TWI348502B - Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method - Google Patents
Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said methodInfo
- Publication number
- TWI348502B TWI348502B TW093115701A TW93115701A TWI348502B TW I348502 B TWI348502 B TW I348502B TW 093115701 A TW093115701 A TW 093115701A TW 93115701 A TW93115701 A TW 93115701A TW I348502 B TWI348502 B TW I348502B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- etching
- carrying
- solutions containing
- containing iron
- Prior art date
Links
- 238000005530 etching Methods 0.000 title abstract 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052802 copper Inorganic materials 0.000 title abstract 5
- 239000010949 copper Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title abstract 4
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 2
- 229910052742 iron Inorganic materials 0.000 title abstract 2
- 238000005554 pickling Methods 0.000 title abstract 2
- 230000001172 regenerating effect Effects 0.000 title 1
- 238000005868 electrolysis reaction Methods 0.000 abstract 3
- 239000003014 ion exchange membrane Substances 0.000 abstract 1
- 230000008929 regeneration Effects 0.000 abstract 1
- 238000011069 regeneration method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/36—Regeneration of waste pickling liquors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- ing And Chemical Polishing (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10326767A DE10326767B4 (de) | 2003-06-13 | 2003-06-13 | Verfahren zur Regenerierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200506099A TW200506099A (en) | 2005-02-16 |
| TWI348502B true TWI348502B (en) | 2011-09-11 |
Family
ID=33495031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093115701A TWI348502B (en) | 2003-06-13 | 2004-06-01 | Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7520973B2 (zh) |
| EP (1) | EP1633906B1 (zh) |
| JP (1) | JP4425271B2 (zh) |
| KR (1) | KR101052245B1 (zh) |
| CN (1) | CN100413999C (zh) |
| AT (1) | ATE376080T1 (zh) |
| DE (2) | DE10326767B4 (zh) |
| MY (1) | MY139968A (zh) |
| TW (1) | TWI348502B (zh) |
| WO (1) | WO2004111308A1 (zh) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8372757B2 (en) | 2003-10-20 | 2013-02-12 | Novellus Systems, Inc. | Wet etching methods for copper removal and planarization in semiconductor processing |
| US8597461B2 (en) | 2009-09-02 | 2013-12-03 | Novellus Systems, Inc. | Reduced isotropic etchant material consumption and waste generation |
| EP2594662B1 (en) | 2011-11-21 | 2014-04-09 | Atotech Deutschland GmbH | Aqueous composition for etching of copper and copper alloys |
| JP2013199702A (ja) * | 2012-02-24 | 2013-10-03 | Mitsubishi Shindoh Co Ltd | 銅或いは銅基合金表面の酸化皮膜の除去方法 |
| KR20130069419A (ko) * | 2011-12-15 | 2013-06-26 | 미쓰비시 마테리알 가부시키가이샤 | 구리 혹은 구리기 합금 표면의 산화 피막의 제거 방법 및 이 방법을 사용하여 회수한 구리 혹은 구리기 합금 |
| EP2754732B1 (en) | 2013-01-15 | 2015-03-11 | ATOTECH Deutschland GmbH | Aqueous composition for etching of copper and copper alloys |
| CN103556211B (zh) * | 2013-10-14 | 2016-08-10 | 刘刚 | 一种印制电路板铜表面微蚀粗化方法及其设备 |
| JP2016059855A (ja) | 2014-09-17 | 2016-04-25 | 株式会社東芝 | 処理装置、及び、処理液の再利用方法 |
| CN104562020A (zh) * | 2014-12-24 | 2015-04-29 | 苏州欧美克合金工具有限公司 | 一种刀具增亮池 |
| KR101704748B1 (ko) | 2015-08-28 | 2017-02-08 | 신희찬 | 능동 변속기어 |
| EP3184669B1 (en) | 2015-12-23 | 2018-07-18 | ATOTECH Deutschland GmbH | Etching solution for copper and copper alloy surfaces |
| CN106222661A (zh) * | 2016-07-26 | 2016-12-14 | 深圳崇达多层线路板有限公司 | 微蚀废液回收利用的方法及系统 |
| EP3825441A1 (en) * | 2019-11-21 | 2021-05-26 | COVENTYA S.p.A. | An electrolytic treatment device for preparing plastic parts to be metallized and a method for etching plastic parts |
| CN117144365A (zh) * | 2023-09-01 | 2023-12-01 | 东莞市百良电子科技有限公司 | 一种微蚀液合成工艺以及循环再生方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3825484A (en) * | 1971-04-29 | 1974-07-23 | N Fronsman | Electrolytic regenerator for chemical etchants including scraper means and rotating cathodes |
| US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
| US3933606A (en) * | 1973-12-03 | 1976-01-20 | Saul Gesler | Water treatment process and apparatus |
| JPS51119632A (en) | 1975-04-15 | 1976-10-20 | Chiyuuoo Kk | Process for treating etching agents |
| JPS585996B2 (ja) | 1976-06-01 | 1983-02-02 | スタンレー電気株式会社 | 金属電解回収装置 |
| JPS582272B2 (ja) | 1978-06-23 | 1983-01-14 | 椿 秀夫 | 塩素化合物腐蝕液の電解方法 |
| DE2850542C2 (de) * | 1978-11-22 | 1982-07-01 | Kernforschungsanlage Jülich GmbH, 5170 Jülich | Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen |
| US4604175A (en) * | 1982-12-07 | 1986-08-05 | Naumov Jury I | Process for regeneration of iron-copper chloride etching solution |
| US4880495A (en) * | 1987-04-13 | 1989-11-14 | The Harshaw Chemical Company | Regeneration of copper etch bath |
| JP3458036B2 (ja) | 1996-03-05 | 2003-10-20 | メック株式会社 | 銅および銅合金のマイクロエッチング剤 |
| DE19850530A1 (de) | 1998-11-03 | 2000-05-25 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
| CN1348020A (zh) * | 2000-10-10 | 2002-05-08 | 同济大学 | 氯化铁刻蚀或酸洗废液中镍与重金属离子的去除方法 |
-
2003
- 2003-06-13 DE DE10326767A patent/DE10326767B4/de not_active Expired - Fee Related
-
2004
- 2004-06-01 TW TW093115701A patent/TWI348502B/zh not_active IP Right Cessation
- 2004-06-04 MY MYPI20042176A patent/MY139968A/en unknown
- 2004-06-07 DE DE602004009572T patent/DE602004009572T2/de not_active Expired - Lifetime
- 2004-06-07 WO PCT/EP2004/006115 patent/WO2004111308A1/en not_active Ceased
- 2004-06-07 AT AT04739653T patent/ATE376080T1/de active
- 2004-06-07 JP JP2006515835A patent/JP4425271B2/ja not_active Expired - Fee Related
- 2004-06-07 US US10/559,396 patent/US7520973B2/en not_active Expired - Fee Related
- 2004-06-07 KR KR1020057023701A patent/KR101052245B1/ko not_active Expired - Fee Related
- 2004-06-07 EP EP04739653A patent/EP1633906B1/en not_active Expired - Lifetime
- 2004-06-07 CN CNB2004800156724A patent/CN100413999C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004111308A1 (en) | 2004-12-23 |
| KR101052245B1 (ko) | 2011-07-27 |
| KR20060063796A (ko) | 2006-06-12 |
| CN100413999C (zh) | 2008-08-27 |
| ATE376080T1 (de) | 2007-11-15 |
| DE602004009572D1 (de) | 2007-11-29 |
| JP2006527304A (ja) | 2006-11-30 |
| MY139968A (en) | 2009-11-30 |
| CN1802456A (zh) | 2006-07-12 |
| JP4425271B2 (ja) | 2010-03-03 |
| US7520973B2 (en) | 2009-04-21 |
| US20060175204A1 (en) | 2006-08-10 |
| DE10326767A1 (de) | 2005-01-05 |
| EP1633906B1 (en) | 2007-10-17 |
| DE602004009572T2 (de) | 2008-07-24 |
| DE10326767B4 (de) | 2006-02-02 |
| EP1633906A1 (en) | 2006-03-15 |
| TW200506099A (en) | 2005-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI348502B (en) | Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method | |
| MY127183A (en) | Feedback controlled airfoil stripping system with integrated water management and acid recycling system | |
| JPH04500242A (ja) | スズまたはスズ―鉛合金の剥離用組成物を再生するための電解法 | |
| JPH10317154A5 (zh) | ||
| JPH0780466A (ja) | 金属イオンおよび硫酸を含有する水溶液の再生のための方法および装置 | |
| CA2217436A1 (en) | Ion exchange and regeneration process for separation and removal of iron (iii) ions from aqueous sulfuric acid metal ion-containing solutions | |
| JPS63193129A (ja) | コンタクトレンズの処理方法 | |
| CA2081578A1 (en) | Method for treating etchant | |
| ES2375057T8 (es) | Célula de extracción electrol�?tica de metales con purificador de electrolito. | |
| JP3118793B2 (ja) | 汚泥中の有害金属の分離方法 | |
| JPH1018073A (ja) | 超音波振動を加えた電解方法 | |
| JP2012092447A (ja) | コバルトの電解採取方法 | |
| JPH0688275A (ja) | 金属イオン及び硫酸含有水溶液の再生方法及びその使用方法及び装置 | |
| MY137770A (en) | Metal finishing apparatus and metal finishing method using the same | |
| JP3339505B1 (ja) | 銅メッキカーボン電極の銅メッキ剥離装置 | |
| ATE135417T1 (de) | Verfahren und vorrichtung zum elektrolytischen austragen von metallen aus einer metallionen enthaltenden lösung sowie elektrode zur durchführung des verfahrens | |
| US4183794A (en) | Zinc extraction method | |
| JPS58105477U (ja) | 卑な金属イオンを含む溶液の処理装置 | |
| JPS56119776A (en) | Method and apparatus for removing copper from copper chloride etching solution and regenerating said solution by electrolysis | |
| JPS5534607A (en) | Recovering and removing method for useless metals from chromate solution by diaphragm electrolysis | |
| KR830010223A (ko) | 무전해 도금욕 재생방법 및 그 재생장치 | |
| CA1051820A (en) | Zinc extraction method and apparatus | |
| TWI352134B (zh) | ||
| Goto et al. | Method and Apparatus for Recovering Silver From Waste Photographic Processing Solutions | |
| JPH11335873A (ja) | 塩化鉄系エッチング廃液の再生方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |