TWI363359B - Inductor with exchange-coupling film - Google Patents
Inductor with exchange-coupling film Download PDFInfo
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- TWI363359B TWI363359B TW096124105A TW96124105A TWI363359B TW I363359 B TWI363359 B TW I363359B TW 096124105 A TW096124105 A TW 096124105A TW 96124105 A TW96124105 A TW 96124105A TW I363359 B TWI363359 B TW I363359B
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- 238000010168 coupling process Methods 0.000 title claims description 15
- 238000005859 coupling reaction Methods 0.000 title claims description 15
- 239000010408 film Substances 0.000 claims description 33
- 230000005291 magnetic effect Effects 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 11
- 230000005294 ferromagnetic effect Effects 0.000 claims description 6
- 239000003302 ferromagnetic material Substances 0.000 claims description 6
- 239000000696 magnetic material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 230000035699 permeability Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 13
- 230000001939 inductive effect Effects 0.000 claims 12
- 230000005290 antiferromagnetic effect Effects 0.000 claims 4
- 230000002452 interceptive effect Effects 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000002885 antiferromagnetic material Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000012528 membrane Substances 0.000 claims 2
- 229910001020 Au alloy Inorganic materials 0.000 claims 1
- 229910001313 Cobalt-iron alloy Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000013039 cover film Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- NJJQMCFHENWAGE-UHFFFAOYSA-N manganese yttrium Chemical compound [Mn].[Y] NJJQMCFHENWAGE-UHFFFAOYSA-N 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000010409 thin film Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229910019586 CoZrTa Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005350 ferromagnetic resonance Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/3218—Exchange coupling of magnetic films via an antiferromagnetic interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Magnetic Films (AREA)
- Coils Or Transformers For Communication (AREA)
Description
九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種電感元件(inductor),特別是指一 種具交互耦合(exchange-coupling)膜的電感元件。 【先前技術】 因應電子產品數位化的需求,電子元件傾向於輕薄短 小化。因而,電感亦經由半導體製程自三維(3D)的螺旋狀結 構演變成二維(2D)結構的平面化電感(pianar inductor)。基於 電路積體化的原則’當遽波器(filter)、震盪器(oscillator)及 電感等基本的電子零組件整合於積體電路(integrated-circuit) 上以構成早晶微波積體電路(monolithic-microwave integrated-circuit’簡稱MMIC)等應用於高頻相關領域的高 頻構件時,至少仍須符合其相容性並達到高頻系統級通訊 產品的使用要求。 以目前國内外專利中常見的平面化電感(圖未示)結構, 一般主要是由一矽基材、一形成於該矽基板上的絕緣層、 一埋於該絕緣層内的螺旋狀金屬帶體,以及一形成於該絕 緣層上鐵磁性層(ferromagnetic layer)所構成。
當上述平面化電感之鐵磁性層欲被應用於射頻積體電 路(RFIC)等領域時,需具備有高飽和磁化值(saturation magnetization ; Ms值)、高面内異向性磁場(in-plane anisotropy field ; Ηκ)、低橋頑磁場(coercive field ; Hc)、高 電阻係數(resistivity ; p值)、高誘磁率(permeability,μ〇值) 及鐵磁共振頻率高(ferromagnetic resonance frequency > fFMR 值)等特性。 參閱圖1,US 2005/0120543揭露一種磁性薄膜電感 (magnetic thin film induct〇r)1,包含:一由 si 或以〇2 所構 成的基材11、一疊置於該基材u上的第一磁性層12、一形 成於該第磁性層12上的第一絕緣層13、複數相間隔地設 置於該第·絕緣層13上的條狀傳導件14、一覆蓋該等條狀 傳導件14的第一絕緣層丨5,及一覆蓋該第二絕緣層15的 第二磁性層16。 在US 2005/0120543中,該等磁性層12、16主要是使 用 FeBN、FeZrO、FeYO、CoAlO、FeAlO 等磁性材料。以
FeAlO舉例說明,主要是將Fe奈米粒子埋於Al2〇3基質 (matrix)中,藉由八丨2〇3基質增加電阻係數值)以減少渦電 流(eddy Currents)損失。us 2〇〇5/〇12〇543 所使用的 FeAi〇 雖然可增加p值以減少渦電流損失,且藉相間隔的條狀傳導 件14可增加彼此的電感值(inductance,L值)。然而,在該 磁性薄膜電感1的製作過程中,不僅成長條件不易控制, 此外’ FeAlO等磁性材料的磁性亦不容易掌控。另,雖然 US 2005/0120543 所使用的 FeA1〇 之 fFMR 值可趨近 9 5 GHz ,但往往無法同時達到高fpRM值與高叫值的要求,其必須 於fFMR值與μ〇值兩者之間作取捨,因此,無法完全符合高 頻應用領域的需求。 參閱圖2,US 2006/0152321揭露一種平面狀磁性電感 (planar magnetic inductor)2 ’ 包含:一由聚醯亞胺 (polyimide)所構成的基材21、一疊置於該基材21的下氧化 隹層22 t成於該下氧化磁性層22之線圈狀晶種層 (seed layer)23、一對應設置於該線圈狀晶種層23上的導性 線圈24覆蓋該導性線圈24的上氧化磁性層25,及— 覆蓋該上氧化磁性層25且是由具有耐化學腐蝕性之高分子 材料所製成的覆蓋層26。 在US 2006/0152321中,主要是使用Ni_Zn鐵氧磁體 (femte)作為該等磁性氧化層22、25之磁性材料。以該平面 狀磁性電《2的製作方法觀之,不僅製程繁複;此外,此 種三明治型的結構(即,該導性線圈24是被夾置於該等氧化 磁I·生層22、25之間),在製作過程中的製程溫度與化學飯刻 等因素,亦將影響該下氧化磁性層22的膜層鍵結強度並使 付磁性產生劣化的現象。再者,此種犯_211鐵氧磁體無法同 時達到尚fFRM值與高μ〇值的要求,其必須於fpMR值與Μ值 兩者之間作取捨,因此,亦無法滿足高頻應用領域的需求 〇 參閱圖3及圖4, US 2006/0220776揭露一種薄膜式電 感(thin film inductor)3,包含:一由以、Ah 或樹脂 (resin)等材質所製成的基材31、一疊置於該基材31上的下 磁性層32、一疊置於該下磁性層32上的下絕緣層33、一 疊置於該下絕緣層33上的中間絕緣層34、一設置於該中間 絕緣層34中的線圈35、一覆蓋該中間絕緣層34與線圈35 的上絕緣層36,及一疊置於該上絕緣層36上的上磁性層 37 ° 在US 2006/0220776中,主要是藉由調整該上磁性層 1363359~ 37與線圈35之間的間距及該下磁性層32與線圈35之間的 間距來控制元件的寄生電容(parasitic capacitance),並藉以 增加其 fFMR 值;然而,L值與 f*FRM 值是建立在寄生電容的 基礎上,其兩者有著折衷的關係,因此,基於考量其折衷 關係的平衡,所欲調整的間距並不容易被設定。 另,US 2006/0220776 主要是使用 CoZrTa、CoZrNb 等 鈷基(Co-based)合金、鐵基(Fe-based)合金或NiFe合金[即, 所謂的高誘磁合金(permalloy)]等材料以構成該等磁性層32 、37。US 2006/0220776於實施過程中,該等磁性層32、37 雖然是使用高誘磁合金;然而,該薄膜式電感3所存在的 問題是相同於該磁性薄膜電感1及平面狀磁性電感2,該薄 膜式電感3的fFMR值僅維持在〜MHz的範圍。 經上述說明可知,尋求高fFMR值與高μ值兼具的薄膜式 電感以滿足高頻應用領域的需求,是當前研究開發薄膜式 電感相關領域者所待突破的課題。 【發明内容】 <發明概要> 由下列式(1)中簡化的L丄.G.方程式之關係可知[其中, γ是迴磁比(gyromagnetic ratio)],為了滿足磁性材料應用於 面頻領域需同時具備有向fFMR值與南值的條件^磁性材 料本身的特性雖然必須在fFMR值與μ〇值兩者之間作取捨。 然而,值得一提的是,藉由鐵磁性材料(ferromagnetic material)與偏壓材(biasing material)之間的交互輕合 (exchange-coupled)機制,或是藉由軟磁性(soft magnetic)層 / 8
Claims (1)
1363359--------------- 一 -——— — 第096124105號專利_請索補充、修正後無劃線之說明書替換頁 十、申請專利範園: 修正曰期· 101年01月 1· 一種具交互耦合膜之電感元件,包含: . 一基材; 一咿现於蔹丞材上的絕緣膜; 一埋於該絕緣膜内的螺旋狀導體;及 至少-交互耦合膜,是疊置於該絕緣膜或夾置於 該基材與絕緣膜之間,該交 乂立耦合膜含有一偏壓材盥一 鐵磁性材料,該鐵磁性材料於—〇」M Hz〜i〇 GHz、之 頻率範圍的最大誘磁率是至少大 干疋芏少大於〗〇,該偏壓材使該鐵 磁性材料的面内異向性磁場增加1〇。/0以上。 2. 依料請專利範圍第1項所述之具交互輕合膜之電感元 件,其t ,該交互耦合膜是疊置於該絕緣膜。 3. 依據中請專利範圍第2項所述之具交互耗合膜之電感元 件,其令,該鐵磁性材料於該頻率範圍的最大誘磁率是 介於10〜100000之間。 4. 依據:請專利範圍第2項所述之具交互搞合膜之電感元 件,其中,該交互耦合膜的偏壓材是選自反鐵磁性材料 、陶鐵磁性材料或硬磁性材料。 5. 依據申凊專利範圍第4項所述之具交互耦合膜之電感元 件’其中’該交互耦合膜的偏壓材是反鐵磁性材料。 6. 依據中睛專利範圍第5項所述之具交互鶴合膜之電感元 件’其令’該交互耦合膜自該絕緣膜向遠離該基材的一 疊置方向具有—(AF/F)n之膜層結構,AF及F分別為一 反鐵磁性層及一鐵磁性層,且η 2 1。 21 1363359 — - -——-------—… 第096124105號專利申請案補充、修正後無劃線之說明書替換頁 修正曰期:101年01月 7. 依據申請專利範圍第6項所述之具交互耦合膜之電感元 件’其中’該反鐵磁性層與鐵磁性層分別是採用銥錳合 . 金與鈷鐵合金。 8. 依據申睛專利範圍第7項所述之具交互搞合膜之電感元 件,其中,銥於該反鐵磁性層中的原子百分比是介於〇 at%〜50 at%之間;鈷於該鐵磁性層中的原子百分比是 介於30 at%〜90 at%之間。 9. 依據申請專利範圍第8項所述之具交互耦合膜之電感元 件’其中’該交互耦合膜的總厚度是介於1〇 nm〜25 μιη之間。 • 10·依據申請專利範圍第9項所述之具交互耦合膜之電感元 件’其中’ 1 $ n ^ 500 ;定義該反鐵磁性層與鐵磁性層 的厚度分別為d與D,d/D是介於0.1〜1 〇之間。 11.依據申請專利範圍第2項所述之具交互耦合膜之電感元 件’更包含一夾置於該絕緣膜與該交互耦合膜之間的晶 種膜及一疊置於該交互耦合膜上的覆蓋膜,該晶種膜具 有一形成於該絕緣膜的銅層及一夾置於該絕緣膜與銅層 之間的鈕層。 12.依據申請專利範圍第1項所述之具交互耦合膜之電感元 件’其中’ s亥螺旋狀導體是選自Cu、Al、Au、Ag、Pt 或此等之一組合;該絕緣膜是Si〇2。 22
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096124105A TWI363359B (en) | 2007-07-03 | 2007-07-03 | Inductor with exchange-coupling film |
| US11/969,307 US7847668B2 (en) | 2007-07-03 | 2008-01-04 | Inductor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096124105A TWI363359B (en) | 2007-07-03 | 2007-07-03 | Inductor with exchange-coupling film |
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| Publication Number | Publication Date |
|---|---|
| TW200903536A TW200903536A (en) | 2009-01-16 |
| TWI363359B true TWI363359B (en) | 2012-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW096124105A TWI363359B (en) | 2007-07-03 | 2007-07-03 | Inductor with exchange-coupling film |
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| US (1) | US7847668B2 (zh) |
| TW (1) | TWI363359B (zh) |
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| US7855853B2 (en) * | 2007-06-20 | 2010-12-21 | Seagate Technology Llc | Magnetic write device with a cladded write assist element |
| JP2010256835A (ja) * | 2009-04-28 | 2010-11-11 | Sanyo Electric Co Ltd | フィルタ部材及びこれを備えた投写型映像表示装置 |
| US8717136B2 (en) | 2012-01-10 | 2014-05-06 | International Business Machines Corporation | Inductor with laminated yoke |
| US9064628B2 (en) | 2012-05-22 | 2015-06-23 | International Business Machines Corporation | Inductor with stacked conductors |
| US10593449B2 (en) | 2017-03-30 | 2020-03-17 | International Business Machines Corporation | Magnetic inductor with multiple magnetic layer thicknesses |
| US10607759B2 (en) | 2017-03-31 | 2020-03-31 | International Business Machines Corporation | Method of fabricating a laminated stack of magnetic inductor |
| US10597769B2 (en) | 2017-04-05 | 2020-03-24 | International Business Machines Corporation | Method of fabricating a magnetic stack arrangement of a laminated magnetic inductor |
| US10396144B2 (en) | 2017-04-24 | 2019-08-27 | International Business Machines Corporation | Magnetic inductor stack including magnetic materials having multiple permeabilities |
| US10347411B2 (en) | 2017-05-19 | 2019-07-09 | International Business Machines Corporation | Stress management scheme for fabricating thick magnetic films of an inductor yoke arrangement |
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| JP2002171013A (ja) * | 2000-12-04 | 2002-06-14 | Sony Corp | 磁気抵抗効果素子および磁気抵抗効果型磁気ヘッド |
| JP3950807B2 (ja) * | 2003-03-12 | 2007-08-01 | アルプス電気株式会社 | 薄膜磁気ヘッド |
| JP2005209301A (ja) * | 2004-01-23 | 2005-08-04 | Hitachi Global Storage Technologies Netherlands Bv | 磁気ヘッド及びその製造方法 |
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2007
- 2007-07-03 TW TW096124105A patent/TWI363359B/zh active
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2008
- 2008-01-04 US US11/969,307 patent/US7847668B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20090009278A1 (en) | 2009-01-08 |
| US7847668B2 (en) | 2010-12-07 |
| TW200903536A (en) | 2009-01-16 |
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