TWI360470B - Antisticking mold and manufacturing method thereof - Google Patents

Description

6. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a mold and a method of preparing the same, and more particularly to an anti-stick mold and a method of preparing the same. [Prior Art] In general, in order to prevent reflection of light such as sunlight and fluorescent light, the liquid crystal panel is mostly subjected to anti-reflection treatment to improve the recognition of the displayed image. The anti-reflection treatment is mainly provided on the surface of the liquid crystal panel as a layer or a multi-layer anti-reflection optical film, which is generally called an anti-foam film or an anti-reflection film. However: in the panel industry, the demand for anti-reflection optical films of this type is also increasing. At present, such anti-reflection optical films are usually molded by injection molding or imprinting with a mold having a nano-scale fine concavo-convex structure. A material is processed to produce the anti-reflective optical film. This type of anti-reflection diaphragm can be further applied to the surface anti-reflection function of glass, lens, liquid crystal panel, flexible substrate = diaphragm. However, since the material for fabricating the antireflection optical film is easily adhered to the surface of the mold by the transfer of the microstructure, the problem of being difficult to demold is caused, and it cannot be efficiently produced. In order to overcome the above problem of difficulty in demolding, it is common to fabricate the above-mentioned anti-reflection optical film. The method of making the anti-adhesive mold includes the following steps: (a) Please refer to Figure 1 for pre-selection of the mold substrate 91 ^ 乂 for subsequent microstructure processing, including the substrate 91 series force 13 working surface 911; 1360470 (b) Please refer to Fig. 2, the mold base material 9丨<~ work surface 911 for cutting or other processing to form a micro-junction, ▲ structure A structural surface 92; 'Soul fiber (c), as shown in Fig. 3, in order to avoid the subsequent transfer of the material, on the structural surface 92, so that the structural surface 92 is plated, adhered The anti-adhesion film 93 has a transfer surface 94. King's set

The production of the anti-adhesive mold 9 can be completed, and the anti-reflection optical film can be used to fabricate the anti-reflection optical film to prevent the material of the anti-reflection optical film from sticking to the structure. The design of the face %, such as the Patent No. 1287043 of the Republic of China, is attached to the workpiece. Anti-adhesion high-nitrogen chromium film with a high anti-adhesion high-nitrogen chromium film thickness of 1~2 μm to prevent the material from sticking to the workpiece. '

