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TWI371066B - - Google Patents

Info

Publication number
TWI371066B
TWI371066B TW097140117A TW97140117A TWI371066B TW I371066 B TWI371066 B TW I371066B TW 097140117 A TW097140117 A TW 097140117A TW 97140117 A TW97140117 A TW 97140117A TW I371066 B TWI371066 B TW I371066B
Authority
TW
Taiwan
Application number
TW097140117A
Other languages
Chinese (zh)
Other versions
TW200927623A (en
Inventor
Yashima Tsukasa
Ekko Hiroshi
Nogami Shigeki
Teranishi Isao
Original Assignee
Hitachi Int Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Int Electric Inc filed Critical Hitachi Int Electric Inc
Publication of TW200927623A publication Critical patent/TW200927623A/en
Application granted granted Critical
Publication of TWI371066B publication Critical patent/TWI371066B/zh

Links

TW97140117A 2007-11-05 2008-10-20 Substrate processing apparatus TW200927623A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007287843 2007-11-05
JP2008256588A JP2009135433A (en) 2007-11-05 2008-10-01 Substrate processing equipment

Publications (2)

Publication Number Publication Date
TW200927623A TW200927623A (en) 2009-07-01
TWI371066B true TWI371066B (en) 2012-08-21

Family

ID=40866995

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97140117A TW200927623A (en) 2007-11-05 2008-10-20 Substrate processing apparatus

Country Status (2)

Country Link
JP (2) JP2009135433A (en)
TW (1) TW200927623A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555075B (en) * 2013-12-04 2016-10-21 Psk有限公司 Substrate processing equipment and substrate processing method

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5337639B2 (en) * 2009-09-04 2013-11-06 株式会社日立ハイテクノロジーズ Semiconductor device manufacturing inspection apparatus, and semiconductor device manufacturing inspection apparatus control method
JP6169365B2 (en) * 2013-02-07 2017-07-26 株式会社日立国際電気 Semiconductor device manufacturing method and substrate processing apparatus
DE102013111165A1 (en) * 2013-10-09 2015-04-09 Aixtron Se Apparatus and method for determining the rotational position of a susceptor in a process chamber
JP6446211B2 (en) * 2014-09-09 2018-12-26 光洋サーモシステム株式会社 Article monitoring apparatus, transfer apparatus, heat treatment apparatus, and article monitoring method
JP6256286B2 (en) * 2014-10-09 2018-01-10 三菱電機ビルテクノサービス株式会社 Elevator equipment
US10192762B2 (en) * 2016-01-26 2019-01-29 Applied Materials, Inc. Systems and methods for detecting the existence of one or more environmental conditions within a substrate processing system
JP6240695B2 (en) 2016-03-02 2017-11-29 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and program
JP6723055B2 (en) * 2016-04-04 2020-07-15 株式会社荏原製作所 Substrate processing apparatus and method for confirming presence/absence of substrate
JP6851348B2 (en) * 2018-08-15 2021-03-31 日本電子株式会社 Vacuum equipment and recovery support method
KR102720570B1 (en) * 2019-12-24 2024-10-21 에스케이하이닉스 주식회사 System and Method for Testing Semiconductor
CN112410765A (en) * 2020-11-05 2021-02-26 宣城睿晖宣晟企业管理中心合伙企业(有限合伙) Cluster type equipment control method and device and storage medium
JP7440480B2 (en) * 2021-12-13 2024-02-28 株式会社Kokusai Electric Substrate processing equipment, semiconductor device manufacturing method, and program
JP7399933B2 (en) 2021-12-22 2023-12-18 株式会社Kokusai Electric Substrate processing equipment, substrate processing methods, semiconductor manufacturing methods, programs
CN115394691A (en) * 2022-09-29 2022-11-25 中国电子科技集团公司第四十八研究所 Control method of SiC heat treatment process
WO2024174497A1 (en) * 2023-02-23 2024-08-29 浙江新唐实业有限公司 Coating device and coating method thereof

Family Cites Families (10)

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JP2706793B2 (en) * 1988-12-23 1998-01-28 東京エレクトロン株式会社 Coating and developing equipment
JPH04225255A (en) * 1990-12-26 1992-08-14 Shinko Electric Co Ltd Method and apparatus for controlling transfer and charge of wafer in cvd device
JPH07169819A (en) * 1993-12-13 1995-07-04 Kokusai Electric Co Ltd Substrate transfer method
JPH08153672A (en) * 1994-11-29 1996-06-11 Canon Inc Semiconductor manufacturing apparatus and device manufacturing method
JPH10149977A (en) * 1996-11-19 1998-06-02 Tokyo Electron Ltd Processing device control method and processing device
JP2001093791A (en) * 1999-09-20 2001-04-06 Hitachi Ltd Method of operating vacuum processing apparatus and method of processing wafer
JP2001274100A (en) * 2000-03-27 2001-10-05 Hitachi Kokusai Electric Inc Substrate processing method
JP4181457B2 (en) * 2003-07-10 2008-11-12 大日本スクリーン製造株式会社 Substrate processing equipment
JP2006253483A (en) * 2005-03-11 2006-09-21 Hitachi Kokusai Electric Inc Substrate processing equipment
JP4737392B2 (en) * 2005-06-06 2011-07-27 株式会社ニコン Board inspection equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555075B (en) * 2013-12-04 2016-10-21 Psk有限公司 Substrate processing equipment and substrate processing method

Also Published As

Publication number Publication date
JP2009135433A (en) 2009-06-18
TW200927623A (en) 2009-07-01
JP5007359B2 (en) 2012-08-22
JP2010206222A (en) 2010-09-16

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