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TWI349353B - - Google Patents

Info

Publication number
TWI349353B
TWI349353B TW096138726A TW96138726A TWI349353B TW I349353 B TWI349353 B TW I349353B TW 096138726 A TW096138726 A TW 096138726A TW 96138726 A TW96138726 A TW 96138726A TW I349353 B TWI349353 B TW I349353B
Authority
TW
Taiwan
Application number
TW096138726A
Other languages
Chinese (zh)
Other versions
TW200919662A (en
Inventor
Yi Shao Lai
Tsung Yueh Tsai
Hsiao Chuan Chang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW096138726A priority Critical patent/TW200919662A/en
Publication of TW200919662A publication Critical patent/TW200919662A/en
Application granted granted Critical
Publication of TWI349353B publication Critical patent/TWI349353B/zh

Links

Classifications

    • H10W72/884—
TW096138726A 2007-10-16 2007-10-16 Tenon-type package structure and method thereof TW200919662A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096138726A TW200919662A (en) 2007-10-16 2007-10-16 Tenon-type package structure and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096138726A TW200919662A (en) 2007-10-16 2007-10-16 Tenon-type package structure and method thereof

Publications (2)

Publication Number Publication Date
TW200919662A TW200919662A (en) 2009-05-01
TWI349353B true TWI349353B (en) 2011-09-21

Family

ID=44727187

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096138726A TW200919662A (en) 2007-10-16 2007-10-16 Tenon-type package structure and method thereof

Country Status (1)

Country Link
TW (1) TW200919662A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608772B (en) * 2015-06-29 2017-12-11 鵬鼎科技股份有限公司 Circuit boards connecting structure and method for manufacturing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608772B (en) * 2015-06-29 2017-12-11 鵬鼎科技股份有限公司 Circuit boards connecting structure and method for manufacturing same

Also Published As

Publication number Publication date
TW200919662A (en) 2009-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees