1238684 玖、發明說明： 【發明所屬之技術領域】 本發明關於一種在樹脂製的基板等基材上形成配線的配 線基材，尤其關於一種即使在具有水分的環境下長時間使 用，也不會產生配線部分或端子部分從底層樹脂剝離的現 象的技術。 【先前技術】 爲適應電子設備的小型化、輕量化，安裝在電子設備上 的各種印刷配線基板或可撓性印刷配線基板也向小型化、 輕量化方向發展。隨著該等配線基板的小型化，也發展配 線基板的端子部分的小型化，已開始使用端子部配線間距 0.5 mm左右的窄間距的配線基板。基於此背景，以連接端 子的高密度化爲目的，提出了錯開端子間距間隔的高密度 化結構的方案等（參照專利文獻丨）。 專利文獻1 :特開平6-13 154號公報 在此背景下，本案發明者們進行了具有窄間距結構的端 子部的配線基板的研究開發，製造了多種窄間距結構的配 線基板试樣，在將該4斌樣收容在耐環境試驗裝置中，設 定溫度60°C，濕度90%的氣氛中，進行外加直流電壓3.2 v、 通電幾百小時後，原樣放置的耐環境加速試驗時，在25〇小 時左右的試驗時間内，雖未發生特別的問題，但超過25〇小 時，繼續進行500小時以上的耐環境加速試驗時，結果發 現，在作爲窄間距結構的配線基板的連接端子部分，連接 部分的接觸電阻開始增加，根據試樣不同，有的引起連接 91997.doc 1238684 不良。 供於该耐環境加速試驗的配線基板試樣，其結構是：在 PET(聚對苯二甲酸乙二醇酯）製的細長的可撓性配線基板 上’利用絲網印刷法，多層塗布形成銀導電膠製的線狀配 線，在配線基板的端部，按〇·5 mm左右的窄間距，形成連 接端子，同時，連接端子以外的部分塗布抗蝕劑材料，形 成保濩層，在連接端子部分，去除保護層，露出銀製的連 接端子和基板端部表面。 根據上述耐環境加速試驗的結果，本案發明者們分析了 引起連接不良的原因，結果發現，在連接端子部分，特別 是從成爲負極側的連接端子的底層的PET製的基板表面部 分，剝離連接端子，連接端子從基板表面鼓起。該剝離現 象可理解爲是以下說明的原因造成的。 在n溫咼濕的耐環境加速試驗氣氛中，大量的水分存在 連接端子的周圍。如果在高溫高濕環境下，存在大量的水 分，亚且，以幾V〜最大5 V範圍的外加電壓，對露出的連 接端子部分長時間通電，能夠電分解端子部分周圍的水， 在連接端子部分的正極側產生氫，在負極側産生氫氧根。 因此，認爲，負極側的連接端子周圍容易因氫氧根成鹼性， 由此’ PET製的基板表面部分被水解，結果，形成連接端子 的底層的部分與連接端子一同剝離。 》、本案發明者們，在耐環境加速試驗巾，在進行配線基板 式樣的負極側連接端子部分的水分的阳試驗時，發現阳高 達1 3〜14的試樣。 91997.doc 1238684 可是，PRT，由於一般通過脫水縮合對苯二酸和乙二醇進 行製造’所以認爲有水解的可能性，特別是在域環境下高 温可促進這種水解反應。 此外，發現，不局限於PET製的可撓性基板，在酚醛樹脂 製的基板或聚醜亞胺製的基板，或者另外利用脫水縮合製 造的各種基板，也出現同樣的現象。 【發明内容】 本發明疋針對上述課題而提出的，其目的是提供一種在 利用脫水縮合製造的基材上露出設置配線或其連接端子的 結構中，即使在南溫環境下通電，露出的配線或其連接端 子也不剝離，不產生連接不良的配線基材和具有該配線基 材的電氣機器及開關裝置。 爲達到上述目的，本發明的特徵在於：在由利用脫水縮 合合成的高分子樹脂構成的基材本體上形成配線，在該基 材本體的至少一部分上，以露出狀態形成該配線的連接端 子，由具有耐水性的導電膠，形成連接端子的至少呈露出 狀態的部分，該具有耐水性的導電膠，是通過在加成聚合 類型的高分子樹脂中添加導電性粒子而形成的。 在由利用脫水縮合合成的高分子樹脂構成的基材本體上 形成配線的結構的配線基板上，如果在高溫高濕環境下通 電:容易在負極側，㈣環境氣氛中的水的電分解，産生 氫氧根，形成域環境，但在本發明的配線基材上，形成在 上述配線上的連接端子的呈露出狀態的部分（有時也稱 連接端子的露出部分）’由於由上述具有耐水性的導電膠（有 91997.doc 1238684 a守也稱爲耐水性導電膠） 、 4)形成，所以，連接端子的露出部分 不會被水解。此外，士 # 土材本體與連接端子的露出部分連 接的部分（有時也稱爲盥 ^ |材本體的連接端子的連接部 、、）；被上述耐水性導電膠覆蓋，所以，也能夠防止上 =基：本體的連接端子的連接部分被水解。由此，在高 Z皿呵濕％境下’即使長時間通電，也不會從基材本體剝離 或分離露出狀態的連接端子。 爲達到上述目的’本發明的特徵在於··在由利用脫水縮 。口成的N刀子树脂構成的基材本體上形成配線，在上述 配線中至少由具有耐水性的導電膠形成呈露出狀態的部 刀口亥具有耐水性的導電膠，是通過在加成聚合類型的高 分子樹脂中添加導電性粒子而形成的。 3在本發明的配線基材上，由於由上述具有耐水性的導電 膠（有時也稱爲耐水性導電膠）形成上述配線的呈露出狀態 的邛刀所以，配線的露出部分不會被水解。此外，由基 材本泡:與配線的露出部分連接的部分（有時也稱爲與基材 本體的配線的連接部分），由於被上述耐水性導電膠覆蓋， 所以’也能夠防止上述與基材本體的配線的連接部分被水 解。由此’在高溫高濕環境下，即使長時間通電，也不會 攸基材本體剝離或分離露出狀態的配線。 爲達到上述目的，本發明的特徵在於：由具有耐水性的 導电膝’形成上述連接端子或上述配線的、至少負極側的 端子或配線的形成部分，該具有耐水性的導電膠，是通過 在加成聚合類型的高分子樹脂中添加導電性粒子而形成 91997.doc 1238684 的。 由於水的電分解發生在連接端子或配線的負極側，負極 側和其附近部分的水被分解，容易形成域環境，所以，有 政的辦法是至少由具有耐水性的導電膠形成負極側的連接 端子或配線。 爲達到上述目的，本發明的特徵在於：用保護層覆蓋上 述連接端子以外的部分的配線和其周圍部分的基材本體表 〇 採用由保護層覆蓋連接端子以外的部分的配線和其周圍 部分的基材本體表面的結構，不會分解或剝離被保護層覆 蓋的部分的配線或基材本體表面。 在本發明中，作爲上述基材本體，可採用由聚對苯二甲 酸乙二醇酯、聚酰亞胺、酚醛樹脂、聚萘二甲酸乙二醇酯 中的任何一種構成的基材本體。 如果是由上述材料構成的基材本體，在製造時，由於隨 著脫水反應製造，所以在高溫高濕的鹼性環境下，通過通 電’在負極側，有引起水解反應的可能性，適合採用本發 明。 在本發明中，作爲上述加成聚合類型的高分子樹脂，可 以選擇由聚苯乙烯（PE)、聚丙烯（pp)、聚甲基丙烯酸f酯（p MMA)、聚氣乙烯（PVC)、環氧樹脂、丙烯酸樹脂、丙烯腈-丁一稀-笨乙烯樹脂（ABS)、烯丙樹脂、咬喃樹脂、密胺樹 脂、脲醛樹脂、矽酮樹脂等中的任何一種構成的樹脂。 用於上述财水性導電勝的樹脂，只要是上述加成聚合類 9l997.doc 1238684 型的高分子樹脂，就不會被水解，此外，由於由該耐水性 導電膠保護與基材本體的連接端子的連接部分，所以，也 不會水解基材本體。因此，即使在高溫高濕環境下長時間 通笔由於在連接知子的露出部分或配線的露出部分和基 材本體雙方，都不會産生分解或剝離，所以，露出狀態的 配線或連接端子也不會從基材本體剝離或分離。 在本發明中，用於耐水性導電膠的導電性粒子，可以選 擇由A1粒子、Ag粒子、Au粒子及Ni粒子中的任何一種構成 的粒子。 此外，在本發明中，上述耐水性導電膠中的導電性粒子 的添加量，按體積百分比，較佳者係在2〇%以上5〇%以下， 更佳者係在25%以上45%以下。導電性粒子的添加量如果按 體積百分比低於20% ,比電阻增大，得不到良好的導電性， 相反的，如果超過50%，塗膜變脆。 此外’在本發明中，上述導電性粒子的粒徑較佳者係在 20 μιη以下，更佳者係在1〇 μηχ以下，如此有利於配線或連 接端子的高密度化。如果導電性粒子的粒徑超過2〇 pm，在 利用絲網印刷形成本發明的配線或連接端子時，不能使配 線間距或端子間距小於0.3 mm。 本發明能夠提供一種具有上述各項所述的配線基材的電 氣機器或開關裝置，只要是上述電氣機器或開關裝置，即 使在问/皿向濕環境下通電使用，也不會引起從配線或連接 端子的基材本體的剝離或分離，能夠提供不會引起配線連 接部分的連接不良的電氣機器或開關裝置。 91997.doc -10 - 1238684 【實施方式】 圖1是表示具有本發明的第1實施方式的配線基板的開關 裝置的俯視圖，圖2是該開關裝置中的配線基板前端部分的 主要部位剖視圖。另外，在以下的所有的圖面中，爲便於 理解圖式’適當的不同地表示各構成要素的膜厚度或尺寸 的比率等。此外，本發明當然不局限於以下的實施方式。 圖1表示表示具有本發明的第丨實施方式的配線基板的開 關裝置，該實施方式的開關裝置A，構成具有開關本體部i 和與该開關本體部1連接的可撓性的配線基板2。 在開關本體部1設置本體基板3,在該本體基板3上設置滑 動式的第1開關部5和第2開關部6,在上述本體基板3的背面 、6的開關回線連接的細長的可撓1238684 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a wiring substrate that forms wiring on a substrate such as a resin substrate, and more particularly to a wiring substrate that will not be used for a long time in an environment with moisture. A technology that causes a phenomenon in which a wiring portion or a terminal portion is peeled from a base resin. [Prior art] In order to adapt to the miniaturization and weight reduction of electronic equipment, various printed wiring boards or flexible printed wiring boards mounted on electronic equipment are also moving toward miniaturization and weight reduction. Along with the miniaturization of such wiring substrates, the miniaturization of the terminal portions of the wiring substrates has also been developed, and narrow-pitch wiring substrates having a wiring pitch of the terminal portions of about 0.5 mm have begun to be used. Based on this background, for the purpose of increasing the density of the connection terminals, proposals have been made for a high-density structure that staggers the pitch of the terminals (see Patent Document 丨). Patent Document 1: Japanese Unexamined Patent Publication No. 6-13 154 Against this background, the inventors of this case conducted research and development of a wiring substrate having a terminal portion with a narrow pitch structure, and produced a variety of wiring substrate samples with a narrow pitch structure. The 4 bin samples were housed in an environment resistance test device, the temperature was set at 60 ° C, and the humidity was 90%. The DC voltage of 3.2 v was applied, and after several hundred hours of energization, the environment resistance acceleration test was left as it was at 25. Although no special problems occurred during the test period of about 0 hours, when the accelerated environmental resistance test was continued for more than 500 hours after more than 25 hours, it was found that the connection terminals of the wiring substrate as a narrow-pitch structure were connected. Part of the contact resistance began to increase, and depending on the sample, some caused a poor connection. The wiring board sample provided for this accelerated environmental resistance test has a structure in which a multilayer flexible wiring board made of PET (polyethylene terephthalate) is formed by multi-layer coating using a screen printing method. Wire-shaped wiring made of silver conductive adhesive is used to form connection terminals at a narrow pitch of about 0.5 mm at the ends of the wiring substrate. At the same time, resist materials are applied to the parts other than the connection terminals to form a protection layer, and the connection For the terminal part, remove the protective layer to expose the silver connection terminal and the end surface of the substrate. Based on the results of the above-mentioned accelerated environmental resistance test, the inventors of this case analyzed the cause of the poor connection, and found that the connection terminal part, especially the surface portion of the substrate made of PET that becomes the bottom layer of the connection terminal on the negative side, was peeled off. Terminals, connection terminals bulge from the surface of the substrate. This peeling phenomenon is understood to be caused by the reasons described below. A large amount of moisture is present around the connection terminals in an environment of accelerated temperature resistance test at n temperature and humidity. If there is a large amount of water in a high temperature and high humidity environment, the exposed connection terminal part is energized for a long time with an applied voltage in the range of several V to a maximum of 5 V, and the water around the terminal part can be electrically decomposed. Part of the positive electrode generates hydrogen and the negative electrode generates hydroxide. Therefore, it is considered that the periphery of the connection terminal on the negative electrode side is likely to become alkaline due to hydroxide, so that the surface portion of the substrate made of PET is hydrolyzed, and as a result, the portion forming the bottom layer of the connection terminal is peeled off together with the connection terminal. 》 、 The inventors of the present case found that in the environmental resistance accelerated test towel, when the anode test of the moisture on the negative-side connection terminal portion of the wiring board pattern was conducted, a sample with an anode height of 1 to 14 was found. 91997.doc 1238684 However, since PRT is generally produced by dehydration condensation of terephthalic acid and ethylene glycol ', it is considered that there is a possibility of hydrolysis, especially in a high temperature environment, which can promote such a hydrolysis reaction. In addition, it was found that the same phenomenon occurs not only with flexible substrates made of PET, but also with substrates made of phenol resin or substrates made of polyimide, or various substrates made by dehydration condensation. [Summary of the Invention] The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a structure in which a wiring or a connection terminal thereof is exposed on a substrate manufactured by dehydration condensation, and the wiring is exposed even when energized in a south temperature environment. Also, its connection terminals are not peeled off, and there is no wiring substrate with poor connection, and electrical equipment and switchgears having the wiring substrate. In order to achieve the above object, the present invention is characterized in that a wiring is formed on a substrate body composed of a polymer resin synthesized by dehydration condensation, and a connection terminal of the wiring is formed on at least a part of the substrate body in an exposed state, A conductive adhesive having water resistance is used to form at least a portion of the connection terminal in an exposed state. The conductive adhesive having water resistance is formed by adding conductive particles to an addition polymerization type polymer resin. On a wiring board with a structure that forms wiring on a substrate body composed of a polymer resin synthesized by dehydration condensation, if it is energized in a high-temperature and high-humidity environment: it is easy to cause the electrolysis of water in the ambient atmosphere on the negative electrode side, and generate electricity. Hydroxide forms a domain environment. However, on the wiring substrate of the present invention, the exposed portion of the connection terminal (sometimes also referred to as the exposed portion of the connection terminal) formed on the wiring is formed by the above. Conductive adhesive (91997.doc 1238684 a is also called water-resistant conductive adhesive), 4), so the exposed part of the connection terminal will not be hydrolyzed. In addition, the part where the Shi # earth material body is connected to the exposed part of the connection terminal (sometimes also referred to as the connection part of the connection terminal of the material body) is covered by the water-resistant conductive adhesive, so it can also be prevented Top = base: The connection part of the connection terminal of the body is hydrolyzed. Therefore, even when the power is applied for a long period of time under the condition of high humidity in the high Z dish, the connection terminal in the exposed state will not be peeled off or separated from the base body. To achieve the above-mentioned object, the present invention is characterized by ... Wiring is formed on the base body made of N-knife resin formed by the mouth. In the above wiring, at least the conductive adhesive having water resistance is used to form an exposed part. The conductive glue having water resistance is formed by addition polymerization. It is formed by adding conductive particles to a polymer resin. 3 On the wiring substrate of the present invention, the exposed portion of the wiring is not hydrolyzed because the exposed wiring trowel is formed by the conductive adhesive with water resistance (sometimes referred to as a water-resistant conductive adhesive). . In addition, the base material foam: the part connected to the exposed part of the wiring (sometimes called the connection part with the wiring of the base body) is covered with the water-resistant conductive adhesive, so it can also prevent the above The connection part of the wiring of the material body is hydrolyzed. Therefore, even in a high-temperature and high-humidity environment, even if the power is applied for a long time, the wiring of the base body is not peeled or separated. In order to achieve the above object, the present invention is characterized in that the connection terminal or the wiring, at least the negative terminal or the formation portion of the wiring is formed by a conductive knee having water resistance, and the conductive adhesive having water resistance is formed by Addition of conductive particles to an addition polymerization type polymer resin results in 91997.doc 1238684. Since the electrolysis of water occurs on the negative side of the connection terminal or wiring, the water on the negative side and its vicinity is decomposed, and it is easy to form a domain environment. Therefore, it is a political way to form the negative side at least with a water-resistant conductive adhesive. Connection terminal or wiring. In order to achieve the above-mentioned object, the present invention is characterized in that: a protective layer is used to cover the wiring of a portion other than the connection terminal and its surroundings; The structure of the surface of the substrate body does not decompose or peel off part of the wiring covered by the protective layer or the surface of the substrate body. In the present invention, as the substrate body, a substrate body composed of any one of polyethylene terephthalate, polyimide, phenol resin, and polyethylene naphthalate can be used. If it is a base body made of the above materials, it is produced along with the dehydration reaction at the time of manufacture. Therefore, in the alkaline environment of high temperature and high humidity, by applying electricity to the negative electrode side, there is a possibility of causing a hydrolysis reaction, which is suitable for use. this invention. In the present invention, as the above-mentioned addition polymerization type polymer resin, polystyrene (PE), polypropylene (pp), polymethacrylate (p MMA), polyethylene gas (PVC), Resin consisting of any one of epoxy resin, acrylic resin, acrylonitrile-butadiene-styrene resin (ABS), allyl resin, bite resin, melamine resin, urea resin, silicone resin, and the like. The resin used for the above-mentioned water-based conductive resin will not be hydrolyzed as long as it is the above-mentioned addition polymerization type 9l997.doc 1238684 polymer resin. In addition, the connection terminal with the base body is protected by the water-resistant conductive adhesive. The connection part, therefore, will not hydrolyze the substrate body. Therefore, even in a high-temperature and high-humidity environment, the pen will not be decomposed or peeled off at both the exposed part of the connection or the exposed part of the wiring and the base body. Therefore, the exposed wiring or connection terminal is not. Will peel or separate from the substrate body. In the present invention, the conductive particles used for the water-resistant conductive adhesive may be particles composed of any of A1 particles, Ag particles, Au particles, and Ni particles. In addition, in the present invention, the addition amount of the conductive particles in the water-resistant conductive adhesive is preferably 20% or more and 50% or less by volume percentage, and more preferably 25% or more and 45% or less. . If the amount of conductive particles added is less than 20% by volume, the specific resistance increases and good conductivity cannot be obtained. On the contrary, if it exceeds 50%, the coating film becomes brittle. In addition, in the present invention, the particle diameter of the conductive particles is preferably 20 μm or less, and more preferably 10 μηχ or less, which is advantageous for high density of wiring or connection terminals. If the particle diameter of the conductive particles exceeds 20 pm, when the wiring or connection terminal of the present invention is formed by screen printing, the wiring pitch or the terminal pitch cannot be made smaller than 0.3 mm. The present invention can provide an electric device or a switching device having the wiring substrate described above. As long as the electric device or the switching device is used, even if the electric device or the switching device is energized and used in a wet environment, it will not cause the Peeling or separation of the base body of the connection terminal can provide an electrical device or a switchgear that does not cause poor connection of the wiring connection portion. 91997.doc -10-1238684 [Embodiment] Fig. 1 is a plan view showing a switchgear having a wiring board according to a first embodiment of the present invention, and Fig. 2 is a cross-sectional view of a main part of a front end portion of the wiring board in the same. In addition, in all of the drawings below, the ratio of the film thickness or the size of each component is appropriately and differently shown for the sake of understanding of the drawings. It is needless to say that the present invention is not limited to the following embodiments. Fig. 1 shows a switchgear having a wiring board according to a first embodiment of the present invention. A switchgear A of this embodiment constitutes a wiring board 2 having a switch body portion i and a flexible connection to the switch body portion 1. The switch main body 1 is provided with a main body substrate 3, and the main body substrate 3 is provided with a sliding first switch portion 5 and a second switch portion 6, and the back of the main body substrate 3 is connected to a long and thin flexible switch.
在電氣機器Β的外面的局部位置。 側’設置與上述開關部5、 性印刷基板2。該可捲柯Local location outside the electric machine B. The side 'is provided with the switch section 5 and the printed circuit board 2 described above. The roll roll
多條配線8··· 按大致等間隔 由絲網印刷法等塗布法， 91997.doc 1238684 平行地形成到接近基板本體7的前端部7a的部分。此外、 分別壓接在上述配線8的前端部8a上面的 — J乃式，由絲網印刷 法等印刷法形成連接端子9...。在該結構中，連接端子9具 有按規定長度壓在配線8的前端部心上面的基端部9^，其2 外的部分直接形成在基材本體7上。 此外，以覆蓋配線8和其前端部8a、該前端部“上的連接 端子9、接近該前端部8a的部分的連接端子9的中央部外及 它們周圍部分的基板本體表面的方式，形成由抗姓劑構成 的保護層10。因此，上述連接端子9的前端部％的部分，在 上述基板本體7的前端部7a的表面側露出。 基板本體7，在本實施方式中，由PET薄膜構成，但所謂 該PET，是通過脫水聚合對苯二甲酸和乙二醇製造的。此 外，基板本體7的構成材料也不局限於pET，也可以如聚酰 亞胺、酚醛樹脂等，由脫水聚合製造的樹脂構成。 配線8由銀、金、銅、鉑或它們的合金等t導電性的金屬 材料構成，但其中，較佳者係採用容易利用絲網印刷法， 在基板本體7上印刷形成的銀膠或由銀合金膠構成的材料。 連接端子9,在本實施方式中，由於前端部％的部分形成 露出狀態，所以，與構成配線8的材料相比，較佳者係採用 耐水性優良的材料。作爲構成該連接端子9的材料，採用具 有耐水性的導電膠（耐水性導電膠）。 上述耐水性導電膠，是通過在加成聚合類型的高分子樹 脂中添加導電性粒子而形成的。 關於連接端子9，通過利用絲網印刷法，在配線8的前端 91997.doc -12- 1238684 2上面及基板本體7的前端部73上面，塗布上述耐水性導 電膠’能夠很容易形成連接端子9。 關於用於上料水性導電㈣加成聚合類_高分子樹 腊’可從PE、pp、PMMA、Pvc、《#m、^_: :BS、烯丙樹脂、呋喃樹脂、密胺樹脂、脲醛樹脂、矽酮 樹脂t選擇使用。即使在該等樹財，較佳者係容易採用 絲網印刷法在配線8上或基板本體7上塗布形成的、容易確 保塗布精度的、難於水解的環氧㈣作爲導電膠的構成材 料。 關於上述導電性粒子’可以從八丨粒子、Ag粒子、Au粒子 及Ni粒子中選擇使用。 在用絲網印刷法在配線8上和基板本體7上塗布耐水性導 電膠時，爲形成良好的塗布狀態的膜形成精度，較佳者係 耐水性導電膠具有適合印刷的粘度，鑒於能夠確保作爲膜 的厚度等，爲此，較佳者係使上述加成聚合類型的高分子 樹脂的分子量達到幾百〜幾十萬的程度。基於此點，認爲 熱硬化型的高分子樹脂，在交聯前的塗布階段，溶解在溶 劑等中，容易塗布，通過加熱交聯，增加分子量，有利於 形成堅固的塗膜。 上述耐水性導電膠中的導電性粒子的添加量，基於前述 的理由，按體積百分比，較佳者係在20%以上50%以下，更 佳者係在25%以上45%以下。 此外，上述導電性粒子的粒徑，基於前述的理由，較佳 者係在20 μιη以下，更佳者係在1〇 μιη以下。 91997.doc - 13 - 1238684 另外，在用絲網印刷法以外的方法形成連接端子9時，上 述導電性粒子的粒徑也可以不_定在2()㈣以下。 關於連接端子9的膜厚度，從能夠形成良好的導電性、並 能夠在具有可撓性的基板本體7上隨㈣㈣的角度考 慮，較佳者係設定在5〜25 ^1〇1的範圍。 在本實施方式的結構中，在多個連接端子9的前端部 Μ多個連接端子9的露出部）的周圍存在水分的環境下，即 使通電使用該等連接端子9...，由於在上述多個連接端子 9.·.的耐水性導電膠中含有加成聚合類型的高分子樹脂，所 以多個連接端子9.·.不會水解。此外，用基板本體7連接連 接端子9的前端部％的部分（與基板本體7的連接端子9的連 接部分），由於被上述耐水性導電膠覆蓋，所以，也能夠防 止水解與基板本體7的連接料9的連接部分。因此，即使 在高溫高濕環境下長時間通電，露出狀態的連接端子也不 會從基板本體7剝離或分離。 。因此’、要疋具有本實施方式的結構的開關裝置a或電氣 機裔B ’即使在高溫高濕環境下長時間通電的狀態下直接使 用也*曰引起從連接端+ 9···的基板本體7的剝離或分 此夠提1、不引起配線連接部分的連接不良的開關裝置A 或電氣機器B。 另外，在上述實施方式中，將整個配線8形成用由抗姓劑 等而才水性材料構成的保護層1〇覆蓋的結構，但也可以採用 :用保護層_蓋配線8的結構。此時，在未被保護層1〇覆 盖的配線8的周圍八 j 4刀’由於在其底層側的基板本體7的表 ()l()97.doc -14- 1238684 ，所以，較佳者係由上述 覆蓋的配線8(配線8的露 面部分’具有引起水解的可能性 耐水性導電膠形成未被保護層10 出部分）。 可是，在本實施方 、 忒中，在配線δ的前端部側，設置由不 同於配線8的構成材料 ^ 的材枓構成連接端子9，如圖4和圖5 所示的結構，蔣配綞^ ^ ' 直接延長形成到基板本體（基材本 體）1 6的前端部i 6a側，去 田然也可以將配線15的前端部1化用 作連接端子1 7。 在此、’構巾’當然’由上述耐水性導電膠形成配線15。 關於圖4和圖5所不的結構，是部分從保護膜_出配線 的、。構gp使在如此的結構中，也能夠#制在配線^的 丽端部15a(配線15的露出部分）周圍部分的從基板本體“的 剝離現象或分離現象。 此外，在上述的實施方式中，說明了由耐水性導電膠形 成整個配線1 5時的情況，但也可以用耐水性導電膠形成配 線15的前端部15a(配線15的露出部分），其他部分也可以用 銀膠或銀合金膠形成。 次之，能夠採用本發明者，並不局限於可撓性配線基板， 當然一般也可以廣泛用於脫水聚合製造的剛性的厚基板， 或者，板狀以外的其他形狀的實施配線的基材。 圖6表示連接在感測器（電氣機器）2〇上設置的本發明的可 撓性配線基板25，圖7表示連接設置在攜帶電話用薄膜開關 (開關裝置）30上的本發明的可撓性配線基板26。上述可撓性 配線基板25、26的結構與上述的實施方式的可撓性配線基 91997.doc -15 - 1238684 板2相同，只是外形有所不同。 如該等例所述’無論是何種電氣機器或開關裝置，當然 都能夠採用本發明的可撓性配線基板25、26，當然本發明 也可廣泛適用於本說明書所說明以外的多種開關裝置或電 氣機器。 實施例 採用PET(聚對苯二甲酸乙二醇酯）製的厚〇 〇7 mm的可撓 性基板’利用絲網印刷法，在該可撓性基板上塗布銀膠， 加熱到150°C，燒成厚1〇 μιη、寬〇·35 mm的多條配線，以在 位於可撓性基板端部的各配線的前端部側，將由在作爲加 成聚合類型的高分子樹脂的環氧樹脂中按體積百分比添加 3 0%的作爲導電性粒子的Au粒子製成的耐水性導電膠構成 的長4 mm、厚0.01 mm的連接端子連接在上述配線的方式， 製造多塊按0.5 mm間距形成的可撓性印刷基板。 下面，在可撓性印刷基板的除連接端子部分之外的部 分’塗布由聚氣乙烯樹脂的抗蝕劑材料構成的保護層，製 作50個可撓性印刷基板試樣（實施例）。 以將該等可撓性印刷基板試樣的連接端子插入與電源連 接的連接器中並以對各配線通3.2 V電的狀態，將可撓性印 刷基板試樣收容在條件爲溫度60°C、濕度90%的環境試驗 裝置中’貫施10 0 0小時的耐環境加速試驗。 此外，爲進行比較，製作多個除作爲連接端子形成用的 導電膠採用市售的銀膠（asahi化學研究所株式會社製的商 品名SW1 100-1)外，其餘均與上述可撓性印刷基板相同的可 91997.doc -16 - 1238684 撓性印刷基板試樣，實施相同的耐環境加速試驗。 該試驗結果表明，具有由耐水性導電膠形成的連接端子 的5 0個試樣（實施例），在經過1⑽ υ J ¥後，通電性能也完全 無變化，也未見接觸電阻值上升。相對於該等試樣，對於 ： 具有由市售的銀膠形成的連接端子的比較試樣，到經過25〇 小時後’未見變化’但在經過250〜500小時的之間，發現 的試樣的接觸電阻發生變化，在經過5〇〇小時後，6〇% 的試樣出現通電不良。 從以上的試驗結果得知，通過採用本發明的結構，能肖 · 提供-種即使在高溫高濕環境下露出的連接端子部分長時 間通電使用，接觸電阻也無變化，也不變化通電狀態的結 構。 除形成由按體積百分比以20%〜70%的範圍變更添加在 %氧樹脂中的Au粒子的添加量的導電膠構成的連接端子 外，製作其他與上述實施例相同的各種可撓性印刷基板試 樣。 ° 將製作的各種可撓性印刷基板試樣的連接端子插入與冑 ^ 源連接的連接器中，研究了在溫度6〇t、濕度9〇%的環境 條件下’對各配線通電3·2 V時的比電阻。圖8表示其結果。 此外’研究了製作的各種可撓性印刷基板試樣的連接端子 的表面的雜筆劃傷值（使用JIS標準中的劃傷硬度法即錯筆 法得到的值）。圖8一併表示其結果。 從圖8的結果看出，如果導電膠中的All粒子的添加量低於 20% ’則比電阻增大，如果超過5〇%塗膜變脆，如果超過 91997.doc -17- 1238684 60%’即使用Η程度硬度㈣筆’也可劃傷連接端子的表面。 從以上試驗結果得知’通過採用本發明的結構，即使在 π溫冋濕％境下露出的連接端子部分，導電性也良好，▲匕 夠形成良好的塗膜強度。 &The plurality of wires 8 are formed at approximately equal intervals by a coating method such as a screen printing method, 91997.doc 1238684, and are formed in parallel to a portion close to the front end portion 7a of the substrate body 7. In addition, the J-type is crimped onto the front end portion 8a of the wiring 8, respectively, and the connection terminals 9 are formed by a printing method such as a screen printing method. In this structure, the connection terminal 9 has a base end portion 9 ^ which is pressed against the center of the front end portion of the wiring 8 by a predetermined length, and the other portion 2 is directly formed on the base body 7. In addition, the wiring body 8 and the front end portion 8a, the connection terminal 9 on the front end portion, the central portion of the connection terminal 9 near the front end portion 8a, and the substrate body surface around them are formed so as to cover Protective layer 10 made of anti-surname agent. Therefore, a part of the front end portion of the connection terminal 9 is exposed on the surface side of the front end portion 7a of the substrate body 7. The substrate body 7 in this embodiment is made of a PET film However, the so-called PET is produced by dehydration polymerization of terephthalic acid and ethylene glycol. In addition, the constituent material of the substrate body 7 is not limited to pET, but can also be polymerized by dehydration such as polyimide, phenol resin, etc. The wiring is made of a resin. The wiring 8 is made of a conductive metal material such as silver, gold, copper, platinum, or an alloy thereof. However, the wiring 8 is preferably formed by printing on the substrate body 7 by a screen printing method. The silver glue or a material made of silver alloy glue. The connecting terminal 9 is in a state where the front end portion is exposed in this embodiment, so it is better than the material constituting the wiring 8. The material is excellent in water resistance. As a material constituting the connection terminal 9, a conductive adhesive (water-resistant conductive adhesive) having water resistance is used. The above-mentioned water-resistant conductive adhesive is obtained by adding a polymer resin of addition polymerization type. It is formed by adding conductive particles. The connection terminal 9 is coated with the above-mentioned water-resistant conductive adhesive on the front end 91997.doc -12-1238684 2 of the wiring 8 and the front end 73 of the substrate body 7 by using a screen printing method. 'The connection terminal 9 can be easily formed. About the water-based conductive ㈣ addition polymerization class _ polymer tree wax used for feeding materials' can be obtained from PE, pp, PMMA, Pvc, "#m, ^ _ :: BS, allyl resin , Furan resin, melamine resin, urea resin, silicone resin t. Even in these trees, the better one is easy to apply screen printing method on the wiring 8 or the substrate body 7 formed, easy to ensure Epoxy resin, which is coated accurately and is difficult to hydrolyze, is used as a constituent material of the conductive adhesive. The conductive particles can be selected from eight particles, Ag particles, Au particles, and Ni particles. Screen printing When coating the water-resistant conductive adhesive on the wiring 8 and the substrate body 7, in order to form a film with good coating accuracy, the water-resistant conductive adhesive preferably has a viscosity suitable for printing. In view of ensuring the thickness of the film, etc. For this reason, it is preferable that the molecular weight of the above-mentioned addition polymerization type polymer resin reaches several hundreds to several hundreds of thousands. Based on this, it is considered that the thermosetting polymer resin is applied before crosslinking. In this stage, it is easy to apply by dissolving in a solvent, etc. It can increase the molecular weight by heating and cross-linking, which is conducive to the formation of a strong coating film. The amount of the conductive particles in the water-resistant conductive adhesive is based on the foregoing reasons, in terms of volume percentage, The better is between 20% and 50%, and the better is between 25% and 45%. The particle size of the conductive particles is preferably 20 μm or less, and more preferably 10 μm or less, for the reasons described above. 91997.doc-13-1238684 In addition, when the connection terminal 9 is formed by a method other than the screen printing method, the particle diameter of the conductive particles may not be limited to 2 () ㈣ or less. Regarding the film thickness of the connection terminal 9, it is considered that the film thickness can be formed in the range of 5 to 25 ^ 1 from the viewpoint that it can form a good conductivity and can be flexibly formed on the substrate body 7 having flexibility. In the structure of the present embodiment, in the environment where moisture is present around the front end portions of the plurality of connection terminals 9 (the exposed portions of the plurality of connection terminals 9), even if the connection terminals 9 are used when power is applied, since The water-resistant conductive adhesive of the plurality of connection terminals 9... Contains an addition polymerization type polymer resin, so the plurality of connection terminals 9... Do not hydrolyze. In addition, the portion connected to the front end portion of the connection terminal 9 by the substrate body 7 (the connection portion with the connection terminal 9 of the substrate body 7) is covered with the above-mentioned water-resistant conductive adhesive, so it can also prevent hydrolysis with the substrate body 7. The connecting portion of the connecting material 9. Therefore, even if the power is applied for a long time in a high-temperature and high-humidity environment, the exposed connection terminals are not peeled or separated from the substrate body 7. . Therefore, "The switch device a or the electric machine B having the structure of this embodiment is required." Even if it is directly used under a high-temperature and high-humidity environment for a long time, it will cause a substrate from the connection terminal + 9 ... The peeling of the main body 7 can be mentioned as follows: 1. The switching device A or the electric device B that does not cause poor connection of the wiring connection portion. In addition, in the above-mentioned embodiment, the entire wiring 8 is formed into a structure covered with a protective layer 10 made of a water-resistant material such as an anti-surname agent. However, a structure in which the wiring 8 is covered with a protective layer may also be adopted. At this time, around the wiring 8 that is not covered by the protective layer 10, there are four blades. Since the surface of the substrate body 7 on the bottom side thereof is (1) () 97.doc -14-1238684, it is preferable The wiring 8 covered by the above (the exposed portion of the wiring 8 has the possibility of causing hydrolysis, and the water-resistant conductive adhesive forms an unprotected layer 10). However, in this embodiment, the connection terminal 9 is formed on the front end portion side of the wiring δ from a material different from the constituent material ^ of the wiring 8, as shown in FIG. 4 and FIG. 5. ^ ^ 'It is directly extended to the front end portion i 6a side of the substrate body (substrate body) 16, and the front end portion of the wiring 15 can also be used as the connection terminal 17. Here, the "structure towel" is formed of the wiring 15 from the above-mentioned water-resistant conductive adhesive. The structures shown in Figs. 4 and 5 are partially wired out from the protective film. The structure gp enables the peeling phenomenon or separation phenomenon from the substrate main body of the peripheral portion of the wiring end 15a (the exposed portion of the wiring 15) to be controlled even in such a structure. In addition, in the embodiment described above, The case where the entire wiring 15 is formed of a water-resistant conductive adhesive has been described, but the front end portion 15a of the wiring 15 (the exposed portion of the wiring 15) may also be formed by a water-resistant conductive adhesive, and other parts may also be made of silver glue or silver alloy Secondly, the present inventors can be used and are not limited to flexible wiring substrates. Of course, they can also be widely used for rigid thick substrates produced by dehydration polymerization, or for wiring in other shapes than plate shape. Fig. 6 shows a flexible wiring substrate 25 of the present invention connected to a sensor (electrical device) 20, and Fig. 7 shows the present invention connected to a membrane switch (switching device) 30 for a mobile phone. The flexible wiring substrate 26. The structures of the above-mentioned flexible wiring substrates 25 and 26 are the same as those of the flexible wiring base 91997.doc -15-1238684 of the above-mentioned embodiment, except that the outline is somewhat different. As described in these examples, of course, the flexible wiring substrates 25 and 26 of the present invention can be used regardless of the type of electrical equipment or switchgear. Of course, the present invention can be widely applied to a variety of types other than those described in this specification. Switching device or electrical equipment. Example: A flexible substrate 007 mm thick made of PET (polyethylene terephthalate) was used. The silver substrate was coated with a silver paste by a screen printing method. After heating to 150 ° C, a plurality of wirings with a thickness of 10 μm and a width of 35 mm are fired so that the front ends of the wirings located at the ends of the flexible substrates will be heated at the height of the type of addition polymerization. The epoxy resin of molecular resin is added with 30% by volume of Au particles as conductive particles. Water-resistant conductive glue made of Au particles is a 4 mm thick and 0.01 mm thick connection terminal connected to the above wiring. A flexible printed circuit board formed at a pitch of 0.5 mm. Next, a portion of the flexible printed circuit board other than the connection terminal portion was coated with a protective layer made of a polyresin resin resist material to produce 50 pieces. Flexible Flexible printed circuit board sample (Example) The flexible printed circuit board was inserted into the connector connected to the power supply with the connection terminals of the flexible printed circuit board sample, and the flexible printed circuit board was connected to 3.2 V of each wiring. The samples were housed in an environmental test device at a temperature of 60 ° C and a humidity of 90%, and subjected to an accelerated environmental resistance test for 100 hours. In addition, for comparison, a plurality of conductive adhesives were prepared except for forming connection terminals. 91997.doc -16-1238684 Flexible printed circuit board samples, except for the commercially available silver glue (trade name SW1 100-1 manufactured by Asahi Chemical Research Institute Co., Ltd.), and the rest are the same as the flexible printed circuit board described above. The same accelerated environmental resistance test was performed. The test results show that 50 samples (examples) having connection terminals made of water-resistant conductive adhesive have no change in the current-carrying performance after 1⑽ υ J ¥, and no increase in the contact resistance value was observed. With respect to these samples, for a comparative sample having a connection terminal formed of a commercially available silver paste, no change was observed after 25 hours had elapsed, but the test was found between 250 and 500 hours. The contact resistance of the sample changed, and after 500 hours, 60% of the samples exhibited poor electrical conduction. From the above test results, it is known that by adopting the structure of the present invention, it is possible to provide a kind of contact resistance that does not change even if the connection terminal part exposed in a high temperature and high humidity environment is energized for a long time. structure. Except for forming a connection terminal composed of a conductive paste that changes the amount of Au particles added to the% oxygen resin in a range of 20% to 70% by volume, other flexible printed circuit boards similar to the above-mentioned embodiments are produced. Sample. ° The connection terminals of the various flexible printed circuit board samples produced were inserted into the connector connected to the 源 ^ source, and it was studied that the wiring was energized under the environmental conditions of 60t and 90% humidity 3.2. Specific resistance at V. The results are shown in FIG. 8. In addition, the scratch penetrating value on the surface of the connection terminals of various flexible printed circuit board samples (values obtained by using the scratch penetrating method in the JIS standard, that is, the wrong pen method) were examined. The results are shown in FIG. 8 together. From the results in Figure 8, it can be seen that if the amount of All particles added to the conductive paste is less than 20%, the specific resistance will increase, if it exceeds 50%, the coating film will become brittle, and if it exceeds 91997.doc -17-1238684 60% 'Even with Η degree of hardness ㈣ pen' can scratch the surface of the connection terminal. From the above test results, it is known that by adopting the structure of the present invention, even if the connection terminal portion is exposed at π temperature and humidity%, the electrical conductivity is good, and the strength of the coating film is good. &
在製作除採用添加在環氧樹脂中的Au粒子（導電性粒子 的粒徑在以㈣〜外^爪的範圍變更的導電^利用絲網 印刷法形成連接端子外，其他均與上述實施例相同的各種 可撓性印刷基板試樣時’研究了導電性粒子的最大粒徑與 可印刷間距的關係’其結果示於幻。在表(中，〇表示優 異’無印刷的飛白、漏潤等問題，△表示良好，無印刷的 飛白、漏潤等問題’X表示不良，存在印刷的飛白、漏潤等 問題。 導電”立間距的關係Except for the use of Au particles added to the epoxy resin (the particle size of the conductive particles is changed in the range of ㈣ ~ outer ^ conductive ^ using the screen printing method to form the connection terminal, the other is the same as the above embodiment In the case of various flexible printed circuit board samples, "the relationship between the maximum particle size of the conductive particles and the printable pitch" was examined. The results are shown in the table. In the table (in the table, 0 indicates excellent. No whiteness, leakage, etc. without printing) The problem, △ means good, there are no problems such as printed blush, leakage and so on. 'X means bad, there are problems such as printed blush, and leakage.
大粒徑 印刷間^\^ 1.0 μιη 3.0 Jim 5.0 μιη 丹μ ι： 10.0 μηι :IU rd 20.0 um ]距的 30.0 υ m 關係 40.0 11 m 50.0 11 m 1.0 mm 〇 〇 〇 〇 〇 ΙΑ 111 〇 Ll 111 Δ LX 111 Δ 0.9 mm 〇 〇 〇 〇 〇 〇 Δ X 0.8 mm 〇 〇 〇 〇 〇 Δ X X 0.7 mm 〇 〇 〇 〇 〇 Δ X X 0.6 mm 〇 〇 〇 〇 〇 X X X 0.5 mm 〇 〇 〇 〇 Δ X X X 0.4 mm 〇 〇 〇 〇 Δ X X X 0.3 mm 〇 〇 〇 Δ Δ X X X 0.2 mm 〇 〇 Λ Λ X X X X 9l997.doc -18- 1238684 從表1的結果可以看出，用於導電膠的導電性粒子的粒徑 如果在2〇μιη以下，印刷間距可達到〇3mm ’粒徑如果^ ΙΟμΓΠ以下，印刷間距可達到〇 2mm，有利於連接端子的高 : 密度化。 如以上所述，如果採用本發明，通過由具有耐水性的導 包膠，形成上述連接端子的至少呈露出狀態的部分，而即 使在南溫高濕環境下通電，露出的配線或連接端子也不會 剝離，此夠提供結構不會産生連接不良的配線基板。 所以，能夠提供即使在高溫高濕環境下通電，也不引^ % 通電不良或連接不良的配線基材及開關裝置或電氣機器。 【圖式簡單說明】 圖1是表示具有本發明的第1實施方式的配線基材的開關 裝置的俯視圖。 圖2疋上述配線基材的主要部位剖視圖。 圖3是表示一例裝有上述配線基材的開關裝置的電氣機 器的斜視圖。 0 圖4是本發明的第2實施方式的配線基板的斜視圖。 3 5疋5亥苐2貫施方式的配線基板的主要部位剖視圖。 圖6是表示具有本發明的第1實施方式的配線基板的感測 器的俯視圖。 圖7是表示具有本發明的第1實施方式的配線基板的開關 裝置的其他例的俯視圖。 圖8疋表示導電性粒子的添加量（體積百分比）與比電阻的 關係的圖表。 91W.doc -19- 1238684 【圖式代表符號說明】 1 開關本體部 2 可撓性印刷基板 7、16 基板本體（基材本體） 8 ^ 15 配線 8a ' 15a 前端部 9、17 連接端子 9a 基端部 9b 中央部 9c 前端部 10 保護層 20 感測器（電氣機器）。 A、30 開關裝置 B 電氣機器 91997.doc -20-Large-size printing room Δ LX 111 Δ 0.9 mm 〇〇〇〇〇〇〇Δ X 0.8 mm 〇〇〇〇〇〇Δ XX 0.7 mm 〇〇〇〇〇〇Δ XX 0.6 mm 〇〇〇〇〇XXX 0.5 mm 〇〇〇〇 △ XXX 0.4 mm 〇〇〇〇Δ XXX 0.3 mm 〇〇〇Δ Δ 0.2 0.2 mm 〇〇Λ Λ XXXX 9l997.doc -18-1238684 From the results in Table 1, it can be seen that the particle size of the conductive particles used in the conductive adhesive is Below 20μιη, the printing pitch can reach 0.33mm. If the particle size is less than ΙΟμΓΠ, the printing pitch can reach 0.22mm, which is conducive to the high: density of connection terminals. As described above, if the present invention is adopted, at least the exposed portion of the connection terminal is formed by the water-resistant guide rubber, and even if the current is applied in a high temperature and high temperature environment, the exposed wiring or connection terminal is also It does not peel, which is enough to provide a wiring board with a structure that does not cause poor connection. Therefore, even if it is energized in a high-temperature and high-humidity environment, it can provide a wiring substrate, a switchgear, or an electrical device that does not cause ^% poor electrical connection or poor connection. [Brief Description of the Drawings] Fig. 1 is a plan view showing a switchgear having a wiring substrate according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view of a main part of the wiring substrate. Fig. 3 is a perspective view showing an example of an electric machine in which the switchgear of the wiring substrate is mounted. 0 FIG. 4 is a perspective view of a wiring board according to a second embodiment of the present invention. 3 5 疋 5 苐 苐 2 The cross-sectional view of the main parts of the wiring board according to the embodiment. Fig. 6 is a plan view showing a sensor including a wiring substrate according to the first embodiment of the present invention. Fig. 7 is a plan view showing another example of a switching device including the wiring board according to the first embodiment of the present invention. Fig. 8A is a graph showing the relationship between the amount of conductive particles added (volume percentage) and the specific resistance. 91W.doc -19- 1238684 [Description of Symbols] 1 Switch body 2 Flexible printed circuit board 7, 16 Substrate body (substrate body) 8 ^ 15 Wiring 8a '15a Front end 9, 17 Connection terminal 9a base End portion 9b Center portion 9c Front end portion 10 Protective layer 20 Sensor (electrical device). A, 30 Switchgear B Electrical equipment 91997.doc -20-