TWI236757B - Leadframe without outer leads for semiconductor package - Google Patents

Abstract

A leadframe without outer leads for semiconductor package includes a plurality of first inner leads and a plurality of second inner leads in alternate format. Each first inner lead has a first outer pad, and each second inner lead has a second outer pad. Each first inner lead is connected to a frame dam of the leadframe with a connecting bar so that the distance from the first outer pads to the frame dam is greater than the distance from the second outer pads to the frame dam to make the first outer pads and the second outer pads in staggered format. The pitch between the first inner leads and adjacent second inner leads is constant. The connecting bars of the first inner leads have a width more than said pitch. Therefore the inner leads are able to arrange in high density without fan-out design.

Description

1236757

V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a semiconductor package [prior art] An outer lead type lead frame used in a lead frame of a semiconductor package. In the conventional semiconductor packaging technology, a chip is a lead frame, and the chip is sealed with a gel. In order to reduce the size of the package structure: the glue C is designed to have no outer pin type. The external pads on the bottom surface replace conventional non-lead pins, such as the Quad Flat Non-leaded package (㈣): when packaging high-terminal-count (I / O) chips, the internal lead of the lead frame The feet are arranged in high density ^ to form a fan-out structure, which increases the size of the package structure.

U.S. Patent No. 2003/0168719 discloses a multi-row leadframe with no outer pins. There are multiple rows of terminal pads on the four perimeters of the central paddle ring, and the inner and outer rows of terminal pads. It is arranged in pairs, and the inner pins cannot be connected to the frame on the same side of the lead frame. In order to fix the inner row terminal pad in the manufacturing process, please refer to FIG. 9 and FIG. Of US Patent No. 2003/0 1 6871 9. · 10 (that is, Figures 9 and 10 of the previous case) 'The inner row terminal pads are connected to the socket ring with a connection portion, and the outer row terminal pads are connected to the frame of the lead frame, After wafer bonding, wire bonding and sealing compound formation, a chemical etching step is required to remove the connection between the inner row terminals 塾 and the socket%, which complicates the packaging process. In addition, the bonding force between the inner and outer row terminal pads and the sealing compound is slightly weak. " " Mouth [Inventive Content]

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V. Description of the invention (2) „The first inner pins and the plurality of second inner pins are arranged at intervals and connected to a frame, and the distance between the pins of the feet is fixed. —::?: Inner! 1 foot and the adjacent second inner-outer pad to the frame so that the distance between the η-th-inner pin is greater than the distance between the four frames in the second inner boom. And make these first-external ::; the first: the gap between the pad and the frame are misaligned, and this is also the fourth lead: the second external 塾 is-the inner pin and adjacent second; It is larger than the first fan-out design and can achieve high-density arrangement. The main purpose of the present invention is to provide a semiconductor package. The second purpose of the present invention is to be especially 4a M ^ r ^ The bow and foot 4 scoops are located on the edge for a semiconductor package without the outside :: The type lead frame is misplaced on the female first first pins, and the first-inner pins are spaced apart from the two expansion wires. Here, the distance between the first inner pins is the same, and the distance between them is equal to the distance between the connecting portions of the extensions of the second inner pins. ：：： ； = The pad and the adjacent first-inner pin N are arranged in an array of these inner pins. Another purpose of this month is to provide a recorded main channel to strengthen > P-pin lead frame, Each first inner lead has no outer outer conductor package, and the inner pins are connected by a connecting part. First first evening M pgiu: ^ two first outer pad and second inner lead The second external pad of the foot is connected to the right one Μ 仙 # ^ ^ α. The second external pads of the first inner pins are successively transmitted into eight different pi into H flutes and pass away from the metal frame. The lower surface of the connecting part of the notch foot and the inner leg is extended with the second inner pin. The lower surface is used to enhance the first and second external pads and the second external pad! 236757

Description of the invention (3) Fixing after sealing. According to the present invention, i L < no outer pin wood, a plurality of _ flesh 2 丨 _ inner bow 丨 feet and at least-smell. Β openings, the first inside are arranged at intervals in the periphery of the opening to lead The lower surface of the foot has a lower surface with a second external lead frame, and the second internal lead pin is connected to the plurality of metal and includes a foot, the second frames, a first external pad, Each second has a connecting portion, which connects the first external pads, the second external pads, and the metal frame column, and each first inner pin is fixed, and the first inner pins are connected. The distance between adjacent first inner pins is arranged in a row and there is no need to design a fan-out frame. Pads, wherein the distance between each of the first inner pads and the frame of the metal frame, and the width of the junction between the first inner pads and the adjacent second inner pins are larger than the first pads to achieve a high density of multiple rows of outer pads. The metal distance between the pins connected to the same side is a metal frame with a metal frame. The inner pins are the frames of each of the first inner pins. Feet and Degree Spaced Metal Frame [Embodiment] Referring to the attached drawings, the present invention will enumerate the following embodiments. • According to a specific embodiment of the present invention, FIG. 丨 is a partial schematic diagram of the upper surface of a leadless lead frame without external pins, and FIG. 2 is a partial schematic diagram of the lower surface of a leadless leadframe with external leads. Leadless lead frame system · Mainly includes a metal frame 10, a plurality of first inner pins 20, and a plurality of second inner pins 30, corresponding to each packaging unit. The metal frame It has at least one opening 11. The first inner pins 20 and the second inner pins 30 are spaced apart from each other around the opening 11 and connected to the metal frame 10.

1236757 V. Description of the invention (4) Ershi rtN This—The lead frame is based on the square as flat without outer lead (0n leaded leadframe). The lower surface of each inner pin 20 is provided with a first-external pad 21, which is electrically connected externally, and these first external pads are connected: pads = pads = partitions, columns, ... The embodiment is based on ^ two buds; = ί Two ΠΓ and the second inner pins 3. Wherein, each of the metal frame joints 23 ′ is connected to the first and second external pads 21 and 2 so that the first and second external pads 21 and the metal frame 10 are left and right, preferably, each The two inner pins 30, part 3i, are connected to the corresponding second outer pad 31 and away from the equal length, and the first inner pins 20 and the second inner pins 30 are obtained as the joint name 4 ^ Electrical functions, and the second inner pin 30 on both sides may not have the extension portion 33 due to the configuration of the coupler ~ cup 41. Please refer to FIGS. 1 and 2 again. The first-inner pins 20 and the second inner-pins 30 are connected to the metal frame at a distance from the first inner-pins 30 to the second inner-pins 30. For fixing, the 丄 = = :? ~ 0.3mmtt is based on one of them, and the width W1 of the connecting portion 23 of the first inner pin 20 is fixed at 0.15 Li | It is larger than 4 on 2 of each first inner pin 20 and adjacent second inner pin 30 (printed as shown in Figures 1, 3 and 4), and then please refer to Figures i, 3 and 4 ' A first expansion is formed on the upper surface of a first inner pin 20

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The wire bonding pad 22 corresponds to the first external pad 21 and has a large area, and a second expanded wire bonding pad 32 is formed on the upper surface of each second inner pin 30, which corresponds to the second The external pad 31 has a large area for connection of wire bonding wires. In this embodiment, please refer to FIG. 丨, the first expansion wire bonding pads 22 and the adjacent second expansion wire bonding pads 32 are The spacing is arranged so that the horizontal distance D1 (as shown in FIG. 3) between the first expansion bonding pads 22 and the extensions 33 of the adjacent second inner pins 30 is equal to the number of the second expansion bonding wires. The horizontal distance D2 between the pad 32 and the connecting portion 23 of the adjacent first inner pin 20 (as shown in FIG. 4). Therefore, the first outer pad 21 and the second outer pad 21 The external pad 3 丨 will arrange the first inner pins 20 and the second inner pins L 3 0 which can be arranged at high density and are staggered and can be equally spaced in a fan-out type to the metal frame 1 0 on the same side. In addition, The lower surface of the connecting portions 23 of the first inner feet 2 0 is formed with a half button notch 24 (as shown in Figs. 2 and 5), and Half-etching notches 34 are also formed on the lower surfaces of the extensions 33 of the second inner pins 30 (as shown in Figures 2 and 6) to avoid the electrical properties of the first external pads 21 and the second external pads 31. Short circuit, and the half-etched notches 24 and 34 can be sealed by a gel 70 to improve the fixing of the first inner pin 20 and the second inner pin 30 in the package structure. Please refer to FIGS. 1, 5 and 6. In this embodiment, the lead frame further includes a wafer holder 40, which can be of any shape, such as rectangular or ring shape, for the adhesion of the wafer. The wafer holder 4 〇 A tie is formed in the opening 1 i and is connected to the metal frame 10 with a plurality of coupling rods 41. Please refer to FIG. 7. When a semiconductor package structure is manufactured by using the lead frame described above, a semiconductor wafer 50 is a wafer pad 40 attached to the lead frame.

Page 12 1236757 V. Description of the invention (6) The wafer 50 is provided with pads 51 and 22, and the body 70 with a plurality of two inner pins 30 is used to seal the wafer 50 and the body 70. The 24, the other pads 21 of the second lead frames are arranged in a misalignment with the second outer spacer, and a semiconductor formed by cutting the side 72 to obtain a high-density second inner pin 30, the inner pin 20, and the first better electrical properties. The function is because the connecting part 2 3 can be more securely connected to the last part. The name of the present invention is removed. Anything made in any enclosure is a plurality of welding pads on its active side. 51 Several first welding wires 6 1 connection The first and second bonding wires 62 are connected to the second expanded bonding wire 32 of the chip 50, and then an electric chip 50 is connected to the first bonding wires 61, the second first inner pins 20, and the first bonding wires 62. The two half-etched and half-etched parts of the extension part 33 of the inner lead 30 of the first inner lead 20 and the lead part 30 are exposed in the sealant 70 in the seal. After the gel 70 is cured, the pads 21 and 22 can be arranged along a small non-lead-out arrangement along the first inner pins 20 and the second inner package structure. These sections do not need to be fan-out design, and the distance between the two inner pins 30 is solid energy. At the same time, the first inner pins 20 and the half-etched notch 24 and the extension 33 are combined. The sealant 70 has no practical steps in the manufacturing process. The scope of protection is subject to the attached patent application knowing that this artisan, without departing from the changes and modifications of the present invention, is part of the invention's part of the expanded wire bonding pad, its bonding pad 51 to the insulating sealing wire 62 and fixed foot 30, the sealant half touches the notch 34 and the first external bottom surface 71 of the row with the pins 30 of the sealant 70, and the package size of the last foot is an inner pin 20 with some spaces The first determination will be able to express the second inner pin 30 half surname carved gap 3 4 need additional even the spirit and scope of protection as defined by the I range.

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1 〇 Metal frame 20 First inner pin 23 connection portion 30 Second inner pin 33 extension portion 40 Wafer socket 50 Wafer 61 First bonding wire 71 Bottom surface D1 Pitch 11 Open 〇21 External connection 24 Half-cut 31 External connection 34 half 4k notch 41 connecting rod 51 solder pad 62 first fresh line 72 side D2 pitch Zhang Dian 塾 Zhang Dian 塾 Φ gasket opening 22 first gasket 32 second 〇70 sealant W1 width

Claims (1)

