1343292 ψ1343292 ψ
I 100年03月08日梭正替换頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種脆性非金屬基材之切割方法。 【先前技術】 [0002] 玻璃作為光學元器件之主要製成材料，在當代工業中得 到廣’乏應用。然，採用傳統之機械切割玻璃方法製成之 光學元器件之斷口粗縫，導致製成之光學元器件之光學 性能及強度較差。故為獲得較佳品質之光學元器件，雷 射切割技術得以開發並迅速發展。與習知機械切割方法 , 相比，雷射切割技術具有加工精度高、產品一致性好、 ’ 切割面光滑等優點。 [0003] 請參見圖1，所示為一種習知脆性非金屬基板1〇之切割方 法：藉由鑽石刀（圖未示）於脆性非金屬基板1〇之一側 形成一初始劃痕101，該初始劃痕1〇1位於該脆性非金屬 基板10之預定切割直線\上；接著將雷射光束聚焦於該 脆性非金屬基板ίο上，以形成一橢圓形光Mlu ;從初始 劃痕101處開始，使橢圓形光斑ηι沿著預定切割直線L 移動，並使該橢圓形光斑lu之長軸b之延伸方向與預定 切割直線1^之延伸方向始終保持一致；使一冷卻液體流 12跟隨該顧形光斑1U運動，以對摘圓形光斑⑴加熱 過之區域進行及時冷卻，從而按預定切割直線、於脆性 非金屬基板10上形成-琴痕；於該脆性非金屬基板1〇上 施加機械力’即可使其沿所述裂痕斷裂。然，該種切割 方法需使满圓形光斑1U之長轴6之延伸方向與預定切割 直線L丨之延伸方向保持一致，以使橢圓形光斑ηι之能量 09615)265 表單編號A0101 第3頁/共26頁 1003076185-0 ^43292 100年03月08日修正替換苜 平均分配於預定切割直線L }之二側，從而使裂痕沿預定 切割直線1^形成。然，當需對脆性非金屬基板10沿一預 定曲線切割時，由於該糖圓形光班111於脆性非金屬基板 10表面按預定曲線移動時，其長軸b之延伸方向始終保持 不變，故在切割過程中，該橢圓形光斑111之長軸b之延 伸方向偏離預定曲線之延伸方向，從而不能沿預定曲線 於脆性非金屬基板上形成裂痕。 [0004] 請參閱圖2及圖3，為使雷射可對脆性非金屬基板進行弧 線切割’習知技術提供一種孤爽法：先藉由雷射 掃描裝置2 4對雷舯為東2 ί难非金屬基板 2 0表面形成一餘形光斑21 4包括-第 一反射鏡241、一第二反射。該第 —反射鏡241與第二反射鏡242相對設董Η且第一反射鏡 241可繞第一掃描軸^旋轉，第二反射可繞第二掃 描軸κ2旋轉，該第一掃描軸Κ與睾二掃描鲈Κ相互垂直 。控制器243可控制第一反苐兰反射鏡242之 '「open' 旋轉。藉由第一反射鏡241之可‘使投射於脆性非金 …‘C'Cr 屬基板20上之雷射光束21沿X軸ϋ移動，藉由第二反射 鏡242之旋轉，可使投射於脆性非金屬基板2〇上之雷射光 束21沿Υ轴方向移動，從而藉由第一反射鏡241及第二反 射鏡242之旋轉，可於脆性非金屬基板2〇上掃描出一線形 光斑211之輪廓。當第一反射鏡241及第二反射鏡242之 旋轉速度較大’即掃描頻率較大時，可近似看作於脆性 非金屬基板20形成有一線形光斑211。 [0005] 然後根據脆性非金屬基板2〇之預定切割曲線L2之形狀調 096151265 表單煸號Α0101 第4頁/共26頁 1003076185-0 1343292 ___ ' 100年03月03日修正替换頁 整該線形光斑2 1 1之形狀，使該線形光斑211之延伸方向 始終與預定切割曲線l2之方向保持一致；接著使一冷卻 液體流22跟隨該線形光斑211運動，以對線形光斑211加 熱過之區域進行冷卻，從而按預定切割曲線1^於脆性非 金屬基板20上形成一裂痕；再施加機械力於該脆性非金 屬基板2 0上，以使其沿裂痕斷裂。 [0006] 然，該種切割方法需在切割過程中對線形光斑211之形狀 不斷調整，即需使第一反射鏡241及第二反射鏡242之位 置根據預定切割線l2之形狀不斷發生變化，其控制難度 1 較大。另，該種曲線切割之方法在控制第一反射鏡241及 ’ 第二反射鏡242之掃描位置之同時，還需使第一反射鏡 241及第二反射鏡242沿預定切割曲線、移動，故在切割 之過程中容易產生誤差，切割精度較低。 【發明内容】 [0007] 鑒於以上内容，有必要提供一種可進行高精度曲線切割 之切割方法。 [0008] 一種於脆性非金屬基材之切割方法，其包括以下步驟： (1)提供一種雷射切割裝置及一脆性非金屬基材，該雷射 切割裝置包括一雷射源、一聚焦元件、一工作台及一控 制器，該聚焦元件用於對雷射源發出之雷射光束進行聚 集，該控制器控制聚焦元件及工作台之運動；（2)於控制 器内預設一與脆性非金屬基材之預定切割曲線相對應之 第一函數，以及一與聚焦元件或脆性非金屬基材之旋轉 運動相對應之第二函數；（3)將脆性非金屬基材置放於 工作台上，並藉由聚焦元件將雷射源發出之雷射光束聚 096151265 表單編號A010】 第5頁/共26頁 1003076185-0 1343292 100年03月08日修正替換苜 焦於脆性非金屬基材上，以形成一橢圓形光斑；（4)控制 器根據第一函數驅動工作台以使雷射光束與脆性非金屬 基材相對運動，並同時根據第二函數使該聚焦元件或脆 性非金屬基材旋轉，從而使橢圓形光斑之長軸延伸方向 始終與橢圓形光斑所在處之預定切割曲線之切線方向基 本保持一致，同時使一冷卻流體跟隨橢圓形光斑運動， 以沿預定切割曲線形成裂痕；（5)沿該裂痕使脆性非金屬 基材分裂。 [0009] 相較於習知技術，本發明脆性#邊*屬基材之切割方法係 .:产.:.$'街， 採用一橢圓形光斑切顧定切割曲線 ι«βΗΚ·ηΗβ··ι 之形狀不斷變先光斑之形狀器内之第 一函數驅動脆性非金屬基材運動，以 及根據控制器内之第二函數驅動聚焦元得或脆性非金屬 基材旋轉即可，控制難度較低。另，圓形光斑長軸 之延伸方向在切割過程中轉終與研圓形光麥所在處之預 定切割曲線之切線方向基保;搏一"^·* .，‘ 21寸使雷射光束 之能量始終在預定切割曲線之二咖Γ對褚分佈以進行加熱 : ，當使用冷卻流體冷卻該加熱區域時，脆性非金屬基材 將沿應力最大之方向發生斷裂，即沿橢圓形光斑之長軸 之延伸方向發生斷裂，故裂痕之形狀可與預定切割曲線 之形狀保持一致，沿該裂痕使脆性非金屬基材分裂後可 製得預定形狀之產品，故藉由本發明之切割方法製得之 產品具有較高之切割精度。 【實施方式】 [0010] 下面將結合附圖及實施例對本發明之脆性非金屬基材及 096151265 表單編號A0101 第6頁/共26頁 1003076185-0 1343292 _ ‘ 100年03月08日核正替換頁 其切割方法作進一步之詳細說明。 [0011] 本發明較佳實施例一提供一種玻璃基板之切割方法，其 採用圖4所示之雷射切割裝置40實施。該雷射切割裝置40 包括一雷射源41、一聚焦鏡頭42、一工作台43及一控制 器44，該聚焦鏡頭42用於對雷射源41發出之雷射光束31 進行會聚，且該聚焦鏡頭42可繞其中心旋轉。該控制器 44控制聚焦鏡頭42及工作台43之運動。 [0012] 請同時參閱圖4至圖6，使用該雷射切割裝置40對玻璃基 板30進行切割之步驟如下： j [0013] (1)於控制器44内預設一與玻璃基板30之預定切割曲線 Pi相對應之第一函數，以及一與聚焦鏡頭42之旋轉運動 相對應之第二函數； [0014] (2)將玻璃基板30置放於工作台43上，然後用鑽石刀（ 圖未示）在玻璃基板30之表面刻出一初始劃痕301，該初 始劃痕301位於脆性非金屬基板30之預定切割曲線？1上； [0015] (3)接著藉由聚焦鏡頭42將雷射源41發出之雷射光束31 聚焦於該玻璃基板30上，以形成一橢圓形光斑311 ; [0016] (4)控制器根據第一函數驅動工作台沿著預定切割曲線 Pi運動，並同時根據第二函數驅動聚焦鏡頭42旋轉，以 使該雷射光束31投射於玻璃基板30上之橢圓形光斑311在 沿預定切割線P1運動之同時繞其中心旋轉，從而使橢圓 形光斑311之長軸\之延伸方向始終與橢圓形光斑311所 在處之預定切割曲線P1之切線方向基本保持一致，較佳 為橢圓形光斑311之中心位於預定切割曲線？1上，且該預 096151265 表單編號Α0ΚΠ 第7頁/共26頁 1003076185-0 10G年ϋ3月08日核正替換育 定切割線？丨於橢圓形光斑31 1之中心處之切線'之方向與 媽圓形光斑311之長轴\之延伸方向相一致，同時使一冷 部液體流32跟隨該橢圓形光斑311運動，以對糖圓形光斑 加熱過之區域進行冷卻’從而於破填基板3〇上按預定 切割曲線匕形成一裂痕。 [0017] [0018] (5)施加壓力於該玻璃基板30之裂痕二側，以使其沿裂 痕斷裂，從而完成對脆性非金屬基板30之切割。 本切割方法係採用一橢圓形光斑311進行切割，其無需根 據坡螭基板3〇之預定切协割曲;斷變化該橢圓 形光斑311之形僅气第一函數驅 動工作台431箸預定切割器44 内之第二函數驅動聚帛、鏡難度較低 vV'" °另’由於本切割方法中之橢圓形光之長軸B之延 滅 1 伸方向始終與橢圓形光斑311所在處之定切割線ρ之切 1 線方向基本保持一致，故可能量始終在 預定切割曲線p丨之二側對箱P分佈鋒行加熱，當使用冷 卻液體流32冷卻加熱區域8#、辨療参板30將沿應力最大 之方向發生斷裂，即沿橢圓形光斑311之長轴^之延伸方 向發生斷裂，故裂痕之形狀可與預定切割曲線Pi之形狀 保持一致，再藉由機械力使玻璃基板30沿裂痕分裂後可 制得預定形狀之玻璃製品，故藉由上述切割方法制得之 玻璃基板具有較高之切割精度。 [0019] 可以理解，在上述玻璃基板30之切割過程中，也可不旋 轉聚焦鏡頭42，而是根據第二函數驅動工作台43進行旋 轉’以帶動玻璃基板30在沿著預定切割曲線動之同 096151265 表單編號A0101 第8頁/共26頁 1003076185-0 1343292 ， _ 100年03月08日修正替換頁 時進行旋轉’從而使觀形光斑311之長轴\之延伸方向 U橢圓形光斑311所在處之預定切割曲線匕之切線方 向基本保持-致’以於該破壤基板⑽上形成與預定切割 曲線P!相對應之裂痕。初始劃痕3〇】也可由其他具有高硬 度之物體刻劃’如金剛石砂輪。另，本發明之切創方法 也可不採用高硬度物體於破壤基板3〇之表面刻出一初始 劃痕301 ’而直接採用雷射光束31對玻璃基板3〇進行切割 ，但由於沒有初始劃痕301，故在玻璃基板3〇上形成裂痕 之時間會延長，即在切割過程中需降低雷射光束31相對 玻璃基板30之運動速度，以提高雷射光束31對玻璃基板 ， 3 0同一部位之加熱時間。 [0020]本發明較佳實施例二提供之玻璃基板切割方法具有與較 佳實施例一中之玻璃基板切割方法相似之步驟，其不同 在於形成裂痕後，採用不同之方式使玻璃基板沿裂痕分 裂。請一併參閱圖7及圖8 ’於玻璃基板50上形成裂痕502 後’擦去殘留於玻璃基板30上之冷卻液體，並將雷射光 束31重新聚焦於玻璃基板5〇上以形成一橢圓形光斑511。 接著控制器44根據第一函數驅動工作台43沿著裂痕502運 動’並同時根據第二函數驅動聚焦鏡頭42旋轉，以使該 雷射光束31投射於玻璃基板50上之橢圓形光斑511在沿裂 痕502運動之同時繞其中心旋轉，從而使橢圓形光斑5 i 1 之長軸\之延伸方向始終與橢圓形光斑51丨所在處之裂痕 502之切線方向基本保持一致，較佳為橢圓形光斑511之 中心位於預定切割曲線p上，且該預定切割線p於橢圓 0 0 形光斑511之中心處之切線'之方向與橢圓形光斑311之 096151265 表箄·編故A0101 1003076185-0 «43292 100年03月08日核正替換苜 長軸B之延伸方向相一致，以使玻璃基板50沿裂痕502斷 裂。由於本實施例中之橢圓形光斑511之長軸B之延伸方 〇 向始終與橢圓形光斑511中心所在處之裂痕5 0 2之切線方 向基本保持一致，故玻璃基板50可精確地按照裂痕502分 裂。 [0021] 可以理解，於玻璃基板上形成裂痕502後，也可採用高頻 波源，如超聲波源，向玻璃基板發出高頻波，以使該裂 痕502向下生長，從而使該玻璃基板沿裂痕502斷裂。 [0022] [0023] 可以理解，上述實施倒切學硖;％第可應用於玻璃 基板之切割，也可應用於某 如藍寶石、水晶等。另， 二氧化碳雷射器，且該雷 瓦特以下。I. March 8, 2010 Shuttle Replacement Page VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a method of cutting a brittle non-metallic substrate. [Prior Art] [0002] Glass, as a main material for optical components, has been widely used in the contemporary industry. However, the fracture of the optical component made by the conventional mechanical cutting glass method results in poor optical performance and strength of the fabricated optical component. Therefore, in order to obtain optical components of better quality, laser cutting technology has been developed and rapidly developed. Compared with the conventional mechanical cutting method, the laser cutting technology has the advantages of high processing precision, good product consistency, and smooth cutting surface. [0003] Referring to FIG. 1, a conventional method for cutting a brittle non-metal substrate is shown: an initial scratch 101 is formed on one side of a brittle non-metal substrate by a diamond knife (not shown). The initial scratch 1〇1 is located on a predetermined cutting line of the brittle non-metal substrate 10; then the laser beam is focused on the brittle non-metal substrate ίο to form an elliptical light Mlu; from the initial scratch 101 Initially, the elliptical spot ηι is moved along a predetermined cutting straight line L, and the extending direction of the long axis b of the elliptical spot lu is consistent with the extending direction of the predetermined cutting straight line 1; a cooling liquid flow 12 is followed. The 1U movement of the shape light spot is performed by cooling the area heated by the circular spot (1) to form a piano mark on the brittle non-metal substrate 10 according to a predetermined cutting line; and applying mechanical force to the brittle non-metal substrate 1 Force ' can cause it to break along the crack. However, the cutting method needs to make the extending direction of the long axis 6 of the full circular spot 1U coincide with the extending direction of the predetermined cutting straight line L丨, so that the energy of the elliptical spot ηι is 09615) 265 Form No. A0101 Page 3 / A total of 26 pages 1003076185-0 ^43292 The correction replacement 苜 is equally distributed on the two sides of the predetermined cutting straight line L } so that the crack is formed along the predetermined cutting straight line. However, when the brittle non-metal substrate 10 is to be cut along a predetermined curve, since the sugar circular light shifting plate 111 moves on the surface of the brittle non-metal substrate 10 according to a predetermined curve, the extending direction of the long axis b remains unchanged. Therefore, during the cutting process, the extending direction of the long axis b of the elliptical spot 111 deviates from the extending direction of the predetermined curve, so that cracks cannot be formed on the brittle non-metal substrate along the predetermined curve. [0004] Please refer to FIG. 2 and FIG. 3, in order to enable the laser to perform arc cutting on a brittle non-metallic substrate, a conventional method is provided: a laser scanning device 2 4 is used to control the Thunder to the east 2 ί A surface of the metal substrate 20 is formed with a residual light spot 21 4 including a first mirror 241 and a second reflection. The first mirror 241 and the second mirror 242 are opposite to each other, and the first mirror 241 is rotatable about the first scan axis, and the second reflection is rotatable about the second scan axis κ2. The testis scans are perpendicular to each other. The controller 243 can control the 'open' rotation of the first reverse blue mirror 242. The laser beam 21 projected onto the brittle non-gold ... 'C'Cr substrate 20 can be made by the first mirror 241 Moving along the X-axis, by the rotation of the second mirror 242, the laser beam 21 projected on the brittle non-metal substrate 2 can be moved in the z-axis direction, thereby passing through the first mirror 241 and the second reflection. The rotation of the mirror 242 can scan the outline of the linear spot 211 on the brittle non-metal substrate 2A. When the rotation speed of the first mirror 241 and the second mirror 242 is large, that is, the scanning frequency is large, the approximation can be approximated. It is considered that a linear spot 211 is formed on the brittle non-metal substrate 20. [0005] Then, according to the shape of the predetermined cutting curve L2 of the brittle non-metal substrate 2, 096151265 is formed. Form number Α 0101 Page 4 / Total 26 pages 1003076185-0 1343292 ___ 'March 03, the correction replacement page aligns the shape of the linear spot 2 1 1 such that the direction of extension of the linear spot 211 is always consistent with the direction of the predetermined cutting curve l2; then a cooling liquid flow 22 is followed by the linear spot 211 movement to the line The heated area of the spot 211 is cooled to form a crack on the brittle non-metal substrate 20 according to a predetermined cutting curve; mechanical force is applied to the brittle non-metal substrate 20 to break it along the crack. However, the cutting method needs to continuously adjust the shape of the linear spot 211 during the cutting process, that is, the positions of the first mirror 241 and the second mirror 242 are constantly changed according to the shape of the predetermined cutting line l2, and the control thereof is controlled. The difficulty 1 is larger. In addition, the method of cutting the curve requires controlling the first mirror 241 and the second mirror 242 to cut along the predetermined position while the first mirror 241 and the second mirror 242 are cut. Curves and movements are prone to errors in the process of cutting, and the cutting precision is low. [Invention] [0007] In view of the above, it is necessary to provide a cutting method capable of performing high-precision curve cutting. [0008] A brittleness A method for cutting a non-metallic substrate, comprising the steps of: (1) providing a laser cutting device and a brittle non-metallic substrate, the laser cutting device comprising a laser source a focusing component, a working table and a controller for collecting the laser beam emitted by the laser source, the controller controlling the movement of the focusing component and the table; (2) pre-controlling in the controller a first function corresponding to a predetermined cutting curve of the brittle non-metallic substrate, and a second function corresponding to the rotational motion of the focusing element or the brittle non-metallic substrate; (3) placing the brittle non-metallic substrate Placed on the workbench, and the laser beam emitted by the laser source is concentrated by the focusing element. 096151265 Form No. A010] Page 5 of 26 Page 1003076185-0 1343292 Correction of replacement of the focus on brittleness a metal substrate to form an elliptical spot; (4) the controller drives the table according to a first function to cause the laser beam to move relative to the brittle non-metallic substrate while simultaneously causing the focusing element or brittleness according to a second function The non-metallic substrate is rotated such that the long axis extending direction of the elliptical spot is substantially consistent with the tangential direction of the predetermined cutting curve where the elliptical spot is located, while a cooling fluid follows the ellipsoid The circular spot moves to form a crack along a predetermined cutting curve; (5) the brittle non-metallic substrate is split along the crack. [0009] Compared with the prior art, the cutting method of the brittleness of the present invention is: .. '' Street, using an elliptical spot to cut the cutting curve ι«βΗΚ·ηΗβ·· The shape of the ι shape continues to change the first function in the shape of the spot to drive the brittle non-metallic substrate movement, and according to the second function in the controller to drive the focus element or the brittle non-metallic substrate to rotate, the control is less difficult . In addition, the extension direction of the long axis of the circular spot is in the tangential direction of the predetermined cutting curve where the circular light wheat is located during the cutting process; the beater is "^·* ., '21 inch makes the laser beam The energy is always distributed in the second cutting curve of the predetermined cutting curve for heating: when the cooling region is cooled by the cooling fluid, the brittle non-metallic substrate will break along the direction of the maximum stress, that is, along the length of the elliptical spot. The direction of the extension of the shaft is broken, so that the shape of the crack can be consistent with the shape of the predetermined cutting curve, and the product of the predetermined shape can be obtained by splitting the brittle non-metal substrate along the crack, so that the cutting method is obtained by the cutting method of the present invention. The product has a high cutting accuracy. [Embodiment] [0010] The brittle non-metal substrate of the present invention and 096151265 Form No. A0101, Page 6 of 26, 1003076185-0 1343292 _ '100 March 08, nuclear replacement, will be replaced with reference to the accompanying drawings and embodiments. The page is cut for further details. [0011] A preferred embodiment of the present invention provides a method of cutting a glass substrate, which is implemented using the laser cutting device 40 shown in FIG. The laser cutting device 40 includes a laser source 41, a focusing lens 42, a table 43 and a controller 44 for concentrating the laser beam 31 emitted from the laser source 41. The focus lens 42 is rotatable about its center. The controller 44 controls the movement of the focus lens 42 and the table 43. [0012] Referring to FIG. 4 to FIG. 6 simultaneously, the step of cutting the glass substrate 30 by using the laser cutting device 40 is as follows: j [0013] (1) Presetting a predetermined order with the glass substrate 30 in the controller 44 a first function corresponding to the cutting curve Pi, and a second function corresponding to the rotational movement of the focusing lens 42; [0014] (2) placing the glass substrate 30 on the table 43 and then using a diamond knife (Fig. An initial scratch 301 is formed on the surface of the glass substrate 30. The initial scratch 301 is located on a predetermined cutting curve of the brittle non-metal substrate 30. [0015] (3) The laser beam 31 emitted from the laser source 41 is then focused on the glass substrate 30 by the focusing lens 42 to form an elliptical spot 311; [0016] (4) Controller Driving the table along the predetermined cutting curve Pi according to the first function, and simultaneously driving the focus lens 42 to rotate according to the second function, so that the elliptical spot 311 of the laser beam 31 projected onto the glass substrate 30 is along a predetermined cutting line. The movement of P1 is rotated around its center, so that the extending direction of the long axis \ of the elliptical spot 311 is always consistent with the tangential direction of the predetermined cutting curve P1 where the elliptical spot 311 is located, preferably the elliptical spot 311 Is the center at the scheduled cutting curve? 