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TWI365500B - Control method for bonding machine - Google Patents

Control method for bonding machine

Info

Publication number
TWI365500B
TWI365500B TW097125612A TW97125612A TWI365500B TW I365500 B TWI365500 B TW I365500B TW 097125612 A TW097125612 A TW 097125612A TW 97125612 A TW97125612 A TW 97125612A TW I365500 B TWI365500 B TW I365500B
Authority
TW
Taiwan
Prior art keywords
control method
bonding machine
bonding
machine
control
Prior art date
Application number
TW097125612A
Other languages
Chinese (zh)
Other versions
TW200941597A (en
Inventor
Min-Hyung Lee
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200941597A publication Critical patent/TW200941597A/en
Application granted granted Critical
Publication of TWI365500B publication Critical patent/TWI365500B/en

Links

Classifications

    • H10W72/0711—
    • H10W72/073—
TW097125612A 2008-03-25 2008-07-07 Control method for bonding machine TWI365500B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080027555A KR100844346B1 (en) 2008-03-25 2008-03-25 Control method of bonding equipment

Publications (2)

Publication Number Publication Date
TW200941597A TW200941597A (en) 2009-10-01
TWI365500B true TWI365500B (en) 2012-06-01

Family

ID=39823875

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097125612A TWI365500B (en) 2008-03-25 2008-07-07 Control method for bonding machine

Country Status (3)

Country Link
KR (1) KR100844346B1 (en)
CN (1) CN101546175A (en)
TW (1) TWI365500B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5941705B2 (en) * 2012-02-29 2016-06-29 ファスフォードテクノロジ株式会社 2-axis drive mechanism and die bonder
CN105470173B (en) * 2015-12-15 2018-08-14 上海微电子装备（集团）股份有限公司 A kind of chip bonding system and method
JP7102113B2 (en) * 2017-09-11 2022-07-19 ファスフォードテクノロジ株式会社 Manufacturing method of die bonding equipment and semiconductor equipment
CN116190295B (en) * 2023-04-28 2023-07-11 季华实验室 Semiconductor component transfer device and transfer method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3275742B2 (en) 1996-11-28 2002-04-22 松下電器産業株式会社 Chip bonding method
JP2002231768A (en) * 2001-02-01 2002-08-16 Shinkawa Ltd Inner lead bonding equipment
JP3747054B2 (en) 2001-12-04 2006-02-22 Ｔｏｗａ株式会社 Bonding apparatus and bonding method
KR101132141B1 (en) * 2006-03-03 2012-03-29 삼성테크윈 주식회사 Method for correcting die pickup position

Also Published As

Publication number Publication date
TW200941597A (en) 2009-10-01
KR100844346B1 (en) 2008-07-08
CN101546175A (en) 2009-09-30

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