1356089 九、發明說明： 【發明所屬之技術領域】 ,· 本發明係關於用於固定研磨件之承載層及其製造方法， .且更特定言之，係、關於在化學機械研磨（CMp)製程中用於 固定研磨件之承載層及其製造方法。 【先前技術】 一般而s，研冑係指化學機械研磨製程中對於_初步粗 • 糙表面之磨損控制，其使得含有精細微粒之研磨t均句分 散於-研磨塾之上表面上，且同時抵靠該研磨塾放置一: 磨件，且然後以一規則運動反覆摩擦該研磨件。該研磨件 • 可為諸如半導體、儲存媒體基板、積體電路、LCD平板玻 璃、光學玻璃及光電面板之物件。研磨製程期間，必須使 用承載層以承載且固定該研磨件，且承載層之品質直接影 響研磨件之研磨效應。 圖1展示具有習知承載層之研磨裝置之示意圖。該研磨 裂置1包括一下底板11、一承載層12、一研磨件13、一上 底板14、一研磨墊15及研磨漿16。該承載層12經由一黏接 層17黏著至該下底板11 ’且用於承載且固定該研磨件13。 該研磨墊15係固定於該上底板14上。 研縻裝置1之操作模式如下。首先，將研磨件13固定於 承載層12上，且然後轉動上底板14及下底板11，且上底板 14同時向下移動，使得研磨墊15接觸研磨件13之表面，且 藉由連續補充研磨漿16且使用研磨墊15之效應可執行對於 研磨件13之研磨操作》 114386.doc 1356089 圖2為第一類型習知承載層。該第一類型習知承載層之 材料為諸如發泡聚胺酯之彈性體。該承載層之表面經研磨 以形成類麂皮表面β該承載層僅包含一個基底，且該基底 之底部較該基底之上部更結實。由於基底之厚度受限其 僅可提供微小緩衝效應。在化學機械研磨製程中，所轉動 之上底板向下移動，且自該上底板經由該研磨墊產生向下 力，且該向下力係施加於該研磨件上。因此，施加於該研 磨件上之向下力未得以均勻傳導及釋放’因為習知承載層 不能提供合適之緩衝效應。該不均力通常推擠研磨件且引 起其破裂。 第二類型習知承載層經開發且展示於圖3中。該承載層 包含一表面基底及至少一個緩衝基底。表面基底及緩衝基 底之材料為諸如發泡聚胺酯之彈性體。表面基底及緩衝基 底係使用壓敏黏接劑（PSA)而黏著。該壓敏黏接劑之一實 施例包含一層，該層包含（例如）聚對苯二甲酸乙二酯，且 該實施例具有在該層之上側及下側上為低流動性之黏接 劑，該黏接劑稱為雙側黏接劑。該黏接劑之厚度通常大於 20 。該層之上側上之黏接劑經配置以耦接該表面基 底，且該層之下側上之黏接劑耦接該緩衝基底。該承載層 之表面經研磨以形成類麂皮表面。藉由應用緩衝基底，向 下力在一定程度上經傳導及釋放。然而，由於壓敏黏接 劑、表面基底及緩衝基底之硬度率及壓縮率不同，從而降 低了缓衝效應。此外，壓敏黏接劑層不提供任何緩衝效 應。研磨時該等因素亦推擠研磨件且引起其破裂。 I14386.doc 丄咖089 【發明内容】 本發明之目的係提供一種用於固定一研磨件之承載層。 該承載層包含-表面基底及__緩衝基底1表面基底包含 孔，且該表面基底之材料包含彈性體。該緩衝基底包含 孔，且該緩衝基底之材#包含肖彈性體。#表面基底及該 緩衝基底係以包含該彈性體之黏接劑而黏著。研磨時，該 承載層提供-良好緩衝性質以傳導及釋放施加於該研磨件 上之向下力。 本發明之另一目的係提供一種製造該用於固定一研磨件 之承載層之方法。本發明之方法包含以下步驟： (a) 提供一包含孔之表面基底，該表面基底之材料包含彈 性體，且提供-包含孔之緩衝&纟，該緩衝基底之材料包 含該彈性體；及 (b) 以包含該彈性體之黏接劑黏著該表面基底及該緩衝基 底。 【實施方式】 為獲得具有令人滿意之緩衝效應、用於固定研磨件之承載 層，本發明提供一種新穎承載層。 該承載層包含一表面基底及一緩衝基底。該表面基底包 含孔，且該表面基底之材料包含彈性體。該緩衝基底包含 孔，且S玄緩衝基底之材料包含該彈性體。該表面基底及該 緩衝基底以包含該彈性體之黏接劑而黏著。 根據本發明之表面基底包含兩個表面，較佳具有一用於 固疋該研磨件之第一類麂皮表面。該類麂皮表面提供較大 I14386.doc 摩擦力，且被設計用來較牢固地固定該研磨件。該表面基 底之第_表面較佳包含_第一平面表面用於黏著至該緩 衝基底的。該第-平面表面提供一良好界面以使用包含該 彈性體之黏接劑而黏著至該緩衝基底。 為提供更佳緩衝效應，表面基底之厚度較佳在0.05 mm 至5.00 mm之間。該厚度範圍提供最優緩衝效應，避免了 如在習知承載層中所觀測到之實心底部之存在。 在本發明之一較佳實施例中，該緩衝基底具有一第二平 面表面。右該第二平面表面係定位於該緩衝基底之一上表 面上，則其有助於經由包含該彈性體之黏接劑而將該緩衝 基底固疋至該表面基底。另一方面，若該第二平面表面係 定位於4緩衝基底之一下表面上，則其有助於將該緩衝基 底亦及該整個承載層固定至—研磨裝置之一下底板。 表面基底及緩衝基底之該等孔為連續或非連續的。該等 孔使空氣能分佈至該等基底中且空氣與該等基底之彈性體 合作以提供用於釋放及傳導發生於研磨製程中之向下力的 可撓性結構。如本文所使用之連續孔係指彼此連接之孔。 另一方面，如本文所使用之非連續孔係指獨立且未連接至 其他孔之孔。該等孔之直徑較佳為〇.〇〇1私爪至1〇〇〇/|111。 本發明之待徵在於，表面基底與緩衝基底之材料相同 (即彈性體），且包含該彈性體之黏接劑被用於黏著該表面 基底及該緩衝基底。如本文所使用，術語「彈性體」（亦 稱作「彈性聚合物」）係指一類展現類橡膠品質之聚合 物。研磨時，彈性體充當良好緩衝性質以傳導及釋放施加 114386.doc 1356089 於研磨件上之向下力》在本發明之一較佳實施例中，該彈 性體為泡沫樹脂。如本文所使用，術語「泡沫樹脂」係指 含有熱塑樹脂及熱解發泡剤之材料。較佳地，該彈性體包 •括聚胺酯（PU) '聚丙烯（PP)、聚乙烯（PE)或聚氣乙烯（PVC) 中之至少一者；更佳地，其包括聚胺酯。 在本發明之一較佳實施例中，用於黏著該表面基底及該 緩衝基底之包含該彈性體之黏接劑為選自由以下各物組成 • 之群的黏接劑：單組份黏接劑、兩組份黏接劑及濕凝固黏 接劑。該黏接劑能夠滲透至表面基底及緩衝基底之表面 中，且能夠牢固地黏著此兩個基底。此外，該黏接劑中之 彈〖生體具有與表面基底及緩衝基底相同之硬度率及壓縮 率，因此產生於研磨製程中之向下力的傳導及釋放兩者均 得以改良。單組份黏接劑係指包含高分子量彈性體充當黏 接劑之黏接劑。兩組份黏接劑係指包含兩個相互作用或彼 此交聯以達成黏著效應之組份的黏接劑。兩組份黏接劑較 佳包3彈性體與聚異氰酸酯。濕凝固黏接劑（亦稱作「濕 氣可固化黏接劑」）係指彈性體單元之彼此交聯係視空氣 中濕氣而定的點接齊J。用於黏著表面基底及緩衝基底之黏 接劑之厚度較佳小於i薄黏接劑提供位於表面基底與 緩衝基底之間的優良界面。在另一態樣中，用於黏著表面 基底與緩衝基底之黏接劑之應力為5 kg/cm2至500 kg/cm2 〇 °以右干方式塗覆用於黏著表面基底及緩衝基底之黏接 劑。在本發明之-較佳實施例中，用於黏著表面基底及緩 114386.doc 1356089 衝基底之彈性體係作為複數個黏接劑ώ塊、一黏接劑層或 複數個黏接劑斑點而形成。該黏接劑不僅能夠黏著此兩個 基底’亦能夠提供適當緩衝效應。 本發明亦提供一種製造一用於固定一研磨件之承載層之 方法’該方法包含以下步驟： (a) 提供一包含孔之表面基底，該表面基底之材料包含彈 性體’且提供一包含孔之緩衝基底，該緩衝基底之材料包 含該彈性體；及 (b) 以包含該彈性體之黏接劑黏著該表面基底及該緩衝基 底。 黏著表面基底及緩衝基底之方式根據黏接劑之形式而變 化。藉由塗佈、噴射或刮擦’用於黏著表面基底及緩衝基 底之黏接劑係較佳塗覆於該表面基底及該緩衝基底中之至 少一表面上。 在本發明之一較佳實施例中，使用具有1〇個網格至8〇〇 個網格之輪執行塗佈該黏接劑。該黏接劑經由該輪塗覆於 該表面基底及該緩衝基底中之至少一個表面上，且形成為 黏接劑凸塊’因此避免了過多黏接劑。 在本發明之一較佳實施例中，使用孔數在1與1〇,〇〇〇之 間且孔尺寸在1 μηι至1000 μηι之間的喷嘴執行喷射該黏接 劑。該黏接劑經由該噴嘴塗覆於該表面基底及該緩衝基底 中之至少一個表面上，且形成黏接劑薄層或斑點，因此避 免了過多黏接劑。 在本發明之一較佳實施例中，使用刮刀執行刮擦該黏接 114386.doc -11 - 1356089 劑。該黏接劑經由該刮刀塗覆於該表面基底及該緩衝基底 中之至少一個表面上，且形成黏接劑薄層，因此避免了過 多黏接劑。 繼塗覆該黏接劑之後，黏著該表面基底及該緩衝基底。 該表面基底及該緩衝基底較佳在〇 kg/cm2至10 kg/cm2之壓 力下黏著。在另一態樣中，該表面基底及該緩衝基底在〇 °C至300°C之溫度下黏著。 若必要，根據本發明之步驟（b)進一步包含一固化步驟。 在某些情況下，該黏接劑需要該固化步驟以凝固且形成膠 結。該固化步驟之條件及方式根據所使用之黏接劑而變 化。 以下實例係僅為說明之目的且並非意欲限制本發明之範 實例： 表面差扁.在隔離紙上塗佈二甲基曱醯胺（作為溶劑）中 之聚胺S曰（作為彈性體），然後將其放置至包含水之固化溶 液中以使該彈性體成形且形成包含孔之表面基底。 表面處理.·該表面基底經受一研磨製程以形成類麂皮表 面 ° •缓衝羞扁··在隔離紙上塗佈二甲基甲醯胺（作為溶劑）中 之聚胺酯（作為彈性體），然後將其放置至包含水之固化溶 液中以使該彈性體成形且形成包含孔之緩衝基底。 裊# •’繼自表面墓底及缓衝基底移瞭隔離紙之後，使用 具有150個網格之滾輪以兩組份聚胺酯黏接劑塗佈缓衝基 114386.doc 12 1356089 底之表面。在651：及6.0 kg/cm2下乾燥緩衝基底且將其黏 著至表面基底》然後在45°C下固化該等基底48小時以使承 載層成形。 . 在穿透式電子顯微鏡下觀測承載層，且展示於圖4(5〇X) 及圖5(100X)中。參看圖4及圖5，黏接劑聚胺酯之厚度小 於 1 /m。 上述實施例僅為說明本發明之原理及其功效，而非限制 • 本發明。本發明所屬技術領域中具通常知識者對上述實施 例所做之修改及變化仍不違背本發明之精神。本發明之權 利範圍應如後述之申請專利範圍所列。 【圖式簡單說明】 圖1展示具有習知承載層之研磨裝置之示意圖。 圖2展示第一類型習知承載層在穿透式電子顯微鏡下之 視圖。 圖3展示第二類型習知承載層在穿透式電子顯微鏡下之 •視圖。 圖4展示實例之承裁層在穿类 刊0牡芽透式電子顯微鏡下之視圖 (50X) ° 圖5展示實例之承載層在空 秋層在穿透式電子顯微鏡下之視圖 (100X) ° 【主要元件符號說明】 I 研磨裝置 II 下底板 12 承載層 I14386.doc -13- 13560891356089 IX. Description of the invention: [Technical field to which the invention pertains], The present invention relates to a carrier layer for fixing an abrasive article and a method of manufacturing the same, and more particularly to a process for chemical mechanical polishing (CMp) A carrier layer for fixing an abrasive member and a method of manufacturing the same. [Prior Art] Generally, s, 胄 refers to the abrasion control of the _ preliminary rough rough surface in the CMP process, which causes the grinding t-segment containing fine particles to be dispersed on the upper surface of the abrasive raft, and at the same time A grinding member is placed against the grinding crucible, and then the grinding member is repeatedly rubbed in a regular motion. The abrasive member can be an object such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass, and an optoelectronic panel. During the grinding process, a carrier layer must be used to carry and secure the abrasive member, and the quality of the carrier layer directly affects the abrasive effect of the abrasive member. Figure 1 shows a schematic view of a polishing apparatus having a conventional carrier layer. The polishing split 1 includes a lower substrate 11, a carrier layer 12, an abrasive member 13, an upper substrate 14, a polishing pad 15, and a slurry 16. The carrier layer 12 is adhered to the lower substrate 11' via an adhesive layer 17 and is used to carry and fix the abrasive member 13. The polishing pad 15 is fixed to the upper bottom plate 14. The operation mode of the mortar device 1 is as follows. First, the abrasive member 13 is fixed to the carrier layer 12, and then the upper substrate 14 and the lower substrate 11 are rotated, and the upper substrate 14 is simultaneously moved downward so that the polishing pad 15 contacts the surface of the polishing member 13 and is continuously replenished by grinding. The slurry 16 and the effect of using the polishing pad 15 can perform the grinding operation for the abrasive member 13" 114386.doc 1356089 Figure 2 is a first type of conventional carrier layer. The material of the first type of conventional carrier layer is an elastomer such as a foamed polyurethane. The surface of the carrier layer is ground to form a skin-like surface. The carrier layer comprises only one substrate, and the bottom of the substrate is stronger than the upper portion of the substrate. Due to the limited thickness of the substrate, it only provides a small buffering effect. In the CMP process, the upper substrate is moved downwardly and a downward force is generated from the upper substrate via the polishing pad, and the downward force is applied to the abrasive member. Therefore, the downward force applied to the abrasive member is not uniformly conducted and released' because conventional carrier layers do not provide a suitable cushioning effect. This uneven force typically pushes the abrasive member and causes it to rupture. A second type of conventional carrier layer has been developed and is shown in FIG. The carrier layer includes a surface substrate and at least one buffer substrate. The material of the surface substrate and the buffer substrate is an elastomer such as foamed polyurethane. The surface substrate and the buffer substrate are adhered using a pressure sensitive adhesive (PSA). One embodiment of the pressure sensitive adhesive comprises a layer comprising, for example, polyethylene terephthalate, and this embodiment has a low flow adhesive on the upper and lower sides of the layer. The adhesive is called a double-sided adhesive. The thickness of the adhesive is typically greater than 20. An adhesive on the upper side of the layer is configured to couple the surface substrate, and an adhesive on the underside of the layer is coupled to the buffer substrate. The surface of the carrier layer is ground to form a suedoid-like surface. By applying a buffer substrate, the downward force is transmitted and released to a certain extent. However, since the pressure-sensitive adhesive, the surface substrate, and the buffer substrate have different hardness ratios and compression ratios, the buffering effect is reduced. In addition, the pressure sensitive adhesive layer does not provide any cushioning effect. These factors also push the abrasive member and cause it to rupture during grinding. SUMMARY OF THE INVENTION It is an object of the present invention to provide a carrier layer for securing an abrasive article. The carrier layer comprises a surface substrate and the surface substrate of the buffer substrate 1 comprises a hole, and the material of the surface substrate comprises an elastomer. The buffer substrate comprises a hole, and the material # of the buffer substrate comprises a SHA elastomer. The surface substrate and the buffer substrate are adhered with an adhesive containing the elastomer. When ground, the carrier layer provides a good cushioning property to conduct and release the downward force applied to the abrasive article. Another object of the present invention is to provide a method of making the carrier layer for securing an abrasive article. The method of the present invention comprises the steps of: (a) providing a surface substrate comprising a hole, the material of the surface substrate comprising an elastomer, and providing a buffer comprising a hole, the material of the buffer substrate comprising the elastomer; (b) adhering the surface substrate and the buffer substrate with an adhesive comprising the elastomer. [Embodiment] In order to obtain a carrier layer for fixing an abrasive member having a satisfactory cushioning effect, the present invention provides a novel carrier layer. The carrier layer comprises a surface substrate and a buffer substrate. The surface substrate comprises a hole and the material of the surface substrate comprises an elastomer. The buffer substrate comprises a hole, and the material of the S-shaped buffer substrate comprises the elastomer. The surface substrate and the buffer substrate are adhered with an adhesive containing the elastomer. The surface substrate according to the present invention comprises two surfaces, preferably a first type of suede surface for fixing the abrasive member. This type of suede surface provides greater I14386.doc friction and is designed to hold the abrasive member more securely. The first surface of the surface substrate preferably includes a first planar surface for adhering to the buffer substrate. The first planar surface provides a good interface for adhering to the buffer substrate using an adhesive comprising the elastomer. To provide a better cushioning effect, the thickness of the surface substrate is preferably between 0.05 mm and 5.00 mm. This thickness range provides an optimum cushioning effect, avoiding the presence of a solid bottom as observed in conventional carrier layers. In a preferred embodiment of the invention, the cushioning substrate has a second planar surface. The second planar surface is positioned on an upper surface of the buffer substrate to facilitate solidification of the buffer substrate to the surface substrate via an adhesive comprising the elastomer. On the other hand, if the second planar surface is located on a lower surface of one of the four buffer substrates, it helps to fix the buffer substrate and the entire carrier layer to the lower substrate of one of the polishing devices. The holes of the surface substrate and the buffer substrate are continuous or discontinuous. The holes allow air to be distributed into the substrates and the air cooperates with the elastomers of the substrates to provide a flexible structure for releasing and conducting the downward force occurring in the polishing process. A continuous pore as used herein refers to a pore that is connected to each other. On the other hand, a discontinuous pore as used herein refers to a pore that is independent and not connected to other pores. The diameter of the holes is preferably 〇.〇〇1 private claw to 1〇〇〇/|111. The present invention is based on the fact that the surface substrate is the same material as the buffer substrate (i.e., elastomer), and an adhesive containing the elastomer is used to adhere the surface substrate and the buffer substrate. As used herein, the term "elastomer" (also referred to as "elastic polymer") refers to a class of polymers that exhibit rubber-like qualities. When ground, the elastomer acts as a good cushioning property to conduct and release the downward force on the abrasive article. In a preferred embodiment of the invention, the elastomer is a foamed resin. As used herein, the term "foam resin" means a material containing a thermoplastic resin and a pyrolyzed foam. Preferably, the elastomer comprises at least one of polyurethane (PU) 'polypropylene (PP), polyethylene (PE) or polyethylene (PVC); more preferably, it comprises a polyurethane. In a preferred embodiment of the present invention, the adhesive for adhering the surface substrate and the buffer substrate comprising the elastomer is an adhesive selected from the group consisting of: a single component bonding Agent, two-component adhesive and wet solidification adhesive. The adhesive is capable of penetrating into the surface of the surface substrate and the buffer substrate, and is capable of firmly adhering to the two substrates. Further, the bomb in the adhesive has the same hardness rate and compressibility as the surface substrate and the buffer substrate, so that both the conduction and the release of the downward force generated in the polishing process are improved. A one-component adhesive refers to an adhesive comprising a high molecular weight elastomer acting as a binder. A two-component adhesive refers to an adhesive comprising two components that interact or crosslink each other to achieve an adhesive effect. The two components of the adhesive are better than the elastomer 3 and the polyisocyanate. Wet-solidifying adhesive (also referred to as "moisture-curable adhesive") refers to the point at which the elastomeric units are in contact with each other depending on the moisture in the air. The thickness of the adhesive used to adhere the surface substrate and the buffer substrate is preferably less than that of the i-thick adhesive providing an excellent interface between the surface substrate and the buffer substrate. In another aspect, the adhesive for adhering the surface substrate to the buffer substrate has a stress of 5 kg/cm 2 to 500 kg/cm 2 , and is applied in a right-drying manner for bonding the adhesive surface substrate and the buffer substrate. Agent. In the preferred embodiment of the present invention, the elastic system for adhering the surface substrate and the slab of the substrate is formed as a plurality of adhesive slabs, an adhesive layer or a plurality of adhesive spots. . The adhesive not only adheres to the two substrates' but also provides a suitable cushioning effect. The present invention also provides a method of manufacturing a carrier layer for holding an abrasive article. The method comprises the steps of: (a) providing a surface substrate comprising a hole, the material of the surface substrate comprising an elastomer and providing a hole a buffer substrate, the material of the buffer substrate comprising the elastomer; and (b) adhering the surface substrate and the buffer substrate with an adhesive comprising the elastomer. The manner in which the surface substrate and the buffer substrate are adhered varies depending on the form of the adhesive. An adhesive for adhering the surface substrate and the buffer substrate is preferably applied to at least one of the surface substrate and the buffer substrate by coating, spraying or scraping. In a preferred embodiment of the invention, the application of the adhesive is performed using a wheel having from 1 grid to 8 grids. The adhesive is applied to at least one of the surface substrate and the buffer substrate via the wheel and formed as an adhesive bump' thus avoiding excessive adhesion. In a preferred embodiment of the invention, the application of the adhesive is performed using a nozzle having a number of holes of between 1 and 1 Torr, and a pore size of between 1 μηι and 1000 μηι. The adhesive is applied to at least one of the