TWI371841B - Cdim package structure with reticular structure and the forming method thereof - Google Patents

Cdim package structure with reticular structure and the forming method thereof

Info

Publication number: TWI371841B
Authority: TW; Taiwan
Prior art keywords: cdim; forming method; reticular; package structure; package
Prior art date: 2007-10-31

Application number

TW096141091A

Other languages

English (en)

Other versions

TW200919668A (en

Inventor

Chung Pang Chi

Original Assignee

Chipmos Technologies Inc

Chipmos Technologies Bermuda

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-10-31

Filing date

2007-10-31

Publication date

2012-09-01

2007-10-31 Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc

2007-10-31 Priority to TW096141091A priority Critical patent/TWI371841B/zh

2009-05-01 Publication of TW200919668A publication Critical patent/TW200919668A/zh

2012-09-01 Application granted granted Critical

2012-09-01 Publication of TWI371841B publication Critical patent/TWI371841B/zh

Classifications

- H10W72/0198—
- H10W70/09—
- H10W72/241—
- H10W72/874—
- H10W74/019—
- H10W74/142—

TW096141091A 2007-10-31 2007-10-31 Cdim package structure with reticular structure and the forming method thereof TWI371841B (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW096141091A TWI371841B (en)	2007-10-31	2007-10-31	Cdim package structure with reticular structure and the forming method thereof

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW096141091A TWI371841B (en)	2007-10-31	2007-10-31	Cdim package structure with reticular structure and the forming method thereof

Publications (2)

Publication Number	Publication Date
TW200919668A TW200919668A (en)	2009-05-01
TWI371841B true TWI371841B (en)	2012-09-01

Family

ID=44727190

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW096141091A TWI371841B (en)	2007-10-31	2007-10-31	Cdim package structure with reticular structure and the forming method thereof

Country Status (1)

Country	Link
TW (1)	TWI371841B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US12506055B2 (en)	2017-11-29	2025-12-23	Pep Innovation Pte. Ltd.	Chip packaging method and chip structure
CN210182362U (zh) *	2019-03-11	2020-03-24	Pep创新私人有限公司	芯片结构

2007
- 2007-10-31 TW TW096141091A patent/TWI371841B/zh active

Also Published As

Publication number	Publication date
TW200919668A (en)	2009-05-01

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