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TWI367267B - Electrolytic stripping method - Google Patents

Electrolytic stripping method

Info

Publication number
TWI367267B
TWI367267B TW093132149A TW93132149A TWI367267B TW I367267 B TWI367267 B TW I367267B TW 093132149 A TW093132149 A TW 093132149A TW 93132149 A TW93132149 A TW 93132149A TW I367267 B TWI367267 B TW I367267B
Authority
TW
Taiwan
Prior art keywords
stripping method
electrolytic stripping
electrolytic
stripping
Prior art date
Application number
TW093132149A
Other languages
Chinese (zh)
Other versions
TW200521270A (en
Inventor
Ogihara Yoko
Nakazawa Masao
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200521270A publication Critical patent/TW200521270A/en
Application granted granted Critical
Publication of TWI367267B publication Critical patent/TWI367267B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings
    • H10W70/457—
    • H10W72/075—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/952—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW093132149A 2003-12-26 2004-10-22 Electrolytic stripping method TWI367267B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003433701A JP4268515B2 (en) 2003-12-26 2003-12-26 Electrolytic peeling method

Publications (2)

Publication Number Publication Date
TW200521270A TW200521270A (en) 2005-07-01
TWI367267B true TWI367267B (en) 2012-07-01

Family

ID=34697737

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132149A TWI367267B (en) 2003-12-26 2004-10-22 Electrolytic stripping method

Country Status (5)

Country Link
US (1) US20050139488A1 (en)
JP (1) JP4268515B2 (en)
KR (1) KR101124546B1 (en)
CN (1) CN1637174B (en)
TW (1) TWI367267B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080112988A1 (en) * 2006-11-14 2008-05-15 Ancient Stones, Inc. Composition and method for cosmetic vitalization and stabilization
JP2011149037A (en) * 2010-01-19 2011-08-04 Mitsubishi Shindoh Co Ltd Method for recycling scrap of copper or copper alloy plated with silver
JP5888403B2 (en) * 2012-02-29 2016-03-22 日立金属株式会社 Method for preparing plating solution for electroaluminum plating having low melting point, electroplating solution for electroaluminum plating, method for producing aluminum foil, and method for reducing melting point of electroplating solution for electroaluminum plating
US20160319444A1 (en) 2013-12-20 2016-11-03 Greene Lyon Group, Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
JP6417586B2 (en) * 2014-08-25 2018-11-07 セイコーエプソン株式会社 Modeling method and model
CN105506728B (en) * 2014-09-29 2019-10-15 盛美半导体设备（上海）有限公司 The device of precipitating metal ion from electrochemical polish liquid
JP2018524480A (en) 2015-06-24 2018-08-30 グリーン リヨン グループ, インコーポレーテッドGreene Lyon Group, Inc. Applications related to selective extraction of precious metals using acidic fluids including nitrate-containing fluids
CN105543948B (en) * 2015-12-23 2017-10-31 苏州卓融新能源科技有限公司 It is a kind of for PCB electroplate accompany plating plate/drag cylinder plate move back process for copper
CN111487267B (en) * 2020-04-09 2023-04-14 哈尔滨工业大学 A method for peeling off double-layer oxide film defects in aluminum bronze alloy
CN113652694A (en) * 2021-06-24 2021-11-16 广东桐鸣环保科技有限公司 Copper plating layer stripping liquid and stripping method
EP4403676A1 (en) * 2023-01-19 2024-07-24 Semsysco GmbH Electro-etching method for an area-selective treatment of a substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596307A (en) * 1947-11-05 1952-05-13 Charles Litzenberg Process of electrostripping electrodeposited metals
US3960675A (en) * 1975-04-17 1976-06-01 Motter Printing Press Co. Method for deplating and replating rotogravure cylinders
US4264420A (en) * 1979-10-29 1981-04-28 Oxy Metal Industries Corporation Electrolytic stripping bath and process
US4404074A (en) * 1982-05-27 1983-09-13 Occidental Chemical Corporation Electrolytic stripping bath and process
JPS6056800B2 (en) 1982-08-11 1985-12-11 新光電気工業株式会社 Method for removing protruding parts of base copper plating in partial silver plating and method for finishing surface of silver plating
US4729940A (en) * 1986-05-16 1988-03-08 Cbs Inc. Method of manufacturing master for optical information carrier
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6783690B2 (en) * 2002-03-25 2004-08-31 Donna M. Kologe Method of stripping silver from a printed circuit board

Also Published As

Publication number Publication date
JP2005187920A (en) 2005-07-14
JP4268515B2 (en) 2009-05-27
CN1637174A (en) 2005-07-13
US20050139488A1 (en) 2005-06-30
CN1637174B (en) 2010-04-28
TW200521270A (en) 2005-07-01
KR101124546B1 (en) 2012-03-15
KR20050066981A (en) 2005-06-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees