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TWI346221B - Camera module and image sensor package structure - Google Patents

Camera module and image sensor package structure

Info

Publication number
TWI346221B
TWI346221B TW096121805A TW96121805A TWI346221B TW I346221 B TWI346221 B TW I346221B TW 096121805 A TW096121805 A TW 096121805A TW 96121805 A TW96121805 A TW 96121805A TW I346221 B TWI346221 B TW I346221B
Authority
TW
Taiwan
Prior art keywords
image sensor
camera module
package structure
sensor package
camera
Prior art date
Application number
TW096121805A
Other languages
Chinese (zh)
Other versions
TW200848832A (en
Inventor
Po Chih Hsu
ming yuan Lin
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW096121805A priority Critical patent/TWI346221B/en
Publication of TW200848832A publication Critical patent/TW200848832A/en
Application granted granted Critical
Publication of TWI346221B publication Critical patent/TWI346221B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
TW096121805A 2007-06-15 2007-06-15 Camera module and image sensor package structure TWI346221B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096121805A TWI346221B (en) 2007-06-15 2007-06-15 Camera module and image sensor package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096121805A TWI346221B (en) 2007-06-15 2007-06-15 Camera module and image sensor package structure

Publications (2)

Publication Number Publication Date
TW200848832A TW200848832A (en) 2008-12-16
TWI346221B true TWI346221B (en) 2011-08-01

Family

ID=44823973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096121805A TWI346221B (en) 2007-06-15 2007-06-15 Camera module and image sensor package structure

Country Status (1)

Country Link
TW (1) TWI346221B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425825B (en) * 2009-12-31 2014-02-01 勝開科技股份有限公司 Adjustable focus image sensor package structure
TWI465788B (en) * 2010-06-21 2014-12-21 Hon Hai Prec Ind Co Ltd Camera module and method for assemblying the same
CN112799197A (en) * 2020-12-29 2021-05-14 豪威光电子科技（上海）有限公司 Lens module and forming method thereof
CN115312549A (en) 2021-05-05 2022-11-08 胜丽国际股份有限公司 Sensor packaging structure
TWI778829B (en) * 2021-05-05 2022-09-21 勝麗國際股份有限公司 Non-reflow type sensor lens
CN113284916A (en) * 2021-06-01 2021-08-20 合肥芯测半导体有限公司 Packaging structure of cmos image sensor chip

Also Published As

Publication number Publication date
TW200848832A (en) 2008-12-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees