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TWI367699B - - Google Patents

Info

Publication number
TWI367699B
TWI367699B TW096127241A TW96127241A TWI367699B TW I367699 B TWI367699 B TW I367699B TW 096127241 A TW096127241 A TW 096127241A TW 96127241 A TW96127241 A TW 96127241A TW I367699 B TWI367699 B TW I367699B
Authority
TW
Taiwan
Application number
TW096127241A
Other languages
Chinese (zh)
Other versions
TW200819002A (en
Inventor
Naohito Nakaya
Ryuji Sekimoto
Original Assignee
Nippon Avionics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd filed Critical Nippon Avionics Co Ltd
Publication of TW200819002A publication Critical patent/TW200819002A/en
Application granted granted Critical
Publication of TWI367699B publication Critical patent/TWI367699B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0495—Cold welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H10W72/073—
    • H10W72/931—
    • H10W74/15—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW096127241A 2006-08-07 2007-07-26 Method and apparatus for connecting printed wiring boards TW200819002A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006214280 2006-08-07
PCT/JP2007/000463 WO2008018160A1 (en) 2006-08-07 2007-04-26 Method and apparatus for connecting printed wiring boards

Publications (2)

Publication Number Publication Date
TW200819002A TW200819002A (en) 2008-04-16
TWI367699B true TWI367699B (en) 2012-07-01

Family

ID=39032701

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096127241A TW200819002A (en) 2006-08-07 2007-07-26 Method and apparatus for connecting printed wiring boards

Country Status (5)

Country Link
JP (1) JP4117851B2 (en)
KR (1) KR100905404B1 (en)
CN (1) CN101347052B (en)
TW (1) TW200819002A (en)
WO (1) WO2008018160A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12069811B2 (en) 2022-02-10 2024-08-20 AUO Corporation Bonding apparatus

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5284194B2 (en) * 2008-08-07 2013-09-11 キヤノン株式会社 Printed wiring board and printed circuit board
KR101046590B1 (en) * 2009-02-16 2011-07-05 한국과학기술원 Electronic component joining method using vibration energy and vibration energy application device
KR101046591B1 (en) * 2009-02-16 2011-07-05 한국과학기술원 Vibration energy applying device used for joining electronic parts
KR101046592B1 (en) * 2009-02-17 2011-07-05 한국과학기술원 Connection method of electronic parts using thermocompression and vibration energy
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
WO2011092809A1 (en) * 2010-01-27 2011-08-04 株式会社コグコフ Ultrasonic bonding method and ultrasonic bonding device
KR100985481B1 (en) * 2010-04-14 2010-10-05 (주)에스이피 Led back light module
JP5644286B2 (en) * 2010-09-07 2014-12-24 オムロン株式会社 Electronic component surface mounting method and electronic component mounted substrate
JP5889718B2 (en) * 2012-05-30 2016-03-22 アルプス電気株式会社 Electronic component mounting structure and input device, and method of manufacturing the mounting structure
JP6214968B2 (en) * 2012-08-27 2017-10-18 シチズン時計株式会社 Optical device
JP5743040B2 (en) 2013-05-13 2015-07-01 株式会社村田製作所 Flexible circuit board and method for manufacturing flexible circuit board
CN103607855B (en) * 2013-10-26 2016-06-08 溧阳市东大技术转移中心有限公司 The manufacture method of a kind of composite flexible substrate
JP6432465B2 (en) 2014-08-26 2018-12-05 三菱マテリアル株式会社 Bonded body, power module substrate with heat sink, heat sink, method for manufacturing bonded body, method for manufacturing power module substrate with heat sink, and method for manufacturing heat sink
CN105117076B (en) * 2015-07-13 2018-01-23 业成光电（深圳）有限公司 Multi-functional touch sensing device
JP2017215499A (en) * 2016-06-01 2017-12-07 エルジー ディスプレイ カンパニー リミテッド Manufacturing method of display device
KR102381286B1 (en) 2017-05-18 2022-03-31 삼성디스플레이 주식회사 Display device
CN110323323A (en) * 2018-03-29 2019-10-11 豪雅冠得股份有限公司 Light irradiation module and LED element wiring substrate
CN108901144A (en) * 2018-07-17 2018-11-27 天津瑞爱恩科技有限公司 Enhance the method for printed wiring board rigid-flex combined strength
CN113237589B (en) * 2021-04-28 2022-03-29 大连理工大学 A parallel detection head for holding force of electrical connector contacts
CN118355736A (en) * 2021-12-20 2024-07-16 三菱电机株式会社 Substrate bonding structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6288393A (en) * 1985-10-15 1987-04-22 セイコーエプソン株式会社 Circuit board pattern structure
JPH058453A (en) * 1991-07-01 1993-01-19 Seiko Epson Corp Wire dot color printer
JP3174374B2 (en) * 1992-01-13 2001-06-11 旭化成株式会社 Outer lead bonding method
JPH06112620A (en) * 1992-09-29 1994-04-22 Minolta Camera Co Ltd Connecting method and structure for wiring
JPH098453A (en) * 1995-06-16 1997-01-10 Matsushita Electric Ind Co Ltd Ultrasonic connection method for insulating substrate and flexible substrate
JPH10233564A (en) * 1997-02-19 1998-09-02 Alps Electric Co Ltd Flexible board
JP3890728B2 (en) * 1998-03-06 2007-03-07 カシオ計算機株式会社 Lead connection structure
JP4123321B2 (en) * 1999-10-28 2008-07-23 セイコーエプソン株式会社 Wiring board bonding method
JP4513147B2 (en) 1999-12-02 2010-07-28 日立化成工業株式会社 Circuit connection method
JP3949031B2 (en) 2002-02-05 2007-07-25 東レエンジニアリング株式会社 Chip mounting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12069811B2 (en) 2022-02-10 2024-08-20 AUO Corporation Bonding apparatus

Also Published As

Publication number Publication date
JP4117851B2 (en) 2008-07-16
JPWO2008018160A1 (en) 2009-12-24
WO2008018160A1 (en) 2008-02-14
CN101347052A (en) 2009-01-14
KR20080049043A (en) 2008-06-03
TW200819002A (en) 2008-04-16
KR100905404B1 (en) 2009-06-30
CN101347052B (en) 2012-02-15

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