1236757 VI. Scope of patent application [Scope of application for May patent] 1. A lead frame without outer pin, including. First metal frame, which has up to a plurality of first inner pins, and s inner pins. The lower surface has = gold: the frame has a plurality of second inner pins, and its A ^ inner bow 丨 brain nr. It is connected to the metal frame. The two lower surfaces have a second outer pad and an inner leg. : The second = the feet are arranged on the metal frame, the opening: the week ^ 丨 the feet and the second external connection:: j :: the pin has a-connecting part, which is connected to the rod Vri = greater than the second The distance between the external pad and the metal frame is arranged at an offset, and the distance between each of the first inner pins and the adjacent second inner pins is w ^, and the distance between these first and second inner pins is fixed. An internal pin connection.卩 The width is greater than the distance between each first inner pin and the adjacent second inner pin. 2. The lead-free lead frame as described in item 1 of the scope of the patent application, wherein the distance between each first inner pin and the adjacent second inner pin is fixed at 〇 · 〇 0.3mm 〇 3. The distance between each first inner pin and the adjacent second inner pin in the leadless lead frame as described in item 1 of the scope of patent application is fixed at 0.15 mm. The lead frame without outer pins according to item 1, wherein the width of the connecting portions of the first inner pins is 0 · 23 mm. 5. As described in item 1 of the scope of patent application, the lead-free lead frame is as follows: 236757 ----- / 、, Table 6 below the first internal connection in the scope of patent application. Each of the second inner and outer ridges is far from 7. If the second inner extensions of the application college are listed in Table 8, if each of the first ridges of the application college has a pad formed on the corresponding surface, the These are spaced apart. The bow and feet have faces. The 1st pin of the range of interest has the metal frame. The 6th pin of the range has the surface 0 of the 6th range of the inner pin / semi-etched notch, which is formed in the outer pin type described in these items. The lead frame, its / extension, is connected to the outer leadless lead frame according to the corresponding item 20, half of which is etched and notched, which is formed in the outer body described in the items The lead-type lead frame has a first expansion wire bonding pad on its surface, and a second expansion wire bonding pad on each of the second inner pins corresponds to the second outer expansion wire bonding pads and the first expansion wire bonding pads. The second expansion wire pad is a lead frame with no outer pin as described in item 8 of the scope of patent application, wherein the distance between the first expansion wire pad and the extension of the adjacent second inner pin Is equal to the distance between the second expanded wiring pads and the connection portions of adjacent first inner pins. 10. The lead-free lead frame as described in item 1 of the scope of patent application, which further includes a chip holder, which is connected to the metal by a plurality of connecting rods. Type lead frame includes: a metal frame having at least one opening; a plurality of first inner pins connected to the metal frame, each first 1236757 The table below the inner pin is a plurality of tables. The second inner pin is the table below. The distance between the frames of each of the first external pad metal frames and the adjacent second inner table. Those first 13, if the application is dedicated below the first some of the connection parts 14, if the application is dedicated to each of the second and second external pads and far 15, if the application is dedicated to the second extension parts 16 below For example, in each of the first pads, the corresponding surface is formed with a surface system having one or two inner pins, and the surface system has an interval arranged at a first inner lead and the distance between the metal frame is large. The space between the pins is within the range of 1 to 1. The inner range of the pins is the surface of the 1st inner pin. The range of the inner lead of the range 1 1 is far from the surface of the range of the inner lead of the range 1 4 of the metal frame. The first and first expansion pads of the first fourteen inner pins are connected to the first and first expansion pads; and the second outer pads are connected to the metal frame, and the first inner pins and the second outer pads are connected to the metal frame. The periphery of the opening of the metal frame; the feet are provided with a connecting portion, which is connected to the frame so that the first external pads and the second external pads are misaligned with the metal frame, and each first The inner pins are fixed between 〇 ·; [~ 〇 · 3_. 23mm。 No external lead type lead frame, the width of the joint is 0. 23mm. The lead-free lead frame according to the item has a half-etched notch, which is formed in the lead-free lead frame according to the item, and has an extension portion connected to the corresponding lead frame. The outer leadless lead frame described in this item has a half-etched notch, which is formed in the outer leadless lead frame described in this item. The first surface is formed with a first expansion wire and an outer joint. Wire pads above the two inner pins correspond to the second outer pins 1236757 VI. Scope of patent application These pads are arranged in offset. 17. If the application is applied, the distance between the first ones is equal to 18 between the joints. If the application is applied, it also includes a metal frame. 19. A semi-conducting piece of colloid is arranged by a plurality of second insides with no outside, pads, each second, each first external pad to the feet between the sides of the body of the sealing gel The distance is the first internal lead, one semiconductor and two internal pins; an expansion wire pad and the second expansion wire pads are the non-lead-type lead frames described in Item 16 of the margin range, and the expansion The distance between the bonding pads and the extensions of the adjacent second inner pins is between the second expanded bonding pads and the adjacent first inner pins. The lead-free lead frame described in item 11 of the scope of interest is a piece of socket, which is connected to the gold package structure with a plurality of connecting rods, including: 'It has a bottom surface and one side A plurality of first inner pins and pins formed by the read lead frame, the first inner pins and the second inner pins have a surface under each of the first inner pins; A lower surface of the first external inner pin is provided with a second external pad, and an internal pin is provided with a connecting portion, which is connected to the sides of the first colloids so that the first external pin and the cuff are sealed. = The distance Γ is between the second external pads and the sealant, and the female first-inner pin and the adjacent second internal lead :: phase = the width of the connecting portion of the first internal pin is greater than-phase The distance between the inner pins; and the chip, which is electrically connected to the first inner pins and the first, and the sealing system fixes the first 1236757 丨 丨 VI. The pins within the scope of the patent application and the pad and the second side are spaced apart by 20, such as each first inner 0.3mm 〇21 of the applicant, One inner 0.15mm 〇22, if applying for the first inner 23 of the college, if applying for the first inner connecting part 24, if every second inner and outer pad of the college, and staying away from 2 5 For example, under the second inner extensions of the applied junior high school 26. If the applied junior high school is on the female first pad, its corresponding surface is the first arrangement of some internal lead pins. The 19th pin of the profit range and the adjacent 19th pin are connected to the 19th pin of the adjacent range. The 19th pin of the range has a surface, so that the 19th pin of the range has The twenty-fourth lead of the sealant has a surface, so that the first inner surface of the twenty-fourth inner pin is formed with a first expansion wire bonding pad, and each second inner pin A second expansion bonding pad above corresponds to the first external two external pads corresponding to the second external pins and the first internal pins, which are exposed in the semiconductor package structure described in the bottom item of the sealant. The distance between the second inner pins is fixed at the semiconductor package structure described in the item 1 ~ 1, and the distance between the second inner pins is fixed at the semiconductor package structure described in the item, and the width of the part is 0. 23mm. In the semiconductor package structure described in the item, half of the notch is formed, and the connection portions are formed to be covered with the sealing compound. In the semiconductor package structure described in the item, an extension portion is connected to a corresponding second side edge. In the semiconductor package structure described in the item, half of the etching notch is formed on the extensions and sealed by the sealing compound. The semiconductor package structure described in the item Page 19 1236757 ~-VI. Scope of patent application An expansion wire is connected at intervals. These first expansion wire pads are aligned with the first and second wires. 2J t = The semiconductor package structure described in item 2 of the second patent range, wherein: 的: the distance between an expanded bonding pad and an extension of an adjacent second inner pin is equal to the second expanded bonding pad The distance from the speed contact portion of the adjacent first inner leg. 28. The semiconductor package structure according to item 9 of the patent application scope, further comprising a chip holder, which is connected by a plurality of coupling rods for mounting the chip. Page 20