1345267 九、發明說明： 【發明所屬之技術領域】 尤其是有關於用 本發明係有關於晶圓加工處理裝置 於劈裂晶圓之晶圓劈裂機。 【先前技術】 μ參閱第1圖」與「第2圖」所示，晶圓劈裂機用 於將晶® 1劈料—粒粒的晶粒’以進行後續的封裝作 業，晶圓1在進行劈裂之前，會先用雷射切割出橫向、與縱 =的預切線2,接著將晶圓！貼附—藍片3加以保護後， 藉一固定夾具4送入一晶圓劈裂機進行劈裂作業。 晶圓劈裂機包含一工作台5、一劈刀6、_劈裂么7 與-影像擷取系統8，該工作台5夾置該固定夹具^並 可作平面方向的移動與轉動’該劈刀6與該劈裂台7係對 設=該晶圓1的上下兩側’以讓該晶圓1抵壓該劈裂台7 並藉該劈刀6的㈣進行劈裂作業，該影像擷取系統8則 用於截取該晶圓1的影像，並藉該預切線2得知該晶圓！ 的位置。 據而《亥曰曰圓1可藉該工作台5的位移與該影像掏取系 統8的_而進行定位’而在定位完成之後，即可藉該劈 刀6的上下位移與該卫作台5的定量位移，對多個預切線 2連續進行劈裂，而㈣彡像擷㈣、統8則在連續劈裂過程 ^控該晶圓1的定錢否偏移，以視偏移的程度重新進 行疋位而田橫向與縱向的預切線2皆被劈裂之後即完成 劈裂作業。 5 096124394 1003171928-0 1345267 此習知的晶圓劈裂機，其在劈裂的過程中，晶圓1會 產生不可忽視的翹曲，當連續劈裂多次時，其翹曲嚴重會 導致該影像擷取系統8失焦，而當失焦時必須手動壓制晶 圓1，使晶圓1影像重新被該影像擷取系統8抓取定位， 其不但造成相當的危險且易損壞晶圓，因而其產量難以提 高，且會降低生產良率，而不符合生產所需。 【發明内容】 爰此，本發明之主要目的在於提供一種晶圓劈裂壓板 機構，以降低晶圓在劈裂時所產生的翹1曲程度。 本發明係一種晶圓劈裂壓板機構，其架設於一晶圓劈 裂機上，並用於壓制一晶圓，該晶圓藉一固定夾具固定在 該晶圓劈裂機的一工作台上，其包含一作動機件、一懸臂 桿與一壓制元件，該作動機件固定在該晶圓劈裂機上，該 懸臂桿與該作動機件連接並受該作動機件帶動而移動，而 該壓制元件設於該懸臂桿的一端，且該壓制元件依據該懸 臂桿的移動位置而具壓制該晶圓與不壓制該晶圓的二種 狀態。 據此，本發明在晶圓劈裂的過程中可以藉該壓制元件 壓制晶圓，因而可減少晶圓的翹曲程度，故可減少重新定 位次數，讓連續劈裂的次數增加，據而提高產量並提高生 產良率。 【實施方式】 為俾使貴委員對本發明之特徵、目的及功效，有著 096124394 1003171928-0 6 1345267 茲列舉較佳實施例並配合圖式說 更加深入之瞭解與認同， 明如后： 請參閱「第3圖」、「第4圖」與「第5圖」所示，本 」月為-種晶圓劈㈣板機構，其包含 =㈣與，元㈣，其中該懸臂㈣與該作動機 10連接並受該作動機件10帶動而移動，該作動機件1〇 可以為轉動元件，因而該作動機件10可帶動該懸臂桿2〇 上了些微擺動，如「第4圖」所示為懸臂桿2〇些微上擺 的不意圖，另該壓制元件30設於該懸臂桿2〇的一端，且 該壓制元# 30設有複數滾動元件31，該壓制元件3〇可以 為轴桿且兩端跨接在_臂桿2G上，該複數滾動元件Μ 為軸套且滾動套合在該壓制元件3〇上’又該壓制元件別 可設有-劈裂π 32，並讓該複數滚動元件31分設在該劈 裂口 32的兩側。 >請再參閱「第6圖」與「第7圖」所示，本發明供架 没於一晶圓劈裂機90上，該晶圓劈裂機9〇包含一劈刀 91、一劈裂台92、一影像擷取系統93與一工作台％，並 用於壓制一晶圓80,該晶圓80用雷射形成有預切線81， 並包覆藍片82加以保護，該晶圓8〇藉一固定夾具7〇固 定在該晶圓劈裂機90的工作台94上，其中該工作台94 可乘載該晶圓80移動，而該壓制元件3〇的複數滾動元件 31於該工作台94的移動方向具滾動自由度，該作動機件 10固定在該晶圓劈裂機9〇上，且該壓制元件3〇依據該懸 096124394 7 1003171928-0 1345267 臂桿20上下擺動時的移動位置而具壓制該晶圓8〇與不壓 制該晶圓80的二種狀態。 又該壓制元件30與該劈裂台92分列於該晶圓8〇之 兩側，該劈裂台92用於頂制該晶圓8〇，該劈裂台犯具有 一裂缝921，該裂縫921與該劈刀91正對該劈裂口 32 , 而該影像擷取系統93擷取該晶圓80的影像，並依據該晶 圓80的預切線81判定該晶圓8〇的位置。 請再參閱「第8-1圖」與「第8_2圖」所示，本發明 晶圓80劈裂壓板機構在使用時，先準備晶圓8〇，該晶圓 80,用雷射預切好預切線81，並包覆藍片犯加以保護， 接著讓該晶圓80藉固定炎具7〇固定在該晶圓劈裂機9〇 的工作台94上，接著移動紅作台94並藉該影像操取系 統93讓該晶圓80最邊緣的預切線81(最邊緣需要劈裂位 置）對準該劈裂台92的裂縫921，此時該壓制元件3〇仍處 於不壓制該晶圓80的狀態。 接著藉該作動機件10讓該壓制元件3〇處於壓制該晶 圓80的狀態，此時即可讓劈刀91下移至劈裂該晶圓8〇 後再回復，接著持續讓該壓制元件3〇冑於塵制該晶圓8〇 的狀態並藉該工作台94橫移一預設量讓下一個預切線 81(需要劈裂處）對準該劈裂台92的裂縫921，接著讓劈刀 91再次下移至劈裂該晶圓8〇後再回復，重覆此一動作直 至所有預切線81皆被劈裂為止’而「第8]圖」與「第 8 1圖」所不，該工作台94在不同位置預備進行劈裂的示 8 096124394 1003171928-0 ^45267 意圖，且為圖示的方便，並未將劈刀91繪上。 接著該工作台94轉動90度，以繼續執行晶圓80另 一方向的劈㈣作。在連續劈㈣過程中，該影像梅 統93可以處於開啟持續監測的狀態，其用於監控預切線、 81是否對準該劈裂台92的裂縫921，當有所偏移時，即 可藉該工作台94重新定位。 如上所述’本發明藉由該壓制元件3〇壓制該晶圓⑼， ^而可以減少該晶圓8〇的翹曲度，據而可以增加連續劈 裒的-人數，並避免因晶圓8〇翹曲而導致該影像擷取系統 =焦’減少重新定位次數，故可以提高產量並提高生產 ^綜上所述僅為本發明的較佳實施例而已，並非用來限 疋本發月之實知範圍，即凡依本發明中請專利範圍之内容 所為的等效變化與修飾，皆應為本發明之技術範_。 【圖式簡單說明】 第1圖’係習知晶圓劈裂裝置之局部結構示意圖。 第2圖，係習知待劈裂晶圓之結構示意圖。 第3圖，係本發明晶圓劈裂壓板機構之前視圖。 第4圖’係本發明晶圓劈裂壓板機構之動作示意圖。 第5圖’係本發明晶圓劈裂壓板機構之俯視圖。 f 6圖’係本發明料劈m安裝後前視圖。 =7圖，係本發明用於劈裂㈣之安裝後俯視圖。 81圖’係本發明劈裂晶圓之動作示意圖-。 096124394 1003171928-0 1345267 第8-2圖，係本發明劈裂晶圓之動作示意圖二。 【主要元件符號說明】 習知 1 .晶圓 2 :預切線 3 :藍片 4:固定夾具 5 :工作台 6 :劈刀 7 :劈裂台 8:影像擷取系統 本發明 10 :作動機件 20 :懸臂桿 30 :壓制元件 31 :滾動元件 32 :劈裂口 70 :固定夹具 80 .晶圓 81 :預切線 82 :藍片 90 :晶圓劈裂機 91 :劈刀 096124394 1003171928-0 10 1345267 92 :劈裂台 921 :裂缝 93 :影像擷取系統 94 :工作台 096124394 11 1003171928-01345267 IX. Description of the Invention: [Technical Field of the Invention] In particular, the present invention relates to a wafer splitting machine for a wafer processing apparatus for a split wafer. [Prior Art] μ Referring to Figure 1 and Figure 2, the wafer splitting machine is used to carry out the subsequent processing of the wafers of the crystals - grains for wafers. Before the splitting, the laser will be used to cut the horizontal, vertical = pre-cut line 2, and then the wafer! Attached - After the blue piece 3 is protected, it is sent to a wafer splitting machine by a fixing jig 4 for cleaving operation. The wafer splitting machine comprises a work table 5, a boring tool 6, a cleavage 7 and an image capturing system 8, the table 5 is placed on the fixing fixture and can be moved and rotated in a plane direction. The boring tool 6 and the cleavage table 7 are paired with the upper and lower sides of the wafer 1 to allow the wafer 1 to press against the cleavage table 7 and perform a splitting operation by the (four) of the trowel 6 The capture system 8 is used to intercept the image of the wafer 1 and learn the wafer by the pre-cut line 2! s position. According to the above, "Haiyuyuan 1 can be positioned by the displacement of the table 5 and the image capturing system 8", and after the positioning is completed, the up and down displacement of the file 6 can be used to support the table. The quantitative displacement of 5, the chopping of a plurality of pre-cut lines 2 is continuous, and (4) the image 撷 (4), the system 8 in the continuous cleaving process ^ control the wafer 1 of the fixed amount of offset, to the extent of the offset The cleaving operation is completed after the chopping is repeated and the transverse and longitudinal pre-tangents 2 of the field are cleaved. 5 096124394 1003171928-0 1345267 The conventional wafer splitting machine, in the process of splitting, the wafer 1 will produce a non-negligible warp. When the continuous splitting is repeated multiple times, the warpage is severe, which causes the The image capturing system 8 is out of focus, and the wafer 1 must be manually pressed when the focus is out of focus, so that the image of the wafer 1 is repositioned by the image capturing system 8 , which not only causes considerable danger but also damages the wafer. Its production is difficult to increase and it will reduce production yields and not meet production needs. SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a wafer splitting platen mechanism to reduce the degree of warpage caused by a wafer during splitting. The present invention relates to a wafer splitting platen mechanism which is mounted on a wafer splitting machine and is used for pressing a wafer, and the wafer is fixed on a workbench of the wafer splitting machine by a fixing fixture. The utility model comprises a driving member, a cantilever rod and a pressing member fixed on the wafer splitting machine, the cantilever rod is connected with the moving member and moved by the driving member, and the pressing The component is disposed at one end of the cantilever rod, and the pressing component has two states of pressing the wafer and not pressing the wafer according to the moving position of the cantilever rod. Accordingly, the present invention can suppress the warpage of the wafer by the pressing component during the process of splitting the wafer, thereby reducing the degree of warpage of the wafer, thereby reducing the number of repositionings and increasing the number of continuous splitting, thereby increasing Yield and increase production yield. [Embodiment] In order to make your members aware of the features, purposes and effects of the present invention, there are 096124394 1003171928-0 6 1345267. The preferred embodiments are listed and further understood and agreed with the drawings, as shown in the following: Figure 3, "4th" and "5th", this month is a wafer crucible (four) board mechanism, which includes = (four) and (4), where the cantilever (four) and the motive 10 Connected and moved by the actuating member 10, the actuating member 1 can be a rotating member, so that the actuating member 10 can drive the cantilever rod 2 to swing slightly, as shown in "Fig. 4" The cantilever rod 2 is not intended to be slightly swayed, and the pressing member 30 is disposed at one end of the cantilever rod 2〇, and the pressing element #30 is provided with a plurality of rolling elements 31, which can be shafts and two The end is bridged on the arm 2G, the plurality of rolling elements Μ are sleeves and the sleeve is rolled onto the pressing element 3', and the pressing element can be provided with a splitting π 32, and the plural rolling The elements 31 are provided on both sides of the splitting opening 32. > Please refer to "Fig. 6" and "Fig. 7" again. The present invention is not provided on a wafer splitting machine 90. The wafer splitting machine 9 includes a file 91 and a file. The splitting table 92, an image capturing system 93 and a table % are used to press a wafer 80. The wafer 80 is formed with a pre-cut line 81 by laser and is covered with a blue sheet 82 for protection.固定 is fixed to the table 94 of the wafer splitting machine 90 by a fixing jig 7 which can be moved by the wafer 80, and the plurality of rolling elements 31 of the pressing member 3 are working there. The moving direction of the table 94 has a rolling degree of freedom, and the driving member 10 is fixed on the wafer splitting machine 9〇, and the pressing member 3〇 moves according to the hanging 096124394 7 1003171928-0 1345267 when the arm 20 swings up and down The position has two states of pressing the wafer 8 and not pressing the wafer 80. Further, the pressing member 30 and the splitting table 92 are arranged on both sides of the wafer 8 , and the splitting table 92 is used for topping the wafer 8 , and the splitting table has a crack 921 , the crack The image of the wafer 80 is captured by the image capture system 93 and the position of the wafer 8 is determined based on the pre-cut line 81 of the wafer 80. Please refer to "8-1" and "8-2" again. In the wafer 80 splitting and pressing plate mechanism of the present invention, the wafer 8 is prepared first, and the wafer 80 is pre-cut with a laser. The pre-cut line 81 is covered and protected by the blue chip, and then the wafer 80 is fixed on the table 94 of the wafer splitting machine 9 by means of a fixed fixture 7 and then moved to the red table 94 and borrowed. The image manipulation system 93 aligns the edge of the wafer 80 with the pre-cut line 81 (the edge requiring the splitting position) to the crack 921 of the splitting table 92. At this time, the pressing member 3 is still not pressing the wafer 80. status. Then, the pressing member 10 is used to press the pressing member 3 to press the wafer 80. At this time, the file 91 can be moved down to split the wafer 8 and then returned, and then the pressing member is continuously pressed. 3 〇胄 制 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该The file 91 is moved down again to split the wafer 8 〇 and then resumed, repeating this action until all the pre-cut lines 81 are split, and the "8th" and "8th 1st" are not The table 94 is intended to be cleaved at different positions, and is intended to be cleaved, and for the convenience of illustration, the file 91 is not drawn. The table 94 is then rotated 90 degrees to continue the 劈(4) operation in the other direction of the wafer 80. In the continuous 劈 (4) process, the image system 93 can be in a state of continuous monitoring, which is used to monitor whether the pre-cut line 81 is aligned with the crack 921 of the cleavage table 92, and when offset, The table 94 is repositioned. As described above, the present invention can reduce the warpage of the wafer 8 by pressing the wafer (9), thereby increasing the number of continuous turns and avoiding the wafer 8 The warp warp causes the image capture system to reduce the number of repositionings, so that the yield can be increased and the production can be improved. The above is only a preferred embodiment of the present invention, and is not intended to be limited to the present month. The scope of the invention, that is, the equivalent changes and modifications of the scope of the patent application in the present invention, should be the technical scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a partial structure of a conventional wafer splitting device. Fig. 2 is a schematic view showing the structure of a wafer to be split. Figure 3 is a front elevational view of the wafer splitting platen mechanism of the present invention. Fig. 4 is a schematic view showing the operation of the wafer splitting presser mechanism of the present invention. Fig. 5 is a plan view showing the wafer splitting platen mechanism of the present invention. The f 6 figure is a front view of the material 劈m of the present invention after installation. Figure 7 is a top view of the installation of the present invention for splitting (four). Figure 81 is a schematic view of the action of the split wafer of the present invention. 096124394 1003171928-0 1345267 Figure 8-2 is a schematic view of the action of the split wafer of the present invention. [Main component symbol description] Convention 1. Wafer 2: Pre-cut line 3: Blue sheet 4: Fixing jig 5: Table 6: Sickle 7: Splitting table 8: Image capturing system The present invention 10: Actuating member 20: Cantilever rod 30: Pressing member 31: Rolling member 32: Splitting port 70: Fixing jig 80. Wafer 81: Pre-cut line 82: Blue sheet 90: Wafer splitting machine 91: Sickle 096124394 1003171928-0 10 1345267 92 : Splitting table 921: Crack 93: Image capturing system 94: Workbench 096124394 11 1003171928-0