TWI350576B - Apparatus for storing substrates - Google Patents

Apparatus for storing substrates

Info

Publication number: TWI350576B
Authority: TW; Taiwan
Prior art keywords: storing substrates; substrates; storing
Prior art date: 2007-05-30

Application number

TW096142259A

Other languages

Chinese (zh)

Other versions

TW200847315A (en

Inventor

Yi Li Hsiao

Chen Hua Yu

Jean Wang

Jui Pin Hung

Ming Shih Yeh

Original Assignee

Taiwan Semiconductor Mfg Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-05-30

Filing date

2007-11-08

Publication date

2011-10-11

2007-11-08 Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd

2008-12-01 Publication of TW200847315A publication Critical patent/TW200847315A/en

2011-10-11 Application granted granted Critical

2011-10-11 Publication of TWI350576B publication Critical patent/TWI350576B/en

Classifications

- H10P72/1914—
- H10P72/1916—
- H10P72/1924—

TW096142259A 2007-05-30 2007-11-08 Apparatus for storing substrates TWI350576B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US11/755,508 US8109407B2 (en)	2007-05-30	2007-05-30	Apparatus for storing substrates

Publications (2)

Publication Number	Publication Date
TW200847315A TW200847315A (en)	2008-12-01
TWI350576B true TWI350576B (en)	2011-10-11

Family

ID=40086586

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW096142259A TWI350576B (en)	2007-05-30	2007-11-08	Apparatus for storing substrates

Country Status (2)

Country	Link
US (1)	US8109407B2 (en)
TW (1)	TWI350576B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20060071384A1 (en) *	2004-10-06	2006-04-06	Advanced Display Process Engineering Co. Ltd.	Apparatus for manufacturing flat-panel display
US8827695B2 (en) *	2008-06-23	2014-09-09	Taiwan Semiconductor Manufacturing Company, Ltd.	Wafer's ambiance control
TWI627696B (en) *	2013-01-22	2018-06-21	布魯克斯自動機械公司	Substrate transport
US9455169B2 (en) *	2013-10-11	2016-09-27	Taiwan Semiconductor Manufacturing Company Limited	Ultra-low oxygen and humility loadport and stocker system
DE202017104929U1 (en) *	2017-08-16	2018-11-19	Rosen Swiss Ag	closure device
US12025919B2 (en) *	2018-11-30	2024-07-02	Taiwan Semiconductor Manufacturing Co., Ltd.	Method of storing photoresist coated substrates and semiconductor substrate container arrangement
US12258184B2 (en) *	2021-05-20	2025-03-25	Doskocil Manufacturing Company, Inc.	Food container
TWI822366B (en) *	2022-09-28	2023-11-11	家登精密工業股份有限公司	Latching guide structure

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2875918A (en) *	1954-11-16	1959-03-03	Baumier Marius	Reinforced locking device for covers for receptacles
US3694145A (en) *	1970-11-10	1972-09-26	Sybron Corp	Adjustable shim for pressure vessel doors
US3820682A (en) *	1972-05-03	1974-06-28	N Davella	Covering arrangement for openings and optical lenses
US3896663A (en) *	1974-06-24	1975-07-29	Oyo Corp	Dilatometer
US4467936A (en) *	1981-07-15	1984-08-28	American Sterilizer Company	Closure for a pressurized chamber
US4763511A (en) *	1985-10-07	1988-08-16	Cherne Industries, Inc.	Pipe joint sealing and testing apparatus
JP3028456B2 (en) *	1994-09-27	2000-04-04	信越化学工業株式会社	Flame retardant silicone rubber composition
US5551707A (en) *	1995-06-06	1996-09-03	Freudenberg-Nok General Partnership	Multi-material seal ring
US6641349B1 (en) *	1999-04-30	2003-11-04	Tdk Corporation	Clean box, clean transfer method and system
US20010032850A1 (en) *	2000-03-09	2001-10-25	Neuner Charles P.	Pump actuated sealing system
JP2002043315A (en)	2000-07-26	2002-02-08	Sony Corp	Semiconductor device and method of manufacturing the same
US6286553B1 (en) *	2000-09-01	2001-09-11	Tdw Delaware, Inc.	Removable closure system
US6457598B1 (en) *	2001-03-20	2002-10-01	Prosys Technology Integration, Inc.	Module cover assembly with door latch transmission mechanism for wafer transport module
US6845876B2 (en) *	2002-06-20	2005-01-25	William F. Helms, Jr.	Expandable seal assembly apparatus and method
JP4573566B2 (en) *	2004-04-20	2010-11-04	信越ポリマー株式会社	Storage container

2007
- 2007-05-30 US US11/755,508 patent/US8109407B2/en not_active Expired - Fee Related
- 2007-11-08 TW TW096142259A patent/TWI350576B/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
TW200847315A (en)	2008-12-01
US8109407B2 (en)	2012-02-07
US20080295412A1 (en)	2008-12-04

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Legal Events

Date	Code	Title	Description
2020-07-11	MM4A	Annulment or lapse of patent due to non-payment of fees