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TWI370490B - Method & apparatus to improve plasma etch uniformity - Google Patents

Method & apparatus to improve plasma etch uniformity

Info

Publication number
TWI370490B
TWI370490B TW094132966A TW94132966A TWI370490B TW I370490 B TWI370490 B TW I370490B TW 094132966 A TW094132966 A TW 094132966A TW 94132966 A TW94132966 A TW 94132966A TW I370490 B TWI370490 B TW I370490B
Authority
TW
Taiwan
Prior art keywords
plasma etch
etch uniformity
improve plasma
improve
uniformity
Prior art date
Application number
TW094132966A
Other languages
Chinese (zh)
Other versions
TW200612489A (en
Inventor
David J Johnson
Russell Westerman
Original Assignee
Unaxis Usa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unaxis Usa Inc filed Critical Unaxis Usa Inc
Publication of TW200612489A publication Critical patent/TW200612489A/en
Application granted granted Critical
Publication of TWI370490B publication Critical patent/TWI370490B/en

Links

TW094132966A 2004-10-04 2005-09-23 Method & apparatus to improve plasma etch uniformity TWI370490B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61586004P 2004-10-04 2004-10-04

Publications (2)

Publication Number Publication Date
TW200612489A TW200612489A (en) 2006-04-16
TWI370490B true TWI370490B (en) 2012-08-11

Family

ID=38772263

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132966A TWI370490B (en) 2004-10-04 2005-09-23 Method & apparatus to improve plasma etch uniformity

Country Status (2)

Country Link
CN (1) CN101048842A (en)
TW (1) TWI370490B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI783980B (en) * 2017-03-29 2022-11-21 日商東京威力科創股份有限公司 Advanced optical sensor, system, and methodologies for etch processing monitoring

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101970166B (en) * 2007-12-13 2013-05-08 朗姆研究公司 Plasma unconfinement sensor and methods thereof
CN102315123B (en) * 2010-07-07 2013-05-01 中国科学院微电子研究所 A method to improve the repeatability of GaN HEMT gate trench etching
JP5487302B2 (en) * 2010-11-30 2014-05-07 キヤノンアネルバ株式会社 Plasma processing equipment
KR101256962B1 (en) 2011-05-31 2013-04-26 세메스 주식회사 Antenna unit, substrate treating apparatus including the unit and substrate treating method using the apparatus
GB201318249D0 (en) * 2013-10-15 2013-11-27 Spts Technologies Ltd Plasma etching apparatus
KR102190794B1 (en) * 2018-07-02 2020-12-15 주식회사 기가레인 A substrate processing apparatus for mechanically controlling plasma density
CN114788419A (en) * 2020-03-11 2022-07-22 株式会社国际电气 Substrate processing apparatus, method of manufacturing semiconductor device, and program
CN114724907B (en) * 2021-01-04 2025-02-14 江苏鲁汶仪器股份有限公司 An ion source device with adjustable plasma density

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI783980B (en) * 2017-03-29 2022-11-21 日商東京威力科創股份有限公司 Advanced optical sensor, system, and methodologies for etch processing monitoring

Also Published As

Publication number Publication date
CN101048842A (en) 2007-10-03
TW200612489A (en) 2006-04-16

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Legal Events

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