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TWI368308B - Method for forming pre-solders on package substrate - Google Patents

Method for forming pre-solders on package substrate

Info

Publication number
TWI368308B
TWI368308B TW098102085A TW98102085A TWI368308B TW I368308 B TWI368308 B TW I368308B TW 098102085 A TW098102085 A TW 098102085A TW 98102085 A TW98102085 A TW 98102085A TW I368308 B TWI368308 B TW I368308B
Authority
TW
Taiwan
Prior art keywords
solders
package substrate
forming pre
forming
package
Prior art date
Application number
TW098102085A
Other languages
Chinese (zh)
Other versions
TW201029135A (en
Inventor
Geng Lin Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW098102085A priority Critical patent/TWI368308B/en
Publication of TW201029135A publication Critical patent/TW201029135A/en
Application granted granted Critical
Publication of TWI368308B publication Critical patent/TWI368308B/en

Links

Classifications

    • H10W72/012—
    • H10W90/724—
TW098102085A 2009-01-20 2009-01-20 Method for forming pre-solders on package substrate TWI368308B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW098102085A TWI368308B (en) 2009-01-20 2009-01-20 Method for forming pre-solders on package substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098102085A TWI368308B (en) 2009-01-20 2009-01-20 Method for forming pre-solders on package substrate

Publications (2)

Publication Number Publication Date
TW201029135A TW201029135A (en) 2010-08-01
TWI368308B true TWI368308B (en) 2012-07-11

Family

ID=44853934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098102085A TWI368308B (en) 2009-01-20 2009-01-20 Method for forming pre-solders on package substrate

Country Status (1)

Country Link
TW (1) TWI368308B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419278B (en) * 2010-10-26 2013-12-11 欣興電子股份有限公司 Package substrate and its preparation method

Also Published As

Publication number Publication date
TW201029135A (en) 2010-08-01

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