1353647 九、發明說明： 【發明所屬之技術領域】 • 本發明係關於一種將切刀刃沿著半導體晶圓的外周而 . 相對地移動，以將黏貼於半導體晶圓的表面上之保護帶，沿 著晶圓外形而切斷之保護帶之切斷方法及裝置。 【先前技術】 上述保護帶之切斷手段方面，例如，揭示於日本國特開 2004-2 543 8號公報中。具體上其係被構成，在載置保持於平 '· 台上的晶圓之表面上供給保護帶*將黏貼輥轉動，而使保護 - 帶黏貼於晶圓之表面上。其後，將切刀刃剌穿保護帶的狀 態，將平台旋轉而使切刀刃沿著晶圓的外周相對地移動，而 將保護帶沿著外周切斷。在該保護帶切斷時，將相對於半導 體晶圓表面的切刀刃之晶圓徑方向的交叉角度進行變更調 節之時，可使保護帶對晶圓之外周緣的突出量因應於晶圓的 厚度或晶圓之外周緣的倒角形態等，而任意地調整。 但是，在上述保護帶之切斷手段之中，有下列之問題點。 ® 即，將相對於半導體晶圓表面的切刀刃之晶圓徑方向的 交叉角度進行變更調節，係採用：以設定於平台上方之高位 置上的支點作爲中心，將切刀單元的傾斜角度變更調整的構 造。因此，變更切刀刃的角度之時，切刀刃全體的上下方向 位置會變化，而使保護帶的切斷位置變化，因而必須進行切 刀刃之角度調整及高度調整，故有調整費時費事之問題。 【發明內容】 本發明係著眼於這些事情而開發者，其主要目的在使切 1353647 . 刀刃的角度可以快速地調整。 本發明爲了達成上述目的，而採用下列的構成。 . 使切刀刃沿著半導體晶圓的外周而相對地移動，以將黏 貼於半導體晶圓的表面上之保護帶，沿著晶圓外形而切取之 保護帶之切斷方法，其特徵爲：上述方法又包含有下列過程： 具備有：將相對於半導體晶圓表面的切刀刃之晶圓徑方 向的交叉角度進行變更調節的過程， 在該過程中，將切刀刃之刃緣與保護帶接觸的切斷部位 '# 作爲中心而變更切刀刃的角度。 - 依照本發明的保護帶之切斷方法的話，即使在進行切刀 刃之角度調整之時，切刀刃之刃緣與保護帶接觸的切斷部位 上亦無位置變化，因而在短時間內可完成切刀刃之角度調 整。 從而，可使保護帶對晶圓之外周緣的突出量，因應於晶 圓的厚度或晶圓之外周緣的.倒角形態等而調整之時，其調整 在短時間即可完成，隨著作業形態變更可使安排時間縮短， • 因而在惟澡-效·率崔·有。 並且，依照本發明的保護帶之切斷方法的話，一面將刃 緣的角度相對於切刀刃的移動方向調節，一面使上述保護帶 沿著半導體晶圓之外形進行切斷之時，藉由彈性手段將切刀 刃滑動地彈壓，而朝向該半導體晶圓的中心側時較佳。依照 該構成時，可使切刀刃之位置合乎良好的精度。 而，切刀刃的刃緣，例如，係爲切刀刃之刃尖，切刀刃 之刃緣與保護帶接觸的切斷部位，係切刀刃之刃尖刺入保護 1353647 t • 帶中到貫通爲止的保護帶之厚度部分。 . 並且，本發明爲了達成上述目的，而採用下列的構成。 • 使切刀刃沿著半導體晶圓的外周而相對地移動，以將黏貼於 . 半導體晶圓的表面上之保護帶，沿著晶圓外形而切取之保護 帶之切斷方法，其特徵爲：上述方法又包含有下列過程： 具備有：將相對於半導體晶圓表面的切刀刃之晶圓徑方 向的交叉角度進行變更調節的過程， 在該過程中，將與保護帶接觸的切斷部位接觸的切刀刃 "· 之刀尖作爲支點，將保持該切刀刃的基端側作圓弧狀地搖 動，而變更切刀刃之角度。 依照本發明的保護帶之切斷方法的話，即使在進行切刀 刃之角度調整之時，切刀刃之刃緣與保護帶接觸的切斷部位 上亦無位置變化，因而在短時間內可完成切刀刃之角度調 整β 從而，可使保護帶對晶圓之外周緣的突出量因應於晶圓 的厚度或晶圓之外周緣的倒角形態等而調整之時，其調整在 ® 短時間即可完成，隨著作業形態變更可使安排時間縮短，因 而在作業效率提高上有効。 並且，依照本發明的保護帶之切斷方法的話，一面將刃 緣的角度相對於切刀刃的移動方向調節，一面使上述保護帶 沿著半導體晶圓之外形進行切斷之時，藉由彈性手段將切刀 刃滑動地彈壓，而朝向該半導體晶圓的中心側之時較佳。依 照該構成時，可使切刀刃之位置合乎良好的精度。 而，切刀刃的刃緣，例如，係爲切刀刃之刃尖，切刀刃 1353647 . 之刃緣與保護帶接觸的切斷部位，係切刀刃之刃尖刺穿保護 帶中到貫通爲止的保護帶之厚度部分。 . 並且，本發明爲了達成上述目的，而採用下列的構成。 ^ 使切刀刃沿著半導體晶圓的外周而相對地移動，以將黏 貼於半導體晶圓的表面上之保護帶，沿著晶圓外形而切取之 保護帶之切斷裝置，其特徵爲：上述裝置包含有下列要件： 具備有： 支持托架，其係在與半導體晶圓的中心爲同心的縱軸心 "# 周圍被驅動旋轉； - 切刀支持構件，安裝有被裝設於上述托架上之切刀刃： 引導機構，其係介裝於支持托架與切刀支持構件之間， 以上述切刀刃之刃緣與保護帶接觸的切斷部位作爲中心，而 將支持托架與切刀支持構件做圓弧狀地移動， 藉由上述引導機構，使切刀支持構件相對於支持托架可 做角度調節及可固定地支持。 依照本發明的保護帶之切斷裝置的話，藉由上述引導機 ® 構，使切刀支持構件相對於支持托架做可角度調節之時，可 使切刀刃以切斷部位作爲中心而進行角度調節。 從而，導入圓弧狀的引導機構之時，將無法設置機械支 點的切斷部位作爲中心，而可變更調節切刀刃之角度，因此 可使上述之保護帶之切斷方法順利地實施。 而，使引導機構由：圓弧狀的滑動引導溝、及在引導溝 中朝圓弧方向自由滑動地嵌入之圓弧狀的滑動突部所構 成，在支持托架及切刀支持構件之一方具備有滑動引導溝， 另一方則具備有上述滑動突部時較佳。 依照該構成的話，即使在進行切刀刃之角度調整之時， 切刀刃之刃緣與保護帶接觸的切斷部位上亦無位置變化，因 而在短時間內可完成切刀刃之角度調整。 並且’本發明的保護帶之切斷裝置，係做成：一方面具 備有：調節相對於上述切刀刃之移動方向的刃緣之角度的移 動角度調節機構，一方面具備有使上述保護帶沿著半導體晶 圓之外形進行切斷之時，將切刀刃滑動地彈壓，而朝向該半 導體晶圓的中心側的彈性手段，又，在滑動突部嵌入滑動引 導溝之狀態而滑動之時，從長孔將可確認滑動位置的記號設 置於滑動引導溝或滑動構件的一方，在另一方設置有，從長 孔確認記號的位置而可讀取切刀刃之角度的記億體，之時較 佳。 依照該構成時，可使切刀刃之位置合乎良好的精度。 【實施方式】 以下將參照附圖而說明本發明之一個實施例。 第1圖係顯示本發明之一個實施例的保護帶黏貼裝置之 全體之立體圖。該保護帶黏貼裝置具備有：被裝塡有已收容 半導體晶圓W(以下只簡略稱爲「晶圓」）的晶圓匣C之晶圓 供給/回收部1、具有機器手2之晶圓搬運機構3、對準平台 4、將晶圓W載置而吸住保持的夾台5、教表面保護用之保 護帶T向晶圓W供給之帶供給部6、將離型紙s從帶供給部 6所供給的附有離型紙之保護帶T上剝離回收之離型紙回收 部7、將保護帶T黏貼到載置於夾台5上被吸住保持的晶圓 1353647 W上之黏貼單元8、將黏貼於晶圓W上之保護帶T沿著晶圓 W之外形切斷之帶切斷機構9、將黏貼於晶圓W上且做切斷 處理後之不要的帶Τ’剝離之剝離單元10、將在剝離單元10 剝離的不要的帶Τ’卷繞回收之帶回收部11，上述各構造部 及機構方面之具體構成將說明如下。 將2台晶圓匣C並列於晶圓供給/回收部1上且可裝塡。 將配線面做成朝上的多數片晶圓W，以水平姿勢多段地插入 而被收容在各晶圓匣C中。 晶圓搬運機構3所具備的機器手2,被構成可水平地進 退移動，且可全體轉動及昇降。然後，在機器手2的前端， 具備有做成馬蹄形的真空吸住式之晶圓保持部2a。該機器手 2可將晶圓保持部2a插入於多段地被收容在晶圓匣C中之 晶圓W彼此之間隙中，而從背面吸住保持晶圓W，將吸住 保持的晶圓W拉出，並依照對準平台4、夾台5、及晶圓供 給/回收部1的順序搬送。 對準平台4將藉由晶圓搬運機構3搬入載置的晶圓W， 根據形成於其外周上之定向平坦部或凹槽等而進行位置對 準。 夾台5係將從晶圓搬運機構3移載，且以預定之位置對 準之姿勢載置的晶圓W真空吸住。並且，在該夾台5的上 面’形成有使後述的帶切斷機構9所具備的切刀刃12沿著 晶圓W之外形繞轉移動而將保護帶T切斷的切刀移動溝 13(參照第9圖）β 帶供給部6係被構成，將從供給捲軸14連續拉出的附 -10- 1353647 • 有離型紙之保護帶T捲繞引導到導.輥1 5群中，而將離型紙 s剝離後的保護帶Τ引導到黏貼單元8。並且，帶供給部6 * 被構成可將適度的抵抗賦予供給捲軸14,使帶子不致過剩地 . 拉出。 離型紙回收部7，將從保護帶Τ剝離的離型紙s捲繞的 回收卷軸16，朝向捲繞方向轉動。 黏貼輥17面向正面成水平地具備於黏貼單元8上，藉 由滑動引導機構18及未圖示的螺桿輸送式的驅動機構，而 朝左右水平地被往復地驅動。 ' 如第9圖所示，剝離輥19面向正面成水平地具備於剝 離單元10上，藉由上述滑動引導機構18及未圖示的螺桿輸 送式的驅動機構，而朝左右水平地被往復地驅動。 帶回收部11，將捲繞不要的帶Τ’的回收卷軸20朝向捲 繞方向轉動。 帶切斷機構9，如第1圖所示，基本上在可驅動昇降的 可動台21之下部，位於夾台5之中心的縱軸心X周圍，並 ^ 列地裝設有可轉動的一對支持臂22，且在該支持臂22之遊 端側所具備的切刀單元23上，裝設有將刀尖做成向下的切 刀刃12。亦即，其被構成藉由支持臂22在縱軸心X周圍之 轉動，使切刀刃12沿著晶圓W之外周移動，而將保護帶Τ 切斷。該帶切斷機構9之細部構造被顯示於第2圖-第7圖。1353647 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a protective tape which is moved relative to the periphery of a semiconductor wafer to be adhered to the surface of the semiconductor wafer. A method and apparatus for cutting a protective tape that is cut by a wafer shape. [Prior Art] The above-described means for cutting the protective tape is disclosed, for example, in Japanese Laid-Open Patent Publication No. 2004-2543. Specifically, it is configured to supply a protective tape* on the surface of the wafer placed on the flat table to rotate the adhesive roller, and the protective tape is adhered to the surface of the wafer. Thereafter, the cutter blade is smashed through the protective tape, and the platform is rotated to relatively move the cutter edge along the outer circumference of the wafer, and the protective tape is cut along the outer circumference. When the protective tape is cut, when the intersection angle of the cutting edge of the semiconductor wafer surface in the wafer radial direction is changed, the amount of protrusion of the protective tape to the outer periphery of the wafer can be made to correspond to the wafer. The thickness or the chamfered shape of the periphery of the wafer is arbitrarily adjusted. However, among the above-described means for cutting the protective tape, there are the following problems. In other words, the angle of intersection of the cutting edge in the wafer radial direction with respect to the surface of the semiconductor wafer is changed, and the inclination angle of the cutter unit is changed by using a fulcrum set at a high position above the platform as a center. Adjusted construction. Therefore, when the angle of the cutting edge is changed, the position of the cutting blade in the vertical direction changes, and the cutting position of the protective tape changes. Therefore, the angle adjustment and the height adjustment of the cutting edge must be performed, so that it takes time and trouble to adjust the adjustment. . SUMMARY OF THE INVENTION The present invention is directed to developers who focus on these things, the main purpose of which is to make the angle of the cutting edge 1537647. The angle of the blade can be quickly adjusted. In order to achieve the above object, the present invention adopts the following constitution. a method for cutting a protective tape which is obtained by moving a cutting edge relative to an outer circumference of a semiconductor wafer to adhere a protective tape adhered to a surface of the semiconductor wafer along the outer shape of the wafer, characterized in that: The method further includes the following processes: a process of changing and adjusting the intersection angle of the wafer radial direction with respect to the surface of the semiconductor wafer, in the process, contacting the edge of the cutting edge with the protective tape The cutting position '# changes the angle of the cutting edge as the center. - According to the cutting method of the protective tape of the present invention, even when the angle of the cutting edge is adjusted, there is no positional change in the cutting edge of the edge of the cutting blade which is in contact with the protective tape, so that it can be completed in a short time Angle adjustment of the cutting edge. Therefore, when the amount of protrusion of the protective tape to the outer periphery of the wafer can be adjusted according to the thickness of the wafer or the chamfered shape of the periphery of the wafer, the adjustment can be completed in a short time. The change of the work form can shorten the arrangement time, and thus the only bath-effect rate Cui has. Further, according to the cutting method of the protective tape of the present invention, the angle of the blade edge is adjusted with respect to the moving direction of the cutting blade, and the protective tape is elastically cut along the outer shape of the semiconductor wafer, thereby being elasticized. Preferably, the cutting edge is slidably biased toward the center side of the semiconductor wafer. According to this configuration, the position of the cutting edge can be made to have good precision. However, the edge of the cutting edge is, for example, the cutting edge of the cutting edge, the cutting edge of the cutting edge and the cutting edge of the cutting tape, and the cutting edge of the cutting edge penetrates the protection 1353647 t. The thickness of the protective tape. Further, in order to achieve the above object, the present invention adopts the following constitution. • A method of cutting a protective tape that is moved relative to the outer periphery of the semiconductor wafer to move the protective tape adhered to the surface of the semiconductor wafer along the outer shape of the wafer, and is characterized by: The above method further includes the following process: a process of changing and adjusting the intersection angle of the wafer radial direction with respect to the surface of the semiconductor wafer, in which the cutting portion in contact with the protective tape is contacted The cutting edge of the cutting edge is used as a fulcrum, and the base end side of the cutting edge is held in an arc shape to change the angle of the cutting edge. According to the cutting method of the protective tape of the present invention, even when the angle of the cutting edge is adjusted, there is no positional change in the cutting edge of the edge of the cutting blade which is in contact with the protective tape, so that the cutting can be completed in a short time. When the angle of the blade is adjusted by β, the amount of protrusion of the protective tape to the periphery of the wafer can be adjusted in accordance with the thickness of the wafer or the chamfered shape of the periphery of the wafer, etc., and the adjustment can be performed in a short time. Completion, with the change of the work form, the arrangement time can be shortened, so it is effective in improving work efficiency. Further, according to the cutting method of the protective tape of the present invention, the angle of the blade edge is adjusted with respect to the moving direction of the cutting blade, and the protective tape is elastically cut along the outer shape of the semiconductor wafer, thereby being elasticized. Preferably, the cutting edge is slidably biased toward the center side of the semiconductor wafer. According to this configuration, the position of the cutting edge can be made to have good precision. However, the cutting edge of the cutting edge is, for example, the cutting edge of the cutting edge, and the cutting edge of the cutting edge 1353647. The cutting edge in contact with the protective tape is protected by the cutting edge of the cutting edge piercing the protective tape. The thickness of the belt. Further, in order to achieve the above object, the present invention adopts the following constitution. a cutting device for moving the cutting edge relative to the outer periphery of the semiconductor wafer to adhere the protective tape adhered to the surface of the semiconductor wafer along the outer shape of the wafer, characterized in that: The device contains the following requirements: It is equipped with: a support bracket that is driven to rotate around a longitudinal axis that is concentric with the center of the semiconductor wafer; - a cutter support member that is mounted on the tray Cutting blade on the frame: a guiding mechanism, which is interposed between the supporting bracket and the cutter supporting member, and the supporting portion is cut and cut with the cutting edge of the cutting edge and the cutting portion contacting the protective tape as a center The knife supporting member is moved in an arc shape, and the cutter supporting member can be angularly adjusted and fixedly supported with respect to the support bracket by the guiding mechanism. According to the cutting device of the protective tape of the present invention, when the cutter supporting member is angularly adjustable with respect to the support bracket by the above-described guiding mechanism, the cutting edge can be angled with the cutting portion as the center Adjustment. Therefore, when the arc-shaped guide mechanism is introduced, the cutting portion of the mechanical fulcrum can be set as the center, and the angle of the cutting blade can be changed. Therefore, the above-described method of cutting the protective tape can be smoothly performed. Further, the guide mechanism is composed of an arc-shaped sliding guide groove and an arc-shaped sliding projection that is slidably inserted in the guide groove in the arc direction, and is supported by one of the support bracket and the cutter supporting member. It is preferable to have a sliding guide groove and the other side to have the above-mentioned sliding protrusion. According to this configuration, even when the angle of the cutting edge is adjusted, there is no positional change in the cutting edge where the cutting edge of the cutting blade comes into contact with the protective tape, so that the angle adjustment of the cutting edge can be completed in a short time. Further, the cutting device for a protective tape according to the present invention is characterized in that: a moving angle adjusting mechanism for adjusting an angle of a blade edge with respect to a moving direction of the cutting blade is provided on the one hand, and the protective tape is provided on the one hand When the semiconductor wafer is externally cut, the cutting blade is slidably biased, and the elastic means toward the center side of the semiconductor wafer is slid while the sliding projection is inserted into the sliding guide groove. In the long hole, it is possible to confirm that the mark of the sliding position is provided on one of the sliding guide groove or the sliding member, and the other side is provided with the position of the long hole confirming the position of the mark, and it is preferable to read the angle of the cutting edge. . According to this configuration, the position of the cutting edge can be made to have good precision. [Embodiment] An embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a perspective view showing the entire protective tape applying device of one embodiment of the present invention. The protective tape attaching device includes a wafer supply/recovery unit 1 and a wafer having a robot 2 that are mounted with a wafer W (hereinafter simply referred to as a "wafer"). The transport mechanism 3, the alignment stage 4, the chuck 5 that holds the wafer W and holds it, the tape supply unit 6 that supplies the protective tape T for the surface protection to the wafer W, and the release paper s are supplied from the tape. The release paper recovery portion 7 which is peeled off and recovered on the protective tape T with the release paper supplied from the portion 6, and the adhesive tape 8 which adheres the protective tape T to the wafer 1353647 W which is placed on the holder 5 and held by the holder 5 A tape cutting mechanism 9 that is formed by cutting the protective tape T adhered to the wafer W along the wafer W, and peeling off the tape which is adhered to the wafer W and subjected to the cutting process. The unit 10 and the unnecessary belt Τ' winding and collecting belt collecting portion 11 which is peeled off in the peeling unit 10, the specific configuration of each of the above-described structural portions and mechanisms will be described below. Two wafers C are juxtaposed on the wafer supply/recovery unit 1 and can be mounted. The plurality of wafers W having the wiring faces facing upward are inserted in a plurality of stages in a horizontal posture and housed in the respective wafer cassettes C. The robot hand 2 provided in the wafer transport mechanism 3 is configured to be horizontally movable and movable, and is rotatable and movable as a whole. Then, at the front end of the robot hand 2, a vacuum holding type wafer holding portion 2a having a horseshoe shape is provided. The robot 2 can insert the wafer holding portion 2a into the gap between the wafers W accommodated in the wafer cassette C in a plurality of stages, and suck the holding wafer W from the back side to suck the held wafer W. The drawing is carried out in the order of the alignment stage 4, the chuck 5, and the wafer supply/recovery unit 1. The alignment stage 4 carries the wafer W placed thereon by the wafer transfer mechanism 3, and performs positional alignment based on the oriented flat portion or the groove formed on the outer circumference thereof. The chuck 5 is vacuum-sucked from the wafer transport mechanism 3 and vacuum-loaded on the wafer W placed in a posture aligned with a predetermined position. Further, on the upper surface of the gantry 5, a cutter moving groove 13 is formed in which the cutting blade 12 provided in the tape cutting mechanism 9 to be described later is moved around the wafer W to cut the protective tape T ( Referring to Fig. 9), the β-belt supply unit 6 is configured to guide the -3- 1353647 • protective tape T having the release paper continuously drawn from the supply reel 14 to the guide roller 15 group, and The protective tape 剥离 after the release paper s is peeled off is guided to the pasting unit 8. Further, the tape supply unit 6* is configured to impart an appropriate resistance to the supply reel 14 so that the tape is not excessively pulled out. The release paper collecting unit 7 rotates the take-up reel 16 wound from the release paper s which has been peeled off from the protective tape toward the winding direction. The sticking roller 17 is provided horizontally on the front side of the sticking unit 8, and is driven to be horizontally reciprocated horizontally by the slide guide mechanism 18 and a screw-feed type drive mechanism (not shown). As shown in Fig. 9, the peeling roller 19 is provided horizontally on the peeling unit 10 facing the front surface, and is reciprocally horizontally left and right by the slide guide mechanism 18 and a screw transport type drive mechanism (not shown). drive. The belt take-up portion 11 rotates the take-up reel 20 of the unwound belt Τ' in the winding direction. The belt cutting mechanism 9, as shown in Fig. 1, is substantially at the lower portion of the movable table 21 that can be driven to move up and down, is located around the longitudinal axis X of the center of the table 5, and is provided with a rotatable one. To the support arm 22, a cutter blade 12 having a cutting edge formed downward is attached to the cutter unit 23 provided on the tour end side of the support arm 22. That is, it is configured such that the support arm 22 is rotated around the longitudinal axis X to move the cutting edge 12 along the outer circumference of the wafer W to cut the protective tape. The detailed structure of the tape cutting mechanism 9 is shown in Figs. 2 to 7 .
如第2圖所示，可動台21被構成，藉由將馬達24正反 向轉動時，可沿著縱軌25而做螺桿輸送式地昇降。並且， 在該可動台21之遊端部上，可轉動地裝設於上述縱軸心X -11- 1353647 - 周圍的轉軸26，介由2條皮帶28而與配置於可動台21上之 馬達27做減速連動，藉由馬達27之作動，使轉軸26以低 • 速轉動。然後’如第3圖所示’支持臂22可滑動調節地貫 . 通支持於從轉軸26向下方伸出的支持構件29的下部上。從 而’藉由支持臂22之滑動調節，可使切刀刃12之轉動半徑 對應於晶圓半徑而變更調節。 托架30被固定在支持臂22之遊端臂上，該托架30被 裝設支持於切刀單元23上。切刀單元23，係由：在托架30 ® 上可轉動地被支持於縱軸心Y周圍的轉動構件31、連結到 ' 轉動構件31之端部下面的縱壁狀之支持托架32、連結到支 持托架32之側面的切刀支持構件33、可水平滑動地被支持 於切刀支持構件33上之可動托架34、被安裝於可動托架34 上的切刀保持部3 5等所構成。切刀刃1 2係以螺絲連結到切 刀保持部35的側面上，而使其刀尖背面與上述縱軸心Y — 致。. 在此處，如第4圖所示’藉由長孔36與2個銷37之卡 ^ 合而與轉動構件31—體地轉動的操作凸緣38，係配置於轉 動構件31的上方。該操作凸緣38藉由空氣缸39而轉動之 時，切刀單元23全體以在縱軸心Y周圍相對於支持臂22 的姿勢，即，相對於切刀刃12之移動方向的角度可在預定 之小範圍調整。而，托架30、轉動構件31、長孔36、操作 凸緣38、及空氣缸39’係相當於本發明之移動角度調整機 構。 如第5圖~第7圖所示’切刀支持構件33係藉由引導機 -12- 1353647 * 構40而可轉動地連結到支持托架32。該引導機構40，係在 形成於支持托架32之側面上的部分圓弧狀的滑動引導溝41 中，嵌入有突設於支持托架32之側面上的部分圓弧狀的滑 動突部42,以滑動引導溝41及滑動突部42之曲率中心作爲 支點，可使切刀支持構件33相對於支持托架32在預定範圍 (例如30°)內作滑動轉動。然後，形成部分圓弧狀的滑動引 導溝41及滑動突部42之曲率中心P，被設定位於切刀刃12 之刀尖的切斷位置A上，利用該滑動調節，在切刀刃12之 t 晶圓徑向的交叉角度α(參照第8圖）可相對於晶圓表面而變 更調節。 而，在凹狀的滑動引導溝41之底面上形成有同曲率的 部分圓弧狀之長孔43，從支持托架32之背面，將插通到長 孔43中之2個螺栓螺鎖到切刀支持構件33中時，可在任意 的滑動位置上將切刀支持構件33固定。並且，未圖示的記 憶體以預定角度節距（該例中爲2°)被雕設在滑動引導溝41 之底面上，可確認嵌入該溝41中之滑動突部42的滑動位 I 置》即，如第7圖所示，滑動引導溝41之底面及對向的滑 動引導溝41之面上附加有記號45，隨著滑動突部42的滑 動，該記號45藉由參照移動的位置、及滑動引導溝41之記 憶體，可了解切刀刃12之晶圓徑向相對於晶圓表面的交叉 角度》 並且，在切刀支持構件33與水平滑動地連結支持於切 刀支持構件上的可動托架34之間，張設有拉緊彈簧46，其 使可動托架34朝向切刀轉動中心側而滑動地被彈迫。而， -13- 1353647 • 拉緊彈簧46係相當於本發明之彈性手段。 其次，將說明使用上述實施例裝置將保護帶T黏貼於晶 • 圓W之表面上的一連串之基本動作。 . 發出黏貼指令之時’首先，晶圓搬運機構3之機器手2 朝向載置裝塡於晶圓供給/回收部1的晶圓匣C移動，晶圓 保持部2 a被插入收容於晶圓匣C中的晶圓W彼此之間隙 中，而在晶圓保持部2a處將晶圓W從背面（下面）吸住保持 而送出，將取出的晶圓W移載到對準平台4上。 ® 載置到對準平台4上的晶圓W，係利用形成於晶圓w ' 之外周的凹槽而進行位置對準，位置對準後的晶圓W再度 利用機器手2而搬出並載置於夾台5上。 載置於夾台5上的晶圓W，係在位置對準後的狀態被保 持，以使其中心位於夾台5的中心上。此時，如第9圖所示， 黏貼單元8及剝離單元10在左側的初期位置、帶切斷機構9 .之切刀刃12在上方之初期位置上分別待機。 其次，如第9圖中之假想線所示，黏貼單元8之黏貼輥 ® 17降低，且以該黏貼輥17 —面將保護帶T向下方押壓，一 面將晶圓W朝向前方（第9圖中爲右方）轉動。藉由該轉動， 將保護帶T黏貼到晶圓W之表面全體上（參照第10圖）。 其次，黏貼單元8到達終端位置之時，如第1 1圖所示， 待機於上方的切刀刃12下降，而剌穿在夾台5之切刀移動 溝13之中的保護帶T。 切刀刃12下降到預定的切斷高度而停止之時，如第12 圖所示，支持臂22朝向預定方向轉動，伴隨於此，切刀刃 -14- 1353647 . 12朝向縱軸心X之周圍繞轉移動，使保護帶T沿著晶圓外 形而被切斷。此時’切刀刃12 —面藉由拉緊彈簧46形成的 - 滑動彈迫力而推壓到晶圓w的外周上，一面移動’而進行 . 沿著晶圓w的外形之切斷。 沿著晶圓w的外形之切斷完成之時，如第12圖所示， 切刀刃12上昇到本來的待機位置，其次，剝離單元10 —面 朝向前方移動，一面將在晶圓W上之切斷而殘留之不要的 帶Τ’捲繞而剝離。 剝離單元1 〇到達剝離作業的完成位置之時，剝離單元 • 10及黏貼單元8朝向反方向移動，而返回初期位置。此時， 不要的帶Τ’被捲繞於回收卷軸20上，且一定量的保護帶Τ 從帶供給部6被拉出。 帶黏貼作動完成之時，夾台5中之吸住被解除之後，完 成黏貼處理的晶圓W被移載到機器手2之晶圓保持部2a， 而插入晶圓供給/回收部1之晶圓匣C中而被回收》 使用以上方式，而完成一次之帶黏貼處理，以後，將上 ^述作動依序地重複進行。 而，本發明亦可使用以下的形態實施之。 (1) 在構成上述的引導機構40上，亦可在支持托架32 上設置滑動突部42，且在切刀支持構件33上設置滑動因應 溝41。 (2) 亦可使用以切刀刃12之切斷部位作爲中心而彎曲 成圓弧狀的滑動引導桿，及沿著該桿而可滑動地外嵌裝設之 構件，而構成上述引導機構40。 -15- 1353647 本發明在不違離本發明的精神及本質之下，可以其它胃 體的型態而實施，因而發明的範圍方面應參考附加的申請專 利範圍，而非上述之說明。 【圖式簡單說明】 爲了說明本發明，圖中顯示許多現有較佳之形式，但是 須了解，本發明並不受限於在此所顯示之構成及對策β 第1圖係顯示本發明之一個實施例的保護帶黏貼裝置= 全體之立體圖。As shown in Fig. 2, the movable table 21 is constructed, and when the motor 24 is rotated in the normal direction, the screw can be lifted and lowered along the vertical rail 25. Further, a rotating shaft 26 that is rotatably mounted around the vertical axis X -11 - 1353647 - at a traveling end portion of the movable table 21 and a motor disposed on the movable table 21 via the two belts 28 27 is decelerated and interlocked, and by the action of the motor 27, the rotating shaft 26 is rotated at a low speed. Then, as shown in Fig. 3, the support arm 22 is slidably adjusted to support the lower portion of the support member 29 projecting downward from the rotary shaft 26. Thus, by the sliding adjustment of the support arm 22, the radius of rotation of the cutting edge 12 can be changed and adjusted corresponding to the radius of the wafer. The bracket 30 is fixed to the travel arm of the support arm 22, which is mounted to support the cutter unit 23. The cutter unit 23 is a rotation member 31 rotatably supported on the bracket 30 ® around the longitudinal axis Y, and a support bracket 32 connected to the vertical wall of the end portion of the 'rotation member 31, a cutter supporting member 33 coupled to the side surface of the support bracket 32, a movable bracket 34 slidably supported by the cutter supporting member 33, a cutter holding portion 35 attached to the movable bracket 34, and the like Composition. The cutting edge 12 is screwed to the side surface of the cutter holding portion 35 so that the back surface of the cutting edge is aligned with the longitudinal axis Y. Here, as shown in Fig. 4, the operation flange 38 which is integrally rotated with the rotation member 31 by the engagement of the long hole 36 and the two pins 37 is disposed above the rotation member 31. When the operation flange 38 is rotated by the air cylinder 39, the entire cutter unit 23 is disposed at a position around the longitudinal axis Y with respect to the support arm 22, that is, an angle with respect to the moving direction of the cutting edge 12 can be predetermined. Small range adjustment. Further, the bracket 30, the rotating member 31, the long hole 36, the operating flange 38, and the air cylinder 39' correspond to the moving angle adjusting mechanism of the present invention. As shown in Figs. 5 to 7, the cutter support member 33 is rotatably coupled to the support bracket 32 by the guide -12-1353647. The guide mechanism 40 is fitted with a partially arc-shaped sliding projection 42 projecting from the side surface of the support bracket 32 in a portion of the arc-shaped sliding guide groove 41 formed on the side surface of the support bracket 32. With the center of curvature of the sliding guide groove 41 and the sliding protrusion 42 as a fulcrum, the cutter supporting member 33 can be slidably rotated with respect to the support bracket 32 within a predetermined range (for example, 30°). Then, the curvature center P of the partial arc-shaped sliding guide groove 41 and the sliding protrusion 42 is set at the cutting position A of the cutting edge of the cutting edge 12, and the t-grain at the cutting edge 12 is adjusted by the sliding adjustment. The angle of intersection α in the radial direction (see Fig. 8) can be adjusted and adjusted with respect to the surface of the wafer. On the bottom surface of the concave sliding guide groove 41, a partial arc-shaped long hole 43 having the same curvature is formed, and from the back surface of the support bracket 32, the two bolts inserted into the long hole 43 are screwed to When the cutter supports the member 33, the cutter supporting member 33 can be fixed at an arbitrary sliding position. Further, a memory body (not shown) is engraved on the bottom surface of the slide guide groove 41 at a predetermined angular pitch (in this example, 2°), and the sliding position I of the sliding protrusion 42 embedded in the groove 41 can be confirmed. That is, as shown in Fig. 7, a mark 45 is attached to the bottom surface of the slide guide groove 41 and the surface of the opposite slide guide groove 41, and the mark 45 is referred to by the movement position as the slide protrusion 42 slides. And the memory of the sliding guide groove 41, the intersection angle of the wafer radial direction of the cutting edge 12 with respect to the wafer surface can be understood, and the cutter supporting member 33 is horizontally slidably coupled to the cutter supporting member. A tension spring 46 is stretched between the movable brackets 34, and the movable bracket 34 is slidably urged toward the center of rotation of the cutter. However, -13-1353647 • The tension spring 46 is equivalent to the elastic means of the present invention. Next, a series of basic operations of adhering the protective tape T to the surface of the wafer W using the apparatus of the above embodiment will be explained. When the attaching command is issued, first, the robot 2 of the wafer transport mechanism 3 moves toward the wafer cassette C mounted on the wafer supply/recovery unit 1, and the wafer holding unit 2a is inserted into the wafer. In the gap between the wafers W in the crucible C, the wafer W is sucked and held from the back surface (lower surface) at the wafer holding portion 2a, and the taken wafer W is transferred onto the alignment stage 4. The wafer W placed on the alignment stage 4 is aligned by a groove formed on the outer circumference of the wafer w', and the wafer W after the alignment is again carried out by the robot 2 and loaded. Placed on the clamping table 5. The wafer W placed on the chuck 5 is held in a state of being aligned so that its center is located at the center of the chuck 5. At this time, as shown in Fig. 9, the pasting unit 8 and the peeling unit 10 stand by at the initial position on the left side and the cutting edge 12 of the tape cutting mechanism 9 at the initial positions on the upper side. Next, as shown by the imaginary line in Fig. 9, the bonding roller® 17 of the pasting unit 8 is lowered, and the protective tape T is pressed downward by the bonding roller 17, and the wafer W is directed forward (9th) In the figure, it is the right side). By this rotation, the protective tape T is adhered to the entire surface of the wafer W (refer to Fig. 10). Next, when the pasting unit 8 reaches the end position, as shown in Fig. 1, the cutting blade 12 which stands by the upper portion descends and passes through the protective tape T which is inserted into the cutter moving groove 13 of the clamping table 5. When the cutting edge 12 is lowered to a predetermined cutting height and stopped, as shown in Fig. 12, the support arm 22 is rotated in a predetermined direction, and along with this, the cutting edge 14-1353474.12 is wound around the longitudinal axis X. The movement is moved so that the protective tape T is cut along the outer shape of the wafer. At this time, the cutting blade 12 is pressed against the outer circumference of the wafer w by the sliding force generated by the tension spring 46, and is moved along the outer shape of the wafer w. When the cutting of the outer shape of the wafer w is completed, as shown in Fig. 12, the cutting edge 12 is raised to the original standby position, and then the peeling unit 10 is moved toward the front side while being on the wafer W. The unnecessary tape 切断 that has been cut and