1362125 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種具有濕度感測之發光二極體，其兼具監 控發光二極體之内部性能及同時具有溫、濕度檢測功能等優點 及功效。 【先前技術】 習知高功率發光二極體(Light Emitting Diode，簡稱LED) 係將一發光二極體磊晶黏貼於一金屬基板(一般為具有高傳導 熱傳係數之銅金屬）上，其黏貼方式一般係利用一添加銀粉之 矽樹脂(Silicon Resin)或陶瓷材料（製程成本較高），且兼具 導電及導熱功能(若為陶瓷材料時，則需另加打金屬導線），在 元成發光二極體蟲晶之黏貼後’再充填具有一定比例螢光粉之 樹脂’最後罩上一石夕樹脂材質之透光鏡。 然而，运樣的發光二極體製程，卻不易達到下列檢測： [1] 發光二極體與金屬基板之黏結性； [2] 可承受反覆高、低溫之次數； [3] 添加銀粉的矽樹脂之耐溫特性及老化現象； [4] 充填含有一定比例螢光粉之樹脂時，如何檢測製程黏 結性； [5] 含有一定比例螢光粉之樹脂之剝落（當部份位置之樹 脂發生剝落時’内部會產生氣泡，降低發光品質，且金線受到 氧化後，大幅降低其使用壽命）。 5 1362125 而目前發光二極體之老化或失去效用之主要因素係有下 列兩種： [1] 磊晶失效。如第一圖所示，添加銀粉的矽樹脂912之 耐溫特性及老化現象使得發光二極體之蠢晶913與金屬板91 ^ 剝離，失去導電性及導熱性，造成熱量8〇無法有效排出該發 光二極體之蟲晶913。 [2] 濕度過高影響效能。因充填樹脂914發生龜裂(如第 二圖所示’充填樹脂914本身出職縫s卜造成外部空氣渗 入磊晶913且發生濕度變化）或剝落(如第三圖所示，充填樹脂 914與該金屬板911間出現一間隙從，造成蟲晶913無法有效 的將熱能排出）而使得外部之空氣滲入内部並產生氣泡，造成 内部濕度變化，嚴重影響發光二極體之效能。 因此，封裝後之發光二極體除了採用破壞性檢測外，並無 其它檢測方法；但破壞性之檢測方法無法於測試程序中監測， 當然，亦無法正確的尋找出封裝製程之缺失。 因此，有必要研發新產品，以解決上述缺點及問題。 【發明内容】 本發明之主要目的，在於提供一種濕度感測之發光二極 體，其係可監控發光二極體之内部性能。 本發明之次一目的，在於提供一種濕度感測之發光二極 體，其同時具有溫、濕度檢測功能。 本發明係提供一種具有濕度感測之發光二極體，其包括： 6 一發光二極體，係至少包括一基板、一塗料部、一晶體部 及一充填部；該晶體部係藉該塗料部黏貼於該基板上；而該充 填部則係用以包覆該晶體部； 一濕度微感測器’係設有一傳輸部；該濕度微感測器係設 於該基板上，並用以檢測發光二極體之内部濕度；及 一外部裝置，係連結至該傳輸部·，該外部裝置係用以監控 該濕度微感測器回傳之發光二極體内部之濕度變化。 本發明之上述目的與優點’不難從下述所選用實施例之詳 細說明與附圖中，獲得深入瞭解。 兹以下列實施例並配合圖式詳細說明本發明於後： 【實施方式】 如第四、第五及第六圖所示，本發明係為一種具有濕度减 測之發光二極體，其包括： 一發光一極體10，係包括一基板11、一塗料部12、一曰 —日日 體部13及一充填部14 ;該晶體部13係藉該塗料部12黏貼於 該基板11上；而該充填部14則係用以包覆該晶體部13 ; 一濕度微感測器20，係設有一傳輸部21 ;該濕度微感測 器20係設於該基板11上，並用以檢測該發光二極體丨〇之内 部濕度； 一外部裝置30，係連結至該傳輸部21 ;該外部裝置3〇係 用以監控該濕度微感測器2〇所回傳之發光二極體内部之濕 度變化。 1362125 關於該塗料部12，係做為導熱，或另做為導電功能；例 如：添加銀粉之矽樹脂(SiliconResin)或陶瓷材料（製程成本 較高，且需另加打金屬導線）。 關於該充填部14，係為添加螢光粉之矽樹脂 Resin)。1362125 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode having humidity sensing, which has the advantages of monitoring the internal performance of a light-emitting diode and having a temperature and humidity detecting function. efficacy. [Prior Art] A conventional high-power LED (Light Emitting Diode) refers to a light-emitting diode epitaxially adhered to a metal substrate (generally a copper metal having a high conduction heat transfer coefficient). The sticking method generally uses a silver resin (Silicon Resin) or ceramic material (higher process cost), and has both conductive and heat conducting functions (if it is a ceramic material, it needs to be additionally metal wire), in the yuan After the paste of the light-emitting diode crystal is refilled, 'refilling the resin with a certain proportion of phosphor powder' is finally covered with a light-transparent mirror of a stone material. However, the process of the light-emitting diode process is not easy to achieve the following tests: [1] the adhesion of the light-emitting diode to the metal substrate; [2] the number of times that can withstand high and low temperatures; [3] the addition of silver powder Resin temperature resistance and aging phenomenon; [4] How to detect process bonding when filling a resin containing a certain proportion of phosphor powder; [5] Peeling of resin containing a certain proportion of phosphor powder (when part of the resin occurs When peeling off, bubbles are generated inside, which reduces the quality of the light, and the gold wire is oxidized, which greatly reduces its service life. 5 1362125 The main factors for the aging or loss of efficacy of the current LED are as follows: [1] Epitaxial failure. As shown in the first figure, the temperature resistance and aging of the silver-filled enamel resin 912 cause the stray crystal 913 of the light-emitting diode to be peeled off from the metal plate 91 ^, losing conductivity and thermal conductivity, and the heat 8 〇 cannot be effectively discharged. The crystal 913 of the light-emitting diode. [2] Excessive humidity affects performance. Cracking occurs due to the filling resin 914 (as shown in the second figure, 'filling resin 914 itself is used to infiltrate the outer air to penetrate the epitaxial 913 and change in humidity) or peeling off (as shown in the third figure, filling the resin 914 with A gap occurs between the metal plates 911, so that the insect crystal 913 cannot effectively discharge the heat energy, so that the external air penetrates into the inside and generates bubbles, causing internal humidity changes, which seriously affects the performance of the light-emitting diode. Therefore, in addition to the destructive detection, the encapsulated LED has no other detection method; however, the destructive detection method cannot be monitored in the test procedure, and of course, the lack of the packaging process cannot be correctly found. Therefore, it is necessary to develop new products to solve the above shortcomings and problems. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a humidity-sensing light-emitting diode that monitors the internal performance of a light-emitting diode. A second object of the present invention is to provide a humidity-sensing light-emitting diode having a temperature and humidity detecting function. The invention provides a light-emitting diode with humidity sensing, comprising: 6 a light-emitting diode comprising at least a substrate, a coating portion, a crystal portion and a filling portion; the crystal portion is coated by the coating The portion is adhered to the substrate; the filling portion is used to cover the crystal portion; the humidity micro-sensor is provided with a transmission portion; the humidity micro-sensor is disposed on the substrate and is used for detecting The internal humidity of the light-emitting diode; and an external device connected to the transmission portion for monitoring the humidity change inside the light-emitting diode returned by the humidity micro-sensor. The above objects and advantages of the present invention are readily apparent from the following detailed description of the embodiments of the invention. The present invention will be described in detail below with reference to the following embodiments: [Embodiment] As shown in the fourth, fifth and sixth figures, the present invention is a light-emitting diode with humidity reduction, which includes The illuminating body 10 includes a substrate 11, a coating portion 12, a 曰-day body portion 13 and a filling portion 14; the crystal portion 13 is adhered to the substrate 11 by the coating portion 12; The filling portion 14 is used to cover the crystal portion 13; a humidity micro sensor 20 is provided with a transmission portion 21; the humidity micro sensor 20 is disposed on the substrate 11 and used to detect the The internal humidity of the LED is connected to the transmission portion 21; the external device 3 is used to monitor the interior of the LED that is returned by the humidity micro-sensor 2 Humidity changes. 1362125 Regarding the coating portion 12, it is used as heat conduction or as a conductive function; for example, adding silver powder to a resin (Silicon Resin) or ceramic material (higher process cost, and additional metal wire is required). The filling portion 14 is a resin (Resin) to which a fluorescent powder is added.
關於該濕度微感測器20，係利用微機電系統製程之特性 整合於該基板11上；當然’本發明亦可利用微機電系統製程 之特性整合一溫度微感測器40(如第五及第六圖所示）於該基 板11上’或同時整合該溫度微感測器40及該濕度微感測器 20於該基板11，達到溫、濕度之量測，使檢測更具準確性。The humidity micro-sensor 20 is integrated on the substrate 11 by using the characteristics of the MEMS process; of course, the present invention can also integrate a temperature micro-sensor 40 by using the characteristics of the MEMS process (such as the fifth and The sixth embodiment shows that the temperature micro-sensor 40 and the humidity micro-sensor 20 are integrated on the substrate 11 to measure the temperature and humidity, so that the detection is more accurate.
關於本發明之具有濕度感測之發光二極體，係利用該塗料 部12(添加銀粉之石夕樹脂或陶瓷材料)將該晶體部13黏貼於該 基板11上，再將該濕度微感測器2〇設於該基板u上，最後 完成該充填部14(具有一定比例之螢光粉之樹脂，經持溫15〇 度後成形）包覆該晶體部13之動作；當然，本發明之外部亦可 再罩上一外罩部丨5(係為矽樹脂(Silicon Resin)材質之透光 鏡）。 更詳細的說，當該充填部14因製程不當、過熱或達到老 化極限而發生剝離現象（該充填部14與該基板u分離或該充 填部14本身之龜裂）時，會造成外界之空氣滲入，產生濕度的 變化，而利用該濕度微感測器2〇所檢測之濕度值，係可用來 8 1.362125 判斷該充填部14之損壞程度；當然，再加設該溫度微感測器 40 ’可再對溫度進行監控（一般係測量該晶體部13與該基板 11間之溫度），藉此找出材料的溫度極限。 另外，關於該溫度微感測器40，其在量測訊號前，先置 * 於—恆溫恆獄驗_作校正，可降低系統所造成的誤差值； 而該恆溫恆濕試驗機係針對該溫度微感測器4〇之電阻值進行 校正’其步驟係觸溫度微❹指放人娜溫‘_、試驗機 内，並逐次改變怪溫怪濕機之溫度且同步量測電阻值，再經由 内差法將溫賴感測器4G的電阻值轉換成相對應之溫度狀 鲅。 & 綜上所述，本發明之優點及功效可歸納為： Π]紐發光二極體之内部性能。習知發光二極體之内部 並無檢測之功能，無法得知内部之散熱及材料老化之情形；而 _ 本發⑽贿基板上設置濕度微感應^，彻該充填部發生剝 洛或龜裂時，部份空氣渗入而產生之濕度來判斷發光二極體内 部之損壞程度。 “[2]同時具有溫、濕度檢測功能。本發明利用微機電系統 製程之特性’將溫、職微❹齡合於該基板上；可同時監 測溫、濕度變化來判斷内部性能及找出材料溫度極限。μ 以上僅是藉由較佳實_詳細·本發明，對於該實施例 所做的任何簡單修改與變化，皆不脫離本發明之精神與範圍。 9 由以上詳細說明，可使熟知本項技藝者明瞭本發明的確可 達成前述目的，實已符合專利法之規定，爰提出發明專利之申 請。 【圖式簡單說明】 第一圖係習知發光二極體之磊晶過熱剝離的示意圖 第二圖係習知發光二極體之充填樹脂龜裂的示意圖 第二圖係習知發光二極體之充填樹脂剝落的示意圖 第四圖係本發明之實施例之示意圖 第五圖係本發明之部分結構之局部放大剖視的示意圖 第六圖係第五圖之局部放大剖視之示意圖 【主要元件符號說明】 10發光二極體 12塗料部 14充填部 2〇濕度微感測器 30外部裝置 80熱量 912矽樹脂 914充填樹脂 S2間隙 11基板 13晶體部 15外罩部 21傳輸部 40溫度微感測器 911金屬板 913蟲晶 S1裂縫In the light-emitting diode of the present invention, the crystal portion 13 is adhered to the substrate 11 by using the coating portion 12 (addition of silver powder or ceramic material), and the humidity is slightly sensed. The device 2 is disposed on the substrate u, and finally completes the action of the filling portion 14 (a resin having a certain proportion of phosphor powder, which is formed by holding a temperature of 15 degrees) to cover the crystal portion 13; of course, the invention The exterior can also be covered with a cover portion 丨 5 (which is a transparent mirror made of silicone resin). In more detail, when the filling portion 14 is peeled off due to improper process, overheating, or reaching the aging limit (the filling portion 14 is separated from the substrate u or the filling portion 14 itself is cracked), the outside air is caused. Infiltration, a change in humidity is generated, and the humidity value detected by the humidity micro-sensor 2 can be used to determine the degree of damage of the filling portion 14 at 1 1.362125; of course, the temperature micro-sensor 40' is added. The temperature can be monitored again (generally by measuring the temperature between the crystal portion 13 and the substrate 11), thereby finding the temperature limit of the material. In addition, regarding the temperature micro-sensing device 40, before the measurement signal, it is first set to - the constant temperature test, the correction value can be reduced, and the error value caused by the system can be reduced; The temperature of the micro-sensor 4〇 is corrected. The step is to touch the temperature and the temperature is slightly lower than the temperature. The test machine is used to change the temperature of the strange temperature machine and measure the resistance value synchronously. The internal difference method converts the resistance value of the temperature sensing sensor 4G into a corresponding temperature state. & In summary, the advantages and effects of the present invention can be summarized as follows: 内部] The internal performance of the neon light-emitting diode. The inside of the conventional light-emitting diode has no function of detection, and it is impossible to know the internal heat dissipation and the aging of the material; and _ the hair (10) is provided with a humidity micro-induction on the substrate, and the filling portion is peeled or cracked. At the time, part of the air infiltrates the humidity to determine the degree of damage inside the light-emitting diode. "[2] has both temperature and humidity detection functions. The present invention utilizes the characteristics of the MEMS process to combine the temperature and the age of the micro-electrode on the substrate; the temperature and humidity changes can be monitored simultaneously to judge the internal performance and find the material. The temperature limit. The above is only by the preferred embodiment. The present invention is not limited to the spirit and scope of the present invention. It is obvious to those skilled in the art that the present invention can achieve the above-mentioned objects, and has been in compliance with the provisions of the Patent Law, and has filed an application for an invention patent. [Simplified Schematic] The first figure is an epitaxial overheating stripping of a conventional light-emitting diode. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a schematic view showing a filling resin crack of a conventional light-emitting diode. FIG. 2 is a schematic view showing a filling resin peeling of a conventional light-emitting diode. FIG. 4 is a schematic view showing an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Partially enlarged cross-sectional view of a part of the structure of the invention is a schematic view of a partially enlarged cross-sectional view of the fifth figure [Description of main components] 10 light-emitting diode 12 coating portion 14 Filling part 2〇 Humidity micro sensor 30 External device 80 heat 912矽 resin 914 filling resin S2 gap 11 substrate 13 crystal part 15 cover part 21 transmission part 40 temperature micro sensor 911 metal plate 913 insect crystal S1 crack