TWI369929B - - Google Patents

Info

Publication number: TWI369929B
Authority: TW; Taiwan

Application number

TW096125842A

Other versions

TW200819012A (en

Inventor

Nakatsuka Tetsuya

Original Assignee

Hitachi Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-09-12

Filing date

2007-07-16

Publication date

2012-08-01

2007-07-16 Application filed by Hitachi Ltd filed Critical Hitachi Ltd

2008-04-16 Publication of TW200819012A publication Critical patent/TW200819012A/zh

2012-08-01 Application granted granted Critical

2012-08-01 Publication of TWI369929B publication Critical patent/TWI369929B/zh

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H10W72/072—
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
- H05K3/346—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Wire Bonding (AREA)

TW096125842A 2006-09-12 2007-07-16 Mounting structure TW200819012A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2006246255A JP4211828B2 (ja)	2006-09-12	2006-09-12	実装構造体

Publications (2)

Publication Number	Publication Date
TW200819012A TW200819012A (en)	2008-04-16
TWI369929B true TWI369929B (zh)	2012-08-01

Family

ID=39169421

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW096125842A TW200819012A (en)	2006-09-12	2007-07-16	Mounting structure

Country Status (5)

Country	Link
US (1)	US20080062665A1 (zh)
JP (1)	JP4211828B2 (zh)
KR (1)	KR100899251B1 (zh)
CN (1)	CN100579337C (zh)
TW (1)	TW200819012A (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2008032755A1 (en) *	2006-09-11	2008-03-20	Panasonic Corporation	Electronic component placing apparatus and electronic component mounting method
JP5339968B2 (ja) *	2009-03-04	2013-11-13	パナソニック株式会社	実装構造体及びモータ
JP5807145B2 (ja) *	2010-05-20	2015-11-10	パナソニックＩｐマネジメント株式会社	実装構造体
JP6374298B2 (ja)	2014-10-31	2018-08-15	千住金属工業株式会社	フラックス及びフラックスを用いた接合方法
KR102055595B1 (ko)	2017-12-15	2019-12-16	삼성전자주식회사	반도체 패키지
WO2020050330A1 (ja) *	2018-09-05	2020-03-12	千住金属工業株式会社	ソルダペーストの塗布方法及びマスク
JP6993605B1 (ja)	2021-03-31	2022-02-04	千住金属工業株式会社	フラックス及びソルダペースト

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3632930B2 (ja) *	1993-12-27	2005-03-30	株式会社ルネサステクノロジ	ボールグリッドアレイ半導体装置
KR100192766B1 (ko) *	1995-07-05	1999-06-15	황인길	솔더볼을 입출력 단자로 사용하는 볼그리드 어레이 반도체 패키지의 솔더볼 평탄화 방법 및 그 기판구조
US6160705A (en) *	1997-05-09	2000-12-12	Texas Instruments Incorporated	Ball grid array package and method using enhanced power and ground distribution circuitry
JPH1126919A (ja) *	1997-06-30	1999-01-29	Fuji Photo Film Co Ltd	プリント配線板
JP3335896B2 (ja) *	1997-12-26	2002-10-21	株式会社東芝	ハンダ材及びハンダ材の製造方法
JP3887620B2 (ja) *	2003-10-02	2007-02-28	沖電気工業株式会社	半導体素子及び半導体装置
US7462861B2 (en) *	2004-04-28	2008-12-09	Cree, Inc.	LED bonding structures and methods of fabricating LED bonding structures
JP5105042B2 (ja) *	2006-03-23	2012-12-19	イビデン株式会社	多層プリント配線板
US20080017407A1 (en) *	2006-07-24	2008-01-24	Ibiden Co., Ltd.	Interposer and electronic device using the same

2006
- 2006-09-12 JP JP2006246255A patent/JP4211828B2/ja not_active Expired - Fee Related
2007
- 2007-07-06 CN CN200710128137A patent/CN100579337C/zh not_active Expired - Fee Related
- 2007-07-16 TW TW096125842A patent/TW200819012A/zh not_active IP Right Cessation
- 2007-07-19 KR KR1020070072016A patent/KR100899251B1/ko not_active Expired - Fee Related
- 2007-07-27 US US11/829,301 patent/US20080062665A1/en not_active Abandoned

Also Published As

Publication number	Publication date
CN100579337C (zh)	2010-01-06
KR20080024059A (ko)	2008-03-17
JP4211828B2 (ja)	2009-01-21
US20080062665A1 (en)	2008-03-13
KR100899251B1 (ko)	2009-05-27
TW200819012A (en)	2008-04-16
CN101146412A (zh)	2008-03-19
JP2008071779A (ja)	2008-03-27

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Legal Events

Date	Code	Title	Description
2019-05-01	MM4A	Annulment or lapse of patent due to non-payment of fees