1 on, and the pre-096151265 form number Α0ΚΠ page 7 / total 26 pages 1003076185-0 10G year ϋ March 08 nuclear replacement cutting line? The direction of the tangent ' at the center of the elliptical spot 31 1 coincides with the extension of the long axis \ of the mother circular spot 311, while causing a cold liquid flow 32 to follow the elliptical spot 311 to move to the sugar The area in which the circular spot is heated is cooled to form a crack on the fractured substrate 3 by a predetermined cutting curve. [0018] (5) Applying pressure to both sides of the crack of the glass substrate 30 to break along the crack, thereby completing the cutting of the brittle non-metal substrate 30. The cutting method adopts an elliptical spot 311 for cutting, which does not need to be cut according to the predetermined cutting of the ramp substrate 3; the shape of the elliptical spot 311 is only changed by the first function driving table 431, the predetermined cutter The second function in 44 drives the convergence, the mirror is less difficult vV'" ° Another 'Because of the extension of the long axis B of the elliptical light in this cutting method, the extension direction is always the same as the position of the elliptical spot 311 The direction of the cutting line ρ is basically the same, so it is possible that the volume of the box P is always heated on the two sides of the predetermined cutting curve p丨. When the cooling liquid flow 32 is used to cool the heating area 8#, the treatment plate 30 will be The fracture occurs in the direction in which the stress is greatest, that is, the fracture occurs along the extension direction of the long axis of the elliptical spot 311, so that the shape of the crack can be consistent with the shape of the predetermined cutting curve Pi, and the glass substrate 30 is further cracked by mechanical force. After the splitting, a glass product of a predetermined shape can be obtained, so that the glass substrate obtained by the above cutting method has high cutting precision. [0019] It can be understood that during the cutting process of the glass substrate 30, the focus lens 42 may not be rotated, but the table 43 is driven to rotate according to the second function to drive the glass substrate 30 along the predetermined cutting curve. 096151265 Form No. A0101 Page 8 of 26 1003076185-0 1343292 , _ March 03, 2010 Correction of the replacement page when rotating 'so that the long axis of the viewing spot 311 extension direction U elliptical spot 311 The tangential direction of the predetermined cutting curve 基本 is substantially maintained so that a crack corresponding to the predetermined cutting curve P! is formed on the ground-breaking substrate (10). The initial scratches can also be scored by other objects with high hardness, such as diamond wheels. In addition, the cutting method of the present invention can also directly cut the glass substrate 3 by using the laser beam 31 without using a high-hardness object to inscribe an initial scratch 301 ' on the surface of the broken substrate 3, but since there is no initial stroke Mark 301, so the time for forming cracks on the glass substrate 3〇 is prolonged, that is, the moving speed of the laser beam 31 relative to the glass substrate 30 is reduced during the cutting process to increase the laser beam 31 to the glass substrate, the same portion of the glass substrate Heating time. [0020] The glass substrate cutting method provided by the preferred embodiment 2 of the present invention has a similar step to the glass substrate cutting method of the first embodiment, except that after the crack is formed, the glass substrate is split along the crack in different ways. . Referring to FIG. 7 and FIG. 8 together, after the crack 502 is formed on the glass substrate 50, the cooling liquid remaining on the glass substrate 30 is wiped off, and the laser beam 31 is refocused on the glass substrate 5 to form an ellipse. Shape spot 511. The controller 44 then drives the table 43 to move along the crack 502 according to the first function and simultaneously drives the focus lens 42 to rotate according to the second function to cause the laser beam 31 to be projected on the glass substrate 50 along the elliptical spot 511. The crack 502 rotates around its center while moving, so that the extending direction of the long axis \ of the elliptical spot 5 i 1 is always consistent with the tangential direction of the crack 502 where the elliptical spot 51 is located, preferably an elliptical spot. The center of 511 is located on a predetermined cutting curve p, and the direction of the tangent line ' at the center of the elliptical 0 0 shaped spot 511 and the elliptical spot 311 is 096151265. 编 编 编 A0101 1003076185-0 «43292 100 On March 08, the replacement direction of the long axis B of the core is replaced so that the glass substrate 50 is broken along the crack 502. Since the extending direction of the major axis B of the elliptical spot 511 in this embodiment is substantially consistent with the tangential direction of the crack 50 2 at the center of the elliptical spot 511, the glass substrate 50 can accurately follow the crack 502. Split. [0021] It can be understood that after the crack 502 is formed on the glass substrate, a high-frequency wave source such as an ultrasonic source may be used to emit a high-frequency wave to the glass substrate to cause the crack 502 to grow downward, thereby breaking the glass substrate along the crack 502. . [0023] It can be understood that the above-mentioned implementation of the inverted cutting method; % can be applied to the cutting of the glass substrate, and can also be applied to some such as sapphire, crystal, and the like. In addition, the carbon dioxide laser is below the Raywat.
材之切割， 源較佳為 i較佳在100 請參閱圖9，本發明較佳實施例三提供一種由上述較佳實 施例一或二之切割方法製轉泛!玻故丨，該玻璃基板 70為鈉、鉀及二氧化矽製成之‘放議hi熱膨脹在3. 2x 10_6/攝氏度以上，且其厚度為0. 2毫米至6毫米。而 且，由於雷射切割玻璃之分裂機制，該玻璃基板之切割 側面701為光亮曲面。 [0024] 下面對雷射切割玻璃之分裂機制進行詳細說明：由於玻 璃屬於脆性非金屬材料範疇，其斷裂形式為低塑性斷裂 ，其材料斷裂時需滿足1^ = 1(1(：。其中，\為應力場強度 因數，其值與材料中存在之裂痕之深度及外加應力大小 有關，與材料本身性質無關，κκ為材料斷裂韌性，其值 096151265 表單編號A0101 第10頁/共26頁 1003076185-0 1343292 . --- 100年03月08日核正替換頁 與材料本身之組織狀態有關《當使用本發明較佳實施例 一或二中之切割方法對玻璃基板進行切割時，玻璃基材 上之待切割部位先受熱後受冷可形成一應力區。該應力 區内之之應力大小與外加之溫度變化值及玻璃材料自身 之膨脹係數、收縮率有關。由於應力增大時，應力場強 度因數1(丨也隨之增大，故，當與該應力區内之最大應力 值對應之場強度因數K, 增加到臨界值KIf<時，該玻璃基 I max 1。 材表面將沿著最大應力方向被拉裂開。由於本發明係採 用橢圓形光斑進行切割，且該橢圓形光斑對玻璃基材加 熱時，該玻璃基材與橢圓形光斑長轴對應之部位溫度升 4 , 高較快，故冷卻後，該玻璃基材與橢圓形光斑長軸對應 之部位溫度變化最大，故與橢圓形光斑長轴方向對應之 應力值為上述應力區内之最大應力值。故採用本發明之 切割方法可按玻璃基材之預定切割曲線準確形成裂痕， 接著採用雷射光束沿裂痕對玻璃基材進行劈裂或將壓力 作用於該裂痕二側以使玻璃基板分裂，即可製得上述玻 璃基板70。由於該玻璃基板7〇係藉由應力在玻璃基材上 產生裂痕後，再使用雷射光束或外界壓力使該玻璃基材 分裂，在切割過程中玻璃基材無須與高硬度物體接觸並 相互擠壓，故該玻璃基板70之切割曲面701上不會形成毛 刺與微裂痕’為·光免曲面。 [0025] 該玻璃基板7 0相對於習知藉由鑽石刀刻劃形成裂痕並藉 由機械力分裂，然後對其切割側面進行研磨製成之玻璃 基板’具有強度高之優點，其可藉由以下實驗驗證：準 備一塊厚度為1. 6毫米之破璃基板7〇及一塊厚度為1· 6毫 096151265 表單编號A0101 第11頁/共26頁 1003076185-0 ^43292 10p年03月08日按正替換有 米之藉由習知機械切割及研磨工藝制得之玻璃基板，然 後將其分別置於二個相同之支撐體上，再於該二塊玻璃 基板上分別施加壓力直至其破裂，接著分別記下該二塊 玻璃基板破裂時對應之負載強度值。重複進行上述試驗 步驟，可得到如圖1 〇所示之二條曲線(：丨、C2，其中曲線 Cl係由二十個厚度為1. 6毫米之玻璃基板70破裂時相對應 之負載強度值連接而成，曲線C2係由二十個與厚度為1. 6 毫米之習知機械切割及研磨工藝制得之玻璃基板破裂時 相對應之負載強度值連接而成。由圖1〇可知，該厚度為 1. 6毫米之玻璃基故之讀為办㊉免至8〇千克， 該厚度為1.6亳米之藉由工藝製得之 玻璃基板之負載強度為塊玻璃基 板產生負載強度差異之原割之玻璃 基板雖然經過研磨處理，但其切割面經_處理僅能形 成一霧面，該切割面上仍然會存在微楚、痕，當該種玻璃 基板承受到較小壓力時，該骚ί璜!著微裂痕破 裂，而玻璃基板7〇之切割痛面欠〇彳驾上免亮曲面，其上無 微裂痕’故其可承受較大沒;力丨時_才發生破裂，即該玻 璃基板7G具核高之負栽強度σ [0026] 細上所述，本發明符合發明專利要件，爰依法提出專利 申明。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士 ’在爰依本發明精神所作之等效修 飾或邊化’皆應涵蓋於以下之巾請專利範圍内。 【圖式簡單說明】 [0027] 096151265 圖1係—種採用習知跪性非金屬基材之切割方法對玻璃基 表單坞號Α0101 1003076185-0 第12頁/共26頁 1343292 ___ ' 100年03月08日核正替換頁 板進行切割之示意圖。 [0028] 圖2係一種採用習知雷射切割裝置形成切割光斑之示意圖 〇 [0029 ] 圖3係採用圖2所示之雷射切割裝置形成之切割光斑對玻 璃基板進行切割之示意圖。 [0030] 圖4係本發明較佳實施例一之脆性非金屬基材之切割方法 採用之雷射切割裝置之立體示意圖。 [0031] 圖5係圖4所示之雷射切割裝置形成之橢圓形光斑於脆性 ' 非金屬基材上沿預定切割曲線形成裂痕之示意圖。 [0032] 圖6係圖5所示之VI區放大圖。 [0033] 圖7係本發明較佳實施例二之脆性非金屬基材之切割方法 採用橢圓形光斑對玻璃基板沿裂痕進行切割之示意圖。 [0034] 圖8係圖7所示之VIII區放大圖。 [0035] 圖9係本發明較佳實施例三之玻璃基板立體示意圖。 [0036] 圖1 0係分別對圖9所示之玻璃基板及習知藉由機械切割及 研磨工藝制得之玻璃基板進行強度試驗之資料比較圖。 【主要元件符號說明】 [0037] (本發明） [0038] 玻璃基板：30、50、70 [0039] 初始劃痕：301 [0040] 雷射光束：31 096151265 表單編號A0101 第13頁/共26頁 1003076185-0 1343292 100年03月08日核正替換苜 [0041] 橢圓形光斑：311、51 1 [0042] 冷卻液體流：32 [0043] 雷射切割裝置：40 [0044] 雷射源：41 [0045] 聚焦鏡頭·· 42 [0046] 工作台：43 [0047] 控制器：44 [0048] 裂痕：502 7:’;’ [0049] 切割側面：7移1 [0050] 預定切割曲線：P i、B1 [0051] 切線：'、Bi [0052] 長軸：、Bi [0053] (習知） [0054] 脆性非金屬基板：10、20 [0055] 初始劃痕：101 [0056] 橢圓形光斑：111 [0057] 冷卻液體流：12、22 [0058] 長軸：b [0059] 預定切割直線：h、L2For the cutting of the material, the source is preferably i is preferably 100. Referring to FIG. 9, a preferred embodiment 3 of the present invention provides a method for manufacturing a glass substrate by the cutting method of the first or second preferred embodiment. 70毫米为6毫米。 The 70 is made up of sodium, potassium and cerium. Moreover, due to the splitting mechanism of the laser cut glass, the cut side 701 of the glass substrate is a bright curved surface. [0024] The following is a detailed description of the splitting mechanism of the laser-cut glass: since the glass belongs to the category of brittle non-metallic materials, the fracture form is low plastic fracture, and the material needs to satisfy 1^ = 1 (1. , \ is the stress field strength factor, its value is related to the depth of the crack and the applied stress in the material, regardless of the nature of the material itself, κκ is the fracture toughness of the material, its value is 096151265 Form No. A0101 Page 10 / Total 26 Page 1003076185 -0 1343292 . --- On March 08, 100, the replacement page is related to the tissue state of the material itself. When the glass substrate is cut using the cutting method of the preferred embodiment of the present invention, the glass substrate The upper part to be cut is heated and then cooled to form a stress zone. The stress in the stress zone is related to the applied temperature change value and the expansion coefficient and shrinkage rate of the glass material itself. The intensity factor 1 (the enthalpy also increases, so when the field strength factor K corresponding to the maximum stress value in the stress region increases to the critical value KIf<, the glass base I max 1 The surface of the material will be pulled apart along the direction of the maximum stress. Since the present invention uses an elliptical spot to cut, and the elliptical spot heats the glass substrate, the glass substrate corresponds to the long axis of the elliptical spot. The temperature rises by 4 and the height is faster. Therefore, after cooling, the temperature of the portion corresponding to the long axis of the elliptical spot is the largest, so the stress value corresponding to the long axis direction of the elliptical spot is the maximum stress value in the above stress region. Therefore, the cutting method of the present invention can accurately form cracks according to a predetermined cutting curve of the glass substrate, and then use a laser beam to split the glass substrate along the crack or apply pressure to the two sides of the crack to split the glass substrate. The glass substrate 70 can be obtained. Since the glass substrate 7 is cracked on the glass substrate by stress, the glass substrate is split by using a laser beam or external pressure, and the glass substrate is cut during the cutting process. It is not necessary to contact with the high-hardness object and squeeze each other, so that the burr and the micro-crack are not formed on the cut curved surface 701 of the glass substrate 70. [0025] The glass substrate 70 has the advantage of high strength compared to the conventional glass substrate which is formed by cracking a diamond knife and is split by mechanical force, and then grinding the cut side thereof, which can be obtained by the following experiment Verification: Prepare a piece of glass substrate with a thickness of 1.6 mm and a piece of thickness of 1·6 milli-096151265 Form No. A0101 Page 11/Total 26 pages 1003076185-0 ^43292 10p Year March 08 Press positive There is a glass substrate prepared by a conventional mechanical cutting and grinding process, and then placed on two identical supports, and then pressure is applied to the two glass substrates until they are broken, and then separately recorded. The corresponding load strength value when the two glass substrates are broken. Repeat the above test steps to obtain two curves as shown in Fig. 1 (: 丨, C2, where the curve C1 is connected by the corresponding load strength value when twenty glass substrates 70 having a thickness of 1.6 mm are broken. The curve C2 is formed by connecting 20 load strength values corresponding to the fracture of the glass substrate obtained by the conventional mechanical cutting and grinding process with a thickness of 1.6 mm. As can be seen from Fig. 1 For the glass of 1. 6 mm, the reading is from 10 to 8 〇, and the thickness of the glass is 1.6 亳. The load strength of the glass substrate obtained by the process is the original load of the glass substrate. Although the glass substrate is subjected to grinding treatment, the cut surface can only form a matte surface by the treatment, and there are still traces and marks on the cut surface. When the glass substrate is subjected to less pressure, the smashing! The micro-crack ruptures, and the cutting pain surface of the glass substrate 7 〇彳 〇彳 〇彳 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上Nuclear bearing height σ [0026] The invention is in accordance with the invention patents, and the patent claims are filed according to the law. However, the above description is only a preferred embodiment of the present invention, and those skilled in the art of the present invention are equivalently modified in accordance with the spirit of the present invention. Or edged 'should be covered in the following patents. [Simplified description of the drawings] [0027] 096151265 Figure 1 is a cutting method using a conventional non-metallic substrate to the glass-based form dock number Α 0101 1003076185-0 Page 12 of 26 1343292 ___ ' Figure 3 is a schematic diagram of the cutting of the replacement plate to perform cutting. [0028] Figure 2 is a schematic diagram of forming a cutting spot using a conventional laser cutting device. Figure 3 is a schematic view showing the cutting of a glass substrate by using a cutting spot formed by the laser cutting device shown in Figure 2. [0030] Figure 4 is a cutting method of a brittle non-metallic substrate according to a preferred embodiment of the present invention. 3 is a schematic view of a laser cutting device. [0031] FIG. 5 is a schematic view showing the formation of a crack along a predetermined cutting curve on a fragile 'non-metal substrate by an elliptical spot formed by the laser cutting device shown in FIG. 6 is an enlarged view of the VI area shown in FIG. 5. [0033] FIG. 7 is a cutting method of a brittle non-metallic substrate according to a preferred embodiment 2 of the present invention, which uses an elliptical spot to cut a crack along a glass substrate. Figure 8 is an enlarged view of the VIII area shown in Figure 7. [0035] Figure 9 is a perspective view of a glass substrate according to a preferred embodiment of the present invention. [0036] Figure 10 is shown in Figure 9 A comparison chart of the strength of the glass substrate and the glass substrate obtained by the mechanical cutting and grinding process. [Main component symbol description] [0037] (Invention) [0038] Glass substrate: 30, 50, 70 [0039] Initial scratch: 301 [0040] Laser beam: 31 096151265 Form number A0101 Page 13 / Total 26 pages 1003076185-0 1343292 100 years of March 8 nuclear replacement 苜 [0041] Oval spot: 311, 51 1 [0042] Cooling liquid flow: 32 [0043] Laser cutting device: 40 [0044] Laser source: 41 [0045] Focusing lens · · 42 [0046] Workbench: 43 [0047] Controller: 44 [ 0048] Crack: 502 7: '; ' [0049] Cutting side: 7 shift 1 [0050] Scheduled cutting curve: P i, B1 [00 51] Tangent: ', Bi [0052] Long axis:, Bi [0053] (conventional) [0054] Brittle non-metallic substrate: 10, 20 [0055] Initial scratch: 101 [0056] Elliptical spot: 111 [ 0057] Cooling liquid flow: 12, 22 [0058] Long axis: b [0059] Scheduled cutting straight line: h, L2
096151265 表單編號A0101 第14頁/共26頁 1003076185-0 1343292 100年03月08日慘正替换頁 [0060] 雷射光束：2 1 [0061] 線形光斑·· 211 [0062] 雷射掃描裝置：24 [0063] 第一反射鏡：241 [0064] 第二反射鏡：243 [0065] 第一掃描軸：h [0066] 第二掃描軸：K2 [0067] 預定切割曲線：L2 096151265 表單編號A0101 第15頁/共26頁 1003076185-0096151265 Form No. A0101 Page 14 of 26 1003076185-0 1343292 100 years of March 2008 Misplaced replacement page [0060] Laser beam: 2 1 [0061] Linear spot · 211 [0062] Laser scanning device: 24 [0063] First Mirror: 241 [0064] Second Mirror: 243 [0065] First Scanning Axis: h [0066] Second Scanning Axis: K2 [0067] Predetermined Cutting Curve: L2 096151265 Form No. A0101 15 pages / total 26 pages 1003076185-0