However, please refer to Figure 3 again. Since the microstructure of the anti-stick mold is usually only tens to hundreds of nanometers, if the thickness of the structure is further set to the micrometer scale (1000 nm) The anti-adhesive film 93 of the above-mentioned rice, although the anti-adhesion film 93 is attached to the structural surface, the shape of the transfer surface 94 of the anti-spotting point 93 does not completely correspond to the shape conforming to the structural surface %, resulting in The anti-reflection optical film is prepared by the conventional anti-sticking mold, and the obtained anti-reflection optical film has a difference with the anti-reflective optical film produced by the original microstructure; and the film thickness of the anti-adhesion film 93 is higher. The thicker, the greater the influence on the microstructure design of the structural surface 92, so the preparation method of the conventional anti-adhesive film is not easy to be applied to the anti-adhesive treatment of the mold having the nano microstructure. Moreover, the film thickness of the anti-adhesion film 93 is uneven, which also causes the influence of the microstructure design. In addition, since the high-temperature process of i S] - 4 - 1360470 may be used in the process of disposing the anti-adhesion film 93, the microstructure on the mold substrate 91 may be deformed due to high temperature, resulting in poor processing accuracy. Disadvantages. Moreover, the anti-adhesion film 93 is directly disposed on the structural surface 92. The adhesion of the anti-adhesion film 93 to the structural surface 92 may be poor due to the difference in material between the anti-adhesion film 93 and the mold substrate 91. Disadvantages. Further, the microstructure processing needs to process the processed surface 911 of the mold substrate 91 to form the structural surface 92, and the material of the mold substrate 91 is generally hard, so that the processing difficulty is high, so that the microstructure The process selection of the processing will be limited; if the material having a lower hardness is to be selected to reduce the difficulty of processing, the material selection of the mold substrate 91 will be limited. For the above reasons, it is necessary to further improve the above conventional anti-sticking mold and a preparation method thereof. SUMMARY OF THE INVENTION The object of the present invention is to improve the above disadvantages to provide a method for preparing an anti-sticking mold, so as to avoid a difference in the shape of the microstructure of the anti-adhesive film and the surface of the mold surface due to the setting of the anti-adhesion film. for purpose. A second object of the present invention is to provide a method for preparing an anti-sticking mold to prevent deformation of the microstructure of the surface of the mold due to a high-temperature process in which the anti-adhesion film is disposed. Still another object of the present invention is to provide a method for preparing an anti-sticking mold to reduce the difficulty in processing the microstructure to form a microstructure. Another object of the present invention is to provide a method for preparing an anti-sticking mold to enhance the adhesion of the anti-adhesion film to the surface of the mold. A further object of the present invention is to provide an anti-stick mold to prevent the material from sticking to the surface of the mold. .- The preparation method of the anti-adhesive mold according to the present invention includes: an anti-adhesion film setting step, an anti-adhesion film is disposed on one of the attachment faces of a mold body, and a microstructure processing step is performed. A processing method is processed on one of the processing surfaces of the anti-adhesion film to form a microstructure. The method for preparing an anti-sticking mold according to the present invention comprises: an anti-adhesion film setting step, wherein an intermediate layer and a k-adhesive film are sequentially disposed on one of the attachment faces of the mold body, and the intermediate layer is located in the mold The body and the anti-adhesion film are interposed, and a microstructure processing step is processed in a processing manner on one of the anti-adhesive film processing surfaces to form a microstructure. The anti-adhesive mold according to the present invention comprises: - an anti-adhesive film setting step 'attach to the - mold body - the attachment surface is sequentially provided with an intermediate layer and an anti-staining layer (4) 'the intermediate layer is located in the mold body and the Between the anti-adhesive films; and a microstructure processing step' is processed in a processing manner on one of the anti-adhesive films to form a microstructure. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more apparent from the aspects of the invention. As shown in Figures 4 and 5, the preparation method of the anti-sticking mold of the present invention comprises an anti-adhesion film setting step S1 and a microstructure processing step - S2. The following is a detailed description of different embodiments. The first embodiment of the present invention: I S1 - 6 - 1360470 Please refer to Fig. 5, which is an anti-sticking mold prepared by the preparation method of the anti-sticking mold of the present invention. In the anti-adhesion film setting step S1 of the first embodiment, an anti-adhesion film 2 is provided on one of the attachment faces 11 of a mold body 1. More specifically, please refer to FIG. 6 , the phantom 1 of the first embodiment is selected as a STAVAX mold steel block which is quenched, tempered, hardened, etc., and may of course be made of other materials. . Then, as shown in FIG. 7, the anti-adhesion film 2 is disposed on the attachment surface 11 of the mold body 1. In the embodiment, the anti-adhesion film 2 is arranged to be placed in a vacuum coating processing device. In the processing chamber, a chrome metal is provided as a cathode in the processing chamber, and after evacuating to 4×1 (T5torr to remove residual air in the processing chamber, argon gas having a flow rate of 10 to 200 ccm (20 cm in this embodiment) is introduced ( Ar), 80ccm of nitrogen and lOccm of 曱:!: finished in the processing chamber, mixed with argon and maintained at a pressure of 3~8.5mtorr (this embodiment is selected as 4.5mtorr), and then the chrome metal is used as the cathode The furnace wall of the processing chamber is applied with a DC voltage of 300 to 450 V (300V in this embodiment) to ionize the argon gas and accelerate the electric field to the chromium metal at the cathode to strike the chromium metal of the chromium metal. a chromium-nitrogen-carbon film is deposited on the adhesion surface 11 as the anti-adhesion film 2, wherein the chromium-nitrogen-carbon film has a nitrogen atom percentage of 30 to 50% and a carbon atom percentage of 5 to 10%. The treatment time was selected to be 4 hours, and the film of the chromium-nitrogen-carbon film was used. The anti-adhesion film setting step S1 is completed. In addition, in the anti-adhesion film setting step, the adhesion surface of the mold body is first leveled and then the roughening treatment is performed. The surface of the anti-adhesion film 2 is processed in a processing manner. —7 — 1360470 has a microstructured surface 23. More detailed, 兮丄< 士』丹,, the processing method can be ===:::=:,, L, for example, this embodiment is Option: =: = The anti-adhesive film 2 is added to the defending surface 21. Please refer to the == pair == select the diamond knife of T, the amount of feed ~:: cutting speed is selected as U) m / m (four) The processing surface 21 is processed to form v

The nano-scale microstructure 22, the distance between the V-shaped grooves is selected as 曰(10), and the depth d is selected to complete the production of the anti-stick mold, and the microstructure® 23 can avoid materials, At present, the preparation method of the anti-sticking mold of the first embodiment of the present invention is completed, and the obtained anti-mold mold can be prepared as various anti-reflection optical films as described above. In addition, in the 兮 microstructure processing step, the processed surface of the anti-adhesive film may be leveled before the processed surface is processed. The working surface can be a flat surface or a curved surface. Referring again to Figure 5, the anti-stick mold of the first embodiment is used to transfer an object (e.g., an anti-reflective optical film, not shown) to a nano-scale microstructure. The anti-stick mold comprises a mold body 1 and an anti-adhesion film 2. The phantom has an attachment surface U. The anti-adhesion film 2 is disposed above the adhesion surface u

And having a processing surface, the processing surface is machined with a nano-scale microstructure 22, and the nano-scale microstructure 2 of the anti-adhesion film 2 corresponds to the nano-scale microstructure of the object. The anti-adhesion film 2 and the nano-scale microstructure of the article are typically tens to hundreds of nanometers in size, i.e., the nano-scale microstructure can range in size from 1 至 to 999 nm. m The anti-adhesive mold of the present invention is prepared by disposing an anti-adhesion film on the adhesion surface of a -1 to 1360470 of a mold body, and then processing the anti-adhesion film to form a microstructure. In this way, the preparation method of the conventional anti-adhesive mold can be avoided, and the morphological processing is first performed on the phantom, and then the δ and S smear anti-adhesive film covers the microstructure, and the surface shape of the anti-adhesive film cannot completely correspond. The shape of the microstructure, which in turn causes the difference in the finished product. Moreover, the present invention is formed after the anti-adhesion film is formed, and then processed on the anti-adhesion film to form a microstructure, thereby avoiding the preparation method of the conventional anti-sticking mold.

The microstructure of the mold surface is deformed by high temperature due to the high temperature process of the anti-adhesion film, so that the present invention can improve the durability and precision of the microstructure. Further, since the present invention directly forms a microstructure on the anti-adhesion film, it is not necessary to process the hard mold substrate to form a micro-junction, thereby reducing the difficulty in forming the microstructure. Further, the material selection of the mold substrate can have a larger selection space. A second embodiment of the invention:

The preparation method of the anti-sticking mold of the second embodiment of the present invention is the same as that of the first embodiment, and comprises an anti-adhesion film setting step S1 and a microstructure processing step S2. The anti-adhesive film setting step of the second embodiment is performed by first leveling the mold surface 11 and then performing the adhesion surface :::, and then sequentially providing an intermediate layer 3 and the anti-sticking layer. Mucosa 2, "4 layers 3 series are located in the phantom] and the anti-adhesion film 2. Further:: quenching ? according to Figure 8, the phantom 1 of this embodiment is the same selection. 2 two fire, Wei f heat treatment of the light ship x mold from the square, indeed w attached surface „may be unevenness and its system is: 9 — into the anti-stick == the anti-adhesive film 2, it may make a sticky gland _ _ face 115 into the two sides after the anti-flat treatment. Therefore, it is preferable to perform the cleaning of the attachment surface 11 first, so that the attachment surface 11 is flat. At this point, or ^ _ face U leveling processing. The attachment surface η can be a flat surface. Referring to Fig. 1 , the attachment surface 11 can be roughened by mechanical blasting or chemical processing, and the rough surface can be shouted. The second f embodiment is selected to electrically treat the mold: a widened process. More specifically, the second embodiment is directly placed in the processing chamber of the vacuum coating processing apparatus, and is pumped to 4xurW to exclude residual air in the processing chamber, and then the flow 2GG_ is introduced (this embodiment is selected as 20 coffee) of argon (Al and ', held at 3~8.5mtorr (this embodiment is selected as 4mt〇rr) pressure

