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TWI366872B - Apparatus and methods for spectrum based monitoring of chemical mechanical polishing - Google Patents

Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

Info

Publication number
TWI366872B
TWI366872B TW099119185A TW99119185A TWI366872B TW I366872 B TWI366872 B TW I366872B TW 099119185 A TW099119185 A TW 099119185A TW 99119185 A TW99119185 A TW 99119185A TW I366872 B TWI366872 B TW I366872B
Authority
TW
Taiwan
Prior art keywords
methods
mechanical polishing
chemical mechanical
spectrum based
based monitoring
Prior art date
Application number
TW099119185A
Other languages
Chinese (zh)
Other versions
TW201103085A (en
Inventor
Dominic J Benvegnu
Jeffrey Drue David
Bogdan Swedek
Harry Q Lee
Lakshmanan Karuppiah
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/213,675 external-priority patent/US7306507B2/en
Priority claimed from US11/261,742 external-priority patent/US7406394B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201103085A publication Critical patent/TW201103085A/en
Application granted granted Critical
Publication of TWI366872B publication Critical patent/TWI366872B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H10P52/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW099119185A 2005-08-22 2006-08-22 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing TWI366872B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US71068205P 2005-08-22 2005-08-22
US11/213,675 US7306507B2 (en) 2005-08-22 2005-08-26 Polishing pad assembly with glass or crystalline window
US11/213,674 US7226339B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,344 US7764377B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/261,742 US7406394B2 (en) 2005-08-22 2005-10-28 Spectra based endpointing for chemical mechanical polishing
US74776806P 2006-05-19 2006-05-19

Publications (2)

Publication Number Publication Date
TW201103085A TW201103085A (en) 2011-01-16
TWI366872B true TWI366872B (en) 2012-06-21

Family

ID=37560902

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099119185A TWI366872B (en) 2005-08-22 2006-08-22 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

Country Status (4)

Country Link
JP (1) JP5534672B2 (en)
KR (1) KR101324644B1 (en)
TW (1) TWI366872B (en)
WO (1) WO2007024807A2 (en)

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US7998358B2 (en) 2006-10-31 2011-08-16 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
US8569174B2 (en) * 2007-02-23 2013-10-29 Applied Materials, Inc. Using spectra to determine polishing endpoints
US20090275265A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Endpoint detection in chemical mechanical polishing using multiple spectra
US7967661B2 (en) 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
US8439723B2 (en) 2008-08-11 2013-05-14 Applied Materials, Inc. Chemical mechanical polisher with heater and method
US8414357B2 (en) 2008-08-22 2013-04-09 Applied Materials, Inc. Chemical mechanical polisher having movable slurry dispensers and method
WO2010028180A2 (en) * 2008-09-04 2010-03-11 Applied Materials, Inc. Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
WO2010062497A2 (en) * 2008-10-27 2010-06-03 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
US8751033B2 (en) * 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
US8292693B2 (en) * 2008-11-26 2012-10-23 Applied Materials, Inc. Using optical metrology for wafer to wafer feed back process control
JP5968783B2 (en) * 2009-11-03 2016-08-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ End point method using the relationship between peak position and time in spectral contour plots
JP5728239B2 (en) 2010-03-02 2015-06-03 株式会社荏原製作所 Polishing monitoring method, polishing method, polishing monitoring apparatus, and polishing apparatus
US9579767B2 (en) 2010-04-28 2017-02-28 Applied Materials, Inc. Automatic generation of reference spectra for optical monitoring of substrates
TWI496661B (en) * 2010-04-28 2015-08-21 應用材料股份有限公司 Automatic generation of reference spectra for optical monitoring
US8834229B2 (en) 2010-05-05 2014-09-16 Applied Materials, Inc. Dynamically tracking spectrum features for endpoint detection
JP6039545B2 (en) * 2010-05-05 2016-12-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Dynamic or adaptive tracking of spectral features for endpoint detection
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
JP2012019114A (en) * 2010-07-08 2012-01-26 Tokyo Seimitsu Co Ltd Polishing end point detection system and polishing end point detection method
TWI478259B (en) * 2010-07-23 2015-03-21 應用材料股份有限公司 2D spectral feature tracking for endpoint detection
JP5612945B2 (en) 2010-07-23 2014-10-22 株式会社荏原製作所 Method and apparatus for monitoring progress of substrate polishing
US8954186B2 (en) 2010-07-30 2015-02-10 Applied Materials, Inc. Selecting reference libraries for monitoring of multiple zones on a substrate
MY166716A (en) * 2010-11-18 2018-07-18 Cabot Microelectronics Corp Polishing pad comprising transmissive region
JP5980476B2 (en) 2010-12-27 2016-08-31 株式会社荏原製作所 Polishing apparatus and polishing method
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
JP6030636B2 (en) * 2011-04-28 2016-11-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Generation of spectral libraries for polishing based on models
JP5715034B2 (en) * 2011-11-30 2015-05-07 株式会社東京精密 Polishing method by polishing apparatus
US9289875B2 (en) * 2012-04-25 2016-03-22 Applied Materials, Inc. Feed forward and feed-back techniques for in-situ process control
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
JP6060308B2 (en) * 2013-03-15 2017-01-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Dynamic control of residue clearing using in situ profile control (ISPC)
US10012494B2 (en) * 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
JP7197999B2 (en) 2018-05-11 2022-12-28 キオクシア株式会社 polishing equipment and polishing pads
KR102586252B1 (en) * 2018-07-06 2023-10-11 주식회사 케이씨텍 Device and method for detecting thickness of silicon oxide film on wafer
CN117001534A (en) 2018-09-24 2023-11-07 应用材料公司 Using machine vision as input to CMP process control algorithms
JP7253458B2 (en) * 2019-06-27 2023-04-06 株式会社荏原製作所 Method, Apparatus, and System for Determining Optimal Operating Recipe for Optical Film Thickness Gauge
JP7469032B2 (en) * 2019-12-10 2024-04-16 株式会社荏原製作所 Polishing method and polishing apparatus
US11847776B2 (en) 2020-06-29 2023-12-19 Applied Materials, Inc. System using film thickness estimation from machine learning based processing of substrate images

