignment of driver IC and flat panel display
US20070190747A1 (en) * 2006-01-23 2007-08-16 Tessera Technologies Hungary Kft. Wafer level packaging to lidded chips
US7786747B2 (en) * 2007-11-30 2010-08-31 Texas Instruments Incorporated Microdisplay assemblies and methods of packaging microdisplays

Also Published As

Publication number Publication date
US8044525B2 (en) 2011-10-25
US20100193974A1 (en) 2010-08-05
US7727852B2 (en) 2010-06-01
TW200944786A (en) 2009-11-01
US20090267241A1 (en) 2009-10-29

Similar Documents

Publication Publication Date Title
GB2453229B (en) Electroluminescent element and manufacturing method thereof
FI20085443A0 (en) A circuit module and a method for manufacturing a circuit module
EP2240315B8 (en) A stiffener tool positioning apparatus and the corresponding method
EP2436234A4 (en) Light-emitting element, light-emitting device, and method for manufacturing the same
EP2280449A4 (en) Wireless ic device and method for manufacturing the same
EP2187720A4 (en) Flexible wiring board, and its manufacturing method
EP2343413A4 (en) Wallpaper and method for manufacturing same
EP2066161A4 (en) Method for manufacturing substrate with built-in component and substrate with built-in component
EP2357078A4 (en) LAMINATE, METHOD FOR THE PRODUCTION THEREOF, ELECTRONIC DEVICE AND ELECTRONIC DEVICE
KR20180085074A (en) Light-emitting device and manufacturing method thereof
BRPI0822705A2 (en) Printed patch panel and method for manufacturing the same
EP2412775A4 (en) Solder adhesive and a production method for the same, and an electronic device comprising the same
EP2274962A4 (en) Wiring board and method for manufacturing the same
EP2200179A4 (en) Laminated electronic component and method for manufacturing the same
EP2201615B8 (en) Led package and method for manufacturing the led package
FI20070584L (en) Thin battery and method for manufacturing a thin battery
EP2287623A4 (en) Microanalysis chip adhesive sheet, microanalysis chip, and manufacturing method thereof
EP2251880A4 (en) Element for electronic component
PL2329236T3 (en) Method for monitoring the status of a power measuring device, power measuring device and power measuring module
EP2261933A4 (en) Capacitor and method for manufacturing the same
EP2251587A4 (en) A semiconductor solid illuminator and the method thereof
TWI366252B (en) Substrate with high fracture strength, structure for increasing the fracture strength of a substrate and the method thereof
EP2563105A4 (en) Printed substrate manufacturing method and printed substrate employing same
TWI340451B (en) Packaging substrate structure with capacitor embedded therein and method for fabricating the same
TWI340450B (en) Packaging substrate structure with capacitor embedded therein and method for fabricating the same