TWI238505B - Method for fabricating thermally enhanced packaged substrate - Google Patents

Abstract

A method for fabricating a thermally enhanced packaged substrate is proposed. A substrate module panel composed of a plurality of substrate units is mounted on an adhesive, wherein each of the substrate unit has at least a through opening, and the adhesive located over the opening is removed by a laser drilling process. After the substrate formed with an adhesive is mounted on a heat sink plate, a plurality of substrate units each mounted with an individual heat sink are fabricated by a singulation process. By the arrangement, it can improve the operation capability of using fabric impregnation adhesive during a high lamination temperature in a routing type process, and reduce the complex process and cost of using non-fiber impregnation adhesive in a taping type process.

Description

1238505: V. Description of the invention (1). [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a high heat dissipation substrate, and more specifically, to a semiconductor package substrate with integrated heat sink Production Method. -[Previous Technology] With the vigorous development of the electronics industry, electronic products have gradually entered the direction of multi-function and high-performance research and development. In order to meet the packaging requirements for high integration and miniaturization of semiconductor packages, B a 1 1 gridarray (BGA) is an advanced paralyzed conductor chip packaging technology, which is characterized by the use of A substrate is used to place a semiconductor wafer, and a plurality of solder balls (S ο 1 derba 1 1) arranged in a grid array are arranged on the back of the substrate, so that more input / output can be accommodated on a semiconductor wafer carrier of the same unit area The connection terminal (I / O connection) meets the requirements of highly integrated semiconductor chips, and at the same time, the entire packaging unit is soldered and electrically connected to external electronic devices, such as a printed circuit board, by these solder balls. However, due to the high density of the electronic components and electronic circuits on the semiconductor wafer, the heat generated during its operation is large. If the heat generated by the semiconductor wafer is not effectively removed in time, the performance of the semiconductor wafer will be severely shortened. And Qingming. In order to solve the above-mentioned shortcomings and meet the development trend of light, thin and short electronic products, the semiconductor industry has developed a thin semiconductor package substrate with a heat sink exposed on the packaging colloid, such as Cavity down ball grid arrays. , CDBGA) semiconductor package substrate, its special

] 7522 懋 .ptd Page 8 1238505 V. Description of the invention (2) The substrate is formed with at least one opening, and a semiconductor wafer is electrically connected to the substrate through the opening in an inverted manner. Please refer to the semiconductor package shown in FIG. 1, which is a CDBGA semiconductor package 1, which mainly has at least one opening 11 penetrating the upper and lower surfaces of a BGA semiconductor package substrate 10 and dissipates heat by a The sheet 12 is placed on the upper surface of the substrate 10 to close one side of the opening 11, and a semiconductor wafer 13 is housed in the opening 11 to form the semiconductor wafer 13. The non-active surface is tightly adhered to the heat sink by an adhesive, and the semiconductor wafer 13 and the substrate 10 are electrically connected through the main line 14 to cover the semiconductor with a sealing gel (not shown). After the chips 13 and the bonding wires 14 are mounted, a plurality of solder balls 15 are planted on the lower surface of the substrate to complete the semiconductor packaging process with integrated heat sinks. This structure allows the heat generated by the semiconductor wafer 13 to quickly pass through the heat sink 12 and be dissipated to the atmosphere, thereby effectively improving the heat dissipation efficiency. At present, the manufacturing methods that are known in the industry to integrate a heat sink on a semiconductor package substrate can be divided into two types, namely a bonding type (T a p ing type) and a cutting type (Routing type). Please refer to Figures 2A to 2C, which shows a schematic diagram of a high-heat-dissipation semiconductor package substrate process with integrated heat dissipation sheet (Taping, type), which firstly provides a molded substrate unit. 20, the substrate unit 20 is formed with at least one opening 200 (see FIG. 2A) passing through the upper and lower surfaces thereof; and a non-fiber resin adhesive provided with at least one opening 2 1 0 is provided. Adhesive 21, and the non-fibre resin adhesive sheet opening 210 corresponds to the opening of the substrate unit 2 0 0, and is connected to a heat sink 22

Π522 All S. ptd Page 9 12385505: V. Description of the invention (3) (as shown in Figure 2B), so that the substrate unit 20 and the heat sink 2 1 with the non-fiber resin adhesive sheet 2 1 attached They are bonded to each other to form a high heat dissipation type semiconductor package substrate with integrated heat sink (as shown in FIG. 2C). However, the disadvantage of this manufacturing method is mainly that the basis of integrating the non-fiber resin adhesive sheet must be formed by a special machine, which is not only expensive but also cannot be shared for different production sizes, so the production cost is extremely high; Moreover, it is only suitable for a single substrate unit bonding method, which relatively makes the substrate process of the integrated heat sink relatively cumbersome and time-consuming, and cannot be mass-produced. Please refer to FIGS. 3A to 3D, which are schematic diagrams showing a method for manufacturing a semiconductor package substrate with a heat sink integrated in a cutting form (Routing xin ^ pe), which mainly provides a substrate module piece 30 including a plurality of substrate units 3 01. And each of the substrate units 3 01 is formed with at least one opening 3 0 0 (as shown in FIG. 3A) penetrating its upper and lower surfaces, and a plurality of openings 3 1 0 are provided to correspond to each of the The fiber impregnated resin adhesive sheet 3 1 of the substrate unit 3 1 0 with openings 3 0 and a metal heat sink 3 2 (as shown in FIG. 3B), and the substrate module sheet 3 0, The fiber-impregnated resin adhesive sheet 31 is integrated with the metal heat sink 32 (as shown in FIG. 3C), and then singulation is performed to form a plurality of substrate units 3 0 1 integrated with the heat sink 3 2 (such as Figure 3D, shown). But this one-the disadvantage of making square hair is that the temperature of the substrate module sheet and fiber 'Φ impregnated resin adhesive sheet and the heat sink is too high, resulting in poor operability and other problems; In addition, the fiber impregnated with resin adhesive When the sheet forms an opening on the molding machine, many fiber shavings will be exposed at the openings and remain on the crystallizing area of the metal heat sink, resulting in a decrease in the yield of subsequent processes, and the industry is generally removing the fiber shavings. The method is to wash with water and then bake with hot air.

] 7522 懋 .ptd Page 丨 〇 1238505 V. Description of the invention (4) Dry, but when washed with water, water easily penetrates into the openings of the fiber-impregnated resin adhesive sheet, and the substrate is subsequently pressed at high temperature Module chips, fiber-impregnated resin adhesive sheets, and metal heat sinks can easily cause plate explosion problems. Moreover, during thermal shock in subsequent processes, the thermal expansion coefficient (CTE) between the substrate and the metal heat sinks is very different, and the The fiber-impregnated resin adhesive sheet has a hard texture and poor cushioning properties, and cannot effectively absorb thermal stress, which causes it to easily crack under the thermal shock environment, which seriously affects the reliability of the substrate manufacturing process. It is possible to use a milling cutter to cut the non-fibre resin adhesive sheet to form an opening at the corresponding substrate. However, where the non-fibre resin adhesive sheet forms the opening, it is easy to cause burrs due to the high temperature of the opening, resulting in good quality. The problem of falling rates. Therefore, how to save the process cost and also form a highly reliable south heat-dissipating semiconductor package substrate with integrated heat sink is a problem that needs to be solved in the current substrate manufacturing process. [Summary of the Invention] In view of the shortcomings of the above-mentioned conventional technology, the main object of the present invention is to provide a method for manufacturing a high heat dissipation type packaging substrate, which can effectively join the heat sink and the packaging substrate while saving process costs. \ * Another purpose of the present invention is to provide a method for manufacturing a high heat dissipation type packaging substrate, which can save process time and facilitate mass production. Yet another object of the present invention is to provide a method for manufacturing a high heat dissipation type packaging substrate, which can be used with non-fiber resin adhesive sheet to form a better reliability product. Another object of the present invention is to provide a high heat dissipation type packaging substrate.

] 7522 全懋 .ptd Page 11 1238505: Fifth, the description of the invention (5), the method can prevent the joint layer between the heat sink and the substrate from generating burrs at the opening, and provides a better process yield. To achieve the above object, the present invention provides a method for manufacturing a highly heat-dissipative package substrate, which mainly includes the following steps: a substrate module sheet having a plurality of package substrate units is bonded to an adhesive sheet, and each of the substrate units has at least one Through the opening, and then use laser to remove the adhesive sheet at the opening of the substrate unit, and then attach the substrate module sheet integrated with the adhesive sheet to a heat sink. In the present invention, a substrate mold having a plurality of packaged substrate units can be used, and each of the substrate units has at least one through-opening, and can be reused after the substrate module sheet is bonded with a non-fiber resin adhesive sheet. The laser removes the adhesive sheet at the opening of the substrate unit, and then attaches the substrate module integrated with the adhesive sheet to a heat sink, and finally can be singulated to form a plurality of semiconductor package substrate units with integrated heat sink. To improve the process efficiency and productivity of the package substrate. Therefore, in the manufacturing process disclosed in the present invention, not only the traditional cutting method can be improved. Because the bonding lamination temperature between the substrate module sheet and the heat sink is too high, the fiber impregnated resin with the bonding layer is adhered. Film operation.- Poor work, and because of fiber! The impregnated resin adhesive sheet is relatively hard and has poor cushioning properties, which causes the shortcomings of easy cracking during thermal shock. At the same time, it can improve the defects of expensive production cost and complicated and time-consuming process in the manufacturing method of the bonding form. Therefore, the manufacturing method of the high heat dissipation type packaging substrate of the present invention can make the bonding layer between the substrate and the metal heat sink be matched with a non-fiber resin adhesive sheet to form a packaging substrate with better reliability, which can also avoid being familiar with non-fiber

17522 全懋 .ptd Page 121238505 V. Description of the invention (6) The burrs generated during the opening of the 6-dimensional resin adhesive sheet affect the subsequent process yield and other issues. 俾 Provide good bonding between the metal heat sink and the semiconductor package substrate . [Embodiment] The following is a description of specific embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. As shown in FIGS. 4A to 4D, it is a schematic diagram for explaining a method for manufacturing a high heat dissipation type packaging substrate of the present invention. Please refer to FIG. 4A. First, a formed substrate module piece 40 is prepared. The substrate module piece 40 includes a plurality of substrate units 401, and at least one of the substrate units 401 is formed therethrough. The openings 400 on the upper and lower surfaces are used for subsequent storage of semiconductor wafers. Among them, although the illustrated substrate module chip 40 is illustrated by a two-layer circuit board, it is not intended to limit the applicable scope of the present invention, and may be a multi-layer circuit board. Please refer to Figure ~ 4B. Another non-fiber resin adhesive sheet 41 is provided and bonded to the molded substrate module sheet 40 to close one side of the opening 4 0 0 ° Please Referring to FIG. 4C, a laser is used to remove the adhesive sheet at the substrate unit 4 0 1 openings 4 0 0, so that the adhesive sheet 41 is formed corresponding to the substrate unit 4 0 1 openings 4 0 0 4 1 0 (as shown in Figure 4D). Where, the

1 7522 Full S. ptd Page 3 of 1238505: V. Description of the invention (7). The emission direction of the laser can be any of the opposite sides of the adhesive sheet 4 1 at the substrate unit 4 0 1 opening 4 0 0 On one side, and because the openings 4 1 0 of the adhesive sheet 41 are formed by a laser cauterization method, problems such as burrs generated when cutting with a milling cutter can be effectively avoided. • Referring to FIG. 4E, the substrate module sheet 40 integrated with the adhesive sheet 41 is connected to a heat sink 4 2 by pressure heating, so that the heat sink 4 2 closes the substrate mold. One side of each of the substrate units 401 in the assembly sheet 40 has an opening 4 00, and a substrate module sheet 40 integrated with a heat sink 42 is formed. Please refer to FIG. 4F. In the subsequent process, the substrate with integrated heat sink 4 2 may be singulated to form a plurality of semiconductor package substrate units 4 0 1 with integrated heat sink 4 2. Process efficiency and capacity of the package substrate. Therefore, in the manufacturing process disclosed in the present invention, a complete adhesive sheet is pasted on the surface of the substrate module sheet with an opening, and then a laser is used to remove the part of the adhesive sheet that closes the opening. The substrate module with the adhesive sheet attached thereto is connected to a heat sink to form a high heat dissipation type semiconductor package substrate with integrated heat sink, which can not only improve the traditional manufacturing method of the cutting form because the substrate and heat dissipation The bonding and laminating temperature between the sheets is too high, and the first-the bonding layer used, the operability of the soil fiber impregnated resin adhesive sheet is not good, and because the fiber impregnated resin adhesive sheet is hard in nature, cushioning The property is not high, which causes the disadvantage of easy cracking during thermal shock. At the same time, it can also improve the defects of high production cost and complicated and time-consuming process in the manufacturing method of the bonding form. Therefore, the manufacturing method of the high heat dissipation type packaging substrate of the present invention can make the bonding layer between the substrate and the metal heat sink be adhered with non-fiber resin

17522 Full®.ptd Page 14 1238505 V. Description of the invention (8) sheet to form a packaging substrate with better reliability, which can also avoid the burrs generated when opening holes of non-fiber resin adhesive sheets and affect subsequent processes. Yield and other issues, provide good bonding between the metal heat sink and the semiconductor package substrate. The above embodiments are only used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone familiar with the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be as listed in the aforementioned patent application scope.

17522 全懋 .ptd Page 5 1238505 ^ Simplified illustration of the drawing • [Simplified illustration of the drawing] Fig. 1 is a schematic diagram showing a conventional six-position crystal ball grid array (CDBGA) semiconductor package; Section 2 A Figures 2 to 2C are schematic diagrams showing a conventional process for integrating a semiconductor package substrate and a heat sink using a tap type (Tap 1 ngtype); Figures 3A to 3D show a conventional method for integrating a semiconductor package substrate with a routing type. The manufacturing process schematic diagram of the heat sink; and Figures 4A to 4F are schematic diagrams showing the manufacturing method of the high heat dissipation type packaging substrate of the present invention. 1 Semiconductor package 10 Semiconductor package substrate 11 Opening hole 12 Loose sheet 13 Semiconductor wafer 14 Welding wire 15 Solder ball 20 Semiconductor package substrate unit 200 Opening hole 21 Adhesive sheet 210 Opening hole 22 Loose plate 30 Substrate module piece 300 Opening hole 301 substrate early element 31 adhesive sheet 310 openings-•. 32 scattered / 魏 Wei substrate module 400 openings 40 1 substrate 0〇 early element 41 adhesive sheet 410 openings 42 scattered pieces

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Claims (1)

1238505 VI. Applying for patented poisonous color enclosure 1. A method for manufacturing a high heat dissipation type packaging substrate includes: bonding a substrate module sheet having a plurality of packaging substrate units and an adhesive sheet, each substrate unit having at least A through-hole; using a laser to remove the adhesive sheet at the opening of the substrate early element; and connecting the substrate module chip integrated with the adhesive sheet to a heat sink. 2. The method for manufacturing a high-heat-dissipation package substrate according to item 1 of the scope of patent application, which includes singulating a substrate module sheet integrated with a heat sink, and forming a plurality of substrate units integrated with a heat sink. 3. The manufacturing method of the high-heat-dissipation type package substrate according to item 1 of the patent application range, wherein the emission direction of the laser can be any of two sides of the adhesive sheet at the opening of the substrate unit. 4. The method for manufacturing a high heat dissipation type packaging substrate according to item 1 of the patent application scope, wherein the adhesive sheet is a non-fiber resin adhesive sheet. 5. The manufacturing method of the high heat dissipation type packaging substrate according to item 1 of the patent application scope, wherein the opening of the substrate unit is capable of accommodating a semiconductor wafer. 6. According to the manufacturing method and method of the high-heat-dissipation package substrate of the first patent application range, wherein-, the shape of the-substrate J-mo chip can be one of a two-layer circuit board and a multi-layer circuit board. 17522 Total fear.ptd Page 17