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TWI368982B - Circuit component structure - Google Patents

Circuit component structure

Info

Publication number
TWI368982B
TWI368982B TW096114823A TW96114823A TWI368982B TW I368982 B TWI368982 B TW I368982B TW 096114823 A TW096114823 A TW 096114823A TW 96114823 A TW96114823 A TW 96114823A TW I368982 B TWI368982 B TW I368982B
Authority
TW
Taiwan
Prior art keywords
circuit component
component structure
circuit
component
Prior art date
Application number
TW096114823A
Other languages
Chinese (zh)
Other versions
TW200843075A (en
Inventor
Hsin Jung Lo
Ping Jung Yang
Original Assignee
Megica Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Megica Corp filed Critical Megica Corp
Priority to TW096114823A priority Critical patent/TWI368982B/en
Publication of TW200843075A publication Critical patent/TW200843075A/en
Application granted granted Critical
Publication of TWI368982B publication Critical patent/TWI368982B/en

Links

Classifications

    • H10W72/075—
    • H10W70/60—
    • H10W72/073—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W74/00—
    • H10W90/24—
    • H10W90/732—
    • H10W90/734—
    • H10W90/752—
    • H10W90/754—
TW096114823A 2007-04-26 2007-04-26 Circuit component structure TWI368982B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096114823A TWI368982B (en) 2007-04-26 2007-04-26 Circuit component structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096114823A TWI368982B (en) 2007-04-26 2007-04-26 Circuit component structure

Publications (2)

Publication Number Publication Date
TW200843075A TW200843075A (en) 2008-11-01
TWI368982B true TWI368982B (en) 2012-07-21

Family

ID=44822206

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096114823A TWI368982B (en) 2007-04-26 2007-04-26 Circuit component structure

Country Status (1)

Country Link
TW (1) TWI368982B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810963B (en) * 2022-06-07 2023-08-01 華東科技股份有限公司 Chip package structure that improves wire bonding strength

Also Published As

Publication number Publication date
TW200843075A (en) 2008-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees