TWI342811B - Method for laser scribing a brittle substrate and a brittle substrate - Google Patents

Description

1342811 Correction and replacement page on March 14, 100. Description of the invention: [Technical field of the invention] [0001] The present invention relates to cutting and separating techniques, and more particularly to a method of laser cutting a non-metallic or brittle substrate and by the method A brittle substrate made. [Prior Art] [0002] Referring to FIG. 1, a method of laser-cutting a brittle substrate generally heats a surface of a glass substrate 10 with a laser having a strong absorption characteristic of a brittle substrate, such as a carbon dioxide (C02) laser beam 20. Partial cooling with cooling fluid 30,

Further, heat is generated on the surface of the glass substrate 10 due to a sharp temperature difference. The force is made to have an initial crack (i^i: a friend's glass substrate 1 〇4 · ·· I· ' . . 'The edge of the crack is generated ' and grows into a blind crack (as indicated by the arrow in Fig. 1) to form a blind crack (b and thus can form a secant line on the surface of the glass sheet member 10. However, the cutting start position is often due to the glass. The edge of the ^; has a low edge strength (for example, the shadow of the initial crack 11), so that the initial crack 11 will be cut along the thickness of the glass substrate 1 and along the moving direction of the laser beam 20睪; so that a full disconnection corresponding to the full-break region 12 in FIG. 1 is formed at the beginning of the dicing line. [0004] Please refer to FIG. 2 together, which is preceded by the a1 direction on the glass substrate 1 Forming a first direction cutting line A10, All, A12, A13, and forming a state of the second direction cutting line A20 along the A2 direction. It can be seen from FIG. 2 'when sequentially in a single direction (ie, First direction A1) When initial cracking and laser cutting are performed, the start of the first direction cutting lines A10, A11, A12, A13 The initial crack is completely broken and has a difference in growth distance along the A1 direction (the solid line portion 097110077 of the first direction cutting line A1〇, A11, ai2, A13 in the first direction in Fig. 2) Form number·A0101 Page 4/15 pages 1003085051- 0 13,42811 . ___ On March 14, 100, the shuttle is replacing the page), so that the second direction cutting line A20 adjacent to the starting end of the first direction cutting lines A10, A11, A12, A132 cannot cross the first direction cutting line ( For example, the full disconnection of A10) causes the cutting failure (as indicated by the arrow F1 in Fig. 2), or the crack growth in other directions deviating from the A2 direction (such as the portion indicated by the arrow F2 in Fig. 2) affecting the cutting precision. Further, the cutting yield of the glass substrate is poor. [0005] In view of the above, it is necessary to provide a laser cutting brittle substrate having a high cutting yield and a brittle substrate obtained by the method.

SUMMARY OF THE INVENTION [0006] Hereinafter, a method of lightning-cutting a brittle tomb & and a brittle substrate obtained by the method will be described by way of examples. [0007] A method of laser cutting a brittle substrate, comprising the steps of: [0008] providing a brittle substrate;

[0009] forming a cutting edge in a first direction at a position adjacent to an edge of the brittle substrate by a laser cutting process; cutting line; [0010] adjacent to the beginning end of the first cutting line on the brittle substrate a position forming an initial crack originating at the edge and crossing the first cutting line, the initial crack extending in a second direction different from the first direction; and [0011] utilizing a laser cutting process on the brittle substrate The initial crack forms a second cutting line extending in the second direction, the initial crack does not coincide with the second cutting line and the second cutting line extends along the initial crack. And a fragile substrate on which a first cutting line and a 097110077 are formed. Form No. A0101 Page 5 / Total 15 Page 1003085051-0 1342811 [0014] [0015] [0016] 097110077 100 years 03 On the 14th of the month, the second cutting line of the replacement page is replaced, the first cutting line is adjacent to one edge of the brittle substrate, and the position of the brittle substrate adjacent to the starting end of the first cutting line forms the starting edge and spans the first cutting An initial crack of the line, the second cut line extending followed by the initial crack. Compared with the prior art, the above method for laser-cutting a brittle substrate can effectively avoid subsequent formation by forming a cutting process of forming a second cutting line at a position adjacent to the beginning end of the first cutting line after forming a first cutting line. The cutting line extending in the first direction and/or extending in the second direction (a) fails due to the inability to cross the starting end of the cutting line in the other direction, or (b) deviates from the capital: none, thereby achieving Higher cutting yield. [Embodiment]

