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TWI369464B - High performance heat dissipative device and method for manufacturing same - Google Patents

High performance heat dissipative device and method for manufacturing same

Info

Publication number
TWI369464B
TWI369464B TW097141164A TW97141164A TWI369464B TW I369464 B TWI369464 B TW I369464B TW 097141164 A TW097141164 A TW 097141164A TW 97141164 A TW97141164 A TW 97141164A TW I369464 B TWI369464 B TW I369464B
Authority
TW
Taiwan
Prior art keywords
high performance
manufacturing same
performance heat
heat dissipative
dissipative device
Prior art date
Application number
TW097141164A
Other languages
Chinese (zh)
Other versions
TW201017045A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW097141164A priority Critical patent/TWI369464B/en
Publication of TW201017045A publication Critical patent/TW201017045A/en
Application granted granted Critical
Publication of TWI369464B publication Critical patent/TWI369464B/en

Links

TW097141164A 2008-10-24 2008-10-24 High performance heat dissipative device and method for manufacturing same TWI369464B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097141164A TWI369464B (en) 2008-10-24 2008-10-24 High performance heat dissipative device and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097141164A TWI369464B (en) 2008-10-24 2008-10-24 High performance heat dissipative device and method for manufacturing same

Publications (2)

Publication Number Publication Date
TW201017045A TW201017045A (en) 2010-05-01
TWI369464B true TWI369464B (en) 2012-08-01

Family

ID=44830650

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097141164A TWI369464B (en) 2008-10-24 2008-10-24 High performance heat dissipative device and method for manufacturing same

Country Status (1)

Country Link
TW (1) TWI369464B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201204991A (en) * 2010-07-30 2012-02-01 Zhen-Meng Lin Molding method and structure of LED lamp heat sink with micro/nano metal and graphite
CN103629557B (en) * 2012-08-20 2016-12-21 苏州璨宇光学有限公司 Light source module and preparation method thereof
TWI616120B (en) * 2014-06-09 2018-02-21 Flexible circuit board structure combined with carrier board and manufacturing method thereof
CN113534525B (en) * 2021-07-08 2024-02-09 深圳亿成光电科技有限公司 Vehicle-mounted LED high-brightness backlight source

Also Published As

Publication number Publication date
TW201017045A (en) 2010-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees