1231605 玖、發明說明 (發明說明應敘明：發明所屬之技術領域、先前技術、內容、實施方式及圖式簡單說明) 【發明所屬之技術領域】 本發明係與晶片（ic)封裝製程有關，更詳而言之，乃 是有關於一種光電晶片（1C)之封裝製程及其成品。 5【先前技術】 習知之光電晶片（1C)具有一光電感測裸晶，該裸晶具 有一作用面及一非作用面，該作用面上設有一由若干光電 感測件（如光電晶體、光二極體、CCD…等）所形成之感光 區（sensor area)，該感光區係能接收光源或影像，再轉 10 換成強弱不同之訊號輸出，使應用有該光電晶片（1C)之機 構能藉由該光電晶片（1C)而感知與外界之相對位移；由於 該光電晶片（1C)體積小，且處理資訊應用功能強，因此非 常適合可小型化，且需要高靈敏度影像處理之場合。 在應用上，為避免光源不足造成光電晶片（1C)之感光 15 區感應不精確及訊號傳遞遲緩等問題發生，多會在物件上 加裝具有補光功能之構件（例如：LED燈等），以光學TTir 舉例而言，其結構大致包含有：一殼體；一電路板，設在 該殼體内，該電路板具有一矩形穿孔；一光電感測裸晶， 以感光區朝下之方式電性連結在電路板之穿孔處，且其感 20 牟區靠近該穿孔近中央位置；一 LED光源燈，係以燈源朝 前之方式電性連結在電路板於光電感測裸晶之後方；一分 光鏡，設在電路板底面與滑鼠内底面間，具有一向上伸入 電路板穿孔且介在光源燈與光電感測裸晶間之折射部，及 一位在光電感測裸晶之感光區下方之聚焦部。光學滑鼠利 7續次頁（發明說明頁不敷使用時，請註記並使用續頁） - 4- 1231605 發明說明®頁 用分光板之折射部以反射原理將光源朝物體表面照射，當 光源由物體表面折射再經由分光鏡之聚焦部而傳遞至光 電感測裸晶之感光區時，光電晶片（ic)便可藉由接收到之 光源做較精準之判斷，而輸出正確之訊號。 5 但，由於該等設於電路板上之構件都較為細小，且組 裝位置都必須精確，因此作業員在組裝時，都會花費較長 時間套設其相對之位置，使得人員組裝生產效率受限，間 接造成製造成本提升。 10 【發明内容】 本發明之主要目的即在提供一種光電晶片（1C)之封 裝製程及其成品，其製成之光電晶片（1C)具有補光之燈 源，在應用時，可減少組裝之構件，節省組裝製程時間， 藉此提高生產效率，以大量製造降低生產成本。 15 為達成前揭目的，本發明光電晶片（1C)之封裝製程係 包含有下列步驟··準備一基板，並以銲晶（Die Bond)技術 將一光電感測裸晶貼合在該基板正面預定之位置，HL座， 变將一 LED裸晶貼金在該基板正面另一預定之位置,；接著 再以打線（wire bond)技術，利用金屬線將該光電感測裸 20 晶以及該LED裸晶分別與該基板之執跡電路電性連結；實 施第一次封膠（Mold)作業，將呈半固體狀且凝固後透光性 高之塗覆材覆蓋該光電感測裸晶及該LED裸晶，該塗覆材 凝固後即分別在該基板上形成一第一及一第二透明層；對 該等透明層施以第一次製程加工，將多餘之殘膠（deflash) -5- 1231605 發明說明$賣Μ 去除；接續再實施第二次封膠（Mold)作業，取用呈半固體 狀之塗覆材將該基板、該光電感測裸晶及該LED裸晶包覆 其中，並同時預留若干開口，待該塗覆材凝固後即形成一 具有保護作用之封膠體；藉此，製成該光電晶片（1C)之雛 形；再對該雛形施以第二次製程加工，以去除封膠體多餘 之殘膠（deflash);最後，以檢切成型（Form/Singulation) 技術，得到該裸晶光電感測器。 【實施方式】 10 茲配合圖式舉二較佳實施例對本發明之結構及功能 作詳細說明，其中所用圖式先簡要說明如下： 第一圖係本發明第一較佳實施例之流程圖； 第二圖係本發明第一較佳實施例之製法中，經第二 步驟黏晶後所得之結構不意圖， 15 第三圖係本發明第一較佳實施例之製法中，經第三 步驟打線後所得之結構示意圖； 第四圖係本發明第一較佳實施例之製法中，經第四 f 步驟封膠後所得之結構示意圖； 第五圖係本發明第一較佳實施例之製法中，經第六 步驟封膠後所得之結構示意圖；以及 第六圖本發明第二較佳實施例之剖視圖。 本發明第一較佳實施例提供一種“光電晶片（1C)”之製 造方法，請先參閱第一圖所示之該方法流程圖，如圖所 示，該方法包含有下列步驟：“預備一基板、一光電感測 -6- 1231605 發明說明_頁 裸晶及一 LED裸晶”、“銲晶（Die Bond)”、“打線（wire bond)”、“第一次封膠（Mold)”、“去除殘膠，，、“第二次封膠 (Mold)”、“去除殘膠”以及“檢切成形”；茲配合圖示二至五 圖，逐說明如下： 5 步驟一、預備一基板（10)，具有一正面（11)及一背面 (12)，該正面（11)佈設有軌跡電路（printed wiring circuit)(註：即為一般之印刷電路板）。並自晶圓（Wafer) 上取得一光電感測裸晶（Photo-Sensor Ship)(20)，該感 測裸晶（20)具有一作用面（21)及一非作用面（22)。另外預 10 備一 LED裸晶（30)(註：光電感測裸晶及LED裸晶係習知 技藝，其作用原理並非本案重點，容不詳述，此外，晶圓 切割（Die Saw)技術，亦為習知技藝）。 步驟二、請參閱第二圖，利用黏晶（Die Bond)技術， 將該光電感測裸晶（20)之非作用面（22)及該LED裸晶（30) 15 分別貼置於該基板（10)正面（11)預定之位置，同時，該LED 裸晶（30)底面之一電極並與該基板（10)之軌跡電路電性 連結。 步驟三、接著以打線機在該光電感測裸晶（20)作用面 (21)及該基板（1〇)軌跡電路預定之接點間牽連預定數量 20 之金屬線（40)，使該光電感測裸晶（20)能與該基板（1〇)之 軌跡電路電性連結；另外，該LED裸晶（30)正面之另一電 極亦以打線機牵連一金屬線（40)與該基板（10)軌跡電路 預定之接點電性連結（註：打線（wire bond)技術為習知技 藝）。 1231605 發明說明 步驟四、參閱第四圖，該基板（10)正面（11)及背面（12) 於該光電感測裸晶（20)及該LED裸晶（30)之位置上，以呈 半固體狀且凝固後透光性高之硬質塗覆材覆蓋該等區 域’待該塗覆材凝固後即會在該光電感測裸晶（20)上形成 5 一第一透明層（51)，在該LED裸晶（30)上形成一第二透明 層（52) ’在該基板（10)背面與該第一透明層（51)相對之位 置上形成一第三透明層（53)，以及在該基板（1〇)背面與該 第二透明層（53)相對之位置形成一第四透明層（54)。 步驟五、利用去渣（Dejunk)技術及去結（Trim)技術對 10該等透明層（51)(52)(53)(54)施以第一次製程加工，去除 塗佈時所形成之餘渣及結塊等多餘之殘膠（deflash)，以 形成該光電晶片（1C)之半成品。 步驟六、參閱第五圖，接續以另一凝固後不具透光性 之硬質塗覆材將上述步驟五完成之半成品整體包覆，並事 15先預留四開口（61)，各該開口（61)分別與一該透明層 (51)(52)(53)(54)對應；待該塗覆材凝固後，即會形成一 封膠體（60) ’該等透明層（51 )(52)(53)(54)並藉由該等開 口（61)露現於外’藉此即形成該裸晶光電感測器之雛形。 步驟七、再對該封膠體（60)施以第二次製程加工，去 20除塗佈時所形成之餘渣及結塊等多餘之殘膠 (deflash)(同於步驟五之技術手段）。 步驟八、最後再施以之檢切成形（F〇rm/Singulation) 技術，將光電晶片（1C)半成品之外接腳（13)形成，而得到 該光電晶片（1C)。 -8- 1231605 發明說 配合第五圖，在結構方面，該光電晶片（IC)係為插 型，其包含有： 一基板（ίο)，具有一正面（11)及一背面（12)，且翅 正面（11)佈設有執跡電路，該基板（10)周緣繞設有預定數 5量之外接腳（13)，該等外接腳（13)並與軌跡電路電性連 結。 一光電感測裸晶（20)，貼合於該基板（10)正面（1ι) 預定之位置。 一 LED裸晶（30)，貼合在該基板（1〇)正面（11)另〜 10預定之位置，底面之一電極並與基板（10)之軌跡電路電 連結。 預定數量之金屬線（40)，係以打線機由該光電感挪 裸晶（20)之作用面（21)上牽連至該基板（1〇)軌跡電略預 定接點，藉此，使該光電感測裸晶（20)與基板（1〇)之轨鄉 15 電路電性連結；另外，在該LED裸晶（30)正面之另一電極 亦牽連一條金屬線（40)與基板（1〇)之軌跡電路電性連結。 第一、二、第三及第四透明層（51 )(52)(53)(54)， 係均為透光性高之材質製成；該第一透明層（51)包覆該光 電感測裸晶（20)及與其連接之該等金屬線（40)，且貼覆在 20該基板（10)正面（11);該第二透明層（52)係包覆該LED裸 晶（30)及與其連接之該等金屬線（40)，並貼覆在該基板 (10)正面；而該第三透明層（53)貼覆在該基板（1〇)背面 (12)在與該第一透明層（51)對應之位置，另外，該第四透 明層（54)則貼覆在該基板（10)背面（12)在與該第二透明 -9- 1231605 _ 發明說明_胃 層（51)對應之位置。 一封膠體（60)，係為不透光之塗覆材（一般常見為 黑色塑膠材質）凝固後形成，該封膠體（6〇)將該基板 (10)、該光電感測裸晶（20)及該LED裸晶（30)包覆其中， 5且該封膠體（60)具有四開口（61)，各該開口（61)位置分別 對應於一該保護層（51)(52)(53)(54)，藉此，使該等保護 層（51 )(52)(53)(54)能藉由該等開口（61)露現於外。 藉由上述之結構，當該基板（30)之外接腳（13)被導通 有電流時，電流會經由軌跡電路使該LED裸晶（30)產生光 10 源，該光源並會穿過該第二透明層（52)而向外透射；同 時，該光電感測裸晶（20)即接收光源，並感知影像之變化。 由上可知，本發明之光電晶片（1C)能應用在各種可藉 由不同色差光線之變化來得知與外相對位移之場合，舉例 而言，當應用於滑鼠時，本發明之光電晶片（1C)係設在滑 15 鼠内之電路板上’該電路板下方在與光電晶片（1C)上之 LED裸晶對應之位置還會設有一分光鏡，而滑鼠殼體在與 分光鏡對應之底部具有一穿孔；藉此’當基板（3〇)之外接 腳（13)被導通有電流時’該LED裸晶（30)即產生光源，該 光源經由分光鏡折射而投射到物體表面’再由物體表面反 20 射到該光電感測裸晶（2 0)之作用面上’使該光電晶片（IC ) 能傳遞影像之變化到PC(personal computer)上，藉此PC 即會判斷滑鼠之位移量。 由於本發明「光電晶片（IC)」其LED裸晶（3〇)即具有 補光之燈源，相較於習用之光電晶片（1C)應用在滑鼠等物 -10- 1231605 發明說明，續Μ 品上時，為了避免光源不足夠，必須額外加設一 LED光源 燈之步驟，本發明之光電晶片（IC)能縮短物品（泛指滑鼠 等·.·應用物）之製作流程及裝設空間，使組裝之步驟更佳 簡單化，藉此加快生產之速度，提高生產率，同時，並使 5 生產成本降低。 此外，本發明並不限定光電晶片（1C)與外界導通電流 之形式，亦即，請參閱第六圖，本發明第二較佳實施例之 光電晶片（1C)(2)係為表面接著型，其基板（7〇)背面周圍 環設有預定數量之金屬接觸點（71)，且該等接觸點（71)並 10同時與電路板之軌跡電路電性連結；而該封膠體（72)係覆 蓋著該基板（70)之正面、該光電感測裸晶（73)及該LED裸 晶（74)，且在與二該封膠體（75)對應之位置上並各預留有 一開口（76)。 藉此，當光電晶片（IC)(2)之接觸點（71)與滑鼠等物 15件之電路板軌跡電路電性連結時，電流便可經由執跡電路 使該LED裸晶（74)產生光源，並使該光電感測裸晶（73)能 接收光源，感知影像之變化。 -11- 1231605 _ 發明說明ϋ頁 【圖式簡單說明】 第一圖係本發明第一較佳實施例之流程圖。 第二圖係本發明第一較佳實施例之製法中，經第二步 驟黏晶後所得之結構示意圖。 5 第三圖係本發明第一較佳實施例之製法中，經第三步 驟打線後所得之結構示意圖。 第四圖係本發明第一較佳實施例之製法中，經第四步 驟封膠後所得之結構示意圖。 第五圖係本發明第一較佳實施例之製法中，經第六步 10 驟封膠後所得之結構示意圖。 第六圖本發明第二較佳實施例之剖視圖。1231605 发明 Description of the invention (the description of the invention should state: the technical field, prior art, content, embodiments, and drawings of the invention briefly) [Technical field to which the invention belongs] The present invention relates to the wafer (ic) packaging process. More specifically, it is about a packaging process of a photovoltaic chip (1C) and its finished product. 5 [Prior art] The conventional photoelectric chip (1C) has a photo-sensing bare crystal. The bare crystal has an active surface and a non-active surface. The active surface is provided with a plurality of photo-inductive measuring elements (such as photo-electric crystals, Sensor area formed by photodiodes, CCD, etc., which can receive the light source or image, and then turn to 10 for signal output with different strength, so that the mechanism using the photoelectric chip (1C) is applied The relative displacement from the outside can be sensed by the photoelectric chip (1C). Because the photoelectric chip (1C) is small in size and strong in processing information applications, it is very suitable for situations where it can be miniaturized and requires high-sensitivity image processing. In the application, in order to avoid problems such as inaccurate 15-zone sensing of the photonic chip (1C) and inadequate signal transmission caused by insufficient light sources, components with light supplementary functions (such as LED lights) are often installed on objects. Taking the optical TTir as an example, its structure roughly includes: a housing; a circuit board disposed in the housing, the circuit board has a rectangular perforation; a photo-inductor to measure the bare crystal, with the photosensitive area facing downward It is electrically connected to the perforation of the circuit board, and its sensing area is close to the center of the perforation. An LED light source lamp is electrically connected to the circuit board after the bare chip is measured by the light inductor in a forward direction. ; A beam splitter, located between the bottom surface of the circuit board and the inner bottom surface of the mouse, has a refraction part that extends upward into the circuit board perforation and is interposed between the light source lamp and the photodetector bare crystal, and a photodetector bare crystal Focusing section below the photosensitive area. Optical Mouse Lee 7 Continued Pages (Notes on Insufficient Use Pages, Please Note and Use Continued Pages)-4- 1231605 Description of the Invention® The refracting part of the beam splitter for pages uses the principle of reflection to illuminate the light source toward the surface of the object. When refracted from the surface of the object and transmitted to the photosensitive area of the bare chip through the focusing portion of the spectroscope, the photoelectric chip (ic) can make a more accurate judgment by the received light source and output the correct signal. 5 However, because these components on the circuit board are relatively small and the assembly position must be accurate, the operator will spend a long time setting up their relative positions during assembly, which limits the assembly production efficiency of personnel , Which indirectly results in increased manufacturing costs. [Summary of the Invention] The main purpose of the present invention is to provide a packaging process for photovoltaic chip (1C) and its finished product. The manufactured photovoltaic chip (1C) has a light source for supplementary light. Components, saving assembly process time, thereby improving production efficiency and reducing production costs with mass manufacturing. 15 In order to achieve the purpose of pre-disclosure, the packaging process of the photovoltaic chip (1C) of the present invention includes the following steps: preparing a substrate, and bonding a bare die for photo-inductance measurement to the front side of the substrate using die bond technology At the predetermined position, the HL seat will change an LED bare chip to another predetermined position on the front of the substrate; then use wire bond technology to measure the bare 20 crystals and the LED with a metal wire. The bare crystals are respectively electrically connected to the tracking circuit of the substrate; the first molding operation is performed, and the semi-solid coating material with high light transmission after solidification is used to cover the photodetection bare crystals and the bare crystals. For LED bare crystals, a first and a second transparent layer are respectively formed on the substrate after the coating material is solidified. The transparent layers are processed for the first time to remove excess residue (deflash) -5 -1231605 Description of the invention: $ SELM removal; Continue to carry out the second molding operation, and use a semi-solid coating material to cover the substrate, the photodetector bare crystal and the LED bare crystal. , And leave several openings at the same time, after the coating material solidifies, a Protective sealing gel; by this way, a prototype of the photovoltaic chip (1C) is made; and then the prototype is processed by a second process to remove excess deflash of the sealing gel; finally, it is inspected and cut. Form (Singulation) technology to obtain the bare-crystal photoinductor. [Embodiment] The structure and function of the present invention will be described in detail in conjunction with two preferred embodiments of the drawings. The drawings used are briefly described as follows: The first diagram is a flowchart of the first preferred embodiment of the present invention; The second diagram is the structure of the first preferred embodiment of the present invention, and the structure obtained after the second step is not intended. 15 The third diagram is the third method of the first preferred embodiment of the present invention. The schematic diagram of the structure obtained after wire bonding; the fourth diagram is the schematic diagram of the structure obtained after the fourth step f is sealed in the manufacturing method of the first preferred embodiment of the present invention; the fifth diagram is the manufacturing method of the first preferred embodiment of the present invention In FIG. 6, a schematic structural diagram obtained after sealing in the sixth step; and FIG. 6 is a sectional view of a second preferred embodiment of the present invention. The first preferred embodiment of the present invention provides a method for manufacturing a "photoelectric chip (1C)". Please refer to the flowchart of the method shown in the first figure. As shown in the figure, the method includes the following steps: Substrate, a photodetector-6-1231605 Description of the invention_Page bare die and an LED bare die "," Die Bond "," Wire bond "," First Mold " , "Remove Residual Adhesives," "Second Seal (Mold)", "Remove Residual Adhesives", and "Cut and Cut"; here are the two to five diagrams, as explained below: Step 1 A substrate (10) has a front surface (11) and a back surface (12). The front surface (11) is provided with a printed wiring circuit (Note: it is a general printed circuit board). A photo-sensor ship (20) is obtained from Wafer), and the sensing die (20) has an active surface (21) and a non-active surface (22). In addition, an LED is prepared in advance. Bare crystal (30) (Note: Photoelectron measurement of bare crystals and LED bare crystals is a well-known technique. Its principle of action is not the focus of this case, so I will not elaborate. (Die Saw technology, also known technique). Step two, please refer to the second figure, using die bond technology, to measure the non-active surface of the bare chip (20) using die bond technology ( 22) and the LED bare crystal (30) 15 are respectively attached to predetermined positions on the front surface (11) of the substrate (10), and at the same time, an electrode of the bottom surface of the LED bare crystal (30) and the track of the substrate (10) The circuit is electrically connected. Step 3. Next, a predetermined number of 20 metal wires (40) are connected between the active surface (21) of the bare crystal (20) and the predetermined contact of the track circuit of the substrate (10) by a wire bonding machine. ), So that the photodetector die (20) can be electrically connected to the track circuit of the substrate (10); in addition, another electrode on the front of the LED die (30) is also connected to a metal wire by a wire punching machine ( 40) Electrical connection with the predetermined contact of the track circuit of the substrate (10) (Note: wire bond technology is a conventional technique). 1231605 Description of the invention Step 4. Refer to the fourth figure, the front surface of the substrate (10) ( 11) and the back surface (12) are located at the positions where the photodetector bare crystal (20) and the LED bare crystal (30) are semi-solid and After solidification, a hard coating material with high light transmittance covers these areas. After the coating material is solidified, a first transparent layer (51) is formed on the photodetector bare crystal (20). A second transparent layer (52) is formed on the die (30). A third transparent layer (53) is formed on the back of the substrate (10) opposite to the first transparent layer (51), and on the substrate (10) A fourth transparent layer (54) is formed on the back of the second transparent layer (53). Step 5: Use Dejunk technology and Trim technology to apply the first process to 10 such transparent layers (51), 52, 53, and 54 to remove the coating formed during coating. Residual residues and agglomerates such as excess flash (deflash) to form a semi-finished product of the photovoltaic chip (1C). Step 6. Refer to the fifth figure, and then cover the semi-finished product completed in the above step 5 with another hard coating material that does not transmit light after solidification, and leave four openings (61) in advance. Each of these openings ( 61) corresponding to one of the transparent layers (51), 52, 53, and 54 respectively; after the coating material is solidified, a colloid (60) will be formed. 'The transparent layers (51) (52) (53) (54) and through the openings (61) are exposed to the outside to thereby form the prototype of the bare-crystal photoinductor. Step 7. Apply a second process to the sealant (60) to remove excess residue (deflash) such as residues and agglomerates formed during coating (same as the technical means of step 5). . Step 8. Finally, the Form / Singulation technology is applied to form the pins (13) of the semi-finished product of the photovoltaic chip (1C) to obtain the photovoltaic chip (1C). -8- 1231605 Invention According to the fifth figure, in terms of structure, the photoelectric chip (IC) is a plug-in type, which includes: a substrate (ίο), which has a front surface (11) and a back surface (12), and A track circuit is arranged on the front surface of the fin. A predetermined number of external pins (13) are wound around the periphery of the substrate (10). These external pins (13) are electrically connected to the track circuit. A bare chip (20) is measured by a photo-inductor and is attached to a predetermined position on the front surface (1m) of the substrate (10). An LED bare crystal (30) is attached to the front surface (11) of the substrate (10) at another predetermined position, and an electrode on the bottom surface is electrically connected to the track circuit of the substrate (10). The predetermined number of metal wires (40) are drawn from the active surface (21) of the photoinductor (20) by the wire-bonding machine to the predetermined contact of the substrate (10), thereby making the The photodetector die (20) is electrically connected to the track 15 circuit of the substrate (10); in addition, another electrode on the front of the LED die (30) also involves a metal wire (40) and the substrate (1). 〇) The track circuit is electrically connected. The first, second, third, and fourth transparent layers (51), (52), (53), and (54) are made of a material with high light transmittance; the first transparent layer (51) covers the optical inductor The bare die (20) and the metal wires (40) connected to the bare die (20) are attached to the front face (11) of the substrate (10); the second transparent layer (52) covers the LED bare die (30) ) And the metal wires (40) connected to it, and affixed to the front surface of the substrate (10); and the third transparent layer (53) is affixed to the back surface (12) of the substrate (10) and the first A transparent layer (51) corresponding to the position, in addition, the fourth transparent layer (54) is affixed to the back (12) of the substrate (10) and the second transparent -9-1231605 _ Description of the invention _ stomach layer ( 51) Corresponding position. A piece of colloid (60) is formed by solidifying an opaque coating material (commonly a black plastic material), and the sealing colloid (60) measures the substrate (10) and the bare chip (20) ) And the LED bare crystal (30) are covered, 5 and the sealing compound (60) has four openings (61), and the positions of each of the openings (61) respectively correspond to one of the protective layer (51) (52) (53) ) (54), so that the protective layers (51) (52) (53) (54) can be exposed through the openings (61). With the above structure, when a current is conducted to the pins (13) outside the substrate (30), the current will cause the LED bare crystal (30) to generate 10 sources of light through the trace circuit, and the light source will pass through the first The two transparent layers (52) transmit outward; at the same time, the photodetector measures the bare crystal (20) to receive the light source and sense the change of the image. It can be seen from the above that the photovoltaic chip (1C) of the present invention can be applied to various situations where the relative displacement with the outside can be obtained by the change of different color difference light. For example, when applied to a mouse, the photovoltaic chip ( 1C) is located on the circuit board inside the 15 mouse. 'A beam splitter will be set below the circuit board at a position corresponding to the LED die on the optoelectronic chip (1C), and the mouse housing corresponds to the beam splitter. There is a perforation at the bottom; by this, 'when a current is conducted to the pins (13) outside the substrate (30)', the LED bare crystal (30) generates a light source, which is refracted by a beam splitter and projected onto the surface of the object. Then the object surface is reflected back to the active surface of the photodetector bare crystal (20), so that the photoelectric chip (IC) can transmit the image change to the PC (personal computer), and the PC will judge the slippage. The amount of mouse displacement. Because the "photoelectric chip (IC)" of the present invention has an LED bare crystal (30), which is a light source with supplemental light, compared to the conventional optoelectronic chip (1C), it is applied to mouse and other objects -10- 1231605 Description of the invention, continued In order to avoid inadequate light sources, the product must be additionally equipped with an LED light source lamp. The photoelectric chip (IC) of the present invention can shorten the manufacturing process and equipment of articles (referred to as mouse, etc.). Provide space to simplify the assembly process, thereby speeding up production and increasing productivity, while reducing production costs. In addition, the present invention does not limit the form of the conduction current between the photovoltaic chip (1C) and the outside, that is, referring to FIG. 6, the photovoltaic chip (1C) (2) of the second preferred embodiment of the present invention is a surface-attach type A predetermined number of metal contact points (71) are arranged around the back surface of the substrate (70), and the contact points (71) and 10 are electrically connected to the track circuit of the circuit board at the same time; and the sealing compound (72) It covers the front surface of the substrate (70), the photodetector die (73) and the LED die (74), and an opening is reserved at a position corresponding to the two sealing gels (75) ( 76). Thereby, when the contact point (71) of the optoelectronic chip (IC) (2) is electrically connected to the circuit board track circuit of 15 pieces such as a mouse, the current can make the LED die (74) through the track circuit. A light source is generated and the photo-sensing bare crystal (73) can receive the light source and sense the change of the image. -11- 1231605 _ Description of the title page [Brief description of the drawings] The first diagram is a flowchart of the first preferred embodiment of the present invention. The second figure is a schematic view of the structure obtained after the second step of sticking the crystals in the manufacturing method of the first preferred embodiment of the present invention. 5 The third diagram is a schematic diagram of the structure obtained after the third step in the manufacturing method of the first preferred embodiment of the present invention. The fourth figure is a schematic diagram of the structure obtained after the fourth step of sealing in the manufacturing method of the first preferred embodiment of the present invention. The fifth diagram is a schematic diagram of the structure obtained by the sixth step 10 of the method for preparing the glue in the first preferred embodiment of the present invention. FIG. 6 is a sectional view of a second preferred embodiment of the present invention.
【主要部分之代表符號】 10 基板 11 正面 12 背面 13 外接腳 15 20 光電感測裸晶 21 作用面 22 非作用面 30 LED裸晶 40 金屬線 51 第一透明層 52 第二透明層 53 第三透明層 54 第四透明層 60 封膠體 20 61 開口 2 光電晶片（1C) 70 基板 71 接觸點 72 封膠體 73 光電感測裸晶 74 LED裸晶 75 封膠體 76 開口 -12-[Representative symbols of the main parts] 10 Substrate 11 Front 12 Back 13 External pins 15 20 Photodetector bare die 21 Active face 22 Non-active face 30 LED bare 40 Metal wire 51 First transparent layer 52 Second transparent layer 53 Third Transparent layer 54 Fourth transparent layer 60 Sealant 20 61 Opening 2 Photoelectric chip (1C) 70 Substrate 71 Contact point 72 Sealant 73 Photodetector bare crystal 74 LED bare crystal 75 Sealant 76 Opening 12-