The detailed description of the embodiments of the present invention will be described below with reference to the accompanying drawings. iS Referring to FIG. 3 to FIG. 5, a method for laser cutting a brittle substrate according to an embodiment of the present invention includes the following steps, as shown in FIG. 3, providing a brittle fractional laser cutting process adjacent to a brittle substrate. A position of one edge ιοί of the brittle base ^kr〇4 forms a first cutting line 110, and the first cutting line 110 extends in the A1 direction. The brittle substrate 100 is usually a non-metal substrate such as a ceramic substrate, a glass substrate, a quartz substrate, a glass germanium wafer, or a light-emitting diode wafer. The brittle substrate 100 can be a square plate (as shown in Figure 3), or other shaped workpieces, such as circular members, as desired. The laser cutting process can generally include the steps of: (a) heating the brittle substrate 100 with a laser beam, and causing the laser beam to generate a relative movement in the A1 direction with the brittle substrate 100; and (b) applying to the brittle substrate 100 ( For example, jetting) a cooling fluid (example form number A0101 page 6 / total 15 pages 1003085051-0

13,42811 On March 14, 100, the shuttle replacement page, such as the 'gas-liquid mixture,' partially cooled the heated substrate 1 to form a first cutting line 11〇 on the brittle substrate 110. Further, before the laser beam heats the brittle substrate 1 , an initial crack may be formed at the beginning end 11 of the first cutting line 11 by using a diamond knife, a cutter wheel or a laser scribing or the like ( That is, the left side portion of the solid line portion of the first cutting line 11〇 in FIG. 3, the initial crack grows into a full disconnection under the action of the laser beam and the cooling fluid (that is, the first cutting line in FIG. 3) The solid line of 110). [0017] As shown in FIG. 4, an initial crack 122 is formed on the brittle substrate 10 at a position adjacent to the starting end 111 of the first cutting line 110; the initial crack 122 starts at the edge 101 and spans the first slit Win 11 baht. The initial crack 丨Μ is intersected with the starting end 11 of the remaining cutting line 110, which extends in the A2 direction which is the same as the A1 direction. The A1 direction intersects the A2 direction, for example, perpendicularly intersects. The initial crack 12 2 can be formed by a town knife, a cutter wheel or a laser scoring. [0018] As shown in FIG. 5, a second cutting line 12 延伸 extending along the A 2 direction is formed along the initial crack 1 2 2 by using a laser cutting process, and a second cutting line 12 延伸 extending along the A 2 direction is formed. A fragile substrate 1 形成 having a first dicing line η 〇 and a second dicing line 120 intersecting therewith is formed thereon. The first cutting line 110 and the second cutting line 12 are located on the same surface of the brittle substrate 00. Wherein, the laser cutting process can generally include the steps of (3) heating the brittle substrate 1 利用 with a laser beam, and causing the laser beam and the brittle substrate 1 〇〇 to generate relative motion in the Α 2 direction; and (b) A cooling fluid (eg, a gas-liquid mixture) is applied (eg, sprayed) to the brittle substrate 1 to locally cool the heated brittle substrate 100 to form a second cutting line 120 on the brittle substrate 100. The beginning end 12 of the second cutting line 120 and the first cutting line 11 () 097110077 table grass Sfe A0101 page 7 / 15 pages 1003085051-0 ___I_, intersected at the beginning 111 of the replacement page 111 on March 14, 100 The initial crack 122 grows in the A2 direction to a full break (ie, the solid line portion of the second cut line 1 20 in FIG. 5). [0019] It should be noted that the second cutting line 120 in this embodiment may be a first cutting line extending in the A2 direction (as shown in FIG. 5), or may be the last cutting line extending in the A2 direction. In addition, the first cutting line 110 may also extend in the A2 direction, and correspondingly, the second cutting line 120 extends in the A1 direction. [0020] In addition, for the subsequent cutting process of the brittle substrate 100 shown in FIG. 5, the cutting may be further performed along the A2 direction in the A1 direction to form [0021] multiple intersecting cutting lines on the brittle substrate 100. You can also cut along the A1 direction first.

