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TWI340870B - Negative-type photosensitive resin composition containing epoxy-containing material - Google Patents

Negative-type photosensitive resin composition containing epoxy-containing material

Info

Publication number
TWI340870B
TWI340870B TW095106758A TW95106758A TWI340870B TW I340870 B TWI340870 B TW I340870B TW 095106758 A TW095106758 A TW 095106758A TW 95106758 A TW95106758 A TW 95106758A TW I340870 B TWI340870 B TW I340870B
Authority
TW
Taiwan
Prior art keywords
negative
resin composition
photosensitive resin
type photosensitive
composition containing
Prior art date
Application number
TW095106758A
Other languages
English (en)
Other versions
TW200643619A (en
Inventor
Kei Arao
Makoto Nomura
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200643619A publication Critical patent/TW200643619A/zh
Application granted granted Critical
Publication of TWI340870B publication Critical patent/TWI340870B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW095106758A 2005-03-01 2006-03-01 Negative-type photosensitive resin composition containing epoxy-containing material TWI340870B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005056128A JP4662793B2 (ja) 2005-03-01 2005-03-01 エポキシ含有物質を含むネガ型感光性樹脂組成物

Publications (2)

Publication Number Publication Date
TW200643619A TW200643619A (en) 2006-12-16
TWI340870B true TWI340870B (en) 2011-04-21

Family

ID=36637001

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106758A TWI340870B (en) 2005-03-01 2006-03-01 Negative-type photosensitive resin composition containing epoxy-containing material

Country Status (6)

Country Link
US (1) US20060199099A1 (zh)
EP (1) EP1698936A3 (zh)
JP (1) JP4662793B2 (zh)
KR (1) KR101322702B1 (zh)
CN (1) CN1881083A (zh)
TW (1) TWI340870B (zh)

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JP2008292677A (ja) * 2007-05-23 2008-12-04 Mitsubishi Chemicals Corp 反応性樹脂組成物、カラーフィルター及び画像表示装置
JP4924241B2 (ja) * 2007-06-28 2012-04-25 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
EP2292707B1 (en) * 2008-06-13 2017-03-08 DIC Corporation Ink composition for forming an insulating film and an insulating film formed from said ink composition
JP5482552B2 (ja) * 2009-08-03 2014-05-07 Ｊｓｒ株式会社 感光性樹脂組成物及びその硬化物
JP5565931B2 (ja) * 2009-10-01 2014-08-06 株式会社Ａｄｅｋａ シリコンウエハ接着性樹脂組成物
JP5859257B2 (ja) * 2010-09-15 2016-02-10 旭化成イーマテリアルズ株式会社 フェノール樹脂組成物並びに硬化レリーフパターン及び半導体の製造方法
TWI481657B (zh) * 2010-09-15 2015-04-21 旭化成電子材料股份有限公司 A phenol resin composition and a hardened embossed pattern, and a method for manufacturing the semiconductor
JP6026097B2 (ja) * 2010-11-17 2016-11-16 旭化成株式会社 半導体素子表面保護膜又は層間絶縁膜用の感光性樹脂組成物
WO2012090965A1 (ja) 2010-12-27 2012-07-05 旭化成イーマテリアルズ株式会社 アルカリ現像用感光性フェノール樹脂組成物、硬化レリーフパターン及び半導体の製造方法、並びにビフェニルジイルトリヒドロキシベンゼン樹脂
CN102236253B (zh) * 2011-05-20 2012-11-07 潍坊星泰克微电子材料有限公司 用于微光刻工艺的多相高硅光刻胶成像方法、多相高硅光刻胶及应用
JP6233271B2 (ja) 2013-12-27 2017-11-22 Jsr株式会社 感光性樹脂組成物およびレジストパターンの製造方法
JP6220695B2 (ja) * 2014-02-18 2017-10-25 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、感活性光線性又は感放射線性膜を備えたマスクブランクス、パターン形成方法及び電子デバイスの製造方法
WO2015141717A1 (ja) * 2014-03-20 2015-09-24 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
US9828520B2 (en) * 2016-04-15 2017-11-28 Xerox Corporation Interlayer composition and devices made therefrom
JP7100962B2 (ja) 2017-05-17 2022-07-14 東京応化工業株式会社 硬化性組成物、硬化物、硬化膜、表示パネル、及び硬化物の製造方法
JP6894290B2 (ja) 2017-05-17 2021-06-30 東京応化工業株式会社 硬化性組成物、硬化膜、表示パネル、及び硬化物の製造方法
JP6935260B2 (ja) * 2017-07-31 2021-09-15 東京応化工業株式会社 硬化性組成物、硬化膜、表示パネル又はｏｌｅｄ照明、並びに硬化物の製造方法
JP7230508B2 (ja) * 2017-09-29 2023-03-01 東レ株式会社 感光性樹脂組成物、硬化膜、硬化膜を具備する有機ｅｌディスプレイ、並びに有機ｅｌディスプレイの製造方法
KR102605003B1 (ko) * 2018-06-22 2023-11-22 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 레지스트 패턴의 형성 방법
CN120693570A (zh) * 2023-02-28 2025-09-23 住友电木株式会社 正型感光性树脂组合物、固化膜和半导体装置

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US4683317A (en) 1983-05-23 1987-07-28 General Electric Company Photopolymerizable organic compositions and diaryliodonium salts used therein
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US5300380A (en) * 1986-08-06 1994-04-05 Ciba-Geigy Corporation Process for the production of relief structures using a negative photoresist based on polyphenols and epoxy compounds or vinyl ethers
JP2532291B2 (ja) * 1989-10-30 1996-09-11 富士写真フイルム株式会社 湿し水不要感光性平版印刷版
US5210155A (en) * 1990-08-24 1993-05-11 Exxon Chemical Patents Inc. Phenol terminated diester compositions derived from dicarboxylic acids, polyester polymers or alkyd polymers, and curable compositions containing same
US5312715A (en) * 1991-03-04 1994-05-17 Shipley Company Inc. Light-sensitive composition and process
US5262280A (en) * 1992-04-02 1993-11-16 Shipley Company Inc. Radiation sensitive compositions
US5514728A (en) * 1993-07-23 1996-05-07 Minnesota Mining And Manufacturing Company Catalysts and initiators for polymerization
US5858618A (en) * 1996-12-02 1999-01-12 Nan Ya Plastics Corporation Photopolymerizable resinous composition
US5887229A (en) * 1997-04-11 1999-03-23 Xerox Corporation Photoreceptor shipping installation clip for xerographic customer replaceable unit (CRU)
US5919599A (en) * 1997-09-30 1999-07-06 Brewer Science, Inc. Thermosetting anti-reflective coatings at deep ultraviolet
JP2000089454A (ja) * 1998-09-14 2000-03-31 Tokyo Ohka Kogyo Co Ltd ネガ型レジスト組成物
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
JP4251612B2 (ja) * 2003-01-30 2009-04-08 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4266310B2 (ja) * 2003-01-31 2009-05-20 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 感光性樹脂組成物および該組成物を用いた樹脂パターンの形成方法
JP4397601B2 (ja) 2003-02-06 2010-01-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物

Also Published As

Publication number Publication date
JP2006243161A (ja) 2006-09-14
JP4662793B2 (ja) 2011-03-30
TW200643619A (en) 2006-12-16
KR101322702B1 (ko) 2013-10-25
KR20060099416A (ko) 2006-09-19
EP1698936A2 (en) 2006-09-06
CN1881083A (zh) 2006-12-20
US20060199099A1 (en) 2006-09-07
EP1698936A3 (en) 2008-07-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees