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TWI365693B - Solder bump printing method for single print circuit board - Google Patents

Solder bump printing method for single print circuit board

Info

Publication number
TWI365693B
TWI365693B TW097138955A TW97138955A TWI365693B TW I365693 B TWI365693 B TW I365693B TW 097138955 A TW097138955 A TW 097138955A TW 97138955 A TW97138955 A TW 97138955A TW I365693 B TWI365693 B TW I365693B
Authority
TW
Taiwan
Prior art keywords
circuit board
printing method
solder bump
print circuit
single print
Prior art date
Application number
TW097138955A
Other languages
Chinese (zh)
Other versions
TW201016087A (en
Inventor
Shing Fun Ho
Shih Tsung Lin
Original Assignee
Nan Ya Printed Circuit Board
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Printed Circuit Board filed Critical Nan Ya Printed Circuit Board
Priority to TW097138955A priority Critical patent/TWI365693B/en
Priority to JP2009175005A priority patent/JP5004061B2/en
Publication of TW201016087A publication Critical patent/TW201016087A/en
Application granted granted Critical
Publication of TWI365693B publication Critical patent/TWI365693B/en

Links

TW097138955A 2008-10-09 2008-10-09 Solder bump printing method for single print circuit board TWI365693B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW097138955A TWI365693B (en) 2008-10-09 2008-10-09 Solder bump printing method for single print circuit board
JP2009175005A JP5004061B2 (en) 2008-10-09 2009-07-28 Solder bump printing method for single printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097138955A TWI365693B (en) 2008-10-09 2008-10-09 Solder bump printing method for single print circuit board

Publications (2)

Publication Number Publication Date
TW201016087A TW201016087A (en) 2010-04-16
TWI365693B true TWI365693B (en) 2012-06-01

Family

ID=42255640

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097138955A TWI365693B (en) 2008-10-09 2008-10-09 Solder bump printing method for single print circuit board

Country Status (2)

Country Link
JP (1) JP5004061B2 (en)
TW (1) TWI365693B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104191808B (en) * 2014-08-07 2016-08-31 深圳市广晟德科技发展有限公司 Full-automatic stencil printing machine
TWI665455B (en) * 2018-05-30 2019-07-11 緯穎科技服務股份有限公司 Circuit board for transmitting high speed signal and for said signal to be detected
JP1781891S (en) 2024-04-10 2024-10-09 Squeegee for solder ball mounting machine

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3196596B2 (en) * 1995-09-29 2001-08-06 松下電器産業株式会社 Electronic component manufacturing method and electronic component mounting method
JP2000216518A (en) * 1999-01-21 2000-08-04 Ibiden Co Ltd Manufacture of printed wiring board
JP2001068823A (en) * 1999-08-25 2001-03-16 Sumitomo Metal Electronics Devices Inc Substrate for multiple boards and wiring board
JP2003260783A (en) * 2002-03-08 2003-09-16 Matsushita Electric Ind Co Ltd Solder paste printing method and solder paste printing mask
JP2004155185A (en) * 2002-10-18 2004-06-03 Ngk Spark Plug Co Ltd Soldering paste printing method, soldering paste printing machine, and method for manufacturing wiring board having solder printing layer
JP2005072556A (en) * 2003-08-06 2005-03-17 Kenseidou Kagaku Kogyo Kk Wiring substrate carrier
JP2005150196A (en) * 2003-11-12 2005-06-09 Matsushita Electric Ind Co Ltd Module manufacturing method and module manufacturing apparatus used therefor
JP4506515B2 (en) * 2005-03-08 2010-07-21 株式会社デンソー Screen printing device
US7472473B2 (en) * 2006-04-26 2009-01-06 Ibiden Co., Ltd. Solder ball loading apparatus
JP4842864B2 (en) * 2007-03-15 2011-12-21 新光電気工業株式会社 Electronic device and manufacturing method thereof

Also Published As

Publication number Publication date
JP5004061B2 (en) 2012-08-22
JP2010093232A (en) 2010-04-22
TW201016087A (en) 2010-04-16

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