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TWI350711B - Ceramic heater, method for manufacturing ceramic heater, and power supplying components for heater - Google Patents

Ceramic heater, method for manufacturing ceramic heater, and power supplying components for heater

Info

Publication number
TWI350711B
TWI350711B TW095140573A TW95140573A TWI350711B TW I350711 B TWI350711 B TW I350711B TW 095140573 A TW095140573 A TW 095140573A TW 95140573 A TW95140573 A TW 95140573A TW I350711 B TWI350711 B TW I350711B
Authority
TW
Taiwan
Prior art keywords
heater
ceramic heater
power supplying
supplying components
manufacturing
Prior art date
Application number
TW095140573A
Other languages
English (en)
Other versions
TW200735691A (en
Inventor
Takuma Kushihashi
Noboru Kimura
Mitsuhiro Kanai
Yoshihiko Shimizu
Akihiko Hara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005355426A external-priority patent/JP2007157661A/ja
Priority claimed from JP2006073790A external-priority patent/JP2007250403A/ja
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200735691A publication Critical patent/TW200735691A/zh
Application granted granted Critical
Publication of TWI350711B publication Critical patent/TWI350711B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Resistance Heating (AREA)
TW095140573A 2005-12-08 2006-11-02 Ceramic heater, method for manufacturing ceramic heater, and power supplying components for heater TWI350711B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005355426A JP2007157661A (ja) 2005-12-08 2005-12-08 セラミックスヒーターおよびセラミックスヒーターの製造方法
JP2006073790A JP2007250403A (ja) 2006-03-17 2006-03-17 セラミックスヒーターおよびヒーター給電部品

Publications (2)

Publication Number Publication Date
TW200735691A TW200735691A (en) 2007-09-16
TWI350711B true TWI350711B (en) 2011-10-11

Family

ID=37986793

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140573A TWI350711B (en) 2005-12-08 2006-11-02 Ceramic heater, method for manufacturing ceramic heater, and power supplying components for heater

Country Status (4)

Country Link
US (1) US20070131674A1 (zh)
EP (1) EP1799014B1 (zh)
KR (1) KR101299495B1 (zh)
TW (1) TWI350711B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI841664B (zh) * 2019-01-25 2024-05-11 日商日本碍子股份有限公司 陶瓷加熱器及其製法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4435742B2 (ja) * 2005-08-09 2010-03-24 信越化学工業株式会社 加熱素子
DE102008062199A1 (de) * 2008-05-29 2009-12-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Heizeinrichtung zum Thermoformen
US10727092B2 (en) * 2012-10-17 2020-07-28 Applied Materials, Inc. Heated substrate support ring
JP5996519B2 (ja) * 2013-03-13 2016-09-21 信越化学工業株式会社 セラミックヒーター
CN104411032A (zh) * 2014-10-17 2015-03-11 芜湖市泰能电热器具有限公司 一种m型加热铝管
JP2019060819A (ja) * 2017-09-28 2019-04-18 日本特殊陶業株式会社 電子部品検査装置用配線基板
JP6792539B2 (ja) * 2017-10-31 2020-11-25 日本特殊陶業株式会社 流体加熱用のセラミックヒータ
TWI743446B (zh) 2018-02-20 2021-10-21 美商應用材料股份有限公司 用於原子層沉積(ald)溫度均勻性的熱解氮化硼(pbn)加熱器
CN108863443B (zh) * 2018-07-10 2021-05-14 山东国晶新材料有限公司 一种平面复合加热器的制备方法
US12273965B2 (en) * 2018-11-19 2025-04-08 Niterra Co., Ltd. Holding device and method of manufacturing holding device
KR102352837B1 (ko) * 2019-07-01 2022-01-20 주식회사 미코세라믹스 세라믹 히터용 접속 부재
US12334341B2 (en) * 2021-02-11 2025-06-17 Applied Materials, Inc. Chamber body feedthrough for in chamber resistive heating element
JP7514815B2 (ja) * 2021-12-22 2024-07-11 日本碍子株式会社 半導体製造装置用部材

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343022A (en) * 1992-09-29 1994-08-30 Advanced Ceramics Corporation Pyrolytic boron nitride heating unit
JP3560456B2 (ja) * 1997-12-11 2004-09-02 信越化学工業株式会社 複層セラミックスヒータ
JP3477062B2 (ja) * 1997-12-26 2003-12-10 京セラ株式会社 ウエハ加熱装置
JPH11343571A (ja) * 1998-05-29 1999-12-14 Ngk Insulators Ltd サセプター
JPH11354260A (ja) * 1998-06-11 1999-12-24 Shin Etsu Chem Co Ltd 複層セラミックスヒータ
JP2001006584A (ja) * 1999-06-24 2001-01-12 Toshiba Corp 陰極線管
US6452137B1 (en) * 1999-09-07 2002-09-17 Ibiden Co., Ltd. Ceramic heater
US6534751B2 (en) * 2000-02-28 2003-03-18 Kyocera Corporation Wafer heating apparatus and ceramic heater, and method for producing the same
US6960743B2 (en) * 2000-12-05 2005-11-01 Ibiden Co., Ltd. Ceramic substrate for semiconductor manufacturing, and method of manufacturing the ceramic substrate
EP1418160A1 (en) * 2001-07-19 2004-05-12 Ibiden Co., Ltd. CERAMIC CONNECTION BODY, METHOD OF CONNECTING THE CERAMIC BODIES, AND CERAMIC STRUCTURAL BODY
JP4331427B2 (ja) * 2001-10-03 2009-09-16 住友電気工業株式会社 半導体製造装置に使用される給電用電極部材
KR20040068154A (ko) * 2001-11-30 2004-07-30 이비덴 가부시키가이샤 세라믹 히터
US20040074898A1 (en) * 2002-10-21 2004-04-22 Mariner John T. Encapsulated graphite heater and process
US7364624B2 (en) * 2003-01-17 2008-04-29 Momentive Performance Materials Inc. Wafer handling apparatus and method of manufacturing thereof
JP4602662B2 (ja) * 2003-12-01 2010-12-22 株式会社ブリヂストン セラミックヒータユニット
TWI281833B (en) * 2004-10-28 2007-05-21 Kyocera Corp Heater, wafer heating apparatus and method for manufacturing heater
JP4435742B2 (ja) * 2005-08-09 2010-03-24 信越化学工業株式会社 加熱素子
JP2007134088A (ja) * 2005-11-08 2007-05-31 Shin Etsu Chem Co Ltd セラミックスヒーターおよびセラミックスヒーターの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI841664B (zh) * 2019-01-25 2024-05-11 日商日本碍子股份有限公司 陶瓷加熱器及其製法

Also Published As

Publication number Publication date
EP1799014A2 (en) 2007-06-20
TW200735691A (en) 2007-09-16
US20070131674A1 (en) 2007-06-14
EP1799014A3 (en) 2008-12-10
KR101299495B1 (ko) 2013-08-29
EP1799014B1 (en) 2016-09-14
KR20070061300A (ko) 2007-06-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees