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TWI349035B - Semiconductor wafer cleaning solution, method for cleaning a semiconductor wafer and method for forming an interconnect structure of an integrated circuit - Google Patents

Semiconductor wafer cleaning solution, method for cleaning a semiconductor wafer and method for forming an interconnect structure of an integrated circuit

Info

Publication number
TWI349035B
TWI349035B TW096103290A TW96103290A TWI349035B TW I349035 B TWI349035 B TW I349035B TW 096103290 A TW096103290 A TW 096103290A TW 96103290 A TW96103290 A TW 96103290A TW I349035 B TWI349035 B TW I349035B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
cleaning
forming
integrated circuit
interconnect structure
Prior art date
Application number
TW096103290A
Other languages
English (en)
Other versions
TW200740989A (en
Inventor
Chun Li Chou
Jyu Horng Shieh
Syun Ming Jang
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200740989A publication Critical patent/TW200740989A/zh
Application granted granted Critical
Publication of TWI349035B publication Critical patent/TWI349035B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F24C15/32—Arrangements of ducts for hot gases, e.g. in or around baking ovens
    • F24C15/322—Arrangements of ducts for hot gases, e.g. in or around baking ovens with forced circulation
    • F24C15/327—Arrangements of ducts for hot gases, e.g. in or around baking ovens with forced circulation with air moisturising
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23L—FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES, NOT OTHERWISE PROVIDED FOR; PREPARATION OR TREATMENT THEREOF
    • A23L5/00—Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
    • A23L5/10—General methods of cooking foods, e.g. by roasting or frying
    • A23L5/13—General methods of cooking foods, e.g. by roasting or frying using water or steam
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00—Cooking-vessels
    • A47J27/04—Cooking-vessels for cooking food in steam; Devices for extracting fruit juice by means of steam ; Vacuum cooking vessels
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00—Cooking-vessels
    • A47J27/14—Cooking-vessels for use in hotels, restaurants, or canteens
    • A47J27/16—Cooking-vessels for use in hotels, restaurants, or canteens heated by steam
    • A47J27/17—Cooking-vessels for use in hotels, restaurants, or canteens heated by steam with steam jacket
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3245—Aminoacids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • H10P50/73—
    • H10P70/234—
    • H10W20/081—
    • H10W20/087—
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Food Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Nutrition Science (AREA)
  • Polymers & Plastics (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW096103290A 2006-04-28 2007-01-30 Semiconductor wafer cleaning solution, method for cleaning a semiconductor wafer and method for forming an interconnect structure of an integrated circuit TWI349035B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79574606P 2006-04-28 2006-04-28
US11/500,025 US20070254476A1 (en) 2006-04-28 2006-08-07 Cleaning porous low-k material in the formation of an interconnect structure

Publications (2)

Publication Number Publication Date
TW200740989A TW200740989A (en) 2007-11-01
TWI349035B true TWI349035B (en) 2011-09-21

Family

ID=38964352

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103290A TWI349035B (en) 2006-04-28 2007-01-30 Semiconductor wafer cleaning solution, method for cleaning a semiconductor wafer and method for forming an interconnect structure of an integrated circuit

Country Status (4)

Country Link
US (1) US20070254476A1 (zh)
KR (1) KR100862629B1 (zh)
CN (1) CN101063065A (zh)
TW (1) TWI349035B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7659196B2 (en) * 2006-12-20 2010-02-09 Intel Corporation Soluble hard mask for interlayer dielectric patterning
US7767578B2 (en) 2007-01-11 2010-08-03 United Microelectronics Corp. Damascene interconnection structure and dual damascene process thereof
US7968506B2 (en) * 2008-09-03 2011-06-28 Taiwan Semiconductor Manufacturing Co., Ltd. Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process
EP2166564B1 (en) * 2008-09-19 2017-04-12 Imec Method for removing a hardened photoresist from a semiconductor substrate
KR101691850B1 (ko) * 2010-05-28 2017-01-03 (주)디엔에프 포토레지스트 스트리퍼 조성물
CN102693935A (zh) * 2011-03-22 2012-09-26 中芯国际集成电路制造(上海)有限公司 互连结构的制造方法
CN102324400A (zh) * 2011-09-28 2012-01-18 上海华力微电子有限公司 铜互连结构的制作方法
US8623468B2 (en) * 2012-01-05 2014-01-07 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of fabricating metal hard masks
CN103531527B (zh) * 2012-07-03 2016-07-06 中芯国际集成电路制造(上海)有限公司 金属互连结构的制作方法
CN102867780A (zh) * 2012-09-17 2013-01-09 上海华力微电子有限公司 一种铜互连工艺
CN103811409B (zh) * 2012-11-12 2016-04-20 中微半导体设备(上海)有限公司 一种增强低介电材料对TiN硬掩模刻蚀选择性的方法
CN104183540B (zh) * 2013-05-21 2019-12-31 中芯国际集成电路制造(上海)有限公司 一种半导体器件的制造方法
US20150340611A1 (en) * 2014-05-21 2015-11-26 Sony Corporation Method for a dry exhumation without oxidation of a cell and source line
CN106298441B (zh) * 2015-05-18 2020-03-27 盛美半导体设备(上海)股份有限公司 半导体工艺中去除残余物质的方法
JP2017059750A (ja) * 2015-09-18 2017-03-23 東京エレクトロン株式会社 被処理体を処理する方法
US9679850B2 (en) * 2015-10-30 2017-06-13 Taiwan Semiconductor Manufacturing Company Ltd. Method of fabricating semiconductor structure
KR102791311B1 (ko) * 2016-08-12 2025-04-04 인프리아 코포레이션 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법
US11456170B2 (en) 2019-04-15 2022-09-27 Taiwan Semiconductor Manufacturing Co., Ltd. Cleaning solution and method of cleaning wafer
DE102020110480B4 (de) * 2019-09-30 2024-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Middle-of-Line-Interconnect-Struktur und Herstellungsverfahren

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
JPH10289891A (ja) 1997-04-11 1998-10-27 Mitsubishi Gas Chem Co Inc 半導体回路用洗浄剤及びそれを用いた半導体回路の製造方法
US6541367B1 (en) * 2000-01-18 2003-04-01 Applied Materials, Inc. Very low dielectric constant plasma-enhanced CVD films
KR100805693B1 (ko) * 2001-12-14 2008-02-21 주식회사 하이닉스반도체 세정액 및 그를 이용한 금속막 세정 방법
US7238462B2 (en) * 2002-11-27 2007-07-03 Tokyo Ohka Kogyo Co., Ltd. Undercoating material for wiring, embedded material, and wiring formation method
US6864193B2 (en) * 2003-03-05 2005-03-08 Taiwan Semiconductor Manufacturing Co., Ltd. Aqueous cleaning composition containing copper-specific corrosion inhibitor

Also Published As

Publication number Publication date
US20070254476A1 (en) 2007-11-01
KR20070106385A (ko) 2007-11-01
KR100862629B1 (ko) 2008-10-09
CN101063065A (zh) 2007-10-31
TW200740989A (en) 2007-11-01

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