[go: up one dir, main page]

TWI368279B - Method for fabricating high voltage drift in semiconductor device - Google Patents

Method for fabricating high voltage drift in semiconductor device

Info

Publication number
TWI368279B
TWI368279B TW097119779A TW97119779A TWI368279B TW I368279 B TWI368279 B TW I368279B TW 097119779 A TW097119779 A TW 097119779A TW 97119779 A TW97119779 A TW 97119779A TW I368279 B TWI368279 B TW I368279B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
high voltage
voltage drift
fabricating high
fabricating
Prior art date
Application number
TW097119779A
Other languages
English (en)
Other versions
TW200901334A (en
Inventor
Jea Hee Kim
Original Assignee
Dongbu Hitek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongbu Hitek Co Ltd filed Critical Dongbu Hitek Co Ltd
Publication of TW200901334A publication Critical patent/TW200901334A/zh
Application granted granted Critical
Publication of TWI368279B publication Critical patent/TWI368279B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0221Manufacture or treatment of FETs having insulated gates [IGFET] having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended-drain MOSFETs [EDMOS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/601Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/603Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113Isolations within a component, i.e. internal isolations
    • H10D62/115Dielectric isolations, e.g. air gaps
    • H10D62/116Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/514Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
    • H10D64/516Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
TW097119779A 2007-05-29 2008-05-28 Method for fabricating high voltage drift in semiconductor device TWI368279B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070052058A KR100887030B1 (ko) 2007-05-29 2007-05-29 반도체 소자의 고전압 드리프트 형성 방법

Publications (2)

Publication Number Publication Date
TW200901334A TW200901334A (en) 2009-01-01
TWI368279B true TWI368279B (en) 2012-07-11

Family

ID=40087157

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097119779A TWI368279B (en) 2007-05-29 2008-05-28 Method for fabricating high voltage drift in semiconductor device

Country Status (4)

Country Link
US (1) US7851317B2 (zh)
KR (1) KR100887030B1 (zh)
CN (1) CN101315896B (zh)
TW (1) TWI368279B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009016480A (ja) * 2007-07-03 2009-01-22 Toshiba Corp 半導体装置、及び半導体装置の製造方法
KR101102772B1 (ko) * 2009-11-27 2012-01-05 매그나칩 반도체 유한회사 반도체 장치
JP2011204935A (ja) * 2010-03-26 2011-10-13 Mitsubishi Electric Corp 半導体装置とその製造方法
US8754469B2 (en) 2010-10-26 2014-06-17 Texas Instruments Incorporated Hybrid active-field gap extended drain MOS transistor
CN102244092B (zh) * 2011-06-20 2013-01-09 电子科技大学 一种横向高压功率半导体器件的结终端结构
KR101867953B1 (ko) * 2011-12-22 2018-06-18 삼성전자주식회사 반도체 소자 및 반도체 소자의 형성 방법
KR101467703B1 (ko) * 2013-10-10 2014-12-02 매그나칩 반도체 유한회사 반도체 소자 및 그 제조 방법
CN103928528B (zh) * 2014-04-28 2017-06-06 电子科技大学 一种横向高压功率半导体器件的结终端结构
CN103928500B (zh) * 2014-04-28 2017-05-03 电子科技大学 一种横向高压功率半导体器件的结终端结构
US9431480B1 (en) * 2015-03-27 2016-08-30 Texas Instruments Incorporated Diluted drift layer with variable stripe widths for power transistors
CN105206658B (zh) * 2015-08-28 2017-11-03 电子科技大学 一种横向高压功率器件的结终端结构
CN105206657B (zh) * 2015-08-28 2017-10-10 电子科技大学 一种横向高压功率器件的结终端结构
KR102642021B1 (ko) * 2019-01-31 2024-02-29 매그나칩 반도체 유한회사 반도체 소자 및 그 제조방법
TWI838121B (zh) * 2023-02-14 2024-04-01 世界先進積體電路股份有限公司 半導體結構

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539238A (en) 1992-09-02 1996-07-23 Texas Instruments Incorporated Area efficient high voltage Mosfets with vertical resurf drift regions
JPH0897411A (ja) * 1994-09-21 1996-04-12 Fuji Electric Co Ltd 横型高耐圧トレンチmosfetおよびその製造方法
US6306711B1 (en) * 1998-11-03 2001-10-23 United Microelectronics Corp. Method of fabricating a high-voltage lateral double diffused metal oxide semiconductor
KR100377130B1 (ko) * 2000-11-22 2003-03-19 페어차일드코리아반도체 주식회사 반도체 소자 및 그 제조 방법
DE10131706B4 (de) * 2001-06-29 2005-10-06 Atmel Germany Gmbh Verfahren zur Herstellung eines DMOS-Transistors
DE10345347A1 (de) 2003-09-19 2005-04-14 Atmel Germany Gmbh Verfahren zur Herstellung eines DMOS-Transistors mit lateralem Driftregionen-Dotierstoffprofil
KR100507377B1 (ko) * 2003-11-13 2005-08-09 매그나칩 반도체 유한회사 반도체 소자의 제조 방법
TWI263334B (en) 2004-12-13 2006-10-01 United Microelectronics Corp High voltage devices and method of fabricating the same
JP5087816B2 (ja) 2004-12-15 2012-12-05 富士電機株式会社 半導体装置およびその製造方法
US7375408B2 (en) * 2005-10-11 2008-05-20 United Microelectronics Corp. Fabricating method of a high voltage metal oxide semiconductor device

Also Published As

Publication number Publication date
CN101315896B (zh) 2012-07-18
KR100887030B1 (ko) 2009-03-04
TW200901334A (en) 2009-01-01
US20080296678A1 (en) 2008-12-04
CN101315896A (zh) 2008-12-03
KR20080104774A (ko) 2008-12-03
US7851317B2 (en) 2010-12-14

Similar Documents

Publication Publication Date Title
TWI368279B (en) Method for fabricating high voltage drift in semiconductor device
TWI369717B (en) Method for forming semiconductor device
TWI348746B (en) Method for fabricating semiconductor device
TWI562245B (en) Semiconductor device and method for manufacturing the same
TWI366892B (en) Method for fabricating semiconductor device
TWI370516B (en) Semiconductor device manufacturing method
EP2246880B8 (en) Semiconductor device fabrication method
TWI366875B (en) Method of manufacturing semiconductor device
EP2325882A4 (en) Method for manufacturing semiconductor device
TWI371809B (en) Wafer structure and method for fabricating the same
TWI562285B (en) Semiconductor device and method for manufacturing the same
SG10201403913PA (en) Method for manufacturing semiconductor device
TWI365528B (en) Semiconductor structure and method for manufacturing the same
TWI370500B (en) Semiconductor device
GB201122197D0 (en) Semiconductor device and method for producing the same
TWI370596B (en) Method for manufacturing semiconductor optical device
TWI368949B (en) Method for fabricating semiconductor device with vertical channel transistor
TWI373114B (en) Semiconductor device and manufacturing method thereof
TWI347635B (en) Method for fabricating semiconductor device including recess gate
TWI341026B (en) Sensor-type semiconductor device and method for fabricating the same
EP2149842A4 (en) SEMICONDUCTOR DEVICE
EP2506303A4 (en) Semiconductor device and method for manufacturing the same
TWI366864B (en) Method for fabricating semiconductor device
TWI371844B (en) Semiconductor device and method for manufacturing the same
GB0822993D0 (en) Semiconductor device and fabrication method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees