[go: up one dir, main page]

TWI351088B - Cdim-compliant bump on cdim structure - Google Patents

Cdim-compliant bump on cdim structure

Info

Publication number
TWI351088B
TWI351088B TW096141092A TW96141092A TWI351088B TW I351088 B TWI351088 B TW I351088B TW 096141092 A TW096141092 A TW 096141092A TW 96141092 A TW96141092 A TW 96141092A TW I351088 B TWI351088 B TW I351088B
Authority
TW
Taiwan
Prior art keywords
cdim
compliant bump
compliant
bump
cdim structure
Prior art date
Application number
TW096141092A
Other languages
Chinese (zh)
Other versions
TW200919669A (en
Inventor
Pei Hsien Wu
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW096141092A priority Critical patent/TWI351088B/en
Publication of TW200919669A publication Critical patent/TW200919669A/en
Application granted granted Critical
Publication of TWI351088B publication Critical patent/TWI351088B/en

Links

Classifications

    • H10W72/0198—
    • H10W70/09—
    • H10W72/241—
TW096141092A 2007-10-31 2007-10-31 Cdim-compliant bump on cdim structure TWI351088B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096141092A TWI351088B (en) 2007-10-31 2007-10-31 Cdim-compliant bump on cdim structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096141092A TWI351088B (en) 2007-10-31 2007-10-31 Cdim-compliant bump on cdim structure

Publications (2)

Publication Number Publication Date
TW200919669A TW200919669A (en) 2009-05-01
TWI351088B true TWI351088B (en) 2011-10-21

Family

ID=44727191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096141092A TWI351088B (en) 2007-10-31 2007-10-31 Cdim-compliant bump on cdim structure

Country Status (1)

Country Link
TW (1) TWI351088B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618160B (en) * 2017-06-19 2018-03-11 佐臻股份有限公司 Semiconductor device having a multi-wafer stack, a gold bond wire, and a fan-out type RDL layer Low cost manufacturing method

Also Published As

Publication number Publication date
TW200919669A (en) 2009-05-01

Similar Documents

Publication Publication Date Title
GB0717839D0 (en) The treepee
TWI340470B (en) Semiconductor structure
GB0803722D0 (en) Shock bump
EP2143972A4 (en) Bump stopper
GB0702228D0 (en) The cosy-cushion
GB0707146D0 (en) The bealyboard
TWI351088B (en) Cdim-compliant bump on cdim structure
GB0701235D0 (en) Post pad
TWI319374B (en) Package structure
TWI339887B (en) Chip-stacked package structure
GB0711387D0 (en) The fincubator
GB0701309D0 (en) The easi-strutt
GB0720820D0 (en) Veranda on the world
GB0713842D0 (en) Flip over
AU319095S (en) Structure
AU319097S (en) Structure
AU319096S (en) Structure
GB0714206D0 (en) Quantum devices
GB0713046D0 (en) The duveze
GB0720075D0 (en) The groom-buddy
GB0710246D0 (en) The hydra-pack
GB0710701D0 (en) The kaleidosphere
GB0705727D0 (en) The degravitator
GB0711847D0 (en) The potashe
GB0704798D0 (en) The dagice

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees