1352859 100-6-21 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種背光模組，且特別是有關於一種 背板與印刷電路板之有良好概絲的背光模組以及 使用此背光模組的顯示器。 【先前技術】1352859 100-6-21 IX. Description of the Invention: [Technical Field] The present invention relates to a backlight module, and more particularly to a backlight module having a good profile of a backplane and a printed circuit board And a display using the backlight module. [Prior Art]
冷陰極燈管因價格便宜且技術發展成熟，因此現行之 液晶顯示器的背光模組大部分採用冷陰極燈管叹即乍 為光源。然而，冷陰極燈管本身存在著演色性不佳、需高 壓驅動、含汞(Hg)、發光頻譜包含紫外光(uv)波段、啟動 速度慢、燈管易碎裂、色度控制不易㈣題。因此，開發 新一代液晶顯示器之背光模組的重要課題便是尋找新的光 源。 發光二極體(Light Emitting DiGde，以下簡稱[ED)的 毛光效率在近十年來有著突破性的進步，1呈當Due to the low price and mature technology of cold cathode lamps, most of the current backlight modules of liquid crystal displays use cold cathode lamps as the light source. However, the cold cathode lamp itself has poor color rendering, high pressure drive, mercury content (Hg), luminescence spectrum including ultraviolet (uv) band, slow start-up speed, easy lamp fragmentation, and difficult color control (4) . Therefore, an important issue in developing a backlight module for a new generation of liquid crystal displays is to find a new light source. Light Emitting DiGde (hereinafter referred to as [ED]'s light efficiency has made a breakthrough in the past decade, 1
二、無汞、不放射紫外光、快速點二、 桃二i不易破碎、可動態調控色度等特色及優點，因而 破視為新世代液晶顯示器的光源最佳選擇。 ^光模_躺±，LED常設計為點光 電路板以將LED單體組立成一光源模纽。為了散 j讀高可靠度機構設計，LED光_ =緊，:。圖丨為習知之光源模組與金屬 相i μ考圖^但是，由於㈣光源模組10擁有 、硬雜的電路設計，常需要在印刷電路板20的兩面同時 5 100-6-21 鋪設麵箱後 接觸面無法避免地電路板20與金屬背板件30的 雖# 免也存在者㈣線路22。 在組裝利用塗佈塗漆材料來絕緣，但 漆破裂，的區域’ f相為摩擦而發生塗 了縮小液力。此外’為 箔線路22會和。 L觀尺寸，因此印刷電路板20上的銅 離。在模組W時，二3:二:::$:;適當的距 :二容:r背板件』=== 增魏緣材料。但是，此法會導致材料成本i 【發明内容】下降、組裝良率降低及工時增加等負面影響。 本發明之目的是提供—種印刷電路板之印刷電路板與 者板之間絕緣效果佳的背光模組。 ’、 品質的顯示ϋ。的疋提（、祕有良好且穩定之顯示 為達上述或是其他目的，本發明提出一種背光模組， ，包括一印刷電路板、一光源及一背板。印刷電路板的一 第表面及一第一表面各具有一金屬配線。光源配置於印 届J電路板的弟一表面上，並與第一表面的金屬配線電性連 接。月板配置於印刷電路板的一側，並與印刷電路板的第 二表面接觸，其中背板對應位於第二表面的金屬配線為一 折彎部，而折彎部未與第二表面接觸。 1352859 100-6-21 在本發明之一實施例中，位於第二表面的金屬配線集 中在一導線配置區内。 在本發明之一實施例中，上述之位於第一表面的金屬 配線與位於第二表面的金屬配線電性連接。 在本發明之一實施例中，上述之位於第一表面的金屬 配、、泉藉由金屬内連線與位於第二表面的金屬配線電性連 接。 在本發明之一實施例中，上述之光源為發光二極體。 在本發明之-實施例中’上述之背板的材質為金屬。 、在本發明之一實施例中，上述之背光模組更包括一穿 過背板及印刷電路板的鎖固件，且鎖固件是用以使印刷電 路板固定於背板。 在本發明之一實施例中，上述之背光模組更包括一配 置於背板内的導光板，其中導光板位於光源的—側。 在本發明之一實施例中，上述之背光模組更包括一配 置於該背板上的光學膜片，且光學膜片可以是稜鏡片、增 光片、擴散片或這些膜片的組合。 本發明另提出-種顯示器，其包括一液晶顯示面板以 及一上述之背光模組，其中液晶顯示面板配置於背光模組 上。 本發明又提出-種顯示器，其包括一液晶顯示面板以 及-背光模組’其中背光模組置於液晶顯*面板的一 側。背光模組包括一印刷電路板、一光源以及〜背板，其 中印刷電路板的第-、第二表面各具有—金屬配線。光源 1352859 100-6-21 配置於印刷電路板的第一表面’並與第一表面上的金屬配 線電性連接。背板配置於印刷電路板的一側，並與印刷電 路板之無導線區接觸，其中背板對應位於導線配置區為一 折彎部，而折彎部未與導線配置區接觸。 在本發明之一實施例中，上述之印刷電路板有一導線 配置區及一無導線區，且位於第二表面的金屬配線集中配 置於導線配置區内，而位於第二表面之金屬配線未配置於 無導線區内。 在本發明之一實施例中，上述之位於第一表面的金屬 配線與位於第二表面的金屬配線電性連接。 在本發明之一實施例中，上述位於第一表面的金屬配 線藉由一金屬内連線與位於第二表面的金屬配線電性連 接。 在本發明之一實施例中，上述之光源為發光二極體。 在本發明之一實施例_，上述之背板的材質為金屬。 、在本發明之一實施例中，上述之背光模組更包括一穿 過背板及印刷電路板的細件，财貞固件是用以使印刷 路板固定於背板。 在本發明之-實施例中，上述之背光模組更包括一酉己 置於背板内的導光板，其中導光板位於光源的一側。 在本發明之一實施例中，上述之背光模組更包括一酉己 置於该背板上的光學膜片’且光學膜片可以是稜鏡片、你 光片、擴散片或這些臈片的組合。 ㈢ 在本發明之一實施例中，上述之顯示器更包括一· 1352859 100-6-21 „裝置，此光源亮度調節裝置包括一光感測元件以 工制％路單S。光感測it件可配置於顯示器内任何地 T :但其需配置於光源的光路徑上’以接收並偵測光源的 光線。控制電路單S也配置於顯示㈣，其與光感測元件 及光源屯性連接’其用以在光感測元件債測到光源的亮度 改變時，將光源的亮度調整為原本的預設值。 此本發明還提出-麵示H ’包括—液晶顯示面板以及 • 一背光模組’其中背光模組配置於液晶顯示面板的一侧。 ' 印刷電路板包括一金屬配線’且其表面具有一導線配置區 ' 及一無導線區，其中位於印刷電路板之第一表面的金屬配 線集中配置於導線配置區内，而位於第一表面的金屬配線 並未配置於無導線區内。光源配置於印刷電路板之一第二 表面上，並與金屬配線電性連接。背板配置於印刷電路板 的一側，其具有與第一表面相對的第三表面，且位於導線 配置區的第一表面與第三表面的間距大於位於無導線區的 第一表面與第三表面的間距。 ® 本發明更提出一種顯示器，包括一液晶顯示面板以及 月光棋組’其中为光模組配置於液晶顯示面板的一側。 印刷電路板包括一金屬配線，且印刷電路板的表面有一導 線配置區及一無導線區，其中位於印刷電路板之一第一表 面的金屬配線集中配置於導線配置區内，而位於第一表面 的金屬配線並未配置於無導線區内。光源配置於印刷電路 板之一第二表面上，並與金屬配線電性連接。背板配置於 印刷電路板之一側，且其一第三表面與第一表面相對，且 1352859 100-6-21 =導線配置區之第—表面與第三表面的間距大於位於無 導線區之第-表面與第三表面關距。 、 在本發明之顯示器及其所使用的背光模組中，因金屬 配線可以避免與背板賴，金屬配線與背板之間具有良好 的絕緣效果，因此背光餘及顯示H具有良好敝裳良率。 為讓本發明之上述和其他目的、特徵和優點能更明顯 ’Ϊ ’下文轉-實施例’並配合所關式，作詳細說明 如下。 【實施方式】 圖2為本發明一種背光模組的局部示意圖。請參 2 ’本實施例之背光模組⑽為一直下式背光模組，ς包ς —印刷電路板110、-光源12〇以及一背板13〇β印刷電路 板no為一多層板，且此多層板具第一表面u〇a、第二 面ll〇b以及配置在第-表面u〇a及第二表面u〇b上的金 屬配線112。 “ 在本實施例中，位於第一表面11〇a及第二表面u〇b 的金屬配線II2可㈣配置需求科需電性連接，但使用 者可以依照其需求，使位於第_表面110a及第二表面 的金屬配線112電性連接。舉例而言，位於第一表面 及第二表面ll〇b的金屬配線ι12可以是藉由一金屬内連線 以電性連接。此外，在其它未繪示的實施例中，位於第、一 表面110a的金屬配線112也可以是延伸配置在垂直連接第 一表面110a及第二表面ll〇b的表面上，以與位於第二表 面110b的金屬配線112連接。有關於位於第一表面η% 1352859 100-6-21 及苐一表面1 之金屬配線112的電性連接 領域中熟習該項技藝者可依公開文件撼 方式為本技術 明書便不再另關示說明。 施’因此本說 依照金屬配線112配置於第二表面11%的配 可更進-步將印刷電路板110區分為導線 置’ 導線區110d。 c置& 110C及無 光源120配置於印刷電路板110的第—李面Second, mercury-free, non-radiative ultraviolet light, fast point two, peach two i is not easy to break, can dynamically adjust the color and other features and advantages, and thus broken as the best choice for the new generation of liquid crystal display light source. ^ Light mode _ lying ±, LED is often designed as a point light circuit board to set the LED unit into a light source module. In order to read the high-reliability mechanism design, LED light _ = tight, :.丨 丨 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源The rear contact surface of the box cannot avoid the circuit (22) of the circuit board 20 and the metal back board member 30. In the assembly, the coating paint is used to insulate, but the area where the paint is broken, the f phase is rubbed and the shrinking fluid is applied. In addition, the foil line 22 will be combined. L is dimensioned so that the copper on the printed circuit board 20 is off. In the module W, two 3: two::: $:; appropriate distance: two capacity: r back plate 』 === increase the edge of the material. However, this method can lead to negative effects such as a decrease in material cost, a decrease in assembly yield, and an increase in man-hours. SUMMARY OF THE INVENTION An object of the present invention is to provide a backlight module having a good insulating effect between a printed circuit board and a printed circuit board. ‘, the quality of the display ϋ. The present invention provides a backlight module including a printed circuit board, a light source and a backplane. A first surface of the printed circuit board and Each of the first surfaces has a metal wiring. The light source is disposed on a surface of the printed circuit board and electrically connected to the metal wiring of the first surface. The moon plate is disposed on one side of the printed circuit board and printed The second surface of the circuit board is in contact, wherein the metal strip on the second surface corresponding to the second surface is a bent portion, and the bent portion is not in contact with the second surface. 1352859 100-6-21 In an embodiment of the present invention The metal wiring on the second surface is concentrated in a wire arrangement region. In one embodiment of the invention, the metal wiring on the first surface is electrically connected to the metal wiring on the second surface. In one embodiment, the metal arrangement on the first surface is electrically connected to the metal wiring on the second surface by a metal interconnection. In an embodiment of the invention, the light source is In the embodiment of the present invention, the material of the back plate is metal. In an embodiment of the invention, the backlight module further includes a lock that passes through the back plate and the printed circuit board. The firmware is used to fix the printed circuit board to the backplane. In an embodiment of the invention, the backlight module further includes a light guide plate disposed in the backplane, wherein the light guide panel is located at the light source. In an embodiment of the present invention, the backlight module further includes an optical film disposed on the back plate, and the optical film may be a bake piece, a brightness enhancement plate, a diffusion sheet or a combination of the films. The present invention further provides a display comprising a liquid crystal display panel and a backlight module, wherein the liquid crystal display panel is disposed on the backlight module. The present invention further provides a display comprising a liquid crystal display panel and The backlight module includes a backlight module disposed on one side of the liquid crystal display panel. The backlight module includes a printed circuit board, a light source, and a backplane, wherein the first and second surfaces of the printed circuit board have - metal wiring. The light source 1352859 100-6-21 is disposed on the first surface ' of the printed circuit board and electrically connected to the metal wiring on the first surface. The back plate is disposed on one side of the printed circuit board and is printed with the printed circuit board The wire-free area is in contact with the back plate corresponding to the wire arrangement area being a bent portion, and the bent portion is not in contact with the wire arrangement area. In an embodiment of the invention, the printed circuit board has a wire arrangement area and a wire-free region, and the metal wires on the second surface are disposed in the wire arrangement region, and the metal wires on the second surface are not disposed in the wire-free region. In one embodiment of the present invention, the above is located The metal wiring on one surface is electrically connected to the metal wiring on the second surface. In one embodiment of the invention, the metal wiring on the first surface is electrically connected to the metal wiring on the second surface by a metal interconnection. Sexual connection. In an embodiment of the invention, the light source is a light emitting diode. In an embodiment of the invention, the material of the back plate is metal. In an embodiment of the invention, the backlight module further includes a thin member passing through the back plate and the printed circuit board, and the financial firmware is used to fix the printed circuit board to the back plate. In an embodiment of the invention, the backlight module further includes a light guide plate disposed in the back plate, wherein the light guide plate is located at one side of the light source. In an embodiment of the invention, the backlight module further includes an optical film disposed on the back plate, and the optical film may be a cymbal, a light sheet, a diffusion sheet or the cymbals. combination. (3) In an embodiment of the present invention, the display further includes a 1352859 100-6-21 „device, the light source brightness adjusting device includes a light sensing component to manufacture a system road S. The light sensing component It can be configured anywhere in the display T: but it needs to be disposed on the light path of the light source to receive and detect the light of the light source. The control circuit S is also arranged in the display (4), which is connected to the light sensing element and the light source. 'It is used to adjust the brightness of the light source to the original preset value when the light sensing component changes the brightness of the light source. The present invention also proposes that the surface display H' includes a liquid crystal display panel and a backlight module. The group 'the backlight module is disposed on one side of the liquid crystal display panel. 'The printed circuit board includes a metal wiring and has a wire arrangement area on the surface thereof and a wire-free area, wherein the metal on the first surface of the printed circuit board The wiring is disposed in the wire arrangement area, and the metal wiring on the first surface is not disposed in the non-wire area. The light source is disposed on a second surface of the printed circuit board and electrically connected to the metal wiring. The back plate is disposed on one side of the printed circuit board, and has a third surface opposite to the first surface, and the first surface and the third surface of the wire arrangement area are spaced apart from each other by a first surface and a third surface located in the non-wired area The spacing of the surface. The present invention further provides a display comprising a liquid crystal display panel and a moonlight chess set, wherein the optical module is disposed on one side of the liquid crystal display panel. The printed circuit board includes a metal wiring, and the surface of the printed circuit board There is a wire arrangement area and a wire-free area, wherein the metal wires on the first surface of one of the printed circuit boards are disposed in the wire arrangement area, and the metal wires on the first surface are not disposed in the wire-free area. On a second surface of the printed circuit board, and electrically connected to the metal wiring. The back plate is disposed on one side of the printed circuit board, and a third surface thereof is opposite to the first surface, and 1352859 100-6-21 = The distance between the first surface of the wire arrangement region and the third surface is greater than the distance between the first surface and the third surface of the wire-free region. In the backlight module used, since the metal wiring can avoid the backing and the metal wiring and the back board have a good insulation effect, the backlight and the display H have a good yield. Other objects, features, and advantages can be more clearly described in the following description of the present invention in conjunction with the related embodiments. [Embodiment] FIG. 2 is a partial schematic view of a backlight module of the present invention. The backlight module (10) of the embodiment is a direct-type backlight module, and the printed circuit board 110, the light source 12A, and the back plate 13〇β printed circuit board no are a multi-layer board, and the multi-layer board The first surface u〇a, the second surface 11b, and the metal wiring 112 disposed on the first surface u〇a and the second surface u〇b. In the present embodiment, the first surface 11〇a The metal wiring II2 of the second surface u〇b can be electrically connected to the demanding section, but the user can electrically connect the metal wirings 112 located on the first surface 110a and the second surface according to the requirements. For example, the metal wires ι12 on the first surface and the second surface 11b may be electrically connected by a metal interconnection. In addition, in other embodiments not shown, the metal wiring 112 located on the first surface 110a may also be extended on the surface perpendicularly connecting the first surface 110a and the second surface 110b to be located in the second The metal wiring 112 of the surface 110b is connected. The skilled artisan in the field of electrical connection of the metal wiring 112 located on the first surface η% 1352859 100-6-21 and the first surface 1 can be no longer related to the technical specification according to the public document. Show instructions. Therefore, it is said that the printed circuit board 110 can be further divided into the conductor portion 110b according to the arrangement in which the metal wiring 112 is disposed on the second surface 11%. c & 110C and no light source 120 are disposed on the first surface of the printed circuit board 110
且本實施例之光源12G為發光二極體，其巾_ H以 是焊接於金屬配線112，以與金屬配線112電性連接，因 =本實施例之印刷電路板110為背光漁1〇叫光源驅動 %路板。 背板130配置在印刷電路板11〇的一側，並與印刷電 路板110的第二表面UOb的無導線區110d接觸了其中背 板130對應位於第二表面11〇b的導線配置區u〇c^金屬The light source 12G of the embodiment is a light-emitting diode, and the towel _H is soldered to the metal wiring 112 to be electrically connected to the metal wiring 112. The printed circuit board 110 of the embodiment is a backlight. The light source drives the % road board. The backplane 130 is disposed on one side of the printed circuit board 11 and contacts the wire-free area 110d of the second surface U0b of the printed circuit board 110. The wire arrangement area corresponding to the back surface 130 corresponding to the second surface 11〇b c^metal
配線112處為一折彎部132，而折彎部132未與第二表面 11 Ob接觸。 此外’背板130具有一第三表面i30a及一第四表面 l30b，其中第三表面130a位於導線配置區li〇c，而第四 表面130b位於無導線區UOd，而第二表面11〇b至第四表 面130b的間距小於第二表面n〇b與第三表面13〇a的間 距’且在另一未繪示的實施例中，我們也可以是將印刷電 路板110設計為導線配置區11〇c較高而無導線區11〇(1較 低陷的形狀，以使第二表面導線配置區110c與背板130 的間距大於第二表面無導線區11〇d與背板130的間距。如 11 1352859 100-6-21 此，便可以避免位於導線配置區110c的金屬配線112會與 背板130接觸。當然也可以利用如軟性印刷電路板可撓曲 的特性，將導線配線區配置與背板有一間距防止接觸。 雖然本實施例之背板13〇是以背光模組1〇〇内的金屬 背板為例，但熟習該項技藝者也可以將金屬背板以包覆整 個背光模組100的外框架替換，甚至包覆背光模組1〇〇的 外框架與背板是一體成型。 為了讓印刷電路板110能夠固定於背板130上，本實 施例之背光模組100更包括一鎖固件14〇,且此鎖固件140 穿過印刷電路板110以及背板130。 圖3A及3B分別為印刷電路板之金屬配線位於第一及 第二表面的示意圖。請同時參考圖3A及3B，在本實施例 中，位於第二表面ll〇b的金屬配線112是集中在印刷電路 板110的導線配置區11 〇c内，其中折彎部132即是對應導 線配置區110c，而位於第一表面110a的金屬配線112因 不與月板13 0直接接觸，因此不限制金屬配線112佈於第 一表面110a上的位置及範圍。 清同時參考圖2、圖3A及圖3B，由於本實施例之背 板130的材貝為金屬’且在印刷電路板11 〇與背板13〇組 立時，位於組裝施力點或是背板130平整度欠佳處的金屬 配線112’難免會因為絕緣漆破裂而露出銅箔線路^在本 實施例中’位於第二表面ll〇b的金屬配線112集中在導線 配置區110c内，而折彎部132對應導線配置區110c，因 此金屬配線112便可以避免與背板130接觸，金屬配線ι12 1352859 100-6-21 與背板130之間具有良好的絕緣效果。 值得一提的是’雖然本實施例是將原本散佈於第二表 面110b的金屬配線112集中於導線配置區i10c，製作印 刷電路板11〇的成本並未因此增加。但是，將第二表面11〇b 的金屬配線112集中於導線配置區il〇c中，卻可以避免金 屬配線112與背板130接觸而短路，增加了背光模組1〇〇 的良率，進而節省背光模組1〇〇因此損壞而重製的成本。 更進一步地說，將第二表面ll〇b的金屬配線112集中於導 線配置區ll〇c並作為端子時，更可以增加金屬配線112 與其它控制模組或電源供應單元電性連接的組裝便利性及 安全性。 此外，將第二表面110b的金屬配線112集中於導線配 置區110c，並不會影響背光模組100的組裝順序，且因導 線配置區ll〇c與背板130的折彎部132相對應，所以組裝 時可以增加組裝便利性並減少組裝錯誤的可能性。在此同 時，並可將背光模組100良率的提高，減少重工背光模組 100的工時。 另外，由於印刷電路板110部分的連續區域仍須與背 板130接觸，因此印刷電路板11〇才能藉由背板13〇有效 地散熱。較佳地，該導線配置區丨丨〇 c的面積係約佔第二表 面110b之20%〜80%面積，使背板對於印刷電路板兼具散 熱及固定的功能，以維持正常的運作。 雖然本實施例之背光模組1〇〇是以直下式背光模組為 例，但在其他未繪示的實施例中，背光模組也可以是一側 13 100-6-21 邊入光式背光模組，且側邊入光式背光模組更包括一配置 於背板内的導光板，且導光板配置於光源的一側。 圖4為使用圖2之背光模組的顯示器的示意圖。請參 考圖4，顯示器300包括一液晶顯示面板200以及一上述 之背光模組100，其中液晶顯示面板200配置於背光模組 1〇〇的出光側。 由於背光模組1〇〇之金屬配線112與背板130之間具 有良好的絕緣效果，使得背光模組1〇〇能夠提供液晶顯示 面板200穩定的光源。因此，使用背光模組的顯示器 300能夠穩定地顯示圖像。 此外，為了讓顯示器3〇〇具有良好的顯示品質，顯示 器300更包括一光源亮度調節裝置31〇，此光源亮度調節 裝置310包括一光感測元件312以及一控制電路單元 314。光感測元件312可配置於顯示器3〇〇内任何地方但 其需配置於光源的祕徑上，以接收鋪測光源12〇 的光線:控制電路單元314也配置於顯示器3〇〇内其與 光感測το件312及光源120電性連接。進一步而言，因印 屬配線112集中於導線配置區‘並作 ^更有助於與控制電路單元314電性連接的便利 ，控制電路單元314是藉由印刷電路板 元性連接°在其他實施例中，控制電路 早兀314也可以是整合在印刷電路板上。 n則述=制電路單70 314用以谓測光源120的亮度， 备先感如件312勤峨源120的亮度改變時，控制電 1352859 100-6-21 路單元314會將光源120的亮度調整為原本的預設值，以 使顯示器300能夠具有良好且穩定的顯示品質。 另外，為了讓背光模組1〇〇能夠提供均勻的面光源給 液晶顯示面板200，背光模組1〇〇更包括一光學膜片15〇， 而此光學膜片150可以是擴散片、增光片、稜鏡片或其組 合。詳細來說，若此光學膜片150為增光片，則可進一步 提尚由背光模組100所出射的光線亮度。若光學膜片15〇 • 為擴散片’由背光模組1〇〇所出射之光線會經由此光學膜 片150而形成一亮度較均勻的面光源。若此光學膜片150 採用稜鏡片’則可用來調整由背光模組1〇〇所出射之光線 的方向。 在本實施例之背光模組1〇〇以及使用此背光模組1〇〇 的顯示器300中’雖然印刷電路板no是以光源驅動電路 板為例說明’但熟習該項技藝者亦可在不違背本發明精神 之下’將本實施例之印刷電路板以其他類型的電路板代 • 替。舉例來說’印刷電路板也可以是面板控制電路板或視 訊訊號控制電路板’只要在背板會與金屬配線接觸的地方 形成折彎部，便可以讓背板與金屬配線不接觸，避免背板 與印刷電路板發生短路。 綜上所述，本發明之背光模組以及使用此背光模組的 顯示器至少具有下列之優點： 一、金屬配線可以避免與背板接觸，並與背板之間具 有良好的絕緣效果’進而提高背光模組及顯示器 的組裝良率。 15 1352859 100-6-21 二、金屬配線集中於印刷電路板表面之導線配置區， 且此導線配置區位於印刷電路板的側邊’因此可 以增加金屬配線與其它模組或電源供應單元電性 連接的組裝便利。 二、背光模組及顯示器的組裝便利性及良率增加，進 而節省背光模組及顯示器重工的成本及工時。 四、背光模組提供液晶顯示面板穩定的光源，顯示器 具有良好且穩定的顯示效果。 —雖然本發明已以一實施例揭露如上，然其並非用以限 疋本發明’任何所屬技術領域中具有通常知識者，在不脫 離本發明之精神和範圍内，當可作些許之更動與潤飾， =本發明之保護範圍當視後附之申請專利範圍所界定者為 【圖式簡單說明】 意圖。 於第一及 圖。 圖1為習知之光源模組與金屬背板的組立示The wiring 112 is a bent portion 132, and the bent portion 132 is not in contact with the second surface 11 Ob. In addition, the back plate 130 has a third surface i30a and a fourth surface 130b, wherein the third surface 130a is located in the wire arrangement area li〇c, and the fourth surface 130b is located in the wireless area UOd, and the second surface 11〇b is The pitch of the fourth surface 130b is smaller than the pitch of the second surface n〇b and the third surface 13〇a'. In another embodiment not shown, we may also design the printed circuit board 110 as the wire arrangement area 11 〇c is higher and has no lead area 11〇 (1 lower trapped shape) such that the distance between the second surface lead arrangement area 110c and the backing plate 130 is greater than the spacing of the second surface no-wire area 11〇d from the backing plate 130. For example, 11 1352859 100-6-21, the metal wiring 112 located in the wire arrangement area 110c can be prevented from coming into contact with the back plate 130. Of course, the flexibility of the flexible printed circuit board can be utilized to configure the wire distribution area. The backing plate has a spacing to prevent contact. Although the backing plate 13 of the embodiment is a metal backing plate in the backlight module 1 为, the skilled person can also cover the entire backing mode with the metal backing plate. Replacement of the outer frame of group 100, even covering the backlight module The outer frame of the 1 〇〇 is integrally formed with the back plate. In order to enable the printed circuit board 110 to be fixed on the back plate 130, the backlight module 100 of the embodiment further includes a locking member 14 〇, and the locking member 140 passes through The printed circuit board 110 and the back board 130. Figures 3A and 3B are schematic diagrams showing the metal wiring of the printed circuit board on the first and second surfaces, respectively. Please refer to Figs. 3A and 3B, in this embodiment, on the second surface. The metal wiring 112 of the 〇b is concentrated in the wire arrangement area 11 〇c of the printed circuit board 110, wherein the bent portion 132 is the corresponding wire arrangement area 110c, and the metal wiring 112 located on the first surface 110a is not compatible with the moon plate 13 0 is in direct contact, so the position and range of the metal wiring 112 on the first surface 110a are not limited. Referring to FIG. 2, FIG. 3A and FIG. 3B simultaneously, since the material of the back plate 130 of the present embodiment is metal' When the printed circuit board 11 〇 and the back plate 13 〇 are assembled, the metal wiring 112 ′ located at the assembly force application point or the flatness of the back plate 130 is inevitably exposed to the copper foil circuit due to the breakage of the insulating varnish. Medium 'located on the second surface ll〇b The metal wiring 112 is concentrated in the wire arrangement area 110c, and the bent portion 132 corresponds to the wire arrangement area 110c, so the metal wiring 112 can avoid contact with the back plate 130, and the metal wiring ι12 1352859 100-6-21 and the back plate 130 It has a good insulating effect. It is worth mentioning that although the present embodiment concentrates the metal wiring 112 originally dispersed on the second surface 110b in the wire arrangement area i10c, the cost of manufacturing the printed circuit board 11 is not increased. The metal wiring 112 of the second surface 11〇b is concentrated in the wire arrangement area il〇c, but the metal wiring 112 can be prevented from being short-circuited by contacting the back plate 130, thereby increasing the yield of the backlight module 1,, thereby saving The cost of the backlight module 1 〇〇 is thus damaged and reworked. Furthermore, when the metal wiring 112 of the second surface 11b is concentrated in the wire arrangement area 11c and serves as a terminal, the assembly convenience of electrically connecting the metal wiring 112 to other control modules or power supply units can be further increased. Sex and safety. In addition, concentrating the metal wires 112 of the second surface 110b in the wire arrangement area 110c does not affect the assembly sequence of the backlight module 100, and the wire arrangement area 11〇c corresponds to the bent portion 132 of the back plate 130, Therefore, the assembly convenience can be increased and the possibility of assembly errors can be reduced. At the same time, the backlight module 100 can be improved in yield and the working time of the rework backlight module 100 can be reduced. In addition, since the continuous area of the portion of the printed circuit board 110 still has to be in contact with the back plate 130, the printed circuit board 11 can be efficiently dissipated by the back plate 13A. Preferably, the area of the wire arrangement area 丨丨〇 c is about 20% to 80% of the area of the second surface 110b, so that the back plate has both heat dissipation and fixed functions for the printed circuit board to maintain normal operation. Although the backlight module 1 of the embodiment is a direct-type backlight module, in other embodiments not shown, the backlight module may also be a side 13 100-6-21 edge-in type. The backlight module further includes a light guide plate disposed in the back plate, and the light guide plate is disposed on one side of the light source. 4 is a schematic diagram of a display using the backlight module of FIG. 2. Referring to FIG. 4, the display 300 includes a liquid crystal display panel 200 and a backlight module 100. The liquid crystal display panel 200 is disposed on the light exiting side of the backlight module 1 . Since the metal wiring 112 of the backlight module 1 has good insulation effect with the back plate 130, the backlight module 1 can provide a stable light source of the liquid crystal display panel 200. Therefore, the display 300 using the backlight module can stably display an image. In addition, in order to provide a good display quality for the display 3, the display device 300 further includes a light source brightness adjusting device 31. The light source brightness adjusting device 310 includes a light sensing element 312 and a control circuit unit 314. The light sensing component 312 can be disposed anywhere in the display 3 but needs to be disposed on the secret path of the light source to receive the light of the light source 12: the control circuit unit 314 is also disposed in the display 3 The light sensing device 312 and the light source 120 are electrically connected. Further, since the printed wiring 112 is concentrated on the wire arrangement area and facilitates the electrical connection with the control circuit unit 314, the control circuit unit 314 is connected by a printed circuit board. In the example, the control circuit may be integrated on the printed circuit board. n is said = system circuit 70 314 is used to measure the brightness of the light source 120, when the brightness of the device 312 is changed, the control unit 1352859 100-6-21 unit 314 will be the brightness of the light source 120 The original preset value is adjusted to enable the display 300 to have a good and stable display quality. In addition, in order to enable the backlight module 1 to provide a uniform surface light source to the liquid crystal display panel 200, the backlight module 1 further includes an optical film 15A, and the optical film 150 may be a diffusion sheet and a brightness enhancement sheet. , bracts or a combination thereof. In detail, if the optical film 150 is a brightness enhancement sheet, the brightness of the light emitted by the backlight module 100 can be further improved. If the optical film 15 is a diffuser, the light emitted by the backlight module 1 will form a relatively uniform surface light source through the optical film 150. If the optical film 150 is formed of a cymbal sheet, the direction of the light emitted by the backlight module 1 can be adjusted. In the backlight module 1A of the present embodiment and the display 300 using the backlight module 1', although the printed circuit board no is a light source driving circuit board as an example, the skilled person may not In contrast to the spirit of the present invention, the printed circuit board of the present embodiment is replaced with other types of circuit boards. For example, 'the printed circuit board can also be the panel control circuit board or the video signal control circuit board'. As long as the bent part is formed at the place where the back board contacts the metal wiring, the back board can be kept out of contact with the metal wiring, and the back is avoided. The board is shorted to the printed circuit board. In summary, the backlight module of the present invention and the display using the same have at least the following advantages: 1. The metal wiring can avoid contact with the back plate and have a good insulation effect with the back plate. Assembly yield of backlight module and display. 15 1352859 100-6-21 Second, the metal wiring is concentrated in the wire arrangement area on the surface of the printed circuit board, and the wire arrangement area is located on the side of the printed circuit board. Therefore, the metal wiring and other modules or power supply unit can be increased. The assembly of the connection is convenient. Second, the assembly convenience and yield of the backlight module and the display are increased, thereby saving the cost and working hours of the backlight module and the display rework. 4. The backlight module provides a stable light source of the liquid crystal display panel, and the display has a good and stable display effect. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; Retouching, = the scope of protection of the present invention is defined by the scope of the appended patent application. In the first and figure. 1 is a group diagram of a conventional light source module and a metal back plate.
圖2為本發明一種背光模組的局部示意圖。 =3A及犯分別為印刷電路板之金屬配 弟一表面的示意圖。 圖4為使用圖2之背光模組的顯示器的示意 【主要元件符號說明】 ω : LED光源模組 20 :印刷電路板2 is a partial schematic view of a backlight module of the present invention. = 3A and a schematic diagram of the surface of a metal counterpart of a printed circuit board. 4 is a schematic view of a display using the backlight module of FIG. 2. [Key element symbol description] ω : LED light source module 20 : Printed circuit board
S 16 1352859 100-6-21 22 :銅羯線路 30 :背板件 100 :背光模組 110 :印刷電路板 110a :第一表面 110b :第二表面 110c :導線配置區 110d :無導線區 112 :金屬配線 120 :光源 130 :背板 130a :第三表面 130b :第四表面 132 :折彎部 140 :鎖固件 150 :光學膜片 200 ·液晶顯不面板 300 :顯示器 310 :光源亮度調節裝置 312 :光感測元件 314 :控制電路單元 17S 16 1352859 100-6-21 22 : copper enamel line 30 : back plate member 100 : backlight module 110 : printed circuit board 110 a : first surface 110 b : second surface 110 c : wire arrangement area 110 d : no wire area 112 : Metal wiring 120: light source 130: back plate 130a: third surface 130b: fourth surface 132: bent portion 140: lock 150: optical film 200; liquid crystal display panel 300: display 310: light source brightness adjusting device 312: Light sensing element 314: Control circuit unit 17