1358515 [0002] 098102069 第4頁/共23頁 100年11月29日 六、發明說明： 【發明所屬之技術領域】 _] 本發明係有關-種發光元件之散熱結構，尤指〆種 依據不同瓦特（w)數之LED〔 SMD〕之驅動溫度 、’配合使料_散熱材料和套件結賴不_結合， 从確保L ED壽命及節省使用成本，來達到有效之散熱 處理效果。 【先前技術】 按’-般大功率led已逐漸作為照明用，舉凡車 燈、住戶照明、路燈’皆有成品問世，面對高功率L E D之高熱的有效傳遞，已有高散熱元件材料之使用，如 .精密陶究、奈米金屬、梦膠、鋼粉末冶金、銅材來因 應，但上述產品均為高價結構，作為LED照明燈具， 燈泡之普及，價格實是-大⑽，因此鮮為廠商所用。 在成本考量之下，大多業者仍沿用鋁基板及鋁質散 …、件作為散熱結構，係如第一、二圖所示。但因鋁材之 導熱度低’實質上無法充份將晶片熱度導出，故而形成 曰曰片之尚溫運作，導致晶片之衰減極快無法和L E D 業者所標榜的高使用壽命〔或為2 Ο Ο Ο 0小時、或為 40 Ο ο 0小時〕吻合。更有LED業者在燈泡内加裝 8 0 C之斷電器..·等等，或因此之諸多因素，已讓使用 者對L ED燈泡之使用壽命產生疑慮㈣業者；如何 在有限成本’讓晶片在7 以下的溫度持續運作，達 最長的使用壽命，應為一個嚴肅看待的課題及使命。 典；此，為解決上述缺點，爰此設計根據不同瓦 1單之LEp.〔一SMD〕之驅動溫度，使用不同 10034433 1358515 100年.11月29日梭正_百 材料或套件結構做不同的結合，以達到最節省之成本， 來達到有效之散熱處理。 【發明内容】 [0003] 本發明係有關於一種發光元件之散熱結構，在鋁基 板或銅基板之上端面適當處構建發光元件，並在發光元 件對應基板處，構建與發光元件導熱座稍大約同尺寸之 導熱孔洞，且基板下端面構建一散熱板，散熱板對應孔 洞處構建可嵌入孔洞的導熱柱*同時在導熱柱面塗佈導 熱膠並與發光元件導熱座直接密合。並可於散熱板另外 構建數大導熱柱頂住基板下端面讓基板和散熱板無法密 合，形成一間隙，除增加導熱面外，並維持原基板之散 熱面積；又散熱板上端面除了導熱柱及頂撐導熱柱之外 ，於上、下端面構建數十個貫穿或不貫穿之孔穴，以達 到增加散熱面積之功能。 【實施方式】 [0004] 而為令本發明之技術手段能夠更完整且清楚的揭露 ，茲請一併參閱所附圖式及圖號，並詳細說明如下： 首先，請參閱第三圖（A)、（B)所示，係為本 發明之钊視示意圖，其該發光元件之散熱結構，包含有 在鋁基板（1 )或銅基板（1 )之端面適當處構建 一個或一個以上的發光元件（2 )〔為L E D/SMD 〕，並在發光元件（2) 〔LED/SMD〕對應鋁〔 銅〕基板（1 )處，在鋁〔銅〕基板（1 )上構建一個 或一個以上與發光元件（2) 〔LED/SMD〕導熱 098102069 表單編號A0I01 第5頁/共23頁 1003443387-0 1358515 100年11月按正| 座（2 1 )稍大約同尺寸之導熱孔洞（1 1 )。 请一併參閱第四圖（A) 、 （B)所示，在铭〔銅 〕基板（1 )之另一端面〔下端面〕構建一銅質散熱板 (3) ’散熱板（3)上端面在對應鋁基板（1 )孔洞 (1 1)處構建一〜四個導熱柱（3 1)，導熱柱（3 1)可穿過孔洞（1 1)，並塗布導熱膠（3 2)，直 接进合發光元件（2)之晶片（2 0)導熱座（2 1) 及鋁〔銅〕基板（1)孔洞（11)之内徑牆面。 接續，於散熱板（3)再構建數支短於導熱柱（3 1)之頂撐柱（33)，頂住鋁〔銅〕基板（1)之下 端面，使其讓铭〔銅〕基板（1)和銅質散熱板（3) 無法密合，形成一間隙（D)，以增加散熱面積。 另，在銅散熱板（3)端面，除了導熱柱（3工） 及頂撐柱（3 3)外之端面面積構建數個貫穿或不貫穿 之孔穴（3 4)，以達到增加散熱面積之功能。 請一併參閱第五圖所示，可在散熱板（3)對應基 板（1 )孔洞（11 )的對應處，另構建數圓槽（3 5 )，圓槽（35)内構建一導熱性比散熱板優良的高導 熱柱（36)，南導熱柱（36)之長度為圓槽（35 )深度加上導熱孔洞（1 i)深度，並在高導熱柱（3 6)之周圍上下均塗佈導熱膠（3 2 )密合與導熱孔洞 (1 1)、圓槽（3 5)之内壁和發光元件（2)晶片 (2 0)導熱座（2 1 )之底部，其餘構造均同上述銅 散熱板（3)之其他結構同。 另外，請一併參閱第五（A)圖所示，亦可將散熱 板（3)構建成具有散熱鰭片狀的燈泡外型，作為最大 098102069 1003443387-0 表單編號A0101 第6頁/共23頁 [ϊοο 年.11^29 日孩正 散熱面積，其係對應基板（1)孔洞（ii)的對應處 構建數圓槽（3 5)，圓槽（3 5)内構建—導熱性比 散熱板優良的高導熱柱（36)，高導熱柱（36)之 長度由圓槽（3 5 )深度延伸至賴板（3 )底部的深 度並在问導熱柱（36)之周圍上下均塗伟導熱谬（ 3 2)密合與導熱孔洞（1 1 )、圓槽（3 5)之内壁 和發光兀件（2)晶片（2 0)導熱座（2丄）之底部 ，其餘構造均同上述銅散熱板（3)之其他結構同。 請一併參閲第六圖所示，其可在銅導熱座（2工） 下延伸構建數片銅鰭片作為散熱鰭片（4)增加導熱及 散熱面積。 請一併參閱第七圖所示，可將上述之散熱鰭片（4 )與銅導熱座（，2 1 )鎖固，以節省成本。 請一併參閱第八圖所示，亦可於鋁〔銅〕基板（工 )之另一端面構建一散熱座（5)，此散熱座（5)之 材料可為銅球粒冶金，並於此散熱座（5 )對應鋁〔銅 〕基板（1 )對應面之孔洞（i丄）處凸建一個或一個 以上的凸圓柱（51) ’當銘〔銅〕基板（1)鎖合散 熱座（5)時，此凸圓柱（51)恰可穿過鋁〔銅〕基 板（1)之孔洞（1 1 )，而直接密合發光元件（2) 晶片（2 0)之鋁〔銅〕導熱座（2 i)。另，散熱座 (5 )與鋁〔銅〕基板（1)密合面，凸圓柱（51) 與銘〔銅〕基板（1)孔洞（i工）之内牆面及發光元 件（2)導熱座（2 1 )下端面之接觸面均塗佈導熱膠 (52)。 請一併參閱第九圖所示，亦可在上述銅球粒冶金散 098102069 表單編號 A0101 第 7 頁/共 23 ! 1003443387-0 丄乃8515 100年11月29日按正替換頁 熱座（5 )對應鋁〔銅〕基板（1 )之孔洞（1 1 )處 ’構建一圓槽（53)，圓槽（53)置入一高導熱柱 (54) ’此高導熱柱（54)之長度恰為鋁〔銅〕基 板（1 )之厚度加上散熱座（5)圓槽（5 3)深度之 總合’並在高導熱柱（5 4)之周圍上下均塗佈導熱膠 (5 2)密接與發光元件（2)晶片（2 〇)導熱座（ 21)及基板（1)之孔洞（11)之内牆面及球粒冶 金圓槽内壁；而銅球粒冶金散熱座（5)與鋁〔銅〕基 板（1)之密合面亦塗佈導熱膠（52)。 請一併參閱第十圖（A) 、（B)、第十一圖（A )、（B)所示，亦可在銅球粉末冶金之散熱座（5) 外再鎖合一齒輪狀之鋁散熱座板（6 )。 由上述’作為末端導熱可按大功率L ED導熱座（2 1 )溫度之高低，而利用高導熱材料急速導熱，並用中導 熱材料來作導熱及散熱。尾端外端未梢則因已構成大面 積之散熱面，則可用散熱較低的鋁材來作導熱及散熱β 據此，可有效的控制大功率發光元件（2) 〔LED/ SMD〕尚熱驅動，並可讓發光元件（？）〔led/ SMD〕降低衰減度，而加長燈具之使用壽命。 前述之實施例或圖式並非限定本發明之結構樣態或 尺寸，任何所屬技術領域中具有通常知識者之適當變化 或修飾，皆應視為不脫離本發明之專利範疇。 藉由上述可知，本發明之組成與使用實施說明相較 於一般現有類似技術，可以知道發光元件之散熱結構， 具有下列幾項優點，如下： 本發明利用發光元件之散熱結構，利用不同瓦（w 098102069 1003443387-0 表單编號A0101 第8頁/共23頁 1358515 100年.11月29日梭正替換頁 )數之LED〔SMD〕之驅動溫度，使用不同材料的 套件結構做不同的結合，以達到最節省之成本，來達到 有效之散熱處理。 綜上所述，本發明實施例確能達到所預期之使用功 效，又其所揭露之具體構造，不僅未曾見諸於同類產品 中，亦未曾公開於申請前，誠已完全符合專利法之規定 與要求，爰依法提出發明專利之申請，懇請惠予審查，‘ 並賜准專利，則實感德便。 【圖式簡單說明】 [0005] 第一圖：現有結構示意圖（一） 第二圖：現有結構前視示意圖（二） 第三圖（A):本發明之實施例一之平面分解示意圖 第三圖（B):本發明之實施例一之俯視示意圖 第四圖（A):本發明之實施例二之剖視示意圖 第四圖（B):本發明之實施例二之俯視示意圖 第五圖：本發明之實施例三之剖視示意圖 第五圖（A):本發明實施例三另一燈泡外型剖視示意 圖 第六圖：本發明之實施例四之剖視示意圖 第七圖：本發明之實施例五之剖視示意圖 第八圖：本發明之實施例六剖視示意圖 第九圖：本發明之實施例七剖視示意圖 第十圖（A):本發明之實施例八剖視示意圖 第十圖（B):本發明之實施例八仰視示意圖 第十一圖（A):本發明之實施例九剖視示意圖 098102069 第十一圖（B):本發明之實施例九仰視示意圖 表單編號A0101 第9頁/共23頁 1003443387-0 1358515 [0006] 【主要元件符號說明】 (1 ) 基板 (1 (2 ) 發光元件 (2 (21) 導熱座 (3 (31) 導熱柱 (3 (33) 頂撐柱 (3 (35) 圓槽 (3 (D) 間隙 (4 (5 ) 散熱座 (5 (52) 導熱膠 (5 (54) 高導熱柱 (6 100年.11月29日修正替換頁 1 ) 孔洞 0 ) 晶片 ) 散熱板 2 ) 導熱膠 4 ) 孔穴 6 ) 南導熱柱 ) 散熱鰭片 1 ) 凸圓柱 3 ) 圓槽 ) 散熱座板 098102069 表單编號A0101 第10頁/共23頁 1003443387-01358515 [0002] 098102069 Page 4 of 23, November 29, 100, invention, invention: [Technical field of the invention] _] The present invention relates to a heat dissipation structure of a light-emitting element, particularly The driving temperature of the watt (w) LED (SMD), the combination of the material _ heat dissipation material and the kit are not combined, to ensure the L ED life and save the cost of use, to achieve effective heat treatment. [Prior Art] According to the '-like high-power led has gradually been used as lighting, all the lights, household lighting, street lamps' have come out, in the face of high-power LED high heat effective transmission, the use of high heat-dissipating component materials Such as: precision ceramics, nano metal, dream rubber, steel powder metallurgy, copper materials to respond, but the above products are high-priced structure, as LED lighting, the popularity of light bulbs, the price is really - large (10), so fresh Used by manufacturers. Under the cost considerations, most manufacturers still use aluminum substrates and aluminum materials as heat dissipation structures, as shown in the first and second figures. However, due to the low thermal conductivity of the aluminum material, it is not sufficient to fully derive the heat of the wafer, so the temperature of the wafer is still operating, resulting in a very fast decay of the wafer and a high service life as advertised by the LED industry (or 2 Ο). Ο Ο 0 hours, or 40 Ο ο 0 hours]. More LED manufacturers have installed 80 C breakers in the bulbs..·etc., or so many factors, have caused users to have doubts about the service life of L ED bulbs. (4) Operators; The wafer continues to operate at temperatures below 7 for the longest life and should be a serious subject and mission. In order to solve the above shortcomings, this design is based on the driving temperature of LEP. [SMD] of different watts, using different 10034433 1358515 100 years. November 29th shuttle _ hundred materials or kit structure to make different Combine to achieve the most cost-effective to achieve effective heat dissipation. SUMMARY OF THE INVENTION [0003] The present invention relates to a heat dissipating structure of a light-emitting element, a light-emitting element is suitably formed on an end surface of an aluminum substrate or a copper substrate, and a light-emitting element is slightly disposed at a corresponding substrate of the light-emitting element. A heat-dissipating hole of the same size is formed, and a heat-dissipating plate is formed on the lower end surface of the substrate, and a heat-conducting column which can be embedded in the hole is formed at the hole of the heat-dissipating plate. The heat-dissipating plate can be additionally constructed with a plurality of large heat-conducting columns against the lower end surface of the substrate so that the substrate and the heat-dissipating plate cannot be closely adhered to form a gap, in addition to increasing the heat-conducting surface, and maintaining the heat-dissipating area of the original substrate; In addition to the column and the top-supporting heat-conducting column, dozens of holes penetrating through or not penetrating are formed on the upper and lower end faces to achieve the function of increasing the heat-dissipating area. [Embodiment] [0004] In order to make the technical means of the present invention more complete and clear, please refer to the drawings and drawings, and the details are as follows: First, please refer to the third figure (A) And (B) are schematic views of the present invention, wherein the heat dissipation structure of the light-emitting element includes one or more light-emitting structures appropriately formed on the end faces of the aluminum substrate (1) or the copper substrate (1). Component (2) [LED/SMD], and one or more of the aluminum (copper) substrate (1) is formed on the aluminum (copper) substrate (1) corresponding to the light-emitting element (2) [LED/SMD] Light-emitting element (2) [LED/SMD] Heat-transfer 098102069 Form No. A0I01 Page 5 of 23 1003443387-0 1358515 Pressed in November 100 | Block (2 1 ) A heat-conducting hole of the same size (1 1 ). Please refer to the fourth figure (A) and (B) to construct a copper heat sink (3) 'heat sink (3) on the other end face (lower end face) of the [copper] substrate (1). The end face is constructed with one to four heat conducting columns (31) at the corresponding holes (1 1) of the aluminum substrate (1), and the heat conducting column (31) can pass through the holes (11) and coated with the heat conductive glue (3 2). The inner wall surface of the wafer (20) heat conducting seat (2 1) and the aluminum [copper] substrate (1) hole (11) of the light-emitting element (2) are directly introduced. In the continuation, a plurality of top support columns (33) shorter than the heat transfer column (3 1) are constructed on the heat dissipation plate (3), and the lower end surface of the aluminum [copper] substrate (1) is supported to make the [copper] substrate (1) The copper heat sink (3) cannot be tightly fitted to form a gap (D) to increase the heat dissipation area. In addition, in the end face of the copper heat sink (3), in addition to the end face area of the heat conducting column (3 work) and the top support column (3 3), several holes (3 4) penetrating or not penetrating are constructed to increase the heat dissipation area. Features. Referring to the fifth figure, a plurality of circular grooves (3 5 ) can be constructed at the corresponding positions of the holes (11) of the corresponding plates (1) of the heat dissipation plate (3), and a thermal conductivity is constructed in the circular grooves (35). The high thermal conductivity column (36) is superior to the heat sink. The length of the south heat conduction column (36) is the depth of the circular groove (35) plus the depth of the heat conduction hole (1 i), and is above and below the high heat conduction column (36). The coated thermal conductive adhesive (3 2 ) is adhered to the bottom of the heat conducting hole (1 1), the inner wall of the circular groove (35), and the bottom of the light emitting element (2) wafer (20) heat conducting seat (2 1 ), and the rest of the structure is the same The other structures of the above copper heat sink (3) are the same. In addition, please refer to the fifth (A) diagram, and the heat sink (3) can also be constructed as a heat sink fin shape, as the maximum 098102069 1003443387-0 Form No. A0101 Page 6 of 23 Page [ϊοο年.11^29 The child's heat dissipation area, which is corresponding to the substrate (1) hole (ii) corresponding to the construction of a circular groove (3 5), built in the circular groove (3 5) - thermal conductivity than heat The plate has an excellent high thermal conductivity column (36). The length of the high thermal conductivity column (36) extends from the depth of the circular groove (35) to the depth of the bottom of the plate (3) and is coated on the upper and lower sides of the heat conducting column (36). The thermal conductive crucible (3 2) is in close contact with the heat conducting hole (1 1 ), the inner wall of the circular groove (35), and the bottom of the light-emitting element (2) wafer (20) heat conducting seat (2丄), and the rest of the structure is the same as above. The other structure of the copper heat sink (3) is the same. Please refer to the sixth figure, which can be extended under the copper heat conduction seat (2 work) to build a number of copper fins as heat sink fins (4) to increase heat conduction and heat dissipation area. Please refer to the seventh figure to lock the above heat sink fins (4) and copper heat conduction seat (, 2 1) to save cost. Please also refer to the eighth figure, or build a heat sink (5) on the other end of the aluminum [copper] substrate. The material of the heat sink (5) can be copper pellet metallurgy. The heat sink (5) corresponding to the hole (i丄) of the corresponding surface of the aluminum [copper] substrate (1) protrudes one or more convex cylinders (51) 'When Ming [copper] substrate (1) lock heat sink ( 5), the convex cylinder (51) can just pass through the hole (1 1 ) of the aluminum [copper] substrate (1), and directly adhere to the aluminum (copper) heat conducting seat of the light-emitting element (2) wafer (20) (2 i). In addition, the heat sink (5) and the aluminum [copper] substrate (1) are in close contact with each other, and the inner wall of the convex cylinder (51) and the [copper] substrate (1) hole (i) and the light-emitting element (2) are thermally conductive. The contact surface of the lower end of the seat (2 1 ) is coated with a thermal conductive adhesive (52). Please refer to the ninth figure together, or in the above-mentioned copper pellet metallurgical dispersion 098102069 Form No. A0101 Page 7 of 23 ! 1003443387-0 丄 is 8515 100 November 29, according to the replacement page hot seat (5 A circular groove (53) is formed at the hole (1 1 ) corresponding to the aluminum [copper] substrate (1), and the circular groove (53) is placed in a high thermal conductivity column (54) 'The length of the high thermal conductivity column (54) is just It is the thickness of the aluminum [copper] substrate (1) plus the heat sink (5) round groove (53) and the thermal conductive adhesive (5 2) is applied around the high heat conductive column (5 4). The inner wall surface of the hole (11) of the wafer (2) and the hole (11) of the substrate (1) and the inner wall of the spherical metallurgical circular groove; and the copper spherical metallurgy heat sink (5) and the light-emitting element (2) The thermal contact adhesive (52) is also applied to the adhesion surface of the aluminum [copper] substrate (1). Please refer to the tenth figure (A), (B), and the eleventh figure (A) and (B). It can also be locked in a gear-like shape outside the copper ball powder metallurgy heat sink (5). Aluminum heat sink board (6). The above-mentioned 'thermal conduction at the end can be based on the high temperature of the high-power L ED thermal conductive seat (2 1 ), and the high thermal conductive material can be used for rapid heat conduction, and the medium thermal conductive material is used for heat conduction and heat dissipation. If the outer end of the tail end is not formed, the aluminum material for lower heat dissipation can be used for heat conduction and heat dissipation. According to this, the high-power light-emitting element can be effectively controlled (2) [LED/SMD] It is thermally driven and allows the light-emitting element (?) [led/SMD] to reduce the attenuation and extend the life of the lamp. The above-mentioned embodiments or drawings are not intended to limit the structure or the scope of the present invention, and any suitable variations or modifications of the present invention will be apparent to those skilled in the art. It can be seen from the above that the composition of the present invention and the implementation of the present invention can be known from the conventional prior art, and the heat dissipation structure of the light-emitting element can be known as follows. The present invention utilizes the heat dissipation structure of the light-emitting element and utilizes different tiles ( w 098102069 1003443387-0 Form No. A0101 Page 8 of 23 1358515 100 years. On November 29th, the shuttle is replacing the page. The driving temperature of the number of LEDs (SMD) is different using the kit structure of different materials. In order to achieve the most cost-effective, to achieve effective heat dissipation. In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific structure disclosed therein has not been seen in similar products, nor has it been disclosed before the application, and has completely complied with the provisions of the Patent Law. And the request, the application for the invention of a patent in accordance with the law, please forgive the review, and grant the patent, it is really sensible. BRIEF DESCRIPTION OF THE DRAWINGS [0005] First: schematic diagram of existing structure (1) Second diagram: front view of existing structure (2) Third diagram (A): third embodiment of planar decomposition of the first embodiment of the present invention (B) is a top view of the first embodiment of the present invention. FIG. 4A is a cross-sectional view of the second embodiment of the present invention. FIG. 4B is a top view of the second embodiment of the present invention. FIG. 3 is a cross-sectional view showing a third embodiment of the present invention. FIG. 6 is a cross-sectional view showing another embodiment of the present invention. FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a cross-sectional view showing a sixth embodiment of the present invention. FIG. 9 is a cross-sectional view showing a seventh embodiment of the present invention. FIG. FIG. 10(B) is a top view of the embodiment of the present invention. FIG. 11(A) is a cross-sectional view of the embodiment of the present invention. 098102069. FIG. 11(B) is a schematic view showing the embodiment of the present invention. Form No. A0101 Page 9 of 23 1003443387-0 1358515 [0006] [Main component symbol description] (1) Substrate (1 (2) Light-emitting element (2 (21) Thermal block (3 (31) Thermal column (3 (33) Top brace (3 (35) round groove (3 (D ) Clearance (4 (5) Heat sink (5 (52) Thermal paste (5 (54) High heat transfer column (6 100. November 29 revised replacement page 1) Hole 0) Wafer) Heat sink 2) Thermal paste 4 ) Hole 6) South heat transfer column) Heat sink fin 1) Convex cylinder 3) Round groove) Heat sink plate 098102069 Form No. A0101 Page 10/Total 23 Page 1003443387-0