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TWI370534B - Semiconductor chip with chip selection structure and stacked semiconductor package having the same - Google Patents

Semiconductor chip with chip selection structure and stacked semiconductor package having the same

Info

Publication number
TWI370534B
TWI370534B TW097111219A TW97111219A TWI370534B TW I370534 B TWI370534 B TW I370534B TW 097111219 A TW097111219 A TW 097111219A TW 97111219 A TW97111219 A TW 97111219A TW I370534 B TWI370534 B TW I370534B
Authority
TW
Taiwan
Prior art keywords
chip
same
selection structure
semiconductor
semiconductor package
Prior art date
Application number
TW097111219A
Other languages
English (en)
Other versions
TW200933856A (en
Inventor
Sung Min Kim
Chang Jun Park
Kwon Whan Han
Seong Cheol Kim
Ha Na Lee
Original Assignee
Hynix Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of TW200933856A publication Critical patent/TW200933856A/zh
Application granted granted Critical
Publication of TWI370534B publication Critical patent/TWI370534B/zh

Links

Classifications

    • H10W72/00—
    • H10W70/60—
    • H10W72/20—
    • H10W90/00—
    • H10W70/65—
    • H10W70/654—
    • H10W72/01—
    • H10W72/244—
    • H10W72/252—
    • H10W72/29—
    • H10W72/923—
    • H10W72/932—
    • H10W72/936—
    • H10W72/9445—
    • H10W90/24—
    • H10W90/297—
    • H10W90/722—
TW097111219A 2008-01-25 2008-03-28 Semiconductor chip with chip selection structure and stacked semiconductor package having the same TWI370534B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080008252A KR100900236B1 (ko) 2008-01-25 2008-01-25 반도체 칩 및 이를 갖는 적층 반도체 패키지

Publications (2)

Publication Number Publication Date
TW200933856A TW200933856A (en) 2009-08-01
TWI370534B true TWI370534B (en) 2012-08-11

Family

ID=40862652

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097111219A TWI370534B (en) 2008-01-25 2008-03-28 Semiconductor chip with chip selection structure and stacked semiconductor package having the same

Country Status (5)

Country Link
US (1) US7898834B2 (zh)
JP (1) JP2009177114A (zh)
KR (1) KR100900236B1 (zh)
CN (1) CN101494207B (zh)
TW (1) TWI370534B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010138480A2 (en) 2009-05-26 2010-12-02 Rambus Inc. Stacked semiconductor device assembly
US9142262B2 (en) 2009-10-23 2015-09-22 Rambus Inc. Stacked semiconductor device
KR20110099556A (ko) * 2010-03-02 2011-09-08 삼성전자주식회사 반도체 패키지 테스트장치
CN103650131B (zh) * 2012-03-14 2016-12-21 松下电器产业株式会社 半导体装置
US10026666B2 (en) 2013-10-18 2018-07-17 Rambus Inc. Stacked die package with aligned active and passive through-silicon vias
KR102188644B1 (ko) * 2014-11-13 2020-12-08 에스케이하이닉스 주식회사 확장된 대역폭을 갖는 반도체 패키지
KR102848525B1 (ko) * 2020-11-25 2025-08-22 에스케이하이닉스 주식회사 관통 전극을 포함하는 반도체 칩, 및 이를 포함하는 반도체 패키지

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3360655B2 (ja) * 1999-07-08 2002-12-24 日本電気株式会社 半導体装置
JP3723725B2 (ja) * 2000-07-31 2005-12-07 シャープ株式会社 半導体装置及び３次元積層半導体装置
JP2003023135A (ja) * 2001-07-06 2003-01-24 Sharp Corp 半導体集積回路装置
JP2003060053A (ja) * 2001-08-10 2003-02-28 Fujitsu Ltd 半導体チップ及びそれを用いた半導体集積回路装置及び半導体チップ選択方法
JP4045506B2 (ja) * 2004-01-21 2008-02-13 セイコーエプソン株式会社 積層型半導体記憶装置
JP4580671B2 (ja) 2004-03-29 2010-11-17 ルネサスエレクトロニクス株式会社 半導体装置
JP4507101B2 (ja) 2005-06-30 2010-07-21 エルピーダメモリ株式会社 半導体記憶装置及びその製造方法
KR100910229B1 (ko) * 2007-11-13 2009-07-31 주식회사 하이닉스반도체 적층 반도체 패키지

Also Published As

Publication number Publication date
TW200933856A (en) 2009-08-01
JP2009177114A (ja) 2009-08-06
CN101494207B (zh) 2011-12-07
US20090189267A1 (en) 2009-07-30
KR100900236B1 (ko) 2009-05-29
CN101494207A (zh) 2009-07-29
US7898834B2 (en) 2011-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees