1235499 五、發明說明（1) 【發明所屬之技術領域】 本發明係有關於一種光電處理器，特別係有關於一種 影像顯示處-理器。 【先前技術】 習知光電處理器係可運用於背投影機之影像顯示，例 如數位光源處理器（Digital Light Processing device， DLP)之數位微鏡裝置（Digital Micromirrior Device， DMD)或液晶石夕基板顯示裝置（Liquid Crystal On Silicon，LCOS)，或者是運用在影像感測、圖形辨識等領 域。 就習知用於影像顯示之光電處理器而言，在其内部必 須要組配有一光電單元（cell)，以將光源轉換成電訊號或 予以適當之光處理，習知該光電單元係被氣閉密封在一殼 體内’因此該殼體之一玻璃蓋與該光電單元之水平對位， 係影響光處理品質。請參閱第1圖，一種習知之光電處理 器100係主要包含有一基板丨10、一擋環120、一玻璃蓋13〇 與一光學單元140(cel 1)，該基板11 0、該擋環丨20以及該 玻璃蓋130係用以氣閉密封該光學單元14〇，該光學單多 140係以一黏膠1 50 (如銀膠）黏著於該基板丨10上，而該玻 璃蓋130係設置於該擋環丨2〇上。由於在黏晶過程，該光學 單元14 0會相對於該基板11()傾斜，該光學單元14〇與該玻 璃蓋1 3 0之間無法達到準確的平行對位，即，在該光學單 元140與該玻璃蓋1 3〇之間之間隔si係為一誤差大之可變 值，因此影響該光電處理器1 00光處理品質。此外，在該1235499 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to an optoelectronic processor, and particularly to an image display processor. [Prior technology] The conventional photoelectric processor is used for image display of a rear projector, such as a digital light processing device (DLP), a digital micromirror device (DMD), or a liquid crystal substrate Display devices (Liquid Crystal On Silicon, LCOS), or used in image sensing, pattern recognition and other fields. As far as the photoelectric processor used for image display is concerned, it must be equipped with a photoelectric cell inside it to convert the light source into an electrical signal or to perform appropriate light treatment. It is hermetically sealed in a casing, so a glass cover of the casing is horizontally aligned with the photoelectric unit, which affects the quality of light treatment. Please refer to FIG. 1. A conventional photoelectric processor 100 mainly includes a substrate 10, a stop ring 120, a glass cover 130, and an optical unit 140 (cel 1). The substrate 110 and the stop ring 丨20 and the glass cover 130 are used to hermetically seal the optical unit 140. The optical unit 140 is adhered to the substrate 10 with an adhesive 150 (such as silver glue), and the glass cover 130 is provided. On the retaining ring 丨 20. Since the optical unit 140 is inclined with respect to the substrate 11 () during the die bonding process, accurate parallel alignment cannot be achieved between the optical unit 140 and the glass cover 130, that is, in the optical unit 140 The interval si between the glass cover 130 and the glass cover 130 is a variable value with a large error, thus affecting the light processing quality of the photoelectric processor 100. In addition, in the
1235499 ~ ' -------η ，固化後，該光學單元130容易產生殘留應力，因此 邊成该光學單元1 3 0與該基板11 〇形成間隙，當間隙變化過 Λ (約大於0 · 5 // m)時，其係影響光處理品質品質。 在中華民國專利申請案號第092 127884號「減少光折 射之半導體光電處理器」揭示一種光電處理器，一包含有 半導體晶片之光電單元係容置於一殼體内，其中該光電單 兀之下表面係黏設於該基板，在該光電單元與該玻璃蓋之 間的仍不存在有控制機構，無法水平控制該光電單元相對 於該玻璃蓋之位置。 【發明内容】 时本發明之主要目的係在於提供一種光電處理器，利用 :彈性支撐件（elastic stand〇ff)形成於一基板與一光電 早兀（cell)之間，一透明蓋件係壓觸該光電單元，該彈性 支撐件係彈性頂推該光電單元之一下表面，以使該光電單 元之上表面係平行於該透明蓋件，以提升光處理品質。 抑—依本發明之光電處理器，主要包含有一基板、一光電 單元（c e 11 )、一彈性支撑件以及一透明蓋件，其中，該彈 性j撐件係形成在該基板與該光電單元之間，該透明蓋件 ，认置於β亥基板之上方，以氣閉密封該光電單元，該透明 ^件係壓觸該光電單元，該彈性支撐件係彈性頂推該光電 單元之下表面，以使該光電單元之一上表面係平行於該 透明蓋件。 【實施方式】 參閱所附圖式，本發明將列舉以下之實施例說明。1235499 ~ '------- η, after curing, the optical unit 130 is prone to residual stress, so the optical unit 130 and the substrate 11 form a gap, and when the gap changes by Λ (about greater than 0) · 5 // m), it affects the quality of light processing. In the Republic of China Patent Application No. 092 127884 "Semiconductor Optoelectronic Processor for Reducing Light Refraction" discloses an optoelectronic processor. An optoelectronic unit containing a semiconductor wafer is housed in a housing. The lower surface is adhered to the substrate, and there is still no control mechanism between the photoelectric unit and the glass cover, and the position of the photoelectric unit relative to the glass cover cannot be controlled horizontally. [Summary of the invention] The main purpose of the present invention is to provide a photoelectric processor, which uses: an elastic support (elastic stand) formed between a substrate and a photoelectric cell, and a transparent cover is pressed Touching the photovoltaic unit, the elastic support member elastically pushes a lower surface of the photovoltaic unit, so that the upper surface of the photovoltaic unit is parallel to the transparent cover, so as to improve the quality of light processing. Suppressing—The optoelectronic processor according to the present invention mainly includes a substrate, a photoelectric unit (ce 11), an elastic support member, and a transparent cover member, wherein the elastic j-support member is formed between the substrate and the photoelectric unit. In the meantime, the transparent cover member is recognized above the β-hai substrate, and the photovoltaic unit is hermetically sealed. The transparent member is pressed against the photovoltaic unit, and the elastic support member is elastically pushed against the lower surface of the photovoltaic unit. The top surface of one of the photovoltaic units is parallel to the transparent cover. [Embodiment] With reference to the drawings, the present invention will be described by the following embodiments.
mm
1235499 五、發明說明（3) 依據本發明之一具體實施例，請參閱第2圖f 一種光 電處理器200係主要包含有一基板21 0、一擋環22〇、一光 電單元230、一彈性支撐件240以及一透明蓋件25〇，該擔 環220係設置該基板210之一承載面211，以構成容置^ 電早元230之谷至’該基板210係具有適當之電路纟士構（圖 未繪出），以電性傳輸該光電單元230之訊號，該基板21〇 係選自於印刷電路板、陶瓷電路基板與預模導線^基板之 其中之一。 該光電單元230係具有一上表面231與一下表面232， 在本實施例中，該光電單元230係包含有一晶片233與一玻 璃基板234，該玻璃基板234可具有一 ITO(Indium Tin Oxide，氧化銦錫）導電層並設置於該晶片233之一主動表 面，由該晶片233與該玻璃基板234預先組立成為一數位微 鏡裝置（Digital Micromirrior Device, DMD)、液晶砂基 板單元（Liquid Crystal On Silicon cell，LCOS cell) 或其它半導體光電單元。或者，該光電單元2 30亦可為一 種景》像感測器晶片或其它感應晶片，並以複數個如銲線之 電性連接元件電性連接該光電單元23〇與該基板21〇(圖未 緣出）。 該彈性支撐件2 4 0係形成在該基板2 1 0與該光電單元 230之間，並具有適當之可變形性，用以往上彈性頂推該 光電單兀230。在本實施例中，該彈性支撐件24〇係為一金 屬彈片’例如是銅彈片或是包含有銅材質之金屬彈片，或 者’該彈性支撐件24〇可為其它彈性網狀物、彈簧或彈性1235499 V. Description of the invention (3) According to a specific embodiment of the present invention, please refer to FIG. 2f. A photoelectric processor 200 series mainly includes a substrate 21 0, a retaining ring 2220, a photoelectric unit 230, and an elastic support. Piece 240 and a transparent cover piece 25, the supporting ring 220 is provided with a bearing surface 211 of the substrate 210 to form a housing ^ the valley of the electric element 230 to 'the substrate 210 has a suitable circuit structure ( (Not shown), to electrically transmit the signal of the photoelectric unit 230, the substrate 21 is selected from one of a printed circuit board, a ceramic circuit substrate, and a pre-molded wire substrate. The photovoltaic unit 230 has an upper surface 231 and a lower surface 232. In this embodiment, the photovoltaic unit 230 includes a wafer 233 and a glass substrate 234. The glass substrate 234 may have an ITO (Indium Tin Oxide, oxidation) Indium tin) conductive layer is disposed on an active surface of the wafer 233. The wafer 233 and the glass substrate 234 are pre-assembled into a digital micromirror device (DMD) and a liquid crystal sand substrate unit (Liquid Crystal On Silicon). cell, LCOS cell) or other semiconductor optoelectronic cells. Alternatively, the photoelectric unit 2 30 can also be a scene sensor chip or other sensor chip, and electrically connect the photoelectric unit 23 and the substrate 21 with a plurality of electrical connection elements such as bonding wires (FIG. Missed). The elastic supporting member 2 40 is formed between the substrate 2 10 and the photovoltaic unit 230 and has a suitable deformability. The photovoltaic unit 230 is elastically pushed in the past. In this embodiment, the elastic supporting member 24o is a metal elastic sheet, such as a copper elastic sheet or a metal elastic sheet containing a copper material, or 'the elastic supporting member 24o may be another elastic mesh, a spring, or elasticity
第8頁 1235499 五、發明說明（4) 膜。在本實施例中，該彈性支撐件240係以一第一黏膠261 #占a又於β亥基板21 〇之该承載面211 ’並以一第二黏膠2 6 2黏 著於該光學單元230之該下表面232。 / ^ 該透明蓋件2 5 0係設置於該基板21 〇之上方，該透明蓋 件250係為一玻璃蓋或其它硬質之透光蓋件。在本實施例 中’該透明蓋件250係結合於該擋環220，以氣閉密封該光 電單元230，並且，該透明蓋件250係壓觸該光電單元 230，該彈性支撐件240係彈性頂觸該光電單元23〇之該下 表面232，以使該光電單元23〇之該上表面231平行於該透 明蓋件250。在本實施例中，該透明蓋件250之一内表面 2 51係可預先設置有複數個如凸塊之接觸凸點2 5 2，以共平 面地觸壓該光電單元230之上表面231，或者在不同實^例 中，該些接觸凸點252係可預先形成於該光電單元23〇之上 表面231。當該些接觸凸點2 52壓觸該光電單元23〇時，該 彈性支撐件2 4 0係可適當變形並彈性頂推該光電單元2 3 〇， 用以修正該光電單元230之傾斜度，使得在該光電單元23〇 之該上表面231與該透明蓋件250之該内表面251之間係形 成有一等距間隔S2，即，使得該光電單元230之該上表面 231平行於該透明蓋件25〇，而在該光電單元23〇之該下表 面232與該基板2 1 〇之該承載面21 1之間之間隔S3係為一可 隨著該彈性支撐件240伸縮變化之可變值，也就是說，即 使该基板210之承載面21 1為非平面，該光電單元“ο不會 受制於該些用以黏晶之黏膠261、262亦能使其上表面231 平行於該透明蓋件250。Page 8 1235499 V. Description of the invention (4) Membrane. In this embodiment, the elastic supporting member 240 is adhered to the optical unit with a first adhesive 261 # occupying a on the bearing surface 211 ′ of the β-hai substrate 21 〇 and a second adhesive 2 6 2 230 的 该 下面 232. / ^ The transparent cover member 2 50 is disposed above the substrate 21 0, and the transparent cover member 250 is a glass cover or other hard transparent cover member. In this embodiment, 'the transparent cover 250 is coupled to the retaining ring 220 to hermetically seal the photovoltaic unit 230, and the transparent cover 250 is pressed against the photovoltaic unit 230, and the elastic support 240 is elastic. Touch the lower surface 232 of the photoelectric unit 23o, so that the upper surface 231 of the photoelectric unit 23o is parallel to the transparent cover 250. In this embodiment, an inner surface 2 51 of one of the transparent cover members 250 may be provided with a plurality of contact bumps 2 5 2 such as bumps in advance to press the upper surface 231 of the photoelectric unit 230 in a coplanar manner. Alternatively, in different embodiments, the contact bumps 252 may be formed on the upper surface 231 of the photovoltaic unit 23 in advance. When the contact bumps 2 52 are pressed against the photovoltaic unit 23 °, the elastic support member 2 40 can be appropriately deformed and elastically push the photovoltaic unit 2 30 to correct the inclination of the photovoltaic unit 230. An equidistant interval S2 is formed between the upper surface 231 of the photovoltaic unit 23 and the inner surface 251 of the transparent cover 250, that is, the upper surface 231 of the photovoltaic unit 230 is parallel to the transparent cover. The distance S3 between the lower surface 232 of the photovoltaic unit 23 and the supporting surface 21 1 of the substrate 2 10 is a variable value that can be changed as the elastic support 240 expands and contracts. That is, even if the bearing surface 21 1 of the substrate 210 is non-planar, the photovoltaic unit “ο will not be restricted by the adhesives 261, 262 for sticking crystals, and its upper surface 231 may be parallel to the transparent盖 件 250。 Cover member 250.
1235499 五、發明說明（5) 此外’藉由該彈性支撐件240對該光電單元230之往上 彈性頂推，該光電單元2 30不會直接以黏膠黏著在該基板 210 ’該些黏膠2 61、262在固化後不會有作用於該光電單 元230之殘留應力。 第3A至3F圖係為該光電處理器2〇〇在製造過程中之截 面示意圖。首先，如第3A圖所示，提供一基板2 1〇及一擋 環220，該擋環220係設置於該基板21〇之一承載面211 ;之 後，如第3B圖所示，以點塗等方式形成一第一黏膠261於 該基板210之該承載面2Π ;接著，如第3C圖所示，設置一 彈性支撐件240於該第一黏膠261 ;之後，如第3D圖所示， 以點塗等方式形成該第二黏膠2 6 2於該彈性支撐件2 4 0 ;接 著，如第3E圖所示，將一光電單元2 30之一下表面232壓接 於該第二黏膠262 ’在適當固化該第一黏膠mi與該第二黏 膠262之後，該光電單元230係可彈性升降地黏設於在該基 板210上之彈性支撐件240 ;並在電性連接該光電單元23〇 與邊基板21 0之後，如第3F圖所示，以銲接或黏著方式將 該透明蓋件2 50結合於該擋環220，在本實施例中，該透明 蓋件25 0係以複數個接觸凸點252共平面地壓觸該光電單元 2 30之該上表面2 31，使得該彈性支撐件24 〇適當地變形並 彈性頂推該光電單元230，以修正該光電單元23〇之上表面 231之傾斜度，因此該光電單元23〇之該上表面23ι係可實 質平行於該透明蓋件250，以提升光處理品質且無黏晶殘 留應力造成間隙之問題。 本發明之保護範圍當視後附之申請專利範圍所界定者1235499 V. Description of the invention (5) In addition, 'the elastic support member 240 elastically pushes the photovoltaic unit 230 upward, the photovoltaic unit 2 30 will not be directly adhered to the substrate 210 with an adhesive. 2 61 and 262 have no residual stress acting on the photovoltaic unit 230 after curing. Figures 3A to 3F are schematic cross-sectional views of the photoelectric processor 200 during the manufacturing process. First, as shown in FIG. 3A, a substrate 2 10 and a retaining ring 220 are provided, and the retaining ring 220 is disposed on one of the bearing surfaces 211 of the substrate 21; then, as shown in FIG. 3B, a spot coating is applied. A first adhesive 261 is formed on the supporting surface 2Π of the substrate 210 by other methods; then, as shown in FIG. 3C, an elastic support member 240 is provided on the first adhesive 261; and then, as shown in FIG. 3D The second adhesive 2 6 2 is formed on the elastic supporting member 2 4 0 by spot coating or the like. Then, as shown in FIG. 3E, a lower surface 232 of one of the photoelectric cells 2 30 is crimped to the second adhesive. After the adhesive 262 ′ is cured properly, the first adhesive mi and the second adhesive 262 are cured, the photovoltaic unit 230 is elastically attached to the elastic supporting member 240 on the substrate 210, and is electrically connected to the After the photoelectric unit 23 and the side substrate 2 10, as shown in FIG. 3F, the transparent cover 2 50 is bonded to the retaining ring 220 by welding or adhesion. In this embodiment, the transparent cover 2 250 is A plurality of contact bumps 252 are co-planarly pressed against the upper surface 2 31 of the photovoltaic unit 2 30, so that the elastic support member 24 is appropriately changed. The photovoltaic unit 230 is shaped and elastically pushed to correct the inclination of the upper surface 231 of the photovoltaic unit 23o. Therefore, the upper surface 23m of the photovoltaic unit 23o can be substantially parallel to the transparent cover 250 to enhance light Treatment quality and no sticky crystal residual stress cause gap problems. The scope of protection of the present invention shall be defined by the scope of the attached patent application
1235499 五、發明說明（6) 為準，任何熟知此項技藝者，在不脫離本發明之精神和範 圍内所作之任何變化與修改，均屬於本發明之保護範圍。1235499 V. Description of the invention (6) shall prevail. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention.
II·! 第11頁 1235499 圖式簡單說明 【圖式簡單說明】 Ϊ ; U習知光電處理器之截面示意圖； 器之截面示意®;2發明之一具體實施例，-種光電處理 第3A至3F圖： 在製造過程中 該光電處理器 依據本發明之一具體實施例 之截面示意圖。 元件符號簡單說明 1 〇 0光電處理器 130玻璃蓋 2 0 0 光電處理器 2 1 0基板 2 2 0擋環 230光學單元 233晶片 240彈性支撐件 250透明蓋件 2 6 1第一黏膠 S1、S2 'S3 間隔 110 140 211 231 234 251 262 基板 光學單元 1 2 0揞環 15 0翻膠 承載面 上表面 232下表面 玻璃基板 内表面 第二黏膠 2 5 2接觸凸點II ·! Page 11 1235499 Brief description of the drawings [Simplified description of the drawings] Ϊ; U is a cross-sectional view of a known photoelectric processor; U is a cross-sectional view of a device ®; 2 is a specific embodiment of the invention, a kind of photoelectric processing. Figure 3F: A schematic cross-sectional view of the photoelectric processor according to a specific embodiment of the present invention during the manufacturing process. Simple description of component symbols 1 〇0 Photoelectric processor 130 Glass cover 2 0 0 Photoelectric processor 2 1 0 Substrate 2 2 0 Stop ring 230 Optical unit 233 Wafer 240 Elastic support 250 Transparent cover 2 6 1First adhesive S1 S2 'S3 interval 110 140 211 231 234 251 262 substrate optical unit 1 2 0 ring 15 0 flip top surface 232 bottom surface glass substrate inner surface second adhesive 2 5 2 contact bump
第12頁Page 12