The force 'returns the pin body 1 as the cathode'. The process f furnace wall applies 30C r6〇〇V to the anode, and (the f embodiment is selected as 働V) direct current, so that the argon ionized sub-double electric field accelerates toward the location. The cathode of the cathode], the mold ι = the impure attachment atoms attached to it, and the argon ions will also be slightly roughened by the f-plane u, while at the same time achieving clean and roughening The purpose of 11 'the roughening treatment of the attachment surface η as shown in Fig. 1 ' can make the attachment surface 11 have a relatively fine chain degree on (4), and lift the grip film 2 and the inter-layer 3 and The contact area of the phantom, and then the adhesion of the anti-stick 2 and the intermediate layer 3 to the attachment surface 11 of the phantom, and the fine surface does not affect the subsequent anti-adhesion film 2 And the flatness of the intermediate layer 3. The time of the roughening process is selected to be 1 〇 10 - 1360470 minutes = this, and the technique is __1 roughening. Receiver, please refer to, Zhao Zhao 4 11 θ After the roughening process, then the argon gas is not the second embodiment of the second embodiment to complete the λ + W flow rate is adjusted to 30 _ and only 捭 /, about 4mt 〇 1 The force of the second embodiment I, the quasi-holding, and the force cathode, the furnace wall of the processing chamber is an anode, and the 1 genus (Cr) is applied as a von 1% pole to a range of 3 〇〇 to 45 〇 v to 350 volts. The DC voltage is set to 2.5 Λ), with positive electricity #二.心·5Α (In this embodiment, the extremely chrome metal, the chrome is all (4), the secret is accelerated by the electric field to the yin The chromium atom of the genus i is deposited and deposited on the surface 11 to form a chrome plating film for '5 minutes, and the film thickness of the intermediate layer 3 is selected; then the : Ϊ : : : : 。 。 。 。 。 。 。 。 。 。 。 。 。 The material is different. The right side of the anti-film 2 is disposed on the mold body 1 to cause the adhesion of the anti-moire film 2 to be poor. Therefore, the second hemp (1) is attached to the attachment surface 11 to be disposed in the middle. After the layer 3, the anti-adhesion film 2 is disposed on the surface of the second surface of the crucible, so that the intermediate layer 3 is located between the anti-adhesion film 2 to enhance the anti-adhesion film 2 on the crucible body. Sex and adhesion. Please refer to Fig. 12, and then place the anti-adhesion film 2 on the middle layer. Complete the setting of the intermediate layer 3, and then the flow rate is 8〇c, called α1〇咖弟-贯施In the chamber, the atom of argon and chrome metal is _, chrome gold is 300~45〇v (in this embodiment, it is selected as 33〇v), the rose is 3.5Α (the choice is 25 本 in this embodiment), and the process chamber pressure is C〇~ (This example was chosen to be 4,51 coffee), in the secret film (bamboo ^.嶋, deposition of carbon is _ as the anti-adhesion film 2, \上络-nitrogen-carbon book one] 1 1360470 The percentage of nitrogen atoms in the film is 30 to 50%, and the carbon atom percentage is 5 to 1%. The treatment time is selected to be 4 hours, and the film thickness of the chromium/nitrogen-carbon film is 5 to 5.5/zm. The intermediate layer 3 is arranged to increase the bonding strength of the anti-adhesion film 2 to the adhesion surface 11. Thus, the anti-adhesion film setting step S1 is completed. Please refer to the fourth, fourth and fourth figures to avoid The unevenness of the processing surface 21 affects the subsequent processing of the nano-scale microstructure 22, and the microstructure processing step S2 of the second embodiment is the processing surface 21 of the anti-adhesion film 2 first. After the line is leveled, the processing surface of the anti-adhesion film 2 is processed by 21 to form the nano-scale microstructure 22. More specifically, as shown in the figure, 'the actual surface is selected _ The tool phase is tilted to the working surface 21 'the amount of the cutting is selected to be 4 fronts. This can be used to level the working surface 21. The working surface 11 can be flat or curved. Next, please refer to Figure 14, this second The manner of processing the nano-scale microstructure 22 is the same as that of the first embodiment, and will not be described here. So far, the preparation method of the (four) molds of the four-dimensional molds (4) (four) The mold can be used for the preparation of various anti-reflection optical films as described above, and the microstructured surface 23 can prevent the material from being affected. The anti-adhesion mold of the second embodiment of the present invention is corrected to transfer an object (e.g., anti-anti-body, not shown) to the structure. The anti-sticking mold comprises a mold body —'-", & π mucous membrane 2. The mold body 1 has an attachment surface U. The middle '3 Μ = f^11, that is, the intermediate layer 3 is disposed on the mold Between the body i and the anti-sticking layer 2. The anti-adhesion film is disposed on the intermediate layer 3, the gentleman f犋C, , ^, the ' '' has a processing of the plus 4 processing-nano-scale microstructure 22, the anti-adhesion film 2 - 12 - [S} 1360470 nano-scale microstructure 22 corresponds to the nano-scale microstructure of the object. The anti-adhesion film 2 and the nano-scale microstructure of the object are usually only size Dozens to hundreds of nanometers, that is, the size of the nano-scale microstructure may be between 1 〇 and 999 nm ^ where 'the adhesion between the phantom 1 and the intermediate layer 3 is greater than the phantom i is adhered to the adhesion resistance, and the adhesion between the towels and the anti-adhesion film 2 is greater than the adhesion between the mold body and the anti-adhesion film 2.

As described above, the preparation method of the anti-sticking mold of the present invention can prevent the unevenness of the adhesion surface from affecting the subsequent process by leveling the adhesion surface of the first mold body. In the method for preparing the anti-sticking mold of the present invention, the adhesion of the anti-adhesion film to the adhering surface can be improved by first roughening the surface to be adhered. The preparation method of the anti-sticking mold of the invention is transmitted through the phantom and the anti-adhesion

The intermediate layer is disposed between the adhering films to enhance the adhesion of the anti-sticking surface to the adhering surface. The anti-adhesive mold of the present invention is prepared by forming an anti-adhesion film on the attachment surface of the mold body, and then processing the anti-adhesion film to form a microstructure. In this way, the preparation method of the conventional anti-adhesive mold can be avoided, and the microstructure is first added to form a microstructure, and then the anti-slip coating is applied to cover the microstructure, and the surface shape of the anti-adhesion film cannot completely correspond to the microstructure. The shape that causes the difference in the finished product. Moreover, the present invention is formed after the anti-adhesion film is formed, and then processed on the anti-sticking film to form a microstructure, which can avoid the preparation of the anti-sticking mold by the high-temperature process of setting the anti-sticking film. The microstructure of the mold surface is caused by the change of the degree of the third surface due to the temperature of the south. Moreover, the invention can improve the durability and the fine structure of the microstructure, so that the mold 2 can directly read and form the mold 4, so that the mold base can be reduced into a micro structure, which is good for the microstructure. The difficulty of defending. Further, the material selection of the mold substrate can have a larger selection space. Hey. The present invention has been disclosed in the above-described preferred embodiments, and it is not intended to limit the present invention. Any one skilled in the art can change the scope of the invention without departing from the spirit and scope of the present invention. It is a technical scale protected by the present invention, and therefore the scope of the present invention is defined by the scope of the appended claims.

IS) —14 — [Simple description of the drawings] Figures 1 and 2: Schematic diagram of the preparation of a conventional anti-stick mold on the surface of a mold. Fig. 3 is a schematic view showing the preparation method of a conventional anti-sticking mold on the surface of a mold body. Figure 4 is a flow chart showing a method of preparing the anti-stick mold of the present invention. Fig. 5 is a view showing the preparation method of the anti-sticking mold of the first embodiment of the present invention. Figure 6 is a schematic view of a mold body of a first embodiment of the present invention. Fig. 7 is a view showing the first embodiment of the present invention in which an anti-adhesion film is provided on the attachment surface of the mold body. Fig. 8 is a view showing the unprocessed phantom of the second embodiment of the present invention. Figure 9 is a schematic view of a flattened phantom of a second embodiment of the present invention. Fig. 10 is a view showing a roughened phantom of a second embodiment of the present invention. Fig. 11 is a view showing the phantom of the intermediate layer in the second embodiment of the present invention. Figure 12 is a schematic view showing the second embodiment of the present invention in which an anti-adhesion film is provided. Fig. 13 is a view showing the anti-adhesion film which has been leveled in the second embodiment of the present invention. Figure 14: The second embodiment of the present invention is processed to form an anti-adhesive film to form micro 1360470 [Description of main components] [Invention] 1 Mould 2 Anti-adhesion film 22 Nano-scale microstructure 3 Intermediate layer d Depth [Practical] 9 anti-adhesive film 91 mold base 92 structural surface 93 anti-adhesion film 11 attachment surface 21 processing surface 23 microstructure surface w spacing

911 processing surface 94 transfer surface

[S) —]0 —

Claims (1)

VII. Application Patent Range: A preparation method of anti-sticking mold, comprising: face setting - anti-attachment anti-adhesion film setting step, attached to a mold body; and 2 ^ micro-structure processing steps, with - The processing method is processed on the processed surface of the anti-stick film to form a microstructure. 】 The anti-staining pure material described in the cattle item ^In the structure of the structure processing step, the surface is first flattened and then the twisted surface is added with jade. ... plus 1 3, the range of interest in the second item, the anti-mold system _ 八中6海 processing surface is a plane or curved surface. / 4 According to the patent range of the first paragraph of the anti-adhesive mold preparation method: in the middle of the dip _ set step, the new _ body surface into the 仃 - roughening treatment, then set the anti-adhesive 瞑. Face 5, according to the patent _ 4th rhyme, such as the transfer step, in the anti-adhesive film setting step, the mold body first: = flat and then the adhesion surface is subjected to the roughening treatment. , where the attachment surface is a plane or a curved surface. For the preparation method 7, according to the scope of claim 4, the anti-sticking device: ', the coarsening treatment is mechanical blasting, chemical etching or plasma treatment 3, according to I, patent scope 1 The preparation method of the anti-sticking mold, the processing method is lithography (four) processing, electrochemical processing, = 1360470 shot processing or mechanical cutting processing. — 9. A method for preparing an anti-stick mold, comprising: - an anti-adhesion film setting step, wherein an intermediate layer and an anti-adhesion film are sequentially disposed on one of the attachment faces of a mold body, wherein the intermediate layer is located in the mold Between the body and the anti-adhesion film; and a microstructure processing step is processed in a processing manner on one of the anti-adhesive film processing surfaces to form a microstructure. 10. The method for preparing an anti-sticking mold according to claim 9, wherein in the processing step of the microstructure, the processing surface of the anti-adhesive film is first leveled, and then the processed surface is processed. 11. The method for preparing an anti-sticking mold according to claim 10, wherein the processing surface is a flat surface or a curved surface. 12. The method for preparing an anti-sticking mold according to claim 9, wherein the anti-adhesive film setting step is performed after the roughening treatment is performed on the attachment surface of the mold body, and then the intermediate layer is disposed. . 13. The method for preparing an anti-sticking mold according to claim 12, wherein in the step of setting the anti-adhesion film, the attachment surface of the mold body is flattened and then the adhesion surface is roughened. Processing. 14. The method for preparing an anti-sticking mold according to claim 13, wherein the attachment surface is a flat surface or a curved surface. 15. The method for preparing an anti-sticking mold according to claim 12, wherein the roughening treatment is mechanical blasting, chemical etching or plasma treatment - 〇16, according to claim 9 The preparation method of the anti-sticking mold, wherein the processing method is a micro-sharp processing, an electrochemical processing, a laser processing, or a mechanical cutting process. I7, an anti-sticking mold for using a first nano-scale microstructure, the anti-mold comprising: a mold body having an attachment surface; and a dip_, disposed above the attachment surface And having a processing surface, the second working surface has a second nano-scale microstructure, the second nai, and '. The structure corresponds to the first nano-scale microstructure. , w, two = _17 mentioned in the _ mold, two intermediate layer, set in the phantom and the anti-staining = please patent _8 item of the anti-mold, wherein the mold: the door ^ middle layer The adhesion between the phantom and the anti-stick film is greater than the adhesion between the interlayer and the anti-adhesion film and the anti-adhesion film. = Please apply the anti-stick mold of the 17th patent. Hummer anti-reflective optical film. 21 H Please refer to the anti-adhesive mold described in item 17. The film is a chromium-nitrogen-carbon film. 22, according to the application of the special _18 items of the lack of 23, according to the scope of the patent application] 7 - and the AL shell described anti-adhesive mold and Zhongyi Taizhi & n >: Shanren λ丄, a 18 19 20 wherein the substance is resistant to the middle and second nano-scale microstructures, wherein the size of the I is between 10 and 999 nm, and 24, according to the scope of the patent application. ^ L The anti-stick mold, 1 in the middle of each 25, according to the shape of the 4-shaped groove-like microstructure. ..., τ is called the search for 24 people who are rushing---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- [S] — 20 —