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US6271047B1 (en) * 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
US6361646B1 (en) * 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
JP2000183001A (en) * 1998-12-10 2000-06-30 Okamoto Machine Tool Works Ltd Polish end-point detecting method for wafer and chemical-mechanical polishing device used for the same
JP2000310512A (en) * 1999-04-28 2000-11-07 Hitachi Ltd Method and apparatus for measuring thin film thickness and method and apparatus for manufacturing thin film device using the same
JP3327289B2 (en) * 2000-03-29 2002-09-24 株式会社ニコン Process end point measuring device, measuring method, polishing device, semiconductor device manufacturing method, and recording medium recording signal processing program
JP3259225B2 (en) * 1999-12-27 2002-02-25 株式会社ニコン Polishing status monitoring method and apparatus, polishing apparatus, process wafer, semiconductor device manufacturing method, and semiconductor device
JP2001287159A (en) * 2000-04-05 2001-10-16 Nikon Corp Surface condition measuring method, measuring apparatus, polishing apparatus, and semiconductor device manufacturing method
JP3832198B2 (en) * 2000-06-16 2006-10-11 日本電気株式会社 Method and apparatus for detecting end point of polishing of semiconductor wafer
US6676482B2 (en) * 2001-04-20 2004-01-13 Speedfam-Ipec Corporation Learning method and apparatus for predictive determination of endpoint during chemical mechanical planarization using sparse sampling
JP2002359217A (en) * 2001-05-31 2002-12-13 Omron Corp Polishing end point detection method and apparatus
JP3932836B2 (en) * 2001-07-27 2007-06-20 株式会社日立製作所 Thin film thickness measuring method and apparatus, and device manufacturing method using the same
US6618130B2 (en) * 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US6942546B2 (en) * 2002-01-17 2005-09-13 Asm Nutool, Inc. Endpoint detection for non-transparent polishing member
US6806948B2 (en) * 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP4542324B2 (en) * 2002-10-17 2010-09-15 株式会社荏原製作所 Polishing state monitoring device and polishing device
JP2004165473A (en) * 2002-11-14 2004-06-10 Seiko Epson Corp CMP apparatus, CMP polishing method, semiconductor device and method for manufacturing the same
US20050026542A1 (en) 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
JP2005159203A (en) * 2003-11-28 2005-06-16 Hitachi Ltd Film thickness measuring method and apparatus, polishing rate calculating method, CMP processing method and apparatus

Also Published As

Publication number Publication date
WO2007024807A9 (en) 2009-09-03
KR20080042895A (en) 2008-05-15
JP5534672B2 (en) 2014-07-02
WO2007024807A2 (en) 2007-03-01
TW201103085A (en) 2011-01-16
WO2007024807A3 (en) 2007-07-12
KR101324644B1 (en) 2013-11-01
JP2009505847A (en) 2009-02-12

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