left is wound and peeled off. When the peeling unit 1 〇 reaches the completion position of the peeling operation, the peeling unit 10 and the pasting unit 8 move in the opposite direction and return to the initial position. At this time, the unnecessary tape Τ' is wound around the take-up reel 20, and a certain amount of the protective tape 拉 is pulled out from the tape supply portion 6. When the sticking operation is completed, after the suction in the chuck 5 is released, the wafer W which has been pasted is transferred to the wafer holding portion 2a of the robot 2, and inserted into the wafer supply/recovery portion 1 It is recycled in the circle C. Using the above method, the tape processing is completed once, and then the above operation is repeated in sequence. However, the present invention can also be carried out using the following modes. (1) In the above-described guide mechanism 40, a slide protrusion 42 may be provided on the support bracket 32, and a slide countermeasure groove 41 may be provided in the cutter support member 33. (2) The guide mechanism 40 may be configured by using a slide guide rod that is bent in an arc shape with the cut portion of the cutting blade 12 as a center, and a member that is slidably fitted along the rod. -15- 1353647 The present invention may be embodied in other types of stomachs without departing from the spirit and essence of the invention, and the scope of the invention should be construed in reference to the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to explain the present invention, many preferred forms are shown in the drawings, but it should be understood that the present invention is not limited to the configuration and countermeasures shown herein. FIG. 1 shows an embodiment of the present invention. Example of a protective tape sticking device = a full perspective view.
第2圖係帶切斷機構之正面圖。 第3圖係帶切斷機構之要部的立體圖。 第4圖係帶切斷機構之要部的平面圖。 第5圖係帶切斷機構之要部的側面圖。 第6圖係引導機構要部的正面圖。 第7圖係切刀支持構件的立體圖。 第8圖係切刀刃之交叉角度的說明圖。 第9圖係實施例裝置的動作說明圖。 第10圖係實施例裝置的動作說明圖。 第1 1圖係實施例裝置的動作說明圖。 第1 2圖係實施例裝置的動作說明圖。 【元件符號說明】 C 晶圓匣 W 半導體晶圓 S 離型紙 Τ 保護帶 -16- 1353647 T 不要 X，Y 縱軸 Ρ 曲率 A 切斷 1 晶圓 2 機器 2a 晶圓 3 晶圓 4 對準 5 夾台 6 帶供 6 帶供 7 離型 8 黏貼 9 帶切 11 帶回 10 剝離 13 切刀 14 供給 15 導輥 16 回收 17 黏貼 18 滑動 19 剝離Figure 2 is a front view of the strap cutting mechanism. Figure 3 is a perspective view of the main part of the strap cutting mechanism. Figure 4 is a plan view of the main part of the strap cutting mechanism. Fig. 5 is a side view of the main part of the strap cutting mechanism. Figure 6 is a front view of the main part of the guiding mechanism. Figure 7 is a perspective view of the cutter support member. Fig. 8 is an explanatory view of the intersection angle of the cutting edge. Fig. 9 is a view showing the operation of the apparatus of the embodiment. Fig. 10 is a view showing the operation of the apparatus of the embodiment. Fig. 1 is a view showing the operation of the apparatus of the embodiment. Fig. 12 is a view showing the operation of the apparatus of the embodiment. [Component Symbol Description] C Wafer 匣 W Semiconductor Wafer S Release Paper Τ Protective Tape-16- 1353647 T Do not X, Y Vertical axis 曲率 Curvature A Cut 1 Wafer 2 Machine 2a Wafer 3 Wafer 4 Align 5 Clamping table 6 for 6 belts for 7 release type 8 sticking 9 strip cutting 11 belt back 10 stripping 13 cutter 14 feeding 15 guide roller 16 recycling 17 bonding 18 sliding 19 peeling
的帶 心 中心 位置 供給/回收部 手 保持部 搬運機構 平台 給部 給部 紙回收部 單元 斷機構 收部 單元 移動溝 捲軸 卷軸 輥 引導機構 輥 -1 7 回收卷軸 可動台 支持臂 切刀單元 切刀刃 馬達 縱軌 馬達 皮帶 支持構件 托架 轉動構件 支持托架 切刀支持構件 可動托架 切刀保持部 長孔 銷 操作凸緣 空氣缸 引導機構 滑動引導溝 滑動突部 記號 拉緊彈簧 -18-Heart center position supply/recovery part hand holding part transport mechanism platform part supply part paper recovery part unit break mechanism receiving unit moving groove reel roller guide mechanism roller-1 7 recovery reel movable table support arm cutter unit cutting blade Motor longitudinal rail motor belt support member bracket rotation member support bracket cutter support member movable bracket cutter retaining hole pin operation flange air cylinder guide mechanism sliding guide groove sliding protrusion mark tension spring -18-