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TWI341013B - Improved chip-scale package - Google Patents

Improved chip-scale package

Info

Publication number
TWI341013B
TWI341013B TW096109330A TW96109330A TWI341013B TW I341013 B TWI341013 B TW I341013B TW 096109330 A TW096109330 A TW 096109330A TW 96109330 A TW96109330 A TW 96109330A TW I341013 B TWI341013 B TW I341013B
Authority
TW
Taiwan
Prior art keywords
scale package
improved chip
chip
improved
package
Prior art date
Application number
TW096109330A
Other languages
English (en)
Other versions
TW200741990A (en
Inventor
Martin Standing
Original Assignee
Int Rectifier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Rectifier Corp filed Critical Int Rectifier Corp
Publication of TW200741990A publication Critical patent/TW200741990A/zh
Application granted granted Critical
Publication of TWI341013B publication Critical patent/TWI341013B/zh

Links

Classifications

    • H10W70/68—
    • H10W70/20—
    • H10W72/60—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H10W72/07336—
    • H10W72/07636—
    • H10W72/07637—
    • H10W72/622—
    • H10W72/652—
    • H10W72/856—
    • H10W72/877—
    • H10W90/736—
    • H10W90/764—
TW096109330A 2006-03-17 2007-03-19 Improved chip-scale package TWI341013B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/378,607 US20070215997A1 (en) 2006-03-17 2006-03-17 Chip-scale package

Publications (2)

Publication Number Publication Date
TW200741990A TW200741990A (en) 2007-11-01
TWI341013B true TWI341013B (en) 2011-04-21

Family

ID=38516940

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109330A TWI341013B (en) 2006-03-17 2007-03-19 Improved chip-scale package

Country Status (5)

Country Link
US (1) US20070215997A1 (zh)
EP (1) EP2008304A4 (zh)
JP (1) JP4977753B2 (zh)
TW (1) TWI341013B (zh)
WO (1) WO2007109133A2 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005061015B4 (de) * 2005-12-19 2008-03-13 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiterbauteils mit einem vertikalen Halbleiterbauelement
US7982309B2 (en) * 2007-02-13 2011-07-19 Infineon Technologies Ag Integrated circuit including gas phase deposited packaging material
CN111640742B (zh) 2015-07-01 2021-04-20 新唐科技日本株式会社 半导体装置
US9966341B1 (en) 2016-10-31 2018-05-08 Infineon Technologies Americas Corp. Input/output pins for chip-embedded substrate

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482463U (zh) * 1971-05-21 1973-01-12
US3972062A (en) * 1973-10-04 1976-07-27 Motorola, Inc. Mounting assemblies for a plurality of transistor integrated circuit chips
JPS629722Y2 (zh) * 1981-01-13 1987-03-06
JPS6184041A (ja) * 1984-10-02 1986-04-28 Fujitsu Ltd 半導体装置
DE3521572A1 (de) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit keramiksubstrat
JP2702131B2 (ja) * 1987-06-12 1998-01-21 キヤノン株式会社 画像読取装置及び該装置を有する画像情報読取装置
US4976813A (en) * 1988-07-01 1990-12-11 Amoco Corporation Process for using a composition for a solder mask
US4901135A (en) * 1988-08-15 1990-02-13 General Electric Company Hermetically sealed housing with welding seal
US5108825A (en) * 1989-12-21 1992-04-28 General Electric Company Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it
US5161093A (en) * 1990-07-02 1992-11-03 General Electric Company Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive
US5139972A (en) * 1991-02-28 1992-08-18 General Electric Company Batch assembly of high density hermetic packages for power semiconductor chips
JP3258764B2 (ja) * 1993-06-01 2002-02-18 三菱電機株式会社 樹脂封止型半導体装置の製造方法ならびに外部引出用電極およびその製造方法
FR2709021B1 (fr) * 1993-08-09 1995-10-27 Sgs Thomson Microelectronics Dissipateur thermique pour boîtier plastique.
US5446316A (en) * 1994-01-06 1995-08-29 Harris Corporation Hermetic package for a high power semiconductor device
US6359335B1 (en) * 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5688716A (en) * 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
US5572070A (en) * 1995-02-06 1996-11-05 Rjr Polymers, Inc. Integrated circuit packages with heat dissipation for high current load
US5818699A (en) * 1995-07-05 1998-10-06 Kabushiki Kaisha Toshiba Multi-chip module and production method thereof
DE69616186T2 (de) * 1995-07-19 2002-07-11 Raytheon Co., Lexington Bei Raumtemperatur stabiler, flexibler einkomponenten Epoxidklebstoff mit thermischer Leitfähigkeit
JPH09293754A (ja) * 1996-04-24 1997-11-11 Canon Inc 電気回路部品及び電気回路部品の製造方法及び導電ボール及び導電接続部材及び導電接続部材の製造方法
US5949654A (en) * 1996-07-03 1999-09-07 Kabushiki Kaisha Toshiba Multi-chip module, an electronic device, and production method thereof
US6075289A (en) * 1996-10-24 2000-06-13 Tessera, Inc. Thermally enhanced packaged semiconductor assemblies
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
US5893726A (en) * 1997-12-15 1999-04-13 Micron Technology, Inc. Semiconductor package with pre-fabricated cover and method of fabrication
JPH11354680A (ja) * 1998-06-11 1999-12-24 Sony Corp プリント配線基板とこれを用いた半導体パッケージ
EP0978871A3 (en) * 1998-08-05 2001-12-19 Harris Corporation A low power packaging design
US6133634A (en) * 1998-08-05 2000-10-17 Fairchild Semiconductor Corporation High performance flip chip package
JP3895884B2 (ja) * 1999-03-25 2007-03-22 三洋電機株式会社 半導体装置
US6624522B2 (en) * 2000-04-04 2003-09-23 International Rectifier Corporation Chip scale surface mounted device and process of manufacture
US20020016070A1 (en) * 2000-04-05 2002-02-07 Gerald Friese Power pads for application of high current per bond pad in silicon technology
USD503691S1 (en) * 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US7119447B2 (en) * 2001-03-28 2006-10-10 International Rectifier Corporation Direct fet device for high frequency application
US6930397B2 (en) * 2001-03-28 2005-08-16 International Rectifier Corporation Surface mounted package with die bottom spaced from support board
US6645791B2 (en) * 2001-04-23 2003-11-11 Fairchild Semiconductor Semiconductor die package including carrier with mask
US6893901B2 (en) * 2001-05-14 2005-05-17 Fairchild Semiconductor Corporation Carrier with metal bumps for semiconductor die packages
US7476964B2 (en) * 2001-06-18 2009-01-13 International Rectifier Corporation High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing
JP3868777B2 (ja) * 2001-09-11 2007-01-17 株式会社東芝 半導体装置
US6784540B2 (en) * 2001-10-10 2004-08-31 International Rectifier Corp. Semiconductor device package with improved cooling
TW517365B (en) * 2001-11-29 2003-01-11 Orient Semiconductor Elect Ltd Heat dissipation plate and its bonding process with substrate
JP3897596B2 (ja) * 2002-01-07 2007-03-28 日本テキサス・インスツルメンツ株式会社 半導体装置と配線基板との実装体
US20030131975A1 (en) * 2002-01-11 2003-07-17 Sabina Houle Integrated heat spreader with mechanical interlock designs
US6677669B2 (en) * 2002-01-18 2004-01-13 International Rectifier Corporation Semiconductor package including two semiconductor die disposed within a common clip
US6841865B2 (en) * 2002-11-22 2005-01-11 International Rectifier Corporation Semiconductor device having clips for connecting to external elements
US7088004B2 (en) * 2002-11-27 2006-08-08 International Rectifier Corporation Flip-chip device having conductive connectors
US6896976B2 (en) * 2003-04-09 2005-05-24 International Rectifier Corporation Tin antimony solder for MOSFET with TiNiAg back metal
CN100454533C (zh) * 2003-04-15 2009-01-21 波零公司 用于电子元件封装的emi屏蔽
US8368223B2 (en) * 2003-10-24 2013-02-05 International Rectifier Corporation Paste for forming an interconnect and interconnect formed from the paste
US7315081B2 (en) * 2003-10-24 2008-01-01 International Rectifier Corporation Semiconductor device package utilizing proud interconnect material
JP4312616B2 (ja) * 2004-01-26 2009-08-12 Ｎｅｃエレクトロニクス株式会社 半導体装置
US8368211B2 (en) * 2004-03-11 2013-02-05 International Rectifier Corporation Solderable top metalization and passivation for source mounted package
US20050269677A1 (en) * 2004-05-28 2005-12-08 Martin Standing Preparation of front contact for surface mounting
US7678680B2 (en) * 2004-06-03 2010-03-16 International Rectifier Corporation Semiconductor device with reduced contact resistance
DE102004030042B4 (de) * 2004-06-22 2009-04-02 Infineon Technologies Ag Halbleiterbauelement mit einem auf einem Träger montierten Halbleiterchip, bei dem die vom Halbleiterchip auf den Träger übertragene Wärme begrenzt ist, sowie Verfahren zur Herstellung eines Halbleiterbauelementes
US7235877B2 (en) * 2004-09-23 2007-06-26 International Rectifier Corporation Redistributed solder pads using etched lead frame
US7692316B2 (en) * 2004-10-01 2010-04-06 International Rectifier Corporation Audio amplifier assembly
JP2006222298A (ja) * 2005-02-10 2006-08-24 Renesas Technology Corp 半導体装置およびその製造方法
US7476976B2 (en) * 2005-02-23 2009-01-13 Texas Instruments Incorporated Flip chip package with advanced electrical and thermal properties for high current designs
US7402507B2 (en) * 2005-03-04 2008-07-22 International Rectifier Corporation Semiconductor package fabrication
US20060270106A1 (en) * 2005-05-31 2006-11-30 Tz-Cheng Chiu System and method for polymer encapsulated solder lid attach
US7365981B2 (en) * 2005-06-28 2008-04-29 Delphi Technologies, Inc. Fluid-cooled electronic system
US8143729B2 (en) * 2008-01-25 2012-03-27 International Rectifier Corporation Autoclave capable chip-scale package

Also Published As

Publication number Publication date
EP2008304A4 (en) 2011-03-23
TW200741990A (en) 2007-11-01
WO2007109133B1 (en) 2008-07-31
EP2008304A2 (en) 2008-12-31
WO2007109133A3 (en) 2008-04-03
JP2009530826A (ja) 2009-08-27
WO2007109133A2 (en) 2007-09-27
US20070215997A1 (en) 2007-09-20
JP4977753B2 (ja) 2012-07-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees