TWI370040B - Simultanes doppelseitenschleifen von halbleiterscheiben - Google Patents

Simultanes doppelseitenschleifen von halbleiterscheiben

Info

Publication number: TWI370040B
Authority: TW; Taiwan
Prior art keywords: doppelseitenschleifen; halbleiterscheiben; simultanes; von; von halbleiterscheiben
Prior art date: 2007-10-17

Application number

TW097139545A

Other languages

English (en)

Other versions

TW200918237A (en

Inventor

Joachim Junge

Original Assignee

Siltronic Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-10-17

Filing date

2008-10-15

Publication date

2012-08-11

2008-10-15 Application filed by Siltronic Ag filed Critical Siltronic Ag

2009-05-01 Publication of TW200918237A publication Critical patent/TW200918237A/zh

2012-08-11 Application granted granted Critical

2012-08-11 Publication of TWI370040B publication Critical patent/TWI370040B/zh

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
- H10P52/00—
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- H10P50/00—

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Grinding Of Cylindrical And Plane Surfaces (AREA)
Mechanical Treatment Of Semiconductor (AREA)

TW097139545A 2007-10-17 2008-10-15 Simultanes doppelseitenschleifen von halbleiterscheiben TWI370040B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE102007049810A DE102007049810B4 (de)	2007-10-17	2007-10-17	Simultanes Doppelseitenschleifen von Halbleiterscheiben

Publications (2)

Publication Number	Publication Date
TW200918237A TW200918237A (en)	2009-05-01
TWI370040B true TWI370040B (en)	2012-08-11

Family

ID=40458798

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW097139545A TWI370040B (en)	2007-10-17	2008-10-15	Simultanes doppelseitenschleifen von halbleiterscheiben

Country Status (7)

Country	Link
US (1)	US8197300B2 (zh)
JP (1)	JP4921444B2 (zh)
KR (1)	KR101023997B1 (zh)
CN (1)	CN101417405B (zh)
DE (1)	DE102007049810B4 (zh)
SG (1)	SG152124A1 (zh)
TW (1)	TWI370040B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
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KR101103146B1 (ko) *	2011-09-05	2012-01-04	이화다이아몬드공업 주식회사	연삭 품질이 우수한 ｏｌｅｄ 기판용 멀티 연삭 휠 및 이를 이용한 ｏｌｅｄ 기판 연삭 방법
US9358660B2 (en)	2011-11-07	2016-06-07	Taiwan Semiconductor Manufacturing Company, Ltd.	Grinding wheel design with elongated teeth arrangement
US9960088B2 (en) *	2011-11-07	2018-05-01	Taiwan Semiconductor Manufacturing Company, Ltd.	End point detection in grinding
WO2013119261A1 (en) *	2012-02-09	2013-08-15	Duescher Wayne O	Coplanar alignment apparatus for rotary spindles
US20130217228A1 (en)	2012-02-21	2013-08-22	Masako Kodera	Method for fabricating semiconductor device
JP5724958B2 (ja) *	2012-07-03	2015-05-27	信越半導体株式会社	両頭研削装置及びワークの両頭研削方法
GB2516916B (en)	2013-08-06	2016-09-14	Lacsop Ltd	Method and apparatus for determining the mass of a body
GB2516917B (en) *	2013-08-06	2018-02-07	Lacsop Ltd	Surface angle measuring device
JP6327007B2 (ja) *	2014-06-24	2018-05-23	株式会社Sumco	研削装置および研削方法
KR101597209B1 (ko) *	2014-07-30	2016-02-24	주식회사 엘지실트론	웨이퍼 연마 장치
CN105881213A (zh) *	2014-09-01	2016-08-24	曾庆明	一种精密双面研磨机的控制器
DE102017215705A1 (de)	2017-09-06	2019-03-07	Siltronic Ag	Vorrichtung und Verfahren zum doppelseitigen Schleifen von Halbleiterscheiben
KR102695542B1 (ko) *	2018-11-28	2024-08-16	주식회사 케이씨텍	기판 처리 장치
DE102018221922A1 (de) *	2018-12-17	2020-06-18	Siltronic Ag	Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
EP3900876B1 (de)	2020-04-23	2024-05-01	Siltronic AG	Verfahren zum schleifen einer halbleiterscheibe
CN112985281B (zh) *	2021-02-22	2022-08-30	彩虹（合肥）液晶玻璃有限公司	一种液晶玻璃基板磨边磨轮外径测量装置
EP4144480B1 (de)	2021-09-01	2024-01-31	Siltronic AG	Verfahren zum schleifen von halbleiterscheiben
CN114871955B (zh) *	2022-05-25	2023-05-05	郑州磨料磨具磨削研究所有限公司	一种超硬磨料磨具的精密加工方法及系统
CN118848781B (zh) *	2024-09-27	2024-12-17	通威微电子有限公司	一种碳化硅晶锭去胶纸装置及晶锭去胶纸方法

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JPS56133637A (en) *	1980-03-24	1981-10-19	Agency Of Ind Science & Technol	Torque meter for grinder
JPH0679596A (ja) *	1992-09-01	1994-03-22	Matsushita Electric Ind Co Ltd	両頭研削機
US6296553B1 (en) *	1997-04-02	2001-10-02	Nippei Toyama Corporation	Grinding method, surface grinder, workpiece support, mechanism and work rest
JPH11254312A (ja)	1998-03-11	1999-09-21	Super Silicon Kenkyusho:Kk	形状制御を伴ったウェーハの枚葉加工方法及び加工装置
EP1118429B1 (en)	1999-05-07	2007-10-24	Shin-Etsu Handotai Co., Ltd	Method and device for simultaneously grinding double surfaces, and method and device for simultaneously lapping double surfaces
JP2001062718A (ja) *	1999-08-20	2001-03-13	Super Silicon Kenkyusho:Kk	両頭研削装置及び砥石位置修正方法
JP2002292558A (ja)	2001-03-30	2002-10-08	Toyoda Mach Works Ltd	枚葉式研磨装置
JP4072788B2 (ja)	2002-10-09	2008-04-09	光洋機械工業株式会社	薄肉円板状工作物の両面研削方法および両面研削装置
JP2005201862A (ja) *	2004-01-19	2005-07-28	Keyence Corp	接触式変位測定器
DE102004005702A1 (de)	2004-02-05	2005-09-01	Siltronic Ag	Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe
DE102004011996B4 (de) *	2004-03-11	2007-12-06	Siltronic Ag	Vorrichtung zum simultanen beidseitigen Schleifen von scheibenförmigen Werkstücken
DE102004053308A1 (de) *	2004-11-04	2006-03-23	Siltronic Ag	Verfahren und Vorrichtung zum gleichzeitigen Schleifen beider Seiten eines scheibenförmigen Werkstücks sowie damit herstellbare Halbleiterscheibe

2007
- 2007-10-17 DE DE102007049810A patent/DE102007049810B4/de active Active
2008
- 2008-08-27 SG SG200806346-3A patent/SG152124A1/en unknown
- 2008-09-11 CN CN2008102153595A patent/CN101417405B/zh active Active
- 2008-09-17 KR KR1020080090996A patent/KR101023997B1/ko active Active
- 2008-10-01 US US12/242,959 patent/US8197300B2/en active Active
- 2008-10-15 TW TW097139545A patent/TWI370040B/zh active
- 2008-10-17 JP JP2008268225A patent/JP4921444B2/ja active Active

Also Published As

Publication number	Publication date
DE102007049810A1 (de)	2009-04-23
DE102007049810B4 (de)	2012-03-22
US8197300B2 (en)	2012-06-12
CN101417405B (zh)	2011-12-14
SG152124A1 (en)	2009-05-29
JP2009095976A (ja)	2009-05-07
JP4921444B2 (ja)	2012-04-25
US20090104846A1 (en)	2009-04-23
CN101417405A (zh)	2009-04-29
KR101023997B1 (ko)	2011-03-28
TW200918237A (en)	2009-05-01
KR20090039604A (ko)	2009-04-22

Publication	Publication Date	Title
TWI370040B (en)	2012-08-11	Simultanes doppelseitenschleifen von halbleiterscheiben
DE602008005470D1 (en)	2011-04-21	Imidazopyridinone
AP2010005314A0 (en)	2010-08-31	Nanodispersian
GB0719108D0 (en)	2007-11-14	Coiloid-sensor
GB0716271D0 (en)	2007-09-26	SafekeyP
GB0722113D0 (en)	2007-12-19	Easiboss
GB0716803D0 (en)	2007-10-10	Carry-cot
GB0710823D0 (en)	2007-07-18	Wheelshield
GB0709749D0 (en)	2007-06-27	Juglr
GB0705589D0 (en)	2007-05-02	Parkapatch
GB0716727D0 (en)	2007-10-10	Bandscreen
GB0715236D0 (en)	2007-09-12	Brakesafe
GB0708304D0 (en)	2007-06-06	Solaphone
GB0707569D0 (en)	2007-05-30	CX-Kinisis
AU3642P (en)	2008-12-02	TAS100 Dianella tasmanica
AU3606P (en)	2008-09-16	Jaywick xTriticosecale
GB0715962D0 (en)	2007-09-26	Time
GB0713975D0 (en)	2007-08-29	No Riveal
GB0714068D0 (en)	2007-08-29	No riveal
GB0710085D0 (en)	2007-07-04	I
GB0713337D0 (en)	2007-08-22	Bartd/Dooker
GB0707591D0 (en)	2007-05-30	Westie
GB0716748D0 (en)	2007-10-10	Spherikill
GB0713571D0 (en)	2007-08-22	Paveguard
GB0717639D0 (en)	2007-10-17	Hydrodechlorification