surface substrate and the buffer substrate via the nozzle, and forms a thin layer or spot of the adhesive, thereby avoiding excessive adhesion. In a preferred embodiment of the invention, the bonding of the adhesive 114386.doc -11 - 1356089 is performed using a doctor blade. The adhesive is applied to at least one of the surface substrate and the buffer substrate via the doctor blade, and a thin layer of the adhesive is formed, thereby avoiding excessive adhesion. After the application of the adhesive, the surface substrate and the buffer substrate are adhered. The surface substrate and the cushioning substrate are preferably adhered under a pressure of from 〇 kg/cm 2 to 10 kg/cm 2 . In another aspect, the surface substrate and the buffer substrate are adhered at a temperature of from 〇C to 300 °C. If necessary, step (b) according to the invention further comprises a curing step. In some cases, the adhesive requires this curing step to solidify and form a bond. The conditions and manner of the curing step vary depending on the adhesive used. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention: surface unevenness. The polyamine S (as an elastomer) in dimethyl decylamine (as a solvent) is coated on a release paper, and then It is placed into a solidified solution containing water to shape the elastomer and form a surface substrate comprising pores. Surface treatment. The surface substrate is subjected to a grinding process to form a suede-like surface. • Buffering is flat. Applying a polyurethane (as an elastomer) to dimethylformamide (as a solvent) on a release paper, and then It is placed into a solidified solution containing water to shape the elastomer and form a buffer substrate comprising pores.袅# • After the release paper was removed from the surface tomb and the buffer substrate, the surface of the bottom of the buffer was coated with a two-part polyurethane adhesive using a 150-mesh roller. The buffer substrate was dried at 651: and 6.0 kg/cm2 and adhered to the surface substrate. The substrates were then cured at 45 ° C for 48 hours to shape the carrier layer. The carrier layer was observed under a transmission electron microscope and is shown in Figure 4 (5〇X) and Figure 5 (100X). Referring to Figures 4 and 5, the thickness of the adhesive polyurethane is less than 1 / m. The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications and variations of the embodiments described above will be apparent to those skilled in the art without departing from the scope of the invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a schematic view of a polishing apparatus having a conventional carrier layer. Figure 2 shows a view of a first type of conventional carrier layer under a transmission electron microscope. Figure 3 shows a view of a second type of conventional carrier layer under a transmission electron microscope. Figure 4 shows a view of the underlying layer of the example under the peony electron microscope (50X) ° Figure 5 shows an example of the carrier layer in the empty autumn layer under a transmission electron microscope (100X) ° [Main component symbol description] I Grinding device II Lower bottom plate 12 Bearing layer I14386.doc -13- 1356089
13 研磨件 14 上底板 15 研磨墊 16 研磨漿 17 黏接層 114386.doc13 Abrasive parts 14 Upper bottom plate 15 Abrasive pad 16 Grinding paste 17 Adhesive layer 114386.doc