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TWI366951B - A differential i/o spline for inexpensive breakout and excellent signal quality - Google Patents

A differential i/o spline for inexpensive breakout and excellent signal quality

Info

Publication number
TWI366951B
TWI366951B TW096117366A TW96117366A TWI366951B TW I366951 B TWI366951 B TW I366951B TW 096117366 A TW096117366 A TW 096117366A TW 96117366 A TW96117366 A TW 96117366A TW I366951 B TWI366951 B TW I366951B
Authority
TW
Taiwan
Prior art keywords
breakout
spline
inexpensive
differential
signal quality
Prior art date
Application number
TW096117366A
Other languages
English (en)
Other versions
TW200822331A (en
Inventor
Gregory Daly
Dan Willis
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200822331A publication Critical patent/TW200822331A/zh
Application granted granted Critical
Publication of TWI366951B publication Critical patent/TWI366951B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connecting Device With Holders (AREA)
TW096117366A 2006-05-17 2007-05-16 A differential i/o spline for inexpensive breakout and excellent signal quality TWI366951B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/436,860 US7347701B2 (en) 2006-05-17 2006-05-17 Differential I/O spline for inexpensive breakout and excellent signal quality

Publications (2)

Publication Number Publication Date
TW200822331A TW200822331A (en) 2008-05-16
TWI366951B true TWI366951B (en) 2012-06-21

Family

ID=38712502

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117366A TWI366951B (en) 2006-05-17 2007-05-16 A differential i/o spline for inexpensive breakout and excellent signal quality

Country Status (3)

Country Link
US (1) US7347701B2 (zh)
CN (1) CN101136511B (zh)
TW (1) TWI366951B (zh)

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US7772708B2 (en) * 2006-08-31 2010-08-10 Intel Corporation Stacking integrated circuit dies
US20080150122A1 (en) * 2006-12-26 2008-06-26 Cliff Lee Routing density through asymmetric array of vias
US7705447B2 (en) * 2008-09-29 2010-04-27 Intel Corporation Input/output package architectures, and methods of using same
US7744389B1 (en) * 2009-08-04 2010-06-29 Lenovo Singapore Pte. Ltd. Communication with a multi-contact pad having a USB application
US8294259B2 (en) * 2010-02-09 2012-10-23 Altera Corporation Interconnect pattern for transceiver package
CN102651518A (zh) * 2011-02-24 2012-08-29 阿尔卑斯电气株式会社 电子零件用插座
US8853553B2 (en) * 2012-07-13 2014-10-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Ball grid array (BGA) and printed circuit board (PCB) via pattern to reduce differential mode crosstalk between transmit and receive differential signal pairs
US10090235B2 (en) * 2013-11-14 2018-10-02 Toshiba Memory Corporation Semiconductor device and semiconductor package
US9558968B2 (en) * 2014-09-11 2017-01-31 Semiconductor Components Industries, Llc Single or multi chip module package and related methods
US9543243B2 (en) * 2014-11-07 2017-01-10 Oracle International Corporation Low-noise arrangement for very-large-scale integration differential input/output structures
US9543241B2 (en) 2014-11-24 2017-01-10 International Business Machines Corporation Interconnect array pattern with a 3:1 signal-to-ground ratio
US10038281B2 (en) * 2015-08-13 2018-07-31 Intel Corporation Pinfield crosstalk mitigation
US9955605B2 (en) * 2016-03-30 2018-04-24 Intel Corporation Hardware interface with space-efficient cell pattern
US10091873B1 (en) * 2017-06-22 2018-10-02 Innovium, Inc. Printed circuit board and integrated circuit package
US10477672B2 (en) * 2018-01-29 2019-11-12 Hewlett Packard Enterprise Development Lp Single ended vias with shared voids
JP7636445B2 (ja) * 2020-09-02 2025-02-26 長江存儲科技有限責任公司 エクスタッキングアーキテクチャ用の電極出力構造
CN115020383B (zh) * 2022-06-24 2025-05-27 南京航空航天大学 一种阵列化芯片结构及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3516156A (en) * 1967-12-11 1970-06-23 Ibm Circuit package assembly process
US5479319A (en) * 1992-12-30 1995-12-26 Interconnect Systems, Inc. Multi-level assemblies for interconnecting integrated circuits
JPH10335033A (ja) * 1997-05-29 1998-12-18 Fujitsu Ltd パッケージ実装用ソケット及びこのソケットを利用したパッケージの実装構造
US6556455B2 (en) * 1999-07-15 2003-04-29 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
US6585527B2 (en) * 2001-05-31 2003-07-01 Samtec, Inc. Compliant connector for land grid array
JP2003017193A (ja) * 2001-07-04 2003-01-17 Nec Tokin Iwate Ltd シールドコネクタ
CN1870853B (zh) * 2001-10-10 2012-01-18 莫莱克斯公司 高速差分信号边缘卡连接器电路板布局
CN100483886C (zh) * 2001-11-14 2009-04-29 Fci公司 用于电连接器的串扰减小
US6652318B1 (en) * 2002-05-24 2003-11-25 Fci Americas Technology, Inc. Cross-talk canceling technique for high speed electrical connectors
US6692272B2 (en) * 2001-11-14 2004-02-17 Fci Americas Technology, Inc. High speed electrical connector
TW500257U (en) * 2001-11-16 2002-08-21 Via Tech Inc Pin-type integrated circuit connection device
US6811410B2 (en) * 2002-05-28 2004-11-02 Intel Corporation Integrated circuit socket with capacitors and shunts
US7056766B2 (en) * 2003-12-09 2006-06-06 Freescale Semiconductor, Inc. Method of forming land grid array packaged device

Also Published As

Publication number Publication date
US20070269998A1 (en) 2007-11-22
TW200822331A (en) 2008-05-16
CN101136511A (zh) 2008-03-05
US7347701B2 (en) 2008-03-25
CN101136511B (zh) 2010-12-08

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