1352419 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種發光單元，特別關於一種具有密閉 工間的發光單元。 【先％技術】 由於發光二極體（Light Emitting Diode, LED )具有高 免度及省電等優點，因此，隨著發光二極體的技術逐漸成 • # ’其應用領域也越來越廣泛，例如照明設備及背光源。 ’ 請參照圖1所示，一種習知的發光單元1包含一電路 基板11、複數個發光二極體晶粒12、一封膠體13及一反 射喊體（lamp house) 14。其中，發光二極體晶粒12係設 於電路基板11上，並利用打線接合（ wire bonding)的 式與電路基板11電性連接。封膠體13為透光材料，並 用 中Λ保護發光二極體晶粒12，反射殼體14係用以反射集 發光二極體晶粒12的出光方向。 在習知技術中’當發光二極體晶粒12發光時’其會 l3 大量的熱能’且發光二極體晶粒12、固化後之封膠體 電路基板11及反射殼體14四者之材質的熱膨脹係數 相同，因此將會造成夾置於發光二椏體晶粒12、封膠 13、電路基板11及反射殼體14之間的導線w，受到撥 或技扯而產生變形或斷裂，進而可能造成發光二極體晶 1之無法發光的情形，也會使得發光單元1產生缺陷。 中 ’熱膨脹程度不同所造成的影響，尤其是在具有大面 % 5 丄：)3Z4丄y 積封膠體的發光單元中更為嚴 重 另外，習知 技術架構亦不能改善發光二極體散熱的問 題。溫度最咼的…、口 j丨口j 膠體之中，因|| 门坪度的封 板。 此 P、能藉由熱傳導方式將熱導引至電路基 因此，如何括 封夥體材質、替^種能避免發光二極體晶粒之導線因 不同而產线2二極體錄與電路基板之間熱膨脹程度 元，已成為重要===’以及能夠改善散熱的發光單 【發明内容】 發光= =本發明之-目的為提供-種能避免 基板之間材㈣^ 封膠體、發光二極體晶粒與電路 有鐘於上塊課„同而產生斷裂的發光單元。 高發光二極明之另—目的為提供-種能提 為達上述目^的發光單元。 光管體、至少^，依據本發明之—種發光單元包含一透 一 电路基板、複數個發光二極體晶粒及至少 二連接電極。透絲體敍少部分透光，並具有—密閉空 :^路基板係設置於透光管體之密閉㈣。料發光二 趣=日曰粒係覆晶接合或打線接合於電路基板之上。該等連 电極係與該等發光二極體晶粒電性連接。 麵靜^上所述，因依據本發明之一種發光單元係將發光二 -Β曰粒置於透光管體的密閉空間内，因此發光單元不需 6 1352419 再利用高厚度封膠體將發光二極體晶粒整個包覆。藉由透 光管體即可保護發光二極體晶粒不受水氣或灰塵等外界 環境因素的影響，並可避免發光二極體晶粒與電路基板間 * 連接的導線，受擠壓或拉扯而產生變形或斷裂的情形。另 . 外，發光二極體晶粒少了高厚度封膠體的阻隔後，其散熱 路徑除了經由下方電路基板作散熱外，亦可直接經由上方 散熱，又若於密閉空間内充填惰氣、液態膠體、彈性膠體 或油質流體等，藉由氣體或流體之熱對流效應則更可提高 鲁.該等發光二極體晶粒的散熱效果。 另外，本發明之發光單元更可包含一反射層及一螢光 轉換材料。設置有反射層的透光管體除可增加固定方向之 出光效率外，並可使複數個發光二極體晶粒所發出的光線 先於透光管體内進行混光，以使發光單元能發出均勻的光 源。而螢光轉換材料則可用以改變發光單元的出光顏色， 以增加發光單元的應用範圍。 ®【實施方式】 • 以下將參照相關圖式，說明依據本發明之一種發光單 - 元，其中相同的元件將以相同的參照符號加以說明。 第一實施例 請參照圖2所示，本發明第一實施例之一種發光單元 2包含一透光管體21、· 一電路基板22、複數個發光二極體 晶粒23及至少二連接電極24。 透光管體21係至少部分透光，且具有一密閉空間 7 1352419 211，換言之，透光管體21係可具有一透光部及一非透光 部，意即透光管體21可部分透光、部分不透光，當然透 光管體21亦可全部透光。密閉空間211可為真空或充填 * 有氣體，例如充填有惰氣（inert gas )或氮氣。另外，密 . 閉空間211亦可充填一膠體或一流體，其中膠體例如為液 態膠體或彈性膠體，而流體例如為油質流體，且液態膠 體、彈性膠體或油質流體之折射率係大於1.3。另外，當 透光管體21之表面為曲面時，液態膠體、彈性膠體或油 ·.質流體的折射率係可大於或等於透光管體21之透光部的 :折射率，藉此可造成集光的功能，.使透光管體21的出光 面形成類似凸透鏡的效果。 上述之密閉空間211的形成方式係可利用熔合或膠合 等方式，其中，膠合方式包含封膠後紫外光固化、封膠後 熱固化、封膠後自然乾燥、安裝蓋體後封膠固化等方式完 成。 I 在本實施例中，透光管體21之透光部的材質例如為 高分子聚合材料、玻璃或石英之至少其中之一，而非透光 • 部的材質例如為高分子聚合材料、陶瓷或金屬之至少其中 - 之一。其中，高分子聚合材料係可選自聚苯乙烯 (polystyrene，PS )、？畏碳酸酉旨（polycarbonate，PC )、苯乙 稀-曱基丙稀酸曱酉旨樹脂（methylstyrene, MS )、聚曱基丙 稀酸甲 §旨（polymethylmethacrylate, PMMA)或丙烯晴-丁 二稀-苯乙烯（Acrylonitrile Butadiene Styrene, ABS )至少 其中之一。另外，若透光管體21為金屬材質，則於發光 1352419 二極體晶粒23的出光面具有一開口，其係為透光部，以 使光線射出。由於金屬本身具有高反射率、良好的散熱效 果及容易加工成型等優點，藉此可增加發光單元2的應用 - 範圍。 . 透光管體21亦可捧雜複數個散射體（scattering center )，其可為散射粒子或散射氣泡，以增加光擴散的效 果。其中，散射粒子之材料可利用與透光管體21之折射 率不同的有機散射體或無機散射體，例如硫酸鋇 • (BaS04)、二氧化矽（Si02)或氧化鋁（Al2〇3)等。又，透 光管體21例如為直條型（strip type )，且其截面形狀例如 為圓形、橢圓形、三角形、四邊形、多邊形或不規則形， 於本實施例中，係以圓形為例作說明。 電路基板22設置於透光管體21之密閉空間211，且 電路基板22例如為一玻璃基板、一樹脂基板、一陶瓷基 板或一金屬基板。 發光二極體晶粒23係設置於電路基板22之一表面， * 且發光二極體晶粒23可利用覆晶接合（flip-chip)或打線 • 接合（wire-bonding)方式與電路基板22電性連接。另外， - 該等發光二極體晶粒23之發射光譜例如為可見光範圍及/ 或紫外光範圍，其中該等發光二極體晶粒23之發射光譜 若為可見光範圍，則發光二極體晶粒23可選自紅光發光 二極體晶粒、綠光發光二極體晶粒、藍光發光二極體晶粒 及其組合所構成的群組。 連接電極24係與發光二極體晶粒23電性連接，且連 9 1352419 接電極24係可設置於電路基板 電路基板22之兩端。其中， 、端或是分別設置於 光管體21之外部。在本實施例中，^係電性連接至透 別經由-金屬導線241而電性連接電極24係分 於此值得-提的是，複數個發光至遷光管趙21外部。 光官體21外部的連接器或其他 亦可藉由設置於透 接，其中連接H或連接機構縣 接機構來進行串 另外，請參照圖3所示，連接電極24^ 24電性連接。 光管體21的外部。 亦可直接延伸至透 承上所述，請參照圖2所示，由 _ 粒23係位於透光管體。的密閉空間2;; 例之發光單元2不需再利用高厚度封膠體將 體晶粒23整個包覆。藉由透光管體21即可保護 -極體晶粒23不受水氣或灰塵等外界環境因素的影響， 並可避免各發光二極體晶粒23與電路基板22間連接的導 線受擠壓或拉扯而產生變形或斷裂的情形。另外，該等發 光二極體晶粒23少了高厚度封膠體的阻隔後，其散熱路 徑除經由下方電路基板22作散熱外，亦可直接經由上方 散熱，又若於透光管體21内充填氣體、液態膠體、彈性 膠體或油質流體等，藉由氣體或流體之熱對流效應則更可 提高該等發光二極體晶粒23的散熱效果。 本實施例之發光單元亦可利用部分覆蓋於單顆發光 二極體晶粒的封膠體作為提高發光二極體晶粒之出光效 率及出光範圍的功此。清參照圖4所示，發光單元2更包 1352419 含至少一封膠體27，其係覆蓋該等發光二極體晶粒23之 至少其中之一的至少一部分面積，意即，封膠體27並未 完全包覆發光二極體晶粒23。其中，封膠體27係可覆蓋 - 發光二極體晶粒23之出光面，或覆蓋發光二極體晶粒23 . 與至少一導線W的接觸點，且封膠體27未完全覆蓋導線 W。 封膠體27可為一多層折射率材料結構，其材料特性 為隨著與各發光二極體晶粒23的距離由近到遠，材料的 • 折射率由大至小作排列。因此，藉由封膠體27多層折射 率材料結構的特性，即可避免該等發光二極體晶粒23介 面之間容易發生全反射所導致的出光效率下降，進而使發 光單元2的出光效率提高。 第二實施例 請同時參照圖5A及圖5B所示，其中圖5B為沿圖5 A 中之A-A直線的剖面圖。本發明第二實施例之發光單元 2A與第一實施例的差異在於：發光單元2A更包含一反射 • . 部及一螢光轉換材料26。其中，反射部可以係為透光管體 * 21之一部分，或是如本實施例所述係外加一反射層2 5。 . 在本實施例中，反射層25係設置於透光管體21之外 表面，其並具有至少一開口部251，且開口部251係對應 於該等發光二極體晶粒23之一出光面。反射層25之材料 係選自反射頻譜為紫外光波段（ 200-400nm)、可見光藍光 波段（ 400-480nm)或可見光全波段（ 400-780nm)之其中 之一，且其反射率至少大於50%以上。另外，反射層25 11 :利用一氧化鈦（加2)、硫酸鋇（Bas04)或氧化叙⑷ 或才料並以塗佈或印刷來形成於透光管雜21之外表面， ^將上述材料加人塑膠材料t，再以麼出成形、射出成形 6方式形成反射層25。又，反射層25亦可藉由設置一反 ^ y ' — #· H -v 办 ^ ^ 兄月或一多層鍍膜材料於透光管體21之外表 面來達成。 螢光轉換材料26係可設置於至少部分的透光管體21 卩分外表面、部分内表面、直接摻雜於透光管體21及/ 或是捧雜於第—實施例中所述的膠體或流體中。於本實施 」中，螢光轉換材料26係對應設置於開口部251的透光 二體21的外表面。且螢光轉換材料26至少包含一黃色螢 光轉換材料、一紅色螢光轉換材料、一綠色螢光轉換材料 或一藍色螢光轉換材料。 藉由反射層25的設置可集中發光單元2Α的出光方 向’且可利用反射層25使該等發光二極體晶粒23發出的 光線先於透光管體21内進行混光後再射出’以使發光單 元2Α能發出均勻的光源。又，藉由螢光轉換材料26則玎 改變發光單元2Α的出光顏色。 另外’請參照圖6Α所示，反射層25Α亦可設置於透 光管體21之内表面，且反射層25Α亦具有開口部251，其 係對應於該等發光二極體晶粒23之出光面，而螢光轉換 材料26亦可設置於對應於開口部251的透光管體21的内 表面或外表面。於此則以設置於對應於開口部251的透光 管體21的内表面為例作說明。又，請參照圖6Β所示，邡 12 1352419 可同時於透光管體21之内表面及外表面設置反射層25B 及反射層25C。需注意者，設置於透光管體21之内表面及 外表面的反射層25B及反射層25C係為錯位設置，但應避 • 免覆蓋住出光用的開口部251。 , 請參照圖7所示，螢光轉換材料亦可改以利用一螢光 體膠帶（phosphor tape) T來取代，螢光體膠帶T係設置 於至少部分的透光管體21之外表面及/或内表面，於此螢 光體膠帶T是以黏貼設置於透光管體21之外表面為例作 • 說明。螢光體膠帶T例如具有一黏著層T1及一螢光層T2, 螢光層T2中則摻雜有螢光體，以改變出光顏色。其中需 注意者，螢光體膠帶T依不同的需求可有不同的組成。 另外，上述之反射層係以設置於透光管體為例說明， 然而，反射層亦可設置於電路基板之表面。以下，請參照 圖8A至圖8D所示，其係為一電路基板32的長轴剖面圖。 為求清楚說明，以下圖示中皆省略透光管體，然於實際應 用時，電路基板32仍應設置於透光管體内。 I 如圖8A至圖8D所示，電路基板32之之一表面或相 * 對之表面係設置有複數發光二極體晶粒33,而與上述實施 . 例相同，發光二極體晶粒33係可以覆晶接合或打線接合 於電路基板32之上，於此係以覆晶接合為例。 請參照圖8A所示，一反射層35係設置於電輅基板32 上之該等發光二極體晶粒33的周圍。利用反射層35將由 發光二極體晶粒33所發射至電路基板32的光線反射，藉 此可增加該等發光二極體晶粒33所發出光線的利用率。 13 1352419 其中，反射層35之材質係與上述實施例中的反射層之材 質相同，於此不再贅述。 另外，請參照圖8B所示，若電路基板32為透明基板 - 時，反射層35A係可設置於電路基板32與該等發光二極 . 體晶粒33相反的另一面，以反射發光二極體晶粒33所發 射出的光線。 接著，請參照圖8C所示，該等發光二極體晶粒33係 可以錯位的方式分別設置於電路基板32的正反兩面，於 • 此，可分別將一反射層35B、35C分別設置於電路基板32 之正反兩面之該等發光二極體晶粒33的周圍。又，請參 照圖8D所示，該等發光二極體晶粒33亦可以對位的方式 分別設置於電路基板32的正反兩面，於此，可分別將一 反射層35D、35E分別設置於電路基板32之正反兩面該等 發光二極體晶粒33的周圍。需注意者，反射層的設置非 為限制性，依不同的設計亦可僅設置於部分的發光二極體 0 晶粒33的周圍。 另外，請參照圖9所示，電路基板32上該等發光二 • 極體晶粒33周邊亦可設置有一反射殼體（lamp house)L， • 藉此可用以反射集中發光二極體晶粒33的出光方向。 第三實施例 承上所述，發光單元的透光管體除可如上所述係為一 體成型之外，亦可由至少二殼體元件所構成。請參照圖10A 與圖10B所示，發光單元4的一透光管體41係由二殼體 元件412、413所構成。電路基板42之上同樣設置有複數 14 1352419 發光二極體晶粒43及二連接電極44,且電路基板42夾置 於二殼體元件412、413之間。其中，一反射層45係可設 置或形成於電路基板42之上，而一螢光轉換材料46則可 - 設置或形成於殼體元件412，然其非為限制性，其變化態 ^ 樣亦可參照上述實施例。另外，由於透光管體41係可具 有一透光部及一非透光部，意即可部分透光、部分不透 光，因此殼體元件412、413亦可部分透光、部分不透光， 例如於電路基板42下的殼體元件413可為不透光，然其 • 非用以限制本發明。 該等殼體元件412、413係在對應設置後，利用膠合 或熔合等方式結合，以形成密閉空間411。其中，膠合方 式包含封膠後紫外光固化、封膠後熱固化或封膠後自然乾 燥等。另外，該等殼體元件412、413亦可先以鎖合或卡 合結合後，再以膠合或溶合方式作結合。 另外，請參照圖11所示，若於該等發光二極體晶粒 43出光面上之殼體形狀為三角形、四邊形、多邊形或不規 ® 則形等，則對應各發光二極體晶粒43上之殼體的外表面 - 或内表面係可具有一透鏡結構S，藉由不同透鏡的結構， . 以使發光二極體晶粒43所發出的光產生聚光或散光的效 果。於此以透鏡結構S設置於殼體元件412A的外表面為 例作說明，然其非限制性。 綜上所述，因依據本發明之一種發光單元係將發光二 極體晶粒置於透光管體的一密閉空間内，因此發光單元不 需再利用高厚度封膠體將發光二極體晶粒整個包覆。藉由 15 1352419 透光管體即可保護發光二極體晶粒不受水氣或灰塵等外 界環境因素的影響，並可避免發光二極體晶粒與電路基板 間連接的導線，受擠壓或拉扯而產生變形或斷裂的情形。 - 另外，發光二極體晶粒少了高厚度封膠體的阻隔後，其散 . 熱路徑除經由下方電路基板作散熱外，亦可直接經由上方 散熱，又若於密閉空間内充填惰氣、膠體或流體等，藉由 氣體或流體之熱對流效應則更可提高該等發光二極體晶 粒的散熱效果。 • 另外，本發明之發光單元更可包含一反射層及一螢光 轉換材料。設置有反射層的透光管體上除可增加固定方向 之出光效率外，並可使複數個發光二極體晶粒所發出的光 線先於透光管體内進行混光，以使發光單元能發出均勻的 光源。而螢光轉換材料則可用以改變發光單元的出光顏 色，以增加發光單元的應用範圍。螢光轉換材料更可改以 利用螢光體膠帶來取代，來增加製程效率及產品可靠度。 以上所述僅為舉例性，而非為限制性者。任何未脫離. * 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1為一種習知的發光單元示意圖； 圖2為本發明第一實施例之一種發光單元示意圖； 圖3為本發明第一實施例之發光單元另一變化態樣示 意圖； 16 1352419 圖4為本發明第一實施例之發光單元又一變化態樣示 意圖； 圖5A為本發明第二實施例之發光單元示意圖，圖5B . 為沿圖5A中之A-A直線的發光單元剖面圖； . 圖6A及圖6B為本發明第二實施例之發光單元的一變 化態樣示意圖； 圖7為本發明第二實施例之發光單元的另一變化態樣 不意圖， • 圖8A至圖8D為本發明之反射層設置於電路基板上的 不同變化態樣示意圖； 圖9為本發明第—二實施例之發光單元的又一變化態樣 不意圖， 圖10A及圖10B為本發明第三實施例之發光單元的示 意圖；以及 圖11為本發明第三實施例之發光單元的另一變化態 樣示意圖。 * 【主要元件符號說明】 .1、2、2A、4 :發光單元 11、 22、32、42 :電路基板 12、 23、33、43 :發光二極體晶粒 13、 27 :封膠體 14、 L· :反射殼體 21、41 :透光管體 17 1352419 211、411 :密閉空間 24、44 :連接電極 241 :金屬導線 -25、25A〜25C、35、35A〜35E、45 反射層 .251 :開口部 412、412A、413 :殼體元件 26、46 :螢光轉換材料 A-A .直線 • S :透鏡結構 T :螢光體膠帶 T1 :黏著層 T2 :螢光層 W :導線1352419 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting unit, and more particularly to a light-emitting unit having a closed work space. [First Technology] Since the Light Emitting Diode (LED) has the advantages of high degree of freedom and power saving, the technology of the LED has gradually become more and more widely used. For example, lighting equipment and backlights. Referring to FIG. 1, a conventional light-emitting unit 1 includes a circuit substrate 11, a plurality of light-emitting diode chips 12, a gel 13 and a lamp house 14. The light-emitting diode die 12 is provided on the circuit board 11 and electrically connected to the circuit board 11 by wire bonding. The encapsulant 13 is a light transmissive material, and the light emitting diode die 12 is protected by a middle cymbal, and the reflective casing 14 is used to reflect the light outgoing direction of the luminescent diode die 12. In the prior art, when the light-emitting diode die 12 emits light, it will have a large amount of thermal energy and the materials of the light-emitting diode die 12, the cured sealant circuit substrate 11 and the reflective casing 14 The coefficient of thermal expansion is the same, so that the wire w sandwiched between the light-emitting diode body 12, the sealant 13, the circuit substrate 11 and the reflective casing 14 is deformed or broken by the dialing or technical pulling, and further The case where the light-emitting diode crystal 1 cannot be caused to emit light may cause the light-emitting unit 1 to be defective. The effect of the difference in the degree of thermal expansion is especially serious in the illuminating unit with the large surface % 5 丄 :) 3Z4 丄 y encapsulation colloid. Moreover, the conventional technical architecture cannot improve the heat dissipation of the illuminating diode. . The temperature is the most embarrassing..., mouth j丨 mouth j colloid, because || This P can guide heat to the circuit base by means of heat conduction. Therefore, how to cover the body material, and to prevent the wires of the light-emitting diode die from being produced, the two-pole recording and circuit substrate are produced. The degree of thermal expansion between the elements has become an important ===' and a light-emitting single that can improve heat dissipation. [Inventive content] Illumination = = The purpose of the present invention is to provide a kind of material that can avoid inter-substrate (4) ^ encapsulant, light-emitting diode The body grain and the circuit have a light-emitting unit that is broken in the upper block. The high-light-emitting diode is the other one. The purpose is to provide a light-emitting unit capable of raising the above-mentioned object. The light pipe body, at least ^, The light-emitting unit according to the present invention comprises a transparent circuit substrate, a plurality of light-emitting diode crystal grains and at least two connecting electrodes. The light-transmitting body has a small portion of light transmission, and has a closed space: the circuit substrate is disposed on The light-transmissive tube body is sealed (4). The light-emitting material is interesting: the Japanese granules are flip-chip bonded or wire bonded to the circuit substrate. The connecting electrodes are electrically connected to the light-emitting diode crystal grains. According to the above, a luminescence according to the invention The elementary system places the light-emitting bismuth particles in a sealed space of the light-transmissive tube body, so that the light-emitting unit does not need 6 1352419 and then coats the light-emitting diode crystal grains with a high-thickness sealant. The illuminating diode dies can be protected from external environmental factors such as moisture or dust, and the wires connecting the illuminating diode dies and the circuit substrate can be prevented from being deformed or broken by being squeezed or pulled. In addition, after the light-emitting diode has less barrier of high-thickness sealing body, the heat-dissipating path can be directly radiated through the upper surface in addition to heat dissipation through the lower circuit substrate, and if it is filled in the sealed space, it is filled. Gas, liquid colloid, elastic colloid or oleaginous fluid, etc., the heat convection effect of the gas or fluid can further improve the heat dissipation effect of the light-emitting diode crystal grains. In addition, the light-emitting unit of the present invention can further comprise a reflective layer and a fluorescent conversion material. The light-transmissive tube body provided with the reflective layer can increase the light-emitting efficiency in a fixed direction, and can cause the light emitted by the plurality of light-emitting diode crystal grains to precede the light-transmitting tube. The light is mixed in the body so that the light emitting unit can emit a uniform light source. The fluorescent conversion material can be used to change the light output color of the light emitting unit to increase the application range of the light emitting unit. [Embodiment] • Reference will be made to the related drawings below. In the above, a light-emitting unit according to the present invention will be described with the same reference numerals. First Embodiment Referring to FIG. 2, a light-emitting unit 2 according to a first embodiment of the present invention includes a a light-transmissive tube body 21, a circuit substrate 22, a plurality of light-emitting diode crystal grains 23, and at least two connection electrodes 24. The light-transmitting tube body 21 is at least partially transparent and has a closed space 7 1352419 211, in other words, The light-transmitting tube body 21 can have a light-transmitting portion and a non-light-transmitting portion, that is, the light-transmitting tube body 21 can be partially transparent and partially opaque. Of course, the light-transmitting tube body 21 can also transmit light. The confined space 211 can be vacuum or filled. * There is a gas, such as an inert gas or nitrogen. In addition, the closed space 211 may also be filled with a colloid or a fluid, wherein the colloid is, for example, a liquid colloid or an elastic colloid, and the fluid is, for example, an oleaginous fluid, and the refractive index of the liquid colloid, the elastic colloid or the oleaginous fluid is greater than 1.3. . In addition, when the surface of the light-transmitting tube body 21 is a curved surface, the refractive index of the liquid colloid, the elastic colloid or the oil-based fluid may be greater than or equal to the refractive index of the light-transmitting portion of the light-transmitting tube body 21, thereby The function of collecting light causes the light-emitting surface of the light-transmitting tube body 21 to form a convex lens-like effect. The sealing space 211 can be formed by fusion or gluing. The gluing method includes ultraviolet curing after encapsulation, thermal curing after sealing, natural drying after sealing, and curing after mounting the cover. carry out. In the present embodiment, the material of the light transmitting portion of the light transmitting tube body 21 is, for example, at least one of a polymer material, glass or quartz, and the material of the non-light transmitting portion is, for example, a polymer material or a ceramic. Or at least one of the metals - one. Among them, the polymer material can be selected from polystyrene (PS), ? Polycarbonate (PC), styrene-methyl-acrylic acid (MS), polymethylmethacrylate (PMMA) or acrylonitrile-butadiene At least one of styrene (Acrylonitrile Butadiene Styrene, ABS). Further, if the light-transmitting tube body 21 is made of a metal material, the light-emitting mask of the light-emitting 1352419 diode crystal 23 has an opening which is a light-transmitting portion for emitting light. Since the metal itself has the advantages of high reflectivity, good heat dissipation effect, and easy processing and molding, the application range of the light-emitting unit 2 can be increased. The light-transmitting tube body 21 can also hold a plurality of scattering centers, which can be scattering particles or scattering bubbles to increase the effect of light diffusion. The material of the scattering particles may be an organic scatterer or an inorganic scatterer different from the refractive index of the light-transmitting tube body 21, such as barium sulfate (BaS04), cerium oxide (SiO 2 ) or alumina (Al 2 〇 3 ). . Further, the light-transmitting tube body 21 is, for example, a strip type, and its cross-sectional shape is, for example, a circle, an ellipse, a triangle, a quadrangle, a polygon, or an irregular shape. In the present embodiment, the circular shape is An example is given. The circuit board 22 is disposed in the sealed space 211 of the light-transmitting tube body 21, and the circuit board 22 is, for example, a glass substrate, a resin substrate, a ceramic substrate or a metal substrate. The light emitting diode die 23 is disposed on one surface of the circuit substrate 22, and the light emitting diode die 23 can be flip-chip or wire-bonding to the circuit substrate 22 by means of flip-chip bonding or wire bonding. Electrical connection. In addition, the emission spectrum of the light-emitting diode crystal grains 23 is, for example, a visible light range and/or an ultraviolet light range, wherein if the emission spectrum of the light-emitting diode crystal grains 23 is in the visible light range, the light-emitting diode crystal The particles 23 may be selected from the group consisting of red light emitting diode grains, green light emitting diode grains, blue light emitting diode grains, and combinations thereof. The connection electrode 24 is electrically connected to the LED die 23, and the connection electrode 24 can be disposed at both ends of the circuit substrate circuit substrate 22. Wherein, the ends are respectively disposed outside the optical tube body 21. In the present embodiment, it is worthwhile to electrically connect the electrodes 24 to each other via the -metal wires 241. It is worth mentioning that a plurality of light are emitted to the outside of the light-removing tube Zhao 21. The connector external to the illuminating body 21 or the like may be arranged by means of a connection, in which the connection H or the connection mechanism is connected. Referring to Fig. 3, the connection electrodes 24^24 are electrically connected. The outside of the light pipe body 21. It can also be directly extended to the above, as shown in Fig. 2, the _ particles 23 are located in the light-transmissive tube. The sealed space 2;; for example, the light-emitting unit 2 does not need to use the high-thickness sealant to completely coat the bulk crystal grains 23. The transparent body 21 can be protected by the external environment factors such as moisture or dust, and the wire connecting between the LEDs 23 and the circuit substrate 22 can be prevented from being squeezed. A situation in which deformation or breakage occurs when pressed or pulled. In addition, after the light-emitting diode crystal grains 23 have less barrier of the high-thickness sealing body, the heat dissipation path can be directly radiated through the upper surface of the circuit board 22, and the heat-dissipating path can be directly radiated through the upper portion. Filling gas, liquid colloid, elastic colloid or oily fluid, etc., the heat convection effect of the gas or fluid can further improve the heat dissipation effect of the light-emitting diode crystal grains 23. The light-emitting unit of this embodiment can also utilize a sealant partially covering a single light-emitting diode die as a function of improving the light-emitting efficiency and the light-emitting range of the light-emitting diode die. As shown in FIG. 4, the light-emitting unit 2 further includes 1352219 including at least one colloid 27 covering at least a portion of the area of at least one of the light-emitting diode crystal grains 23, that is, the sealant 27 is not The light-emitting diode die 23 is completely covered. The sealing body 27 can cover the light emitting surface of the light emitting diode die 23 or cover the contact point of the light emitting diode die 23 with at least one wire W, and the sealing body 27 does not completely cover the wire W. The encapsulant 27 can be a multi-layer refractive index material having a material property such that the refractive index of the material is arranged from large to small as the distance from each of the light-emitting diode dies 23 is from near to far. Therefore, by virtue of the characteristics of the multilayer refractive index material structure of the encapsulant 27, the light-emitting efficiency degradation caused by the total reflection between the interfaces of the light-emitting diodes 23 can be avoided, and the light-emitting efficiency of the light-emitting unit 2 can be improved. . SECOND EMBODIMENT Please refer to FIG. 5A and FIG. 5B simultaneously, wherein FIG. 5B is a cross-sectional view taken along line A-A of FIG. 5A. The difference between the light-emitting unit 2A of the second embodiment of the present invention and the first embodiment is that the light-emitting unit 2A further includes a reflective portion and a fluorescent conversion material 26. The reflecting portion may be a part of the light transmitting tube body 21, or a reflecting layer 25 may be added as described in this embodiment. In this embodiment, the reflective layer 25 is disposed on the outer surface of the light-transmissive tube body 21 and has at least one opening portion 251, and the opening portion 251 corresponds to one of the light-emitting diode crystal grains 23 surface. The material of the reflective layer 25 is selected from one of the ultraviolet light (200-400 nm), the visible blue light (400-480 nm) or the visible light (400-780 nm), and the reflectance is at least 50%. the above. In addition, the reflective layer 25 11 is formed on the outer surface of the light-transmitting tube 21 by using titanium oxide (plus 2), barium sulfate (Bas04) or oxidized (4) or material, and coating or printing. The plastic material t is added, and the reflective layer 25 is formed by molding and injection molding. Moreover, the reflective layer 25 can also be achieved by providing an inverse ^ y ' — H·v ^ ^ 月 或 or a multi-layer coating material on the surface of the light-transmissive tube body 21. The fluorescent conversion material 26 can be disposed on at least a portion of the light-transmissive tube body 21, the outer surface, a portion of the inner surface, directly doped to the light-transmissive tube body 21, and/or are mixed in the first embodiment. In a colloid or fluid. In the present embodiment, the fluorescent conversion material 26 corresponds to the outer surface of the light-transmitting body 21 provided in the opening portion 251. The fluorescent conversion material 26 comprises at least a yellow fluorescent conversion material, a red fluorescent conversion material, a green fluorescent conversion material or a blue fluorescent conversion material. The light-emitting direction of the light-emitting unit 2 can be concentrated by the arrangement of the reflective layer 25, and the light emitted by the light-emitting diodes 23 can be mixed before the light-emitting tube 21 is mixed by the reflective layer 25. In order to enable the light-emitting unit 2 to emit a uniform light source. Further, the color of the light emitted from the light-emitting unit 2 is changed by the fluorescent conversion material 26. In addition, as shown in FIG. 6A, the reflective layer 25 can also be disposed on the inner surface of the light-transmitting tube body 21, and the reflective layer 25A also has an opening portion 251 corresponding to the light output of the light-emitting diode crystal grains 23. The phosphor conversion material 26 may be disposed on the inner surface or the outer surface of the light transmissive tube body 21 corresponding to the opening portion 251. Here, the inner surface of the light-transmitting tube body 21 corresponding to the opening portion 251 will be described as an example. Moreover, as shown in FIG. 6A, the 反射 12 1352419 can simultaneously provide the reflective layer 25B and the reflective layer 25C on the inner surface and the outer surface of the light-transmitting tube body 21. It is to be noted that the reflective layer 25B and the reflective layer 25C provided on the inner surface and the outer surface of the light-transmitting tube body 21 are disposed in a staggered manner, but the opening portion 251 for light emission should be prevented from being covered. Referring to FIG. 7, the fluorescent conversion material may be replaced by a phosphor tape T, which is disposed on at least a portion of the outer surface of the transparent tube body 21 and / or the inner surface, the phosphor tape T is attached to the outer surface of the light-transmitting pipe body 21 as an example. The phosphor tape T has, for example, an adhesive layer T1 and a phosphor layer T2, and the phosphor layer T2 is doped with a phosphor to change the color of the light. Among them, the phosphor tape T may have different compositions depending on different needs. Further, the reflective layer described above is exemplified as being disposed on the light-transmitting tube body. However, the reflective layer may be provided on the surface of the circuit board. Hereinafter, referring to Figs. 8A to 8D, it is a long-axis cross-sectional view of a circuit board 32. For the sake of clarity, the light-transmissive tube body is omitted in the following figures. However, in actual use, the circuit board 32 should still be disposed in the light-transmitting tube body. As shown in FIG. 8A to FIG. 8D, one surface or phase of the circuit substrate 32 is provided with a plurality of light-emitting diode crystal grains 33, and the light-emitting diode crystal grains 33 are the same as those of the above-described embodiment. The flip-chip bonding or wire bonding may be performed on the circuit substrate 32, for example, a flip chip bonding. Referring to FIG. 8A, a reflective layer 35 is disposed around the LED arrays 33 on the power substrate 32. The light emitted from the light-emitting diode die 33 to the circuit substrate 32 is reflected by the reflective layer 35, whereby the utilization of the light emitted by the light-emitting diode crystal grains 33 can be increased. 13 1352419 The material of the reflective layer 35 is the same as that of the reflective layer in the above embodiment, and details are not described herein. In addition, as shown in FIG. 8B, when the circuit board 32 is a transparent substrate, the reflective layer 35A may be disposed on the other side of the circuit substrate 32 opposite to the light-emitting diodes 33 to reflect the light-emitting diodes. The light emitted by the body grains 33. Next, as shown in FIG. 8C, the light-emitting diode crystal grains 33 are respectively disposed on the front and back surfaces of the circuit board 32 so as to be dislocated, so that a reflective layer 35B, 35C can be respectively disposed on the reflective layer 35B, 35C. The periphery of the light-emitting diode crystal grains 33 on the front and back sides of the circuit board 32. Moreover, as shown in FIG. 8D, the light-emitting diode crystal grains 33 may be disposed on the front and back surfaces of the circuit board 32 in a manner of being aligned, and respectively, a reflective layer 35D and 35E may be respectively disposed on the reflective substrate 35D and 35E. The front and back sides of the circuit board 32 are around the light-emitting diode crystal grains 33. It should be noted that the setting of the reflective layer is not limited, and may be disposed only around a part of the light-emitting diode 0 crystal 33 according to different designs. In addition, as shown in FIG. 9, a light-emitting diode body 33 on the circuit substrate 32 may also be provided with a lamp house L, which can be used to reflect the concentrated light-emitting diode die. 33 light direction. Third Embodiment As described above, the light-transmitting tube of the light-emitting unit may be formed of at least two housing members in addition to being integrally formed as described above. Referring to Figures 10A and 10B, a light-transmissive tube body 41 of the light-emitting unit 4 is composed of two housing members 412, 413. A plurality of 14 1352419 light-emitting diode dies 43 and two connection electrodes 44 are also disposed on the circuit substrate 42, and the circuit substrate 42 is interposed between the two housing members 412, 413. Wherein, a reflective layer 45 can be disposed or formed on the circuit substrate 42, and a fluorescent conversion material 46 can be disposed or formed on the housing member 412. However, it is not limited, and the variation is also Reference can be made to the above embodiment. In addition, since the light-transmitting tube body 41 can have a light-transmissive portion and a non-light-transmitting portion, it is partially transparent and partially opaque, so that the housing members 412 and 413 can also be partially transparent and partially opaque. Light, such as housing element 413 under circuit substrate 42, may be opaque, but it is not intended to limit the invention. The housing members 412, 413 are joined together by gluing or fusion to form a sealed space 411. Among them, the gluing method includes ultraviolet curing after sealing, heat curing after sealing, or natural drying after sealing. In addition, the housing members 412, 413 may be combined by gluing or bonding after being bonded or snap-fitted. In addition, as shown in FIG. 11, if the shape of the casing on the light-emitting surface of the light-emitting diode crystal grains 43 is triangular, quadrangular, polygonal, or irregular, the corresponding light-emitting diode crystal grains are corresponding. The outer surface - or the inner surface of the casing on the 43 may have a lens structure S, by the structure of the different lenses, so that the light emitted by the light-emitting diode crystals 43 has the effect of collecting or astigmatizing. Here, the lens structure S is disposed on the outer surface of the casing member 412A as an example, but it is not limited. In summary, since the light-emitting unit according to the present invention places the light-emitting diode crystal grains in a sealed space of the light-transmitting tube body, the light-emitting unit does not need to use the high-thickness sealant to form the light-emitting diode crystal. The whole grain is coated. The light-emitting diode body can protect the light-emitting diode crystals from external environmental factors such as moisture or dust by 15 1352419 light-transmitting tube body, and can avoid the wire connecting the light-emitting diode die and the circuit substrate, and is squeezed. Or pulling to cause deformation or breakage. - In addition, after the light-emitting diode crystal grains have less barrier of high-thickness sealant, the heat dissipation path can be directly radiated through the upper surface of the heat-dissipating path through the lower circuit substrate, and if the inert gas is filled in the sealed space, The heat convection effect of the gas or fluid by the colloid or fluid, etc., can further improve the heat dissipation effect of the light-emitting diode crystal grains. In addition, the light emitting unit of the present invention may further comprise a reflective layer and a fluorescent conversion material. The light-transmissive tube body provided with the reflective layer can increase the light-emitting efficiency in the fixed direction, and the light emitted by the plurality of light-emitting diode crystal grains can be mixed before the light-transmitting tube body to make the light-emitting unit Can emit a uniform light source. The fluorescent conversion material can be used to change the light-emitting color of the light-emitting unit to increase the application range of the light-emitting unit. Fluorescent conversion materials can be replaced with phosphor tape to increase process efficiency and product reliability. The above is intended to be illustrative only and not limiting. Any changes or modifications of the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional light emitting unit; FIG. 2 is a schematic view of a light emitting unit according to a first embodiment of the present invention; FIG. 3 is a schematic view showing another variation of the light emitting unit according to the first embodiment of the present invention; FIG. 4 is a schematic diagram of another embodiment of the illuminating unit according to the first embodiment of the present invention; FIG. 5A is a schematic diagram of a illuminating unit according to a second embodiment of the present invention, and FIG. 5B is a illuminating unit along the line AA of FIG. 5A; 6A and 6B are schematic views showing a variation of the light-emitting unit according to the second embodiment of the present invention; and FIG. 7 is another schematic view of the light-emitting unit according to the second embodiment of the present invention. 8D is a schematic diagram of different variations of the reflective layer of the present invention disposed on a circuit substrate; FIG. 9 is a schematic view of another embodiment of the light-emitting unit of the second embodiment of the present invention, and FIG. 10A and FIG. A schematic diagram of a light emitting unit according to a third embodiment of the present invention; and FIG. 11 is a schematic view showing another variation of the light emitting unit according to the third embodiment of the present invention. * [Description of main component symbols] .1, 2, 2A, 4: Light-emitting units 11, 22, 32, 42: circuit boards 12, 23, 33, 43: light-emitting diode crystal grains 13, 27: sealant 14, L· : reflective housing 21, 41: light-transmissive tube body 17 1352419 211, 411: sealed space 24, 44: connection electrode 241: metal wire -25, 25A to 25C, 35, 35A to 35E, 45 reflective layer. Openings 412, 412A, 413: Housing elements 26, 46: Fluorescent conversion material AA. Straight line • S: Lens structure T: Phosphor tape T1: Adhesive layer T2: Fluorescent layer W: Wire
1818