In summary, the embodiment of the present invention provides that it is used to form a cut; in a nutshell, subsequent cutting

'No limit. The method of the plate t forms a cutting process of the cutting line 120 adjacent to the starting end 111 of the first cutting line 110, which can effectively avoid the subsequent formation along the ΑΪ' direction and/or A2

The cutting line extending in the direction (1) affects the cutting precision due to the cutting direction of the cutting end due to the cutting end of the cutting line, thereby achieving a higher Qin ratio. [0022] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0023] FIG. 1 is a partial cross-sectional view showing a brittle substrate cut by a laser cutting process. 097110077 Form No. A0101 Page 8 of 15 1003085051-0 1342811 March 14th, 2014 Shuttle Replacement Page [0024] FIG. 2 is a schematic view showing a cutting effect of a brittle substrate cut by a laser cutting process in the prior art. 3 shows a first cutting line extending along a first direction at a position adjacent to an edge of the brittle substrate by a laser cutting process according to an embodiment of the present invention. 4 shows that an initial crack originating from the edge and crossing the first cutting line is formed at the beginning of the first cutting line of the brittle substrate shown in FIG.

[0027] FIG. 5 shows that a second cutting line extending in the second direction is formed along the initial crack on the brittle substrate shown in FIG. 4. [Main component symbol description] [0028] Glass substrate: 10 [0029] Laser beam: 2 0 [0030] Cooling fluid: 30 [0031] Initial crack: 11, 122

[0032] Full-break zone: 12 [0033] Blind crack: 1 4 [0034] Edge: 101 [0035] First cutting line: 11 0 [0036] Starting end: 111, 121 [0037] Second cutting line: 1 2 0 [0038] First direction cutting line: A1 0, A11, A1 2, A1 3 097110077 Form number A0101 Page 9 / Total 15 pages 1003085051-0 1342811 , _* Correction of replacement of π [0039] ] Second direction cutting line: Α20 097110077 Form number Α0101

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Claims (1)

1342811 . , _100 March 14 revised replacement page VII, the scope of application patent: 1. A method of laser cutting a brittle substrate, comprising the steps of: providing a brittle substrate; using a laser cutting process on the brittle substrate Forming a first cutting line extending along a first direction adjacent to an edge thereof; Forming an initial crack starting from the edge and crossing the first cutting line at a position adjacent to the starting end of the first cutting line on the brittle substrate, the initial crack along a second direction different from the first direction Extending; and forming, by the laser cutting process, a second cutting line extending along the initial direction along the initial crack on the brittle substrate, the initial crack not coincident with the second cutting line and the second cutting line This initial crack then extends. 2. The method of f-cutting a brittle material according to claim 1, wherein the first direction intersects the second direction perpendicularly. 3. The method of laser cutting a brittle substrate according to claim 1, wherein the material of the brittle substrate is non-metal. 4. The method of laser cutting a brittle substrate according to claim 3, wherein the brittle substrate is a ceramic substrate, a glass substrate, a quartz substrate, a glass germanium wafer or a light emitting diode wafer. 5. The method of laser cutting a brittle substrate according to claim 1, wherein the brittle substrate is a square plate, the edge of the brittle substrate extending along the first direction, the length of the initial crack being greater than the The distance from the intersection of the beginning end of the second cutting line and the beginning end of the first cutting line to the edge. 6. The method of laser cutting a brittle substrate according to claim 1, wherein the first cutting line and the second cutting line are on the same surface of the brittle substrate. 097110077 Form No. A0101 Page 1 / 15 pages 1003085051-0 1342811 100 March 2014 The replacement page is a brittle substrate, wherein: the brittle substrate is formed with a first cutting line and a second cutting line, The first cutting line is adjacent to an edge of the brittle substrate, and the position of the brittle substrate adjacent to the beginning end of the first cutting line forms an initial crack that starts the edge and spans the first cutting line, and the second cutting line is followed by The fragile substrate of claim 7, wherein the first cutting line intersects the second cutting line perpendicularly. The winning substrate according to claim 7, wherein the first cutting line and the second cutting line are located at the same surface on which the face is attached. Ίο . The brittle substrate according to item 7 of the patent application garden is a square plate member, and the starting end of the initial secant line is at a distance from the first cutting line. 097110077 Form No. A0101 Page 12 of